TWI384174B - - Google Patents
Info
- Publication number
- TWI384174B TWI384174B TW99125314A TW99125314A TWI384174B TW I384174 B TWI384174 B TW I384174B TW 99125314 A TW99125314 A TW 99125314A TW 99125314 A TW99125314 A TW 99125314A TW I384174 B TWI384174 B TW I384174B
- Authority
- TW
- Taiwan
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW99125314A TW201204991A (en) | 2010-07-30 | 2010-07-30 | Molding method and structure of LED lamp heat sink with micro/nano metal and graphite |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW99125314A TW201204991A (en) | 2010-07-30 | 2010-07-30 | Molding method and structure of LED lamp heat sink with micro/nano metal and graphite |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201204991A TW201204991A (en) | 2012-02-01 |
| TWI384174B true TWI384174B (fr) | 2013-02-01 |
Family
ID=46761463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW99125314A TW201204991A (en) | 2010-07-30 | 2010-07-30 | Molding method and structure of LED lamp heat sink with micro/nano metal and graphite |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201204991A (fr) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1551339A (zh) * | 2003-04-14 | 2004-12-01 | ���弼����˾ | 附加了导热性能的树脂基材料制造的热处置器件或散热片 |
| TW201017045A (en) * | 2008-10-24 | 2010-05-01 | Flex So Tech Co Ltd | High-performance heat dissipation device and method for manufacturing the same |
| TWM383090U (en) * | 2010-02-12 | 2010-06-21 | zhi-ming You | LED lamp with enhanced heat dissipation |
-
2010
- 2010-07-30 TW TW99125314A patent/TW201204991A/zh not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1551339A (zh) * | 2003-04-14 | 2004-12-01 | ���弼����˾ | 附加了导热性能的树脂基材料制造的热处置器件或散热片 |
| TW201017045A (en) * | 2008-10-24 | 2010-05-01 | Flex So Tech Co Ltd | High-performance heat dissipation device and method for manufacturing the same |
| TWM383090U (en) * | 2010-02-12 | 2010-06-21 | zhi-ming You | LED lamp with enhanced heat dissipation |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201204991A (en) | 2012-02-01 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |