TWI327109B - - Google Patents

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Info

Publication number: TWI327109B
Authority: TW; Taiwan
Prior art keywords: solder paste; print head; screen; template; workpiece
Prior art date: 2006-06-20

Application number

TW96110888A

Other languages

English (en)

Chinese (zh)

Other versions

TW200800612A (en

Inventor

Norio Gouko

Toshihisa Taniguchi

Atsushi Sakaida

Yuji Tuduki

Original Assignee

Denso Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2006-06-20

Filing date

2007-03-28

Publication date

2010-07-11

2007-03-28 Application filed by Denso Corp filed Critical Denso Corp

2008-01-01 Publication of TW200800612A publication Critical patent/TW200800612A/zh

2010-07-11 Application granted granted Critical

2010-07-11 Publication of TWI327109B publication Critical patent/TWI327109B/zh

Links

229910000679 solder Inorganic materials 0.000 claims description 126
238000007639 printing Methods 0.000 claims description 77
230000007246 mechanism Effects 0.000 claims description 52
238000007650 screen-printing Methods 0.000 claims description 32
238000004140 cleaning Methods 0.000 claims description 27
238000000034 method Methods 0.000 claims description 17
239000002699 waste material Substances 0.000 claims description 3
230000004907 flux Effects 0.000 description 9
239000002245 particle Substances 0.000 description 5
239000000758 substrate Substances 0.000 description 5
230000000694 effects Effects 0.000 description 4
239000012530 fluid Substances 0.000 description 4
238000005476 soldering Methods 0.000 description 4
239000002904 solvent Substances 0.000 description 4
230000003028 elevating effect Effects 0.000 description 3
238000012423 maintenance Methods 0.000 description 3
238000007599 discharging Methods 0.000 description 2
230000000149 penetrating effect Effects 0.000 description 2
238000003825 pressing Methods 0.000 description 2
230000009467 reduction Effects 0.000 description 2
239000004065 semiconductor Substances 0.000 description 2
-1 that is Substances 0.000 description 2
235000012431 wafers Nutrition 0.000 description 2
ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
230000009471 action Effects 0.000 description 1
239000004020 conductor Substances 0.000 description 1
238000012937 correction Methods 0.000 description 1
230000007547 defect Effects 0.000 description 1
230000002950 deficient Effects 0.000 description 1
230000008034 disappearance Effects 0.000 description 1
230000010354 integration Effects 0.000 description 1
239000007788 liquid Substances 0.000 description 1
238000004519 manufacturing process Methods 0.000 description 1
239000002184 metal Substances 0.000 description 1
239000000203 mixture Substances 0.000 description 1
238000012986 modification Methods 0.000 description 1
230000004048 modification Effects 0.000 description 1
238000012216 screening Methods 0.000 description 1
239000007787 solid Substances 0.000 description 1
238000001179 sorption measurement Methods 0.000 description 1
239000007921 spray Substances 0.000 description 1

Landscapes

Screen Printers (AREA)
Electric Connection Of Electric Components To Printed Circuits (AREA)

TW96110888A 2006-06-20 2007-03-28 Screen printing apparatus and its printing method TW200800612A (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2006170488A JP4775133B2 (ja)	2006-06-20	2006-06-20	スクリーン印刷装置及びその印刷方法

Publications (2)

Publication Number	Publication Date
TW200800612A TW200800612A (en)	2008-01-01
TWI327109B true TWI327109B (ja)	2010-07-11

Family

ID=39005695

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW96110888A TW200800612A (en)	2006-06-20	2007-03-28	Screen printing apparatus and its printing method

Country Status (2)

Country	Link
JP (1)	JP4775133B2 (ja)
TW (1)	TW200800612A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI472404B (zh) *	2011-07-15	2015-02-11	日立先端科技儀器股份有限公司	2-axis drive mechanism and wafer bonding machine

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
KR101159101B1 (ko) *	2008-08-13	2012-06-22	주식회사 엘지화학	우수한 결합력을 제공하는 솔더링 방법
US9370923B1 (en) *	2015-04-07	2016-06-21	Illinois Tool Works Inc.	Lift tool assembly for stencil printer
WO2020217468A1 (ja) *	2019-04-26	2020-10-29	株式会社Ｆｕｊｉ	供給ユニット、印刷装置及び印刷装置の制御方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH10296960A (ja) *	1997-04-30	1998-11-10	Juki Corp	クリーム半田印刷機
JP4330720B2 (ja) *	1999-08-27	2009-09-16	ヤマハ発動機株式会社	スクリーン印刷機の印刷剤供給装置

2006
- 2006-06-20 JP JP2006170488A patent/JP4775133B2/ja not_active Expired - Fee Related
2007
- 2007-03-28 TW TW96110888A patent/TW200800612A/zh not_active IP Right Cessation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI472404B (zh) *	2011-07-15	2015-02-11	日立先端科技儀器股份有限公司	2-axis drive mechanism and wafer bonding machine

Also Published As

Publication number	Publication date
JP4775133B2 (ja)	2011-09-21
TW200800612A (en)	2008-01-01
JP2008000923A (ja)	2008-01-10

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Legal Events

Date	Code	Title	Description
2025-04-11	MM4A	Annulment or lapse of patent due to non-payment of fees