TWI362397B - - Google Patents

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Publication number
TWI362397B
TWI362397B TW096130023A TW96130023A TWI362397B TW I362397 B TWI362397 B TW I362397B TW 096130023 A TW096130023 A TW 096130023A TW 96130023 A TW96130023 A TW 96130023A TW I362397 B TWI362397 B TW I362397B
Authority
TW
Taiwan
Prior art keywords
group
hydrogen atom
carbon atoms
general formula
alkyl group
Prior art date
Application number
TW096130023A
Other languages
English (en)
Chinese (zh)
Other versions
TW200815492A (en
Inventor
Nobutoshi Sasaki
Toshio Fujita
Hiroshi Uchida
Original Assignee
Showa Denko Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko Kk filed Critical Showa Denko Kk
Publication of TW200815492A publication Critical patent/TW200815492A/zh
Application granted granted Critical
Publication of TWI362397B publication Critical patent/TWI362397B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02Silicon compounds
    • C07F7/08Compounds having one or more C—Si linkages
    • C07F7/18Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02Silicon compounds
    • C07F7/08Compounds having one or more C—Si linkages
    • C07F7/18Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
    • C07F7/1804Compounds having Si-O-C linkages
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S525/00Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S525/934Powdered coating composition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Compounds (AREA)
  • Epoxy Resins (AREA)
TW096130023A 2006-08-15 2007-08-14 Novel epoxy compound and process for production thereof TW200815492A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006221648 2006-08-15

Publications (2)

Publication Number Publication Date
TW200815492A TW200815492A (en) 2008-04-01
TWI362397B true TWI362397B (2) 2012-04-21

Family

ID=39082158

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096130023A TW200815492A (en) 2006-08-15 2007-08-14 Novel epoxy compound and process for production thereof

Country Status (7)

Country Link
US (1) US7880018B2 (2)
EP (1) EP2055708B1 (2)
JP (1) JP5153635B2 (2)
KR (1) KR101013394B1 (2)
CN (1) CN101501047B (2)
TW (1) TW200815492A (2)
WO (1) WO2008020637A1 (2)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5266248B2 (ja) * 2007-11-07 2013-08-21 昭和電工株式会社 エポキシ基含有オルガノシロキサン化合物
EP2270020B1 (en) * 2008-03-24 2014-03-19 Showa Denko K.K. Epoxy compound and process for producing the epoxy compound
JP5210122B2 (ja) * 2008-10-31 2013-06-12 昭和電工株式会社 接着剤用硬化性組成物
JP5149126B2 (ja) * 2008-11-07 2013-02-20 昭和電工株式会社 半導体封止用硬化性組成物
US8957136B2 (en) * 2010-08-11 2015-02-17 Showa Denko K.K. Epoxysilicone condensate, curable composition comprising condensate, and cured product thereof
US20160032148A1 (en) * 2013-03-15 2016-02-04 Dow Corning Corporation A method for making an optical assembly comprising depositing a solid silicone-containing hot melt composition in powder form and forming an encapsulant thereof
CN105669738A (zh) * 2016-01-19 2016-06-15 南昌大学 一种改性硅烷偶联剂的制备方法
JPWO2023008493A1 (2) * 2021-07-29 2023-02-02
CN119798304B (zh) * 2024-12-31 2025-10-10 苏州高泰电子技术股份有限公司 一种耐高温硅烷偶联剂及其制备方法和应用

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5580430A (en) 1978-12-13 1980-06-17 Teijin Ltd Preparation of polyester
JPS58222160A (ja) * 1982-06-16 1983-12-23 Tokuyama Soda Co Ltd コ−テイング用組成物
US5206328A (en) * 1990-02-08 1993-04-27 Shin-Etsu Chemical Co., Ltd. Process for the production of an organopolysiloxane
JPH03255130A (ja) 1990-03-05 1991-11-14 Shin Etsu Chem Co Ltd エポキシ基含有オルガノポリシロキサンの製造方法
US6080872A (en) * 1997-12-16 2000-06-27 Lonza S.P.A. Cycloaliphatic epoxy compounds
WO2003084928A1 (en) * 2002-04-08 2003-10-16 Ranbaxy Laboratories Limited Alpha, omega-dicarboximide derivatives as useful uro-selective α1α adrenoceptor blockers
US7244473B2 (en) * 2003-04-22 2007-07-17 Konica Minolta Medical & Graphic, Inc. Active ray curable ink-jet composition, image forming method using the same, ink-jet recording apparatus, and triarylsulfonium salt compound
FI116844B (fi) * 2004-03-22 2006-03-15 Valtion Teknillinen Reaktiiviset kalvonmuodostajat
CN100569209C (zh) * 2004-07-14 2009-12-16 3M创新有限公司 包括环氧乙烷单体的牙科组合物

Also Published As

Publication number Publication date
CN101501047B (zh) 2011-12-14
KR101013394B1 (ko) 2011-02-14
US7880018B2 (en) 2011-02-01
EP2055708A1 (en) 2009-05-06
JP5153635B2 (ja) 2013-02-27
EP2055708A4 (en) 2011-01-26
US20100197936A1 (en) 2010-08-05
JPWO2008020637A1 (ja) 2010-01-07
TW200815492A (en) 2008-04-01
KR20090024827A (ko) 2009-03-09
CN101501047A (zh) 2009-08-05
EP2055708B1 (en) 2013-07-17
WO2008020637A1 (en) 2008-02-21

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees