TWI343770B - - Google Patents

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Info

Publication number: TWI343770B
Authority: TW; Taiwan
Prior art keywords: soft; board; hard; area; layer
Prior art date: 2008-04-09

Application number

TW97112767A

Other languages

English (en)

Chinese (zh)

Other versions

TW200944078A (en

Inventor

Timms Ian

Original Assignee

Compeq Mfg Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2008-04-09

Filing date

2008-04-09

Publication date

2011-06-11

2008-04-09 Application filed by Compeq Mfg Co Ltd filed Critical Compeq Mfg Co Ltd

2008-04-09 Priority to TW97112767A priority Critical patent/TW200944078A/zh

2009-10-16 Publication of TW200944078A publication Critical patent/TW200944078A/zh

2011-06-11 Application granted granted Critical

2011-06-11 Publication of TWI343770B publication Critical patent/TWI343770B/zh

Links

238000000034 method Methods 0.000 claims description 49
239000000758 substrate Substances 0.000 claims description 47
239000010410 layer Substances 0.000 claims description 45
238000004519 manufacturing process Methods 0.000 claims description 21
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 20
229910052802 copper Inorganic materials 0.000 claims description 18
239000010949 copper Substances 0.000 claims description 18
239000003292 glue Substances 0.000 claims description 8
238000005553 drilling Methods 0.000 claims description 4
239000000463 material Substances 0.000 claims description 4
238000003825 pressing Methods 0.000 claims description 4
238000005520 cutting process Methods 0.000 claims description 3
238000009713 electroplating Methods 0.000 claims description 2
239000011229 interlayer Substances 0.000 claims description 2
229910000831 Steel Inorganic materials 0.000 claims 1
230000005611 electricity Effects 0.000 claims 1
238000004513 sizing Methods 0.000 claims 1
239000010959 steel Substances 0.000 claims 1
230000001788 irregular Effects 0.000 description 6
238000005516 engineering process Methods 0.000 description 5
238000004026 adhesive bonding Methods 0.000 description 2
238000010586 diagram Methods 0.000 description 2
238000003475 lamination Methods 0.000 description 2
238000002360 preparation method Methods 0.000 description 2
239000002131 composite material Substances 0.000 description 1
230000006870 function Effects 0.000 description 1
239000011159 matrix material Substances 0.000 description 1
239000000203 mixture Substances 0.000 description 1
238000007747 plating Methods 0.000 description 1

Landscapes

Laminated Bodies (AREA)
Structure Of Printed Boards (AREA)

TW97112767A 2008-04-09 2008-04-09 A manufacturing method for a soft-hard board TW200944078A (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
TW97112767A TW200944078A (en)	2008-04-09	2008-04-09	A manufacturing method for a soft-hard board

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
TW97112767A TW200944078A (en)	2008-04-09	2008-04-09	A manufacturing method for a soft-hard board

Publications (2)

Publication Number	Publication Date
TW200944078A TW200944078A (en)	2009-10-16
TWI343770B true TWI343770B (de)	2011-06-11

Family

ID=44869170

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW97112767A TW200944078A (en)	2008-04-09	2008-04-09	A manufacturing method for a soft-hard board

Country Status (1)

Country	Link
TW (1)	TW200944078A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI649016B (zh) *	2018-03-26	2019-01-21	同泰電子科技股份有限公司	軟硬複合板及其製法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN103327738B (zh) *	2012-03-22	2016-03-09	富葵精密组件(深圳)有限公司	软硬结合电路板及其制作方法
TWI458404B (zh) *	2012-05-30	2014-10-21	Mektec Corp	雙面可撓性基板片連接成捲之製程與結構
CN103458624B (zh) *	2012-06-01	2017-05-17	旗胜科技股份有限公司	双面可挠性基板片连接成卷的工艺
CN114286543B (zh) *	2021-12-24	2026-02-06	江西强达电路科技有限公司	一种硬板被软板围捕的软硬结合板制造方法

2008
- 2008-04-09 TW TW97112767A patent/TW200944078A/zh unknown

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI649016B (zh) *	2018-03-26	2019-01-21	同泰電子科技股份有限公司	軟硬複合板及其製法

Also Published As

Publication number	Publication date
TW200944078A (en)	2009-10-16

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