TWI376003B - - Google Patents

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Publication number
TWI376003B
TWI376003B TW097133831A TW97133831A TWI376003B TW I376003 B TWI376003 B TW I376003B TW 097133831 A TW097133831 A TW 097133831A TW 97133831 A TW97133831 A TW 97133831A TW I376003 B TWI376003 B TW I376003B
Authority
TW
Taiwan
Prior art keywords
bare
die
detecting device
transparent glass
image
Prior art date
Application number
TW097133831A
Other languages
English (en)
Chinese (zh)
Other versions
TW201011849A (en
Original Assignee
King Yuan Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by King Yuan Electronics Co Ltd filed Critical King Yuan Electronics Co Ltd
Priority to TW097133831A priority Critical patent/TW201011849A/zh
Priority to JP2008271129A priority patent/JP4767302B2/ja
Priority to KR1020080115156A priority patent/KR101043705B1/ko
Publication of TW201011849A publication Critical patent/TW201011849A/zh
Application granted granted Critical
Publication of TWI376003B publication Critical patent/TWI376003B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like

Landscapes

  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Die Bonding (AREA)
TW097133831A 2008-09-03 2008-09-03 Bare die dual-face detector TW201011849A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW097133831A TW201011849A (en) 2008-09-03 2008-09-03 Bare die dual-face detector
JP2008271129A JP4767302B2 (ja) 2008-09-03 2008-10-21 ベアチップ用両面検査設備
KR1020080115156A KR101043705B1 (ko) 2008-09-03 2008-11-19 다이용 양면 검사 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW097133831A TW201011849A (en) 2008-09-03 2008-09-03 Bare die dual-face detector

Publications (2)

Publication Number Publication Date
TW201011849A TW201011849A (en) 2010-03-16
TWI376003B true TWI376003B (de) 2012-11-01

Family

ID=42178831

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097133831A TW201011849A (en) 2008-09-03 2008-09-03 Bare die dual-face detector

Country Status (3)

Country Link
JP (1) JP4767302B2 (de)
KR (1) KR101043705B1 (de)
TW (1) TW201011849A (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106483126B (zh) * 2015-08-27 2019-12-24 京元电子股份有限公司 半导体元件影像测试装置及其测试设备
JP6903268B2 (ja) * 2016-12-27 2021-07-14 株式会社Ｎｓテクノロジーズ 電子部品搬送装置および電子部品検査装置
JP6849468B2 (ja) * 2017-02-13 2021-03-24 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
ES2976434T3 (es) * 2020-01-24 2024-08-01 Becton Dickinson Rowa Germany Gmbh Dispositivo y procedimiento para identificar, medir y posicionar mercancías en piezas
CN112129700B (zh) * 2020-09-01 2024-03-01 真贺科技(江苏)有限公司 一种柔性电路板的图像检测方法及检测装置
CN112213936B (zh) * 2020-09-28 2022-05-10 深圳市深科达智能装备股份有限公司 一种应用于圆形产品贴合的定位装置及定位方法
TWI756142B (zh) * 2021-06-15 2022-02-21 博磊科技股份有限公司 基板切斷裝置及基板切斷裝置的作動方法
CN113394139B (zh) * 2021-06-25 2025-10-31 佛山缔乐视觉科技有限公司 一种led封装缺陷的检测设备
TWI780930B (zh) * 2021-09-27 2022-10-11 由田新技股份有限公司 以載盤為基礎的半導體檢測設備以及其半導體分類檢測系統
CN115106300B (zh) * 2022-08-11 2026-02-10 深圳市标王工业设备有限公司 芯片检测分选机
CN116399265A (zh) * 2023-03-17 2023-07-07 莆田市荣兴机械有限公司 Pcu中盖双面检测设备及其检测方法
CN116482851B (zh) * 2023-04-23 2026-01-23 上海积塔半导体有限公司 一种热点定位辅助装置及方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH083473B2 (ja) * 1988-05-31 1996-01-17 松下電子工業株式会社 外観検査装置
JP2891825B2 (ja) * 1992-07-27 1999-05-17 大日本スクリーン製造株式会社 パターン検査装置
JP4203164B2 (ja) * 1998-01-27 2008-12-24 大日本印刷株式会社 金属薄板検査方法及び装置
JP3855733B2 (ja) * 2001-10-30 2006-12-13 株式会社村田製作所 電子部品の外観検査装置および外観検査方法
JP2003232750A (ja) * 2002-02-06 2003-08-22 Toshiba Corp 外観検査装置および方法
WO2003075027A1 (en) 2002-03-07 2003-09-12 Yamaha Motor Co., Ltd. Electronic part inspection device
KR20060041454A (ko) * 2004-11-09 2006-05-12 삼성전자주식회사 칩 외관 자동검사 장치
JP4534025B2 (ja) * 2004-11-30 2010-09-01 ルネサスエレクトロニクス株式会社 外観検査装置および外観検査装置用搬送部
KR100833716B1 (ko) 2007-03-30 2008-05-29 (주) 인텍플러스 반도체 소자 비전 검사 시스템

Also Published As

Publication number Publication date
JP2010062508A (ja) 2010-03-18
JP4767302B2 (ja) 2011-09-07
TW201011849A (en) 2010-03-16
KR101043705B1 (ko) 2011-06-22
KR20100027930A (ko) 2010-03-11

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