TWI369727B - Substrate processing apparatus - Google Patents

Substrate processing apparatus

Info

Publication number
TWI369727B
TWI369727B TW096107437A TW96107437A TWI369727B TW I369727 B TWI369727 B TW I369727B TW 096107437 A TW096107437 A TW 096107437A TW 96107437 A TW96107437 A TW 96107437A TW I369727 B TWI369727 B TW I369727B
Authority
TW
Taiwan
Prior art keywords
processing apparatus
substrate processing
substrate
processing
Prior art date
Application number
TW096107437A
Other languages
English (en)
Other versions
TW200802571A (en
Inventor
Masahiro Kimura
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200802571A publication Critical patent/TW200802571A/zh
Application granted granted Critical
Publication of TWI369727B publication Critical patent/TWI369727B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
TW096107437A 2006-03-31 2007-03-05 Substrate processing apparatus TWI369727B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006098132A JP2007273758A (ja) 2006-03-31 2006-03-31 基板処理装置

Publications (2)

Publication Number Publication Date
TW200802571A TW200802571A (en) 2008-01-01
TWI369727B true TWI369727B (en) 2012-08-01

Family

ID=38556790

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096107437A TWI369727B (en) 2006-03-31 2007-03-05 Substrate processing apparatus

Country Status (5)

Country Link
US (1) US20070227032A1 (zh)
JP (1) JP2007273758A (zh)
KR (1) KR100830011B1 (zh)
CN (1) CN100514555C (zh)
TW (1) TWI369727B (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006137330A1 (ja) 2005-06-22 2006-12-28 Tokyo Electron Limited 基板処理装置および基板処理方法
CN101561218B (zh) * 2008-04-16 2010-12-08 富葵精密组件(深圳)有限公司 真空氮气烘箱
US20130081301A1 (en) * 2011-09-30 2013-04-04 Applied Materials, Inc. Stiction-free drying of high aspect ratio devices
CN105665339B (zh) * 2016-02-17 2018-04-06 上海华力微电子有限公司 一种用于槽型湿法设备的干燥装置及干燥方法
JP2017157800A (ja) * 2016-03-04 2017-09-07 東京エレクトロン株式会社 液処理方法、基板処理装置、及び記憶媒体
TWI645913B (zh) * 2016-11-10 2019-01-01 辛耘企業股份有限公司 液體製程裝置
CN110307698B (zh) * 2018-03-27 2020-10-23 创意电子股份有限公司 烘干设备
CN112420485B (zh) * 2019-08-21 2023-03-31 长鑫存储技术有限公司 晶圆加工方法
JP7594883B2 (ja) * 2020-11-06 2024-12-05 東京エレクトロン株式会社 基板処理装置及び基板処理方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5954911A (en) * 1995-10-12 1999-09-21 Semitool, Inc. Semiconductor processing using vapor mixtures
KR100205518B1 (ko) * 1996-08-31 1999-07-01 구자홍 노광장치 및 노광방법
KR100366479B1 (ko) * 1996-11-26 2004-03-20 주식회사 코오롱 태양광선 제어 필름
JP3585199B2 (ja) * 1997-03-31 2004-11-04 大日本スクリーン製造株式会社 基板処理装置
US5884640A (en) * 1997-08-07 1999-03-23 Applied Materials, Inc. Method and apparatus for drying substrates
US6401353B2 (en) * 2000-03-08 2002-06-11 Dainippon Screen Mfg. Co., Ltd. Substrate dryer
US7384484B2 (en) * 2002-11-18 2008-06-10 Dainippon Screen Mfg. Co., Ltd. Substrate processing method, substrate processing apparatus and substrate processing system
DE10256696A1 (de) * 2002-12-04 2004-06-24 Mattson Wet Products Gmbh Verfahren zum Trocknen von Substraten
US7637029B2 (en) * 2005-07-08 2009-12-29 Tokyo Electron Limited Vapor drying method, apparatus and recording medium for use in the method

Also Published As

Publication number Publication date
JP2007273758A (ja) 2007-10-18
KR20070098532A (ko) 2007-10-05
CN100514555C (zh) 2009-07-15
CN101047116A (zh) 2007-10-03
TW200802571A (en) 2008-01-01
US20070227032A1 (en) 2007-10-04
KR100830011B1 (ko) 2008-05-15

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