TWI372003B - Printed circuit board and fabricating method of the same - Google Patents

Printed circuit board and fabricating method of the same

Info

Publication number
TWI372003B
TWI372003B TW096126295A TW96126295A TWI372003B TW I372003 B TWI372003 B TW I372003B TW 096126295 A TW096126295 A TW 096126295A TW 96126295 A TW96126295 A TW 96126295A TW I372003 B TWI372003 B TW I372003B
Authority
TW
Taiwan
Prior art keywords
same
circuit board
printed circuit
fabricating method
fabricating
Prior art date
Application number
TW096126295A
Other languages
English (en)
Other versions
TW200906248A (en
Inventor
Dong Sun Kim
Tae Hoon Kim
Jong Seok Song
Sam Jin Her
Jun Heyoung Park
Original Assignee
Samsung Electro Mech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mech filed Critical Samsung Electro Mech
Priority to TW096126295A priority Critical patent/TWI372003B/zh
Publication of TW200906248A publication Critical patent/TW200906248A/zh
Application granted granted Critical
Publication of TWI372003B publication Critical patent/TWI372003B/zh

Links

TW096126295A 2007-07-19 2007-07-19 Printed circuit board and fabricating method of the same TWI372003B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW096126295A TWI372003B (en) 2007-07-19 2007-07-19 Printed circuit board and fabricating method of the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096126295A TWI372003B (en) 2007-07-19 2007-07-19 Printed circuit board and fabricating method of the same

Publications (2)

Publication Number Publication Date
TW200906248A TW200906248A (en) 2009-02-01
TWI372003B true TWI372003B (en) 2012-09-01

Family

ID=44723060

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096126295A TWI372003B (en) 2007-07-19 2007-07-19 Printed circuit board and fabricating method of the same

Country Status (1)

Country Link
TW (1) TWI372003B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108684151A (zh) * 2018-06-29 2018-10-19 南京大学 一种ptfe基pcb覆铜板及覆铜方法

Also Published As

Publication number Publication date
TW200906248A (en) 2009-02-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees