1329180 九、發明說明： ,【發明所屬之技術領域】 本發明涉及一種照明裝置，尤其涉及一種利用發光二 極體等固態發光元件之照明裝置。 【先前技術】 現如今，發光二極體（Light Emitting Diode, LED)已經 被廣泛應用到很多領域，於此，一種新型發光二極體可參 見 Daniel A. Steigerwald 等人於文獻 IEEE Journal on • Selected Topics in Quantum Electronics, Vol. 8, No.2, March/April 2002 中之 Illumination With Solid State Lighting Technology —文。發光二極體一般可發出特定波長 之光，例如可見光，惟發光二極體所接收能量之大約 80〜90%被轉換為熱量，其餘之能量才被真正轉換為光能。 因此，發光二極體發光所產生得熱量必須被疏散掉以保證 發光二極體地正常運作。 $ 如圖1所示，一種照明裝置10，其包括一殼體11，一 個光源模組12及一個燈罩13。該光源模組12設置於該殼 體11中，且該燈罩13設置於該光源模組12之上方以保護 該光源模組12。該光源模組12包括：一個印刷電路板 (Printed Circuit Board, PCB) 121、設置於該印刷電路板 121 上之一個金屬線路層122與複數個發光元件123(如， LED)，以及覆蓋該發光元件123之封裝體124。該複數個 發光元件123與該金屬線路層122電性連接。然而，該複 數個發光元件123所產生得熱量不能及時有效地從該殼體 1329180 11中排除，進而降低了該複數個發光元件123之發光效率。 - 由此可見，有必要提供一種散熱效率較高之照明裝置。 .【發明内容】 • 以下將以實施例說明一種散熱效率較高之照明裝置。 一種照明裝置，其包括一個光源模組及一個與該光源 模組相結合之電源模組，該光源模組包括一個基板、至少 一個固態發光元件、複數個電極端及複數個第一導熱齒狀 _結構，該基板具有一個第一表面及一個與該第一表面相對 之第二表面，該至少一個固態發光元件與該複數個電極端 電連接且均设置於該基板之第一表面，該複數個第一導熱 齒狀結構設置於該基板之第二表面；該電源模組包括一個 殼體、複數個電源端及複數個第二導熱齒狀結構，該殼體 具有一個光源插槽及設置於該光源插槽底部之導熱部，該 複數個電源端設置於該光源插槽内，該複數個第二導熱齒 狀結構設置於該光源插槽底部且與該導熱部熱連接，該光 Φ源模組可拆卸地插設于該光源插槽内以使該第—導熱齒狀 結構與該第二導熱齒狀結構相嚙合並使該複數個電極端與 該複數個電源端電連接。 與先前技術相比’該光源模組插入該電源模組後，該 第一導熱齒狀結構與該第二導熱齒狀結構相嚙合，二者之 間形成良好地熱性接觸且具有較大之接觸面積，所以該複 數個固態發光元件發光時產生得熱量傳入該第—導熱齒狀 f構後，能夠有效地藉由第二導熱齒狀結構傳入該導熱 部，進而快速地傳導至該殼體之外，使得該照明裝置具有 1329180 .較高之散熱效率，進而提高了該複數個固態發光元件之發 光效率及使用壽命。 【實施方式】 下面結合附圖對本發明作進一步之詳細說明。 請參見圖2，本發明實施例提供一種照明裝置20，其 包括一光源模組21以及一個與該光源模組21相結合之電 源模組22。於本實施例中，該光源模組21設於該電源模组 22内，並與該電源模組22電連接。該光源模組21包括一 個基板210、複數個固態發光元件211，一個第一電極端 212，一個第二電極端213及一個第一導熱齒狀結構214。 該基板210為矩形板狀結構，其具有一個第一表面 2101及一個與該第一表面2101相對之第二表面2102。該 基板210之位於該第一表面2101與該第二表面2102之間 之一個側面設置有一個定位栓2103。該基板210所用材料 為銅、銘、陶究或南分子材料等南導熱材料。 該複數個固態發光元件211均勻設置於該基板210之 第一表面2101。於本實施例中，該固態發光元件211為發 光二極體。該第一電極端212與第二電極端213均設置於 該基板210之第一表面2101，其分別設置於該基板210相 對之兩側且分別與該複數個固態發光元件211電連接。於 本實施例中，該第一電極端212及第二電極端213均為長 條狀，使得其與電源模組22具有良好地電性接觸。 該第一導熱齒狀結構214凸設於該基板210之第二表 面2102。於本實施例中，該第一導熱齒狀結構214為長條 1329180 形且具有基本相同之截面形狀。 - 該基板210上還設置有一個訊號端子215及一個與該 .訊號端子215電連接之感測器216。該訊號端子215可設置 .於該第一電極端212與第二電極端213之間。該感測器216 與該複數個固態發光元件211相鄰設.置，其可為溫度感測 器、光波長感測器或亮度感測器，用以感測該複數個固態 發光元件211之工作狀態。 該電源模組22包括一個殼體221，一個燈罩222，一 個第一電源端223、一個第二電源端224以及一個訊號傳輸 端 225。 該殼體221包括一個底板2210,位於該底板2210相對 兩側之第一側壁2211、第二侧壁2212，以及位於該第一側 壁2211與第二側壁2212之間之第三側壁2213。由該第一 側壁2211，第二側壁2212及該第三側壁2213圍成一光源 插槽226，該光源插槽226之與該第三側壁2213相對之一 鲁側具有一開口 2214。該底板2210具有一導熱部2215，且 該底板2210之内側設置有複數個第二導熱齒狀結構227， 該複數個第二導熱齒狀結構227均沿遠離該底板2210之方 向延伸。該導熱部2215由導熱材料製成，例如銅、鋁等， 其與該底板2210可為分體結構或一體成型成型結構。於本 實施例中，該導熱部2215與該底板2210為分體結構，且 該複數個第二導熱齒狀結構227均與該導熱部2215熱連 接。該光源模組21可經由該開口 2214插入該光源插槽226 内，且該第一導熱齒狀結構214與該第二導熱齒狀結構227 10 1329180 相喷合。 . 該燈罩222設置於該殼體221内且與該底板2210相 .對，即設置於該光源插槽226之與其底部相對之一側，該 .光源模組21發出之光線經由該燈罩222射出。該燈罩222 可為平面透鏡、凹透鏡、凸透鏡、菲沒耳透鏡（Fresnel Lens) 或其他具有週期性結構之透鏡。 該第一電源端223，該第二電源端224及該訊號傳輸端 225分別設置於該殼體221之第一側壁2211、第二側壁2212 ® 及第三側壁2213之内側。該第三側壁2213之内側邊緣處 設置有一個定位孔2216,該基板210上之定位栓2103可對 應插入該定位孔2216内，從而可使得該光源模組21較牢 固地固定於該光源插槽226内。 請參見圖3，當該光源模組21插入該電源模組22内 時，該基板210上之定位栓2103對應插入該第三側壁2213 内側之定位孔2216内，該第一導熱齒狀結構214與該第二 鲁導熱齒狀結構227相嚙合以形成良好之熱接觸，該第一電 極端212、第二電極端213、訊號端子215分別與該第一電 源端223、第二電源端224、訊號傳輸端225電連接。該第 一電源端223與該第二電源端224分別與一個外部電源201 相連，由該外部電源201向該複數個固態發光元件211提 供電能。該訊號傳輸端225與一控制器202相連，該控制 器202與該外部電源201相連。該感測器216感測到得該 複數個固態發光元件211之工作狀態資訊傳入該控制器 202，該控制器202根據接收到得資訊對該外部電源201發 11 1329180 出相應之驅動訊號，該外部電源2〇1根據接收到得驅動訊 號對該複數個固態發光元件211分別進行控制，即調節對 .该複數個固態發光元件211所施加地電壓及電流。值得注 意的是，該第一導熱齒狀結構214與該第二導熱齒狀結構 227所用材料為銅、紹等高㈣材料。為了使該第一導熱窗 狀結構214與該第二導熱齒狀結構227之間形成更好地軌 性連接，可於二者之間設置導熱膠2〇3,例如矽膠、銀膠等‘。 當該光源模組21插入並固定於該電源模組22中後， 該第一導熱齒狀結構214與該第二導熱齒狀結構227之間 形成良好地熱性接觸且具有較大之接觸面積，所以該複數 個固態發光元件211發光時產生得熱量傳入該第—導熱齒 狀結構214後’能夠有效地藉由第二導熱齒狀結構奶傳 入該導熱部2215，進而快速地傳導至該殼體221之外，使 得該照明裝置2〇具有較高之散熱效率，進而提高了該複數 個固恐發光元件211之發光效率及使用壽命。 另，該照明裝置具有組裝簡便之特點，即將該光源模 組21,從該開口 2214插人該電源模組22之光源插槽现 内’並使該基板210上之定錄2期對應插人該第三側辟 奶3内敎定位孔2216内即可完成安裝；對該光源模= 施加-適當之拉力即可使該定位检細3從該定位孔 2216中脫離’從而完成拆除動作。 可理解的是，該殼體221亦可具有其他形狀’並以不 『之方式與該燈罩222結合，只要便於該光源模㈣裝卸 即可。請參見圖4 ’該電源模組22還可包括_個基座以 12 1329180 及一個支撐桿229,該支撐 連，1另 于29之—端與該基座228相 ^ 具另—端與該殼體221 桿229县矛以& 之弟二匍壁2213相連。該支撐 置及屮伞& ώ μ 5周即該先源模組21所處之位 =先角度，以適應不同之實際需要。 提出述，本發明確已符合發明專利之要件，遂依法 出^^。惟’以上所述者僅為本發明之較佳實施方 二自：：以此限制本案之申請專利範圍。舉凡熟悉本案 人士援依本發明之精神所作之等效修都或變化，皆 應，函盍於以下申請專利範圍内。 【圖式簡單說明】 圖1為一種先前照明裝置之截面示意圖。 圖2為本發明實施例提供之照明裝置之結構分解示意 圖3為圖2所示照明裝置之組裝示意圖。 圖4為圖2所示照明裝置包括電源模組具有一個基座 籲及一個支撐桿之結構示意圖。 【主要元件符號說明】 照明裝置 10， 20 殼體 11， 221 光源模組 12， 21 燈罩 13， 222 電源模組 22 印刷電路板 121 金屬線路層 122 13 13291801329180 IX. Description of the Invention: [Technical Field] The present invention relates to a lighting device, and more particularly to an illumination device using a solid-state light-emitting element such as a light-emitting diode. [Prior Art] Nowadays, Light Emitting Diode (LED) has been widely used in many fields. Here, a new type of light-emitting diode can be found in Daniel A. Steigerwald et al. in the IEEE Journal on • Selected Topics in Quantum Electronics, Vol. 8, No. 2, March/April 2002, Illumination With Solid State Lighting Technology. A light-emitting diode generally emits light of a specific wavelength, such as visible light, but about 80 to 90% of the energy received by the light-emitting diode is converted into heat, and the remaining energy is actually converted into light energy. Therefore, the heat generated by the light-emitting diode must be evacuated to ensure the normal operation of the light-emitting diode. As shown in FIG. 1, a lighting device 10 includes a housing 11, a light source module 12 and a lamp cover 13. The light source module 12 is disposed in the housing 11 and the light cover 13 is disposed above the light source module 12 to protect the light source module 12. The light source module 12 includes a printed circuit board (PCB) 121, a metal circuit layer 122 disposed on the printed circuit board 121, and a plurality of light emitting elements 123 (eg, LEDs), and covering the light. The package 124 of the component 123. The plurality of light emitting elements 123 are electrically connected to the metal wiring layer 122. However, the heat generated by the plurality of light-emitting elements 123 cannot be effectively removed from the housing 1329180 11 in time, thereby reducing the luminous efficiency of the plurality of light-emitting elements 123. - It can be seen that it is necessary to provide a lighting device with higher heat dissipation efficiency. SUMMARY OF THE INVENTION [In the following, an illumination device having a high heat dissipation efficiency will be described by way of an embodiment. A lighting device includes a light source module and a power module combined with the light source module, the light source module comprising a substrate, at least one solid state light emitting component, a plurality of electrode ends, and a plurality of first heat conducting teeth The substrate has a first surface and a second surface opposite to the first surface, the at least one solid state light emitting element being electrically connected to the plurality of electrode ends and disposed on the first surface of the substrate, the plurality The first thermal conductive tooth structure is disposed on the second surface of the substrate; the power module includes a housing, a plurality of power terminals, and a plurality of second heat conductive tooth structures, the housing has a light source slot and is disposed on the The heat conducting portion at the bottom of the light source slot, the plurality of power terminals are disposed in the light source slot, and the plurality of second heat conducting tooth structures are disposed at the bottom of the light source slot and are thermally connected to the heat conducting portion, the light Φ source The module is detachably inserted into the light source slot to engage the first heat conductive tooth structure with the second heat conductive tooth structure and the plurality of electrode ends and the plurality of electrodes The source