TWI326567B - - Google Patents

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Publication number
TWI326567B
TWI326567B TW094145509A TW94145509A TWI326567B TW I326567 B TWI326567 B TW I326567B TW 094145509 A TW094145509 A TW 094145509A TW 94145509 A TW94145509 A TW 94145509A TW I326567 B TWI326567 B TW I326567B
Authority
TW
Taiwan
Prior art keywords
light
hole
layer
main surface
semiconductor element
Prior art date
Application number
TW094145509A
Other languages
English (en)
Chinese (zh)
Other versions
TW200635452A (en
Inventor
Higaki Kenjiro
Takagi Daisuke
Ishidu Sadamu
Tsuzuki Yasushi
Original Assignee
Almt Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Almt Corp filed Critical Almt Corp
Publication of TW200635452A publication Critical patent/TW200635452A/zh
Application granted granted Critical
Publication of TWI326567B publication Critical patent/TWI326567B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Led Device Packages (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW094145509A 2005-02-23 2005-12-21 Collective substrate, semiconductor element mount, semiconductor device, imaging device, light emitting diode component and light emitting diode TW200635452A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005047481 2005-02-23

Publications (2)

Publication Number Publication Date
TW200635452A TW200635452A (en) 2006-10-01
TWI326567B true TWI326567B (fr) 2010-06-21

Family

ID=44771388

Family Applications (2)

Application Number Title Priority Date Filing Date
TW096143369A TW200824058A (en) 2005-02-23 2005-12-21 Semiconductor element mounting member, semiconductor device, imaging device, light emitting diode constituting member, and light emitting diode
TW094145509A TW200635452A (en) 2005-02-23 2005-12-21 Collective substrate, semiconductor element mount, semiconductor device, imaging device, light emitting diode component and light emitting diode

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW096143369A TW200824058A (en) 2005-02-23 2005-12-21 Semiconductor element mounting member, semiconductor device, imaging device, light emitting diode constituting member, and light emitting diode

Country Status (1)

Country Link
TW (2) TW200824058A (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI406603B (zh) * 2010-07-12 2013-08-21 Holy Stone Entpr Co Ltd High thermal conductivity substrate process
CN102959747A (zh) * 2010-07-23 2013-03-06 夏普株式会社 发光装置及其制造方法
TWI460893B (zh) * 2010-09-28 2014-11-11 Advanced Optoelectronic Tech 發光二極體封裝基板及發光二極體封裝結構之形成方法
CN102468374A (zh) 2010-11-11 2012-05-23 展晶科技(深圳)有限公司 发光二极管制造方法
TWI425681B (zh) * 2010-11-15 2014-02-01 Advanced Optoelectronic Tech 發光二極體製造方法
TWI492420B (zh) 2011-10-31 2015-07-11 Everlight Electronics Co Ltd 發光裝置、表面貼裝型發光裝置及顯示裝置
CN105378912B (zh) * 2014-06-09 2018-12-28 三菱电机株式会社 半导体封装件的制造方法以及半导体封装件
TWI905469B (zh) 2017-10-30 2025-11-21 日商索尼半導體解決方案公司 固體攝像裝置及電子機器
JP6629391B2 (ja) * 2018-06-27 2020-01-15 株式会社アドマップ ＳｉＣコート
CN113225941B (zh) * 2021-05-12 2023-02-07 四川锐宏电子科技有限公司 盲孔多层高密度电路板制备工艺

Also Published As

Publication number Publication date
TW200635452A (en) 2006-10-01
TWI326483B (fr) 2010-06-21
TW200824058A (en) 2008-06-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees