TWI367718B - Heat dissipating device and heat dissipating method - Google Patents

Heat dissipating device and heat dissipating method

Info

Publication number
TWI367718B
TWI367718B TW097105860A TW97105860A TWI367718B TW I367718 B TWI367718 B TW I367718B TW 097105860 A TW097105860 A TW 097105860A TW 97105860 A TW97105860 A TW 97105860A TW I367718 B TWI367718 B TW I367718B
Authority
TW
Taiwan
Prior art keywords
heat dissipating
dissipating device
dissipating method
heat
dissipating
Prior art date
Application number
TW097105860A
Other languages
Chinese (zh)
Other versions
TW200938064A (en
Inventor
Chung Cheng Chou
Wai Wang
Ta Yuan Lee
Original Assignee
Raydium Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raydium Semiconductor Corp filed Critical Raydium Semiconductor Corp
Priority to TW097105860A priority Critical patent/TWI367718B/en
Publication of TW200938064A publication Critical patent/TW200938064A/en
Application granted granted Critical
Publication of TWI367718B publication Critical patent/TWI367718B/en

Links

TW097105860A 2008-02-20 2008-02-20 Heat dissipating device and heat dissipating method TWI367718B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW097105860A TWI367718B (en) 2008-02-20 2008-02-20 Heat dissipating device and heat dissipating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW097105860A TWI367718B (en) 2008-02-20 2008-02-20 Heat dissipating device and heat dissipating method

Publications (2)

Publication Number Publication Date
TW200938064A TW200938064A (en) 2009-09-01
TWI367718B true TWI367718B (en) 2012-07-01

Family

ID=44867194

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097105860A TWI367718B (en) 2008-02-20 2008-02-20 Heat dissipating device and heat dissipating method

Country Status (1)

Country Link
TW (1) TWI367718B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9735089B2 (en) * 2015-09-24 2017-08-15 Intel Corporation Thermal management for flexible integrated circuit packages
CN113873842B (en) * 2021-09-28 2022-06-07 北京大学 Heat dissipation device and heat dissipation regulation and control method
CN115297695B (en) * 2022-08-31 2024-05-17 西安电子科技大学 Pump and radiator integrated micro-channel radiator

Also Published As

Publication number Publication date
TW200938064A (en) 2009-09-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees