1332143 九、發明說明： "【發明所屬之技術領域】 本发明涉及一種散热模组，特别係指一種对电子元器 件散热之散热模组。 【先前技術】 如今，在電腦產業中，為將微處理晶片等發熱電子元 件產生之熱量有效散發，通常採用方法係將散熱裝置緊密 鲁地貼設於發熱電子元件溢熱表面，以協助發熱電子元件散 熱，保證發熱電子元件在適當溫度下運作。 如圖1所示，中國大陸專利申請第200320103941.5號揭 示一種散熱模組，該散熱模組在底座100上方一定間距處設 有一鰭片組120，鰭片組120與底座100間通過複數“U”形 熱管130相連接。該鰭片組120由複數與底座100平行之散熱 鰭片彼此間隔堆疊形成，進而形成複數與底座100平行之氣 流通道，該鰭片組120兩側分別設置一軸流風扇110，風扇 鲁110為一吹一吸式構造。該散熱模組工作時，底座100所吸 收之熱量借助熱管130傳至鰭片組120，再籍由氣流將熱量 帶出。由於底座100始終係熱量累積之高溫區，但風扇110 所產生之氣流並未直接流經底座100及其周圍，故高溫區之 熱量基本都有賴於熱管130之傳導，而若能直接對底座100 散熱，則會使散熱效率大幅度提升。而前述專利中二風扇 110產生之氣流處於同一直線上，大部分氣流沒有充分吸收 鰭片之熱量便被風扇100快速吸出至外部，風扇110氣流之 利用率較低；另外，缺H本 · μ ‘、、曰片表面與基座100平行，亦影響韓片 I目然對流。綜上可貝，埤 日曰/1 政，、，、政率仍有較大提升空間。 H H rJn tt\j· 有馨：此:有必要提供-種散熱效率較高之散熱模組。 數相互板組’用於電子元器件散熱，其包括-由複 數相互間隔排列之散轨絲片 , ”一曰片組成之第一鰭片組，該等散熱1332143 Nine, the invention description: " [Technical field of the invention] The present invention relates to a heat dissipation module, in particular to a heat dissipation module for dissipating heat from an electronic component. [Prior Art] Nowadays, in the computer industry, in order to effectively dissipate the heat generated by the heat-generating electronic components such as micro-processed wafers, the heat-dissipating device is usually closely attached to the heat-dissipating surface of the heat-generating electronic component to assist the heat-generating electrons. The components dissipate heat to ensure that the hot electronic components operate at the proper temperature. As shown in FIG. 1 , the Chinese Patent Application No. 200320103941.5 discloses a heat dissipation module. The heat dissipation module is provided with a fin group 120 at a certain interval above the base 100, and the plurality of "U" are passed between the fin group 120 and the base 100. The heat pipes 130 are connected. The fin assembly 120 is formed by stacking a plurality of heat dissipating fins parallel to the base 100, and forming a plurality of airflow passages parallel to the base 100. An axial fan 110 is disposed on each side of the fin assembly 120, and the fan is 110 A blow-and-suction configuration. When the heat dissipation module is in operation, the heat absorbed by the base 100 is transmitted to the fin set 120 via the heat pipe 130, and the heat is taken out by the air flow. Since the base 100 is always a high temperature zone in which heat is accumulated, the airflow generated by the fan 110 does not directly flow through the base 100 and its surroundings, so the heat in the high temperature zone basically depends on the conduction of the heat pipe 130, and if the base 100 is directly Heat dissipation will greatly improve the heat dissipation efficiency. In the foregoing patent, the airflow generated by the two fans 110 is on the same straight line, and most of the airflow is not quickly absorbed by the fan 100 and is quickly sucked out to the outside by the fan 100, and the utilization rate of the airflow of the fan 110 is low; ', the surface of the cymbal is parallel to the pedestal 100, which also affects the Korean platoon I convect. In summary, there is still room for improvement in the government, and the political rate. H H rJn tt\j· 馨: This: It is necessary to provide a heat dissipation module with high heat dissipation efficiency. The number of mutual board sets is used for heat dissipation of electronic components, which includes - a plurality of loose track wires arranged at a plurality of intervals, "a first fin set composed of a stack of pieces, the heat dissipation
成稷數氣流通道』第-籍片組與氣流通道相通 =側分別設有第一和第二風扇，該第-和第二風扇相對 =第且=均朝向電子元科，第一風扇產生之氣』 鰭片組吹向電子元器件方向，第二風扇將氣流抽 硪電子兀器件並經由第一鰭片組排出。The first plurality of airflow passages are connected to the airflow passages. The first and second fans are respectively disposed on the side, and the first and second fans are opposite to each other, and the first fan is generated. The fin group blows toward the electronic component, and the second fan draws the airflow from the electronic device and discharges it through the first fin group.
【發明内容】 與習知技術相比，本發明第—風扇之氣流口朝向電子 兀:件，其所產生之氣流可穿過第—鰭片組直接吹向電子 :益件方向’從而使電子元器件附近之高溫區獲得充分之 氣肌政熱，第一風扇之氣流口亦朝向電子元器彳，其將氣 流抽離電子元ϋ件並穿過第—韓片組排出，由於二風扇之 氣流方向不處於同—直線’使氣流在氣流通道中產生擾 μ可充刀與散熱鯖片換熱，從而提高散熱模組之散熱效 | 〇 * 【實施方式】 本發明第一實施例散熱模組係用於安裝在中央處理器 (圖未示）等發熱電子元器件上以對其進行散熱。 明參閱圖2至圖4，示出本發明的第一實施例之散熱模 1332143 '組10。該散熱模組10包括一導熱基座50、一以一定間距設 ••置於導熱基座50上方之第一鰭片組30、複數連接第一鰭片 -組30和導熱基座50之熱管40、以及分別設置於第一鰭片組 • 30兩側且相對傾斜之第一風扇20和第二風扇22。 導熱基座50大致呈方形，其底面向下延伸形成一大致 呈方形之凸塊52，該凸塊52下表面521用於和發熱電子元器 件相接觸；導熱基座50上表面51中央處與其一側面平行延 伸有一凸肋54，該凸肋54截面為矩形，其兩側分別平行設 * 有二長條狀凹槽53，用於容置熱管40 ;該導熱基座50靠近 四角處設有四螺孔55，用於安裝扣具（圖未示）。 第一散熱鰭片組30由複數散熱鰭片32相互間隔排列組 成，該等散熱鰭片32相對於導熱基座50垂直設置，其由高 導熱係數的銅、鋁等金屬片所製成。每一散熱鰭片32具有 一上緣320、一寬度大於上緣320之下緣322、以及分別與上 緣320和下緣322連接並左右對稱之二斜側緣321、323。每 籲一散熱鰭片32之上緣320為波浪形，具有二波谷及位於二波 谷間之一波峰；下緣322具有二弧形凸緣及位於二弧形凸緣 間之一較小直緣，該直緣垂直彎折延伸出第一折邊324 ;二 斜側緣321、323靠近上下緣320、322部分分別與第一折邊 324同向垂直彎折延伸出第二折邊325和第三折邊327。每一 散熱鰭片32表面靠近斜側緣321、323位置設有左右對稱之 四圓形通孔326，通孔326内緣與第一折邊324同向垂直彎折 延伸出一環形結合邊328，用於供熱管40結合。上述各折邊 324、325、327均具有卡扣結構（圖未示），複數散熱鰭片 1332143 、32通過卡扣結構相互扣合，形成第一鰭片組30。散熱鰭片 -· 32間均為平行間隔設置，形成在散熱鰭片32四緣處均敞開 -之氣流通道，且每一鰭片32之第二及第三折邊325、327組 • 合形成第一斜側面3 4和第二斜側面3 6，該二斜側面3 4、3 6 與發熱電子元器件所處平面所形成之内角均為銳角。 如圖4所示，該第一鰭片組30設置於導熱基座50上方， 散熱鰭片32下緣322與導熱基座50上表面51具有一定間 距，且散熱鰭片32與導熱基座50上表面51垂直。導熱基座 * 50和第一鰭片組30通過上述四熱管40相連接，每一熱管40 大致呈“匚”形，其具有相互平行之一冷凝段41和一蒸發 段42，以及連接二者之一彎折段43。其冷凝段41穿設於每 一散熱鰭片32通孔326中，蒸發段42嵌入於導熱基座50相應 之凹槽53内。 如圖5所示，第一風扇20和第二風扇22均為軸流風扇， 其中第一風扇20安裝於第一斜側面34上，由於第一斜側面 春34與發熱電子元器件所處平面形成之内角為銳角，故第一 風扇20將外部空氣吹入第一鰭片組30後，部分空氣穿過散 熱鰭片32下緣322直接流至導熱基座50上表面51 ;第二風扇 22安裝於第二斜側面36上，其將已吸收熱量之空氣由第一 鰭片組30抽出至散熱模組10外部。與習知技術相比，由於 第一風扇20和弟二風扇22之氣流口均朝向電子元件 5 氣 流可直接吹向及抽離導熱基座50，使導熱基座50較高溫區 獲得充分氣流散熱，並且還可幫助導熱基座50周圍之其他 電子元器件（圖未示）散熱；同時，由於二風扇20、22之SUMMARY OF THE INVENTION Compared with the prior art, the airflow port of the first fan of the present invention faces the electronic component: the airflow generated by the airflow can be directly blown to the electron through the first fin group: The high temperature zone near the component obtains sufficient gas muscle heat, and the airflow port of the first fan also faces the electronic component, which draws the airflow away from the electronic component and passes through the first-Korean group, due to the two fans. The airflow direction is not in the same line—the airflow causes the airflow to generate heat in the airflow channel, and the heat exchange effect of the heat dissipation module is improved. 〇* [Embodiment] The first embodiment of the present invention is a heat dissipation module. The system is installed on a heat-generating electronic component such as a central processing unit (not shown) to dissipate heat. Referring to Figures 2 through 4, a heat sink 1332143 'group 10 of a first embodiment of the present invention is shown. The heat dissipation module 10 includes a heat conducting base 50, a first fin set 30 disposed above the heat conducting base 50, and a heat pipe connecting the first fin group 30 and the heat conducting base 50 at a certain interval. 40. The first fan 20 and the second fan 22 are respectively disposed on the first fin group 30 and relatively inclined. The heat-conducting base 50 has a substantially square shape, and a bottom surface thereof extends downward to form a substantially square projection 52. The lower surface 521 of the projection 52 is for contacting the heat-generating electronic component; the central portion of the upper surface 51 of the heat-conductive base 50 is A rib 54 is extended in parallel with a side surface. The rib 54 has a rectangular cross section, and two sides of the rib 54 are respectively disposed in parallel with each other. The second rib groove 53 is used for accommodating the heat pipe 40. The heat conducting base 50 is disposed near the four corners. Four screw holes 55 for mounting the buckle (not shown). The first heat dissipation fin group 30 is composed of a plurality of heat dissipation fins 32 arranged at a distance from each other. The heat dissipation fins 32 are vertically disposed with respect to the heat conduction base 50, and are made of a metal sheet of copper, aluminum or the like having a high thermal conductivity. Each of the heat dissipation fins 32 has an upper edge 320, a lower edge 322 having a width larger than the upper edge 320, and two oblique side edges 321, 323 which are respectively connected to the upper edge 320 and the lower edge 322 and are bilaterally symmetrical. The upper edge 320 of each of the heat dissipation fins 32 is wavy, has two troughs and one peak between the two troughs; the lower edge 322 has two curved flanges and one of the two curved flanges The straight edge is bent vertically to extend out of the first folded edge 324; the portions of the inclined side edges 321 and 323 adjacent to the upper and lower edges 320 and 322 are respectively bent perpendicularly to the first folded edge 324 to extend the second folded edge 325 and the first Tri-folded edge 327. A circular circular through hole 326 is formed on the surface of each of the heat dissipation fins 32 adjacent to the oblique side edges 321 and 323. The inner edge of the through hole 326 is bent perpendicularly to the first flange 324 to extend an annular joint edge 328. For the heat supply tube 40 to be combined. Each of the hem 324, 325, and 327 has a snap-fit structure (not shown), and the plurality of heat-dissipating fins 1332143 and 32 are fastened to each other by a snap-fit structure to form the first fin set 30. The heat dissipating fins - 32 are arranged in parallel, forming an air flow passage which is open at the four edges of the heat dissipating fins 32, and the second and third hemming edges 325, 327 of each fin 32 are formed. The first oblique side surface 34 and the second oblique side surface 3 6 form an acute angle with the inner angle formed by the plane of the heat-emitting electronic component. As shown in FIG. 4 , the first fin set 30 is disposed above the heat conductive base 50 , and the lower edge 322 of the heat dissipation fin 32 has a certain distance from the upper surface 51 of the heat conductive base 50 , and the heat dissipation fins 32 and the heat dissipation base 50 . The upper surface 51 is vertical. The thermally conductive pedestal * 50 and the first fin set 30 are connected by the above four heat pipes 40, each of the heat pipes 40 having a substantially "匚" shape, having one condensation section 41 and an evaporation section 42 parallel to each other, and connecting the two One of the bent sections 43. The condensation section 41 is disposed in the through hole 326 of each of the heat dissipation fins 32, and the evaporation section 42 is embedded in the corresponding groove 53 of the heat conduction base 50. As shown in FIG. 5, the first fan 20 and the second fan 22 are both axial flow fans, wherein the first fan 20 is mounted on the first inclined side surface 34, because the first oblique side spring 34 and the plane where the heat-generating electronic components are located The inner angle formed is an acute angle. After the first fan 20 blows outside air into the first fin set 30, part of the air flows directly through the lower edge 322 of the heat dissipation fin 32 to the upper surface 51 of the heat conducting base 50. The second fan 22 Mounted on the second oblique side surface 36, the air that has absorbed heat is drawn out of the first fin set 30 to the outside of the heat dissipation module 10. Compared with the prior art, since the airflow ports of the first fan 20 and the second fan 22 are both directed toward the electronic component 5, the airflow can be directly blown and pulled away from the heat conducting base 50, so that the heat conducting base 50 obtains sufficient airflow in the higher temperature zone. And can also help other electronic components (not shown) around the thermal base 50 to dissipate heat; at the same time, due to the two fans 20, 22
UJZ14J 氣流方向不處於同一直線，而是均位於導熱基座观風扇 20 22之輻射線上，使氣流在氣流通道中產生擾流，可更 加充分與散觸片32換熱，從而提高散熱效率。 為使氣流能最大限度得到利用，第-風扇20和第二風 扇22與發熱電子元器件所處平面形成之㈣—般為^度， 即第-風扇20轉軸(圖未示)之軸線與第二風扇22轉軸⑽ 未示）之軸線所形成内角呈9()度，同時，依據不同之需求， 二轴線所形成之内角還可在6〇度至1〇〇度間變化。 如Θ 6所$ &本發明第二實施例。其與第一實施例區 別在於：在導熱基座5〇3靠向第一鰭片組3〇之表面加裝一第 二鰭片組60,以增加散熱面積。第二鰭片組6〇與導熱基座 50a通過焊接方式結合，且該第二韓片組6()中散熱韓片間形 成之氣流通道與第一鰭片組3〇中之氣流通道直接相通。導 熱基座50a上表面5ia之凹槽53a截面為矩形，複數熱管4〇& 具有相應截面形狀之蒸發段42a，其完全容置於凹槽53a 内，從而提供一平坦之表面供第二鰭片組6〇緊密結合，使 導熱基座50a之部分熱量通過該第二鰭片組6〇散發至周圍 空氣中。 可以理解地，還可通過其他方式來增加散熱面積，如 使散熱鰭片下緣延伸至導熱基座上表面。 如圖7所示，為本發明之第三實施例。其與第一實施例 之£別在於.政熱鰭片3 2b表面大致為矩形，其兩側分別設 置二獨立支架212、214 ’二支架212、214具有一垂直側面 11 1332143 面斜側面，垂直側面與第'，片組働相應側 之；二1 開口供氣流通過；斜側面用於安裝相應 =二2,其亦設有一供氣流通過之開口。可通過支 ^求14簠活調節風扇2〇、22之氣流方向以滿足不同之 =8所示’為本發明之第四實施例。其與第一實施例 =散熱籍片似氣流通道入口之-斜側緣323。為 一韓片組*和第一風扇2〇間形成一氣流緩衝 區，攸而降低工作之噪音。 綜上所述，本發明確已符合發明專利之 ，出專射請。惟，以上所述者僅為本發明之較佳實施例， 自不能以此限制本案之中請專利範圍。舉凡熟悉本宰技蔽 =人士援依本發明之精神所作之等效㈣或變化 涵 盖於以下申請專利範圍内。 ‘ 【圖式簡單說明】 圖1係一習知散熱模組之示意圖。 圖2係本發明第一實施例散熱模組之立體組合圖。 解圖 圖3係本發明第一實施例散熱模組未含風扇之立體分 〇 圖。 圖4係本發明第一實施例散熱模組未含風扇 之左側視 圖5係本發明第一實施例散熱模組之氣流走向圖 圖6係本發明第二實施例散熱模組之剖面圖。 12 1332143 圖7係本發明第三實施例散熱模組之剖面圖。 圖8係本發明第四實施例散熱模組之剖面及氣流走向The UJZ14J airflow directions are not in the same straight line, but are located on the radiation line of the heat-conducting base observation fan 20 22, so that the airflow generates a turbulence in the airflow passage, which can further fully exchange heat with the contact strip 32, thereby improving the heat dissipation efficiency. In order to maximize the utilization of the airflow, the fourth fan 20 and the second fan 22 are formed with the plane of the heat-generating electronic component (4), that is, the axis of the first fan 20 (not shown) and the first The inner angle formed by the axis of the second fan 22 shaft (10) is 9 () degrees, and the inner angle formed by the two axes can also vary between 6 degrees and 1 degree according to different requirements. For example, the second embodiment of the present invention. It differs from the first embodiment in that a second fin set 60 is attached to the surface of the first fin set 3A at the thermally conductive base 5〇3 to increase the heat dissipation area. The second fin group 6〇 is coupled to the heat conduction base 50a by welding, and the air flow passage formed between the heat dissipation Korean sheets in the second Korean sheet group 6() is directly connected to the air flow passage in the first fin group 3〇. . The groove 53a of the upper surface 5ia of the heat-conducting base 50a has a rectangular cross section, and the plurality of heat pipes 4〇& the evaporation section 42a having a corresponding sectional shape, which is completely accommodated in the groove 53a, thereby providing a flat surface for the second fin The sheet set 6 is tightly coupled such that a portion of the heat of the thermally conductive base 50a is dissipated into the surrounding air through the second fin set 6〇. It can be understood that the heat dissipation area can be increased by other means, such as extending the lower edge of the heat dissipation fin to the upper surface of the heat conduction base. As shown in Fig. 7, it is a third embodiment of the present invention. It is different from the first embodiment in that the surface of the political fin 3 2b is substantially rectangular, and two independent brackets 212, 214 are disposed on two sides thereof. The two brackets 212 and 214 have a vertical side surface 11 1332143. The side is opposite to the first side, the corresponding side of the sheet group; the opening 1 is for the airflow; the oblique side is for the corresponding installation = 2, which also has an opening for the airflow to pass through. The fourth embodiment of the present invention can be made by adjusting the direction of the airflow of the fans 2, 22 to satisfy the difference of =8. It is the same as the first embodiment = heat sinking sheet-like airflow path inlet - oblique side edge 323. A flow buffer zone is formed between the Han group* and the first fan 2, thereby reducing the noise of the work. In summary, the present invention has indeed met the invention patent, and the special shot is requested. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent in this case. The equivalents (4) or variations made by persons in accordance with the spirit of the present invention are within the scope of the following patent application. ‘ [Simple description of the diagram] Figure 1 is a schematic diagram of a conventional heat dissipation module. 2 is a perspective assembled view of a heat dissipation module according to a first embodiment of the present invention. Figure 3 is a perspective view of a heat dissipation module of the first embodiment of the present invention without a fan. 4 is a left side view of the heat dissipation module of the first embodiment of the present invention. FIG. 6 is a cross-sectional view of the heat dissipation module of the second embodiment of the present invention. FIG. 12 1332143 FIG. 7 is a cross-sectional view showing a heat dissipation module according to a third embodiment of the present invention. 8 is a cross-section and airflow direction of a heat dissipation module according to a fourth embodiment of the present invention;
【主要元件符號說明】 (本發明） 散熱模組 10 第一風扇 20 第.一風扇 22 第一韓片組 30,30b,30c 散熱鰭片 32,32b，32c 上緣 320 下緣 322 斜側緣 321,323,323c 第一折邊 324 第二折邊 325 第三折邊 327 通孔 326 環形結合邊 328 第一斜側面 34 第二斜側面 36 献管 ”、、P 40,40a 冷凝段 41 蒸發段 42,42a 彎折段 43 導熱基座 50,50a 上表面 51,51a 下表面 52 凹槽 53,53a 凸肋 54 螺孔 55 支架 212,214 (習知） 底座 100 風扇 110 籍片組 120 敎管 #、、、 & 130[Main component symbol description] (Invention) Thermal module 10 First fan 20 First fan 22 First Korean group 30, 30b, 30c Heat sink fins 32, 32b, 32c Upper edge 320 Lower edge 322 Oblique side edge 321,323,323c first flange 324 second flange 325 third flange 327 through hole 326 annular joint edge 328 first oblique side 34 second oblique side 36 pipe "," P 40, 40a condensation section 41 evaporation section 42, 42a bending section 43 heat-conducting base 50, 50a upper surface 51, 51a lower surface 52 groove 53, 53a rib 54 screw hole 55 bracket 212, 214 (conventional) base 100 fan 110 film group 120 tube #,,, & 130
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