is electrically connected. Compared with the prior art, after the light source module is inserted into the power module, the first thermal conductive tooth structure meshes with the second heat conductive tooth structure, and forms a good thermal contact and a large contact therebetween. The area, so that the heat generated by the plurality of solid-state light-emitting elements is transmitted to the first heat-conducting tooth structure, and can be efficiently transmitted to the heat-conducting portion through the second heat-conductive tooth structure, thereby being quickly transmitted to the shell In addition to the body, the illumination device has a high heat dissipation efficiency of 1329180, thereby improving the luminous efficiency and the service life of the plurality of solid state light-emitting elements. [Embodiment] The present invention will be further described in detail below with reference to the accompanying drawings. Referring to FIG. 2, an embodiment of the present invention provides a lighting device 20 including a light source module 21 and a power module 22 coupled to the light source module 21. In this embodiment, the light source module 21 is disposed in the power module 22 and electrically connected to the power module 22 . The light source module 21 includes a substrate 210, a plurality of solid state light emitting elements 211, a first electrode end 212, a second electrode end 213 and a first thermally conductive tooth structure 214. The substrate 210 is a rectangular plate-like structure having a first surface 2101 and a second surface 2102 opposite the first surface 2101. A positioning pin 2103 is disposed on a side of the substrate 210 between the first surface 2101 and the second surface 2102. The material used for the substrate 210 is a south heat conductive material such as copper, inscription, ceramic or south molecular material. The plurality of solid state light emitting elements 211 are uniformly disposed on the first surface 2101 of the substrate 210. In the embodiment, the solid state light emitting device 211 is a light emitting diode. The first electrode end 212 and the second electrode end 213 are respectively disposed on the first surface 2101 of the substrate 210, and are respectively disposed on opposite sides of the substrate 210 and electrically connected to the plurality of solid state light emitting elements 211, respectively. In the embodiment, the first electrode end 212 and the second electrode end 213 are elongated, so that they have good electrical contact with the power module 22. The first thermally conductive tooth structure 214 is protruded from the second surface 2102 of the substrate 210. In the present embodiment, the first thermally conductive tooth structure 214 is elongated 1329180 and has substantially the same cross-sectional shape. - The substrate 210 is further provided with a signal terminal 215 and a sensor 216 electrically connected to the signal terminal 215. The signal terminal 215 can be disposed between the first electrode end 212 and the second electrode end 213. The sensor 216 is disposed adjacent to the plurality of solid state light emitting elements 211, and may be a temperature sensor, a light wavelength sensor or a brightness sensor for sensing the plurality of solid state light emitting elements 211 Working status. The power module 22 includes a housing 221, a lamp cover 222, a first power terminal 223, a second power terminal 224, and a signal transmission terminal 225. The housing 221 includes a bottom plate 2210, a first side wall 2211, a second side wall 2212 on opposite sides of the bottom plate 2210, and a third side wall 2213 between the first side wall 2211 and the second side wall 2212. The first side wall 2211, the second side wall 2212 and the third side wall 2213 define a light source socket 226. The light source socket 226 has an opening 2214 opposite to the third side wall 2213. The bottom plate 2210 has a heat conducting portion 2215, and a plurality of second heat conducting tooth structures 227 are disposed on the inner side of the bottom plate 2210. The plurality of second heat conducting tooth structures 227 extend away from the bottom plate 2210. The heat conducting portion 2215 is made of a heat conductive material such as copper, aluminum or the like, and the bottom plate 2210 may be a split structure or an integrally formed structure. In the embodiment, the heat conducting portion 2215 and the bottom plate 2210 are separated structures, and the plurality of second heat conducting tooth structures 227 are thermally connected to the heat conducting portion 2215. The light source module 21 is inserted into the light source socket 226 through the opening 2214, and the first heat conductive tooth structure 214 is sprayed with the second heat conductive tooth structure 227 10 1329180. The light cover 222 is disposed in the housing 221 and is opposite to the bottom plate 2210 , that is, disposed on a side opposite to the bottom of the light source socket 226 , and the light emitted by the light source module 21 is emitted through the light cover 222 . . The lamp cover 222 can be a planar lens, a concave lens, a convex lens, a Fresnel Lens or other lens having a periodic structure. The first power terminal 223, the second power terminal 224 and the signal transmitting end 225 are respectively disposed on the inner side of the first sidewall 2211, the second sidewall 2212, and the third sidewall 2213 of the housing 221. A positioning hole 2216 is disposed at the inner edge of the third side wall 2213. The positioning pin 2103 of the substrate 210 can be inserted into the positioning hole 2216, so that the light source module 21 can be fixedly fixed to the light source slot. Within 226. Referring to FIG. 3 , when the light source module 21 is inserted into the power module 22 , the positioning pin 2103 of the substrate 210 is inserted into the positioning hole 2216 inside the third sidewall 2213 . The first thermal conductive structure 214 . Engaging with the second heat conduction tooth structure 227 to form a good thermal contact, the first electrode end 212, the second electrode end 213, and the signal terminal 215 are respectively connected to the first power terminal 223 and the second power terminal 224. The signal transmission terminal 225 is electrically connected. The first power terminal 223 and the second power terminal 224 are respectively connected to an external power source 201, and the external power source 201 supplies power to the plurality of solid state light emitting devices 211. The signal transmitting terminal 225 is connected to a controller 202, which is connected to the external power source 201. The sensor 216 senses that the working status information of the plurality of solid state light emitting elements 211 is transmitted to the controller 202, and the controller 202 sends a corresponding driving signal to the external power source 201 according to the received information. The external power source 2〇1 controls the plurality of solid-state light-emitting elements 211 according to the received driving signals, that is, adjusts the voltage and current applied to the plurality of solid-state light-emitting elements 211. It is to be noted that the material of the first thermal conductive tooth structure 214 and the second thermal conductive tooth structure 227 is copper, and the like. In order to form a better orbital connection between the first heat-conducting window structure 214 and the second heat-conducting tooth structure 227, a thermal conductive adhesive 2〇3 such as silicone rubber, silver glue or the like may be disposed between the two. After the light source module 21 is inserted into and fixed in the power module 22, the first heat conductive tooth structure 214 and the second heat conductive tooth structure 227 form good thermal contact and have a large contact area. Therefore, the heat generated when the plurality of solid state light emitting elements 211 emit light is transmitted to the first heat conductive tooth structure 214, and can be efficiently transmitted to the heat conducting portion 2215 by the second heat conductive tooth structure, thereby being quickly transmitted to the heat conductive portion 2215. In addition to the housing 221, the illumination device 2 has a high heat dissipation efficiency, thereby improving the luminous efficiency and the service life of the plurality of solid-state light-emitting elements 211. In addition, the illuminating device has the characteristics of simple assembly, that is, the light source module 21 is inserted into the light source slot of the power module 22 from the opening 2214, and the second stage of the recording on the substrate 210 is inserted. The third side of the milk 3 can be installed in the positioning hole 2216; the light source mold = applying a proper pulling force to disengage the positioning detecting 3 from the positioning hole 2216 to complete the removal operation. It can be understood that the housing 221 can have other shapes and can be combined with the lamp cover 222 in a manner that is convenient for the light source module (4) to be loaded and unloaded. Please refer to FIG. 4 'The power module 22 can further include _ bases 12 1329180 and a support rod 229, the support link, and the other end of the 29 and the base 228 have another end and The housing 221 rod 229 county spear is connected by the second wall 2213 of the & The support and the umbrella & ώ μ 5 weeks, that is, the position of the precursor module 21 = first angle, to adapt to different practical needs. It is stated that the present invention has indeed met the requirements of the invention patent, and is issued according to law. However, the above is only the preferred embodiment of the present invention. Two:: This limits the scope of patent application in this case. Any equivalents or changes made by those who are familiar with the case in accordance with the spirit of the present invention are hereby incorporated by reference. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic cross-sectional view of a prior illumination device. 2 is a schematic exploded view of a lighting device according to an embodiment of the present invention. FIG. 3 is an assembled view of the lighting device shown in FIG. 4 is a schematic structural view of the lighting device of FIG. 2 including a power module having a base and a support rod. [Main component symbol description] Lighting device 10, 20 Housing 11, 221 Light source module 12, 21 Lampshade 13, 222 Power module 22 Printed circuit board 121 Metal circuit layer 122 13 1329180
發光元件 123 封裝體 124 外部電源 201 控制器 202 導熱膠 203 基板 210 固態發光元件 211 第一電極端 212 第二電極端 213 第一導熱齒狀結構 214 第二導熱齒狀結構 227 訊號端子 215 感測器 216 第一電源端 223 第二電源端 224 訊號傳輸端 225 光源插槽 226 基座 228 支撐桿 229 第一表面 2101 第二表面 2102 定位栓 2103 底板 2210 第一側壁 2211 14 1329180 第二側壁 2212 第三側壁 2213 開口 2214 導熱部 2215 定位孔 2216Light-emitting element 123 Package 124 External power supply 201 Controller 202 Thermal paste 203 Substrate 210 Solid-state light-emitting element 211 First electrode end 212 Second electrode end 213 First heat-conductive tooth structure 214 Second heat-conductive tooth structure 227 Signal terminal 215 Sensing 216 first power terminal 223 second power terminal 224 signal transmission terminal 225 light source slot 226 base 228 support rod 229 first surface 2101 second surface 2102 positioning bolt 2103 bottom plate 2210 first side wall 2211 14 1329180 second side wall 2212 Three side walls 2213 opening 2214 heat conducting portion 2215 positioning hole 2216
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