TWI366706B - Semiconductor substrate defects detection device and method of detection of defects - Google Patents
Semiconductor substrate defects detection device and method of detection of defectsInfo
- Publication number
- TWI366706B TWI366706B TW096123471A TW96123471A TWI366706B TW I366706 B TWI366706 B TW I366706B TW 096123471 A TW096123471 A TW 096123471A TW 96123471 A TW96123471 A TW 96123471A TW I366706 B TWI366706 B TW I366706B
- Authority
- TW
- Taiwan
- Prior art keywords
- defects
- detection
- semiconductor substrate
- detection device
- substrate defects
- Prior art date
Links
- 230000007547 defect Effects 0.000 title 2
- 238000001514 detection method Methods 0.000 title 2
- 238000000034 method Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/958—Inspecting transparent materials or objects, e.g. windscreens
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1306—Details
- G02F1/1309—Repairing; Testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8854—Grading and classifying of flaws
- G01N2021/8858—Flaw counting
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Biochemistry (AREA)
- Immunology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Pathology (AREA)
- General Health & Medical Sciences (AREA)
- Health & Medical Sciences (AREA)
- Nonlinear Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Signal Processing (AREA)
- Optics & Photonics (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- General Factory Administration (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006183112 | 2006-07-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200809316A TW200809316A (en) | 2008-02-16 |
| TWI366706B true TWI366706B (en) | 2012-06-21 |
Family
ID=39035649
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096123471A TWI366706B (en) | 2006-07-03 | 2007-06-28 | Semiconductor substrate defects detection device and method of detection of defects |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR100882252B1 (en) |
| CN (1) | CN101101266A (en) |
| TW (1) | TWI366706B (en) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012073558A1 (en) | 2010-11-29 | 2012-06-07 | 大日本印刷株式会社 | Substrate for evaluation, defect inspection method and defect inspection apparatus |
| JP6165658B2 (en) | 2014-03-20 | 2017-07-19 | 株式会社東芝 | Manufacturing apparatus management system and manufacturing apparatus management method |
| JP2015190890A (en) * | 2014-03-28 | 2015-11-02 | シャープ株式会社 | Defect determination apparatus and defect determination method |
| JP6641093B2 (en) * | 2015-03-20 | 2020-02-05 | 住友化学株式会社 | Defect inspection method for optical film and laminated optical film |
| JP6749894B2 (en) * | 2015-04-09 | 2020-09-02 | 住友化学株式会社 | Defect inspection method for laminated optical film, optical film defect inspection method, and laminated optical film manufacturing method |
| CN104730217B (en) * | 2015-04-16 | 2016-09-07 | 京东方科技集团股份有限公司 | The defect distribution display methods of a kind of glass substrate and display device |
| KR102007959B1 (en) * | 2015-09-08 | 2019-08-06 | 주식회사 엘지화학 | Method of Analyzing Polarizer Defect Through Projection Analysis |
| JP6010674B1 (en) | 2015-09-18 | 2016-10-19 | 住友化学株式会社 | Film manufacturing method and film manufacturing apparatus |
| CN109387961B (en) * | 2018-11-07 | 2020-11-24 | 惠科股份有限公司 | Detection method and detection equipment for display panel |
| CN110095590A (en) * | 2019-04-23 | 2019-08-06 | 深圳市华星光电半导体显示技术有限公司 | Glass substrate residual material method for detecting and device |
| CN110441501B (en) * | 2019-06-27 | 2023-03-21 | 北海惠科光电技术有限公司 | Detection method and detection system |
| CN111261078A (en) * | 2020-03-24 | 2020-06-09 | 深圳市华星光电半导体显示技术有限公司 | Detection method and detection device for display panel |
| CN115360111A (en) * | 2022-08-24 | 2022-11-18 | 厦门士兰集科微电子有限公司 | Wafer abnormity early warning method |
| CN115360112A (en) * | 2022-08-24 | 2022-11-18 | 厦门士兰集科微电子有限公司 | Wafer abnormity early warning method |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05126755A (en) * | 1991-10-31 | 1993-05-21 | Toshiba Corp | Pattern defect inspection system |
| KR100315915B1 (en) * | 1999-01-05 | 2001-12-12 | 윤종용 | an auto system of detecting glass defect and a control method thereof |
| JP2002303587A (en) | 2001-04-03 | 2002-10-18 | Nec Kansai Ltd | Visual inspection method and device |
-
2007
- 2007-06-28 TW TW096123471A patent/TWI366706B/en not_active IP Right Cessation
- 2007-06-29 KR KR1020070065521A patent/KR100882252B1/en not_active Expired - Fee Related
- 2007-07-02 CN CNA2007101269744A patent/CN101101266A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN101101266A (en) | 2008-01-09 |
| KR100882252B1 (en) | 2009-02-06 |
| KR20080003719A (en) | 2008-01-08 |
| TW200809316A (en) | 2008-02-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI366706B (en) | Semiconductor substrate defects detection device and method of detection of defects | |
| TWI349968B (en) | Substrate processing device and substrate processing method thereof | |
| TWI365982B (en) | Method and device for inspecting defects of electroluminescence display device and method of manufacturing electroluminescence display device using the same | |
| TWI372298B (en) | Inspection method of substrate, substrate inspection system, and manufacturing method of display device | |
| TWI365490B (en) | Semiconductor device and method for manufacturing same | |
| TWI348020B (en) | Semiconductor sensor device and manufacturing method thereof | |
| TWI349981B (en) | Semiconductor device and manufacturing method thereof | |
| TWI370508B (en) | Substrate processing apparatus and substrate processing method | |
| TWI341589B (en) | Semiconductor device and manufacturing method of the same | |
| EP2088442A4 (en) | Parallel test circuit and method and semiconductor device | |
| TWI341594B (en) | Semiconductor device and method of manufacturing the same | |
| TWI318002B (en) | Semiconductor device and manufacturing method thereof | |
| TWI365508B (en) | Manufacturing method of semiconductor device | |
| TWI373067B (en) | Substrate processing method and substrate processing device | |
| TWI371095B (en) | Semiconductor device and method of manufacturing the same | |
| TWI339878B (en) | Semiconductor device and fabrication method thereof | |
| TWI340428B (en) | Semiconductor device and fabrication process thereof | |
| EP1979705A4 (en) | Method and measuring device for measuring translation of surface | |
| KR101125913B9 (en) | Method and device for monitoring the contamination of substrate wafers | |
| TWI346776B (en) | Method and system for detecting non-uniformmities of a semiconductor wafer | |
| IL214829A0 (en) | Device and method for inspecting semiconductor wafers | |
| NO20075216L (en) | Device and method for detecting the presence of an object | |
| FR2931295B1 (en) | DEVICE AND METHOD FOR INSPECTING SEMICONDUCTOR WAFERS | |
| TWI351074B (en) | Semiconductor device and method for manufacturing semiconductor device | |
| IL195951A0 (en) | Semiconductor device and manufacturing method of semiconductor device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |