TWI393682B - A scribing method for brittle materials and a method of manufacturing the same, using the scribing method of the scribing wheel and the scribing device, and the scribing tool - Google Patents
A scribing method for brittle materials and a method of manufacturing the same, using the scribing method of the scribing wheel and the scribing device, and the scribing tool Download PDFInfo
- Publication number
- TWI393682B TWI393682B TW95124723A TW95124723A TWI393682B TW I393682 B TWI393682 B TW I393682B TW 95124723 A TW95124723 A TW 95124723A TW 95124723 A TW95124723 A TW 95124723A TW I393682 B TWI393682 B TW I393682B
- Authority
- TW
- Taiwan
- Prior art keywords
- scribing
- brittle material
- scribing wheel
- substrate
- wheel
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/105—Details of cutting or scoring means, e.g. tips
- C03B33/107—Wheel design, e.g. materials, construction, shape
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/10—Methods
- Y10T225/12—With preliminary weakening
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/30—Breaking or tearing apparatus
- Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
- Y10T225/321—Preliminary weakener
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/02—Other than completely through work thickness
- Y10T83/0333—Scoring
- Y10T83/0385—Rotary scoring blade
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/929—Tool or tool with support
- Y10T83/9372—Rotatable type
- Y10T83/9403—Disc type
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Mining & Mineral Resources (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Liquid Crystal (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005227207 | 2005-07-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200720206A TW200720206A (en) | 2007-06-01 |
| TWI393682B true TWI393682B (zh) | 2013-04-21 |
Family
ID=37604557
Family Applications (7)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW95124723A TWI393682B (zh) | 2005-07-06 | 2006-07-06 | A scribing method for brittle materials and a method of manufacturing the same, using the scribing method of the scribing wheel and the scribing device, and the scribing tool |
| TW100128330A TWI409233B (zh) | 2005-07-06 | 2006-07-06 | The brittle material is a scribing wheel, a scribing method using the scribing wheel and a scribing device, and a scribing tool |
| TW100117551A TWI454433B (zh) | 2005-07-06 | 2006-07-06 | A scribing material for a brittle material and a method for manufacturing the same, a scribing method using a scribing wheel, a scribing device, and a scribing tool |
| TW100128327A TWI466837B (zh) | 2005-07-06 | 2006-07-06 | The brittle material is a scribing wheel, a scribing method using the scribing wheel and a scribing device, and a scribing tool |
| TW100128329A TWI409232B (zh) | 2005-07-06 | 2006-07-06 | Method for manufacturing scratches for brittle materials |
| TW100128328A TWI409231B (zh) | 2005-07-06 | 2006-07-06 | Method for manufacturing scratches for brittle materials |
| TW102135325A TWI498299B (zh) | 2005-07-06 | 2006-07-06 | A scribing material for a brittle material and a method for manufacturing the same, a scribing method using a scribing wheel, a scribing device, and a scribing tool |
Family Applications After (6)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100128330A TWI409233B (zh) | 2005-07-06 | 2006-07-06 | The brittle material is a scribing wheel, a scribing method using the scribing wheel and a scribing device, and a scribing tool |
| TW100117551A TWI454433B (zh) | 2005-07-06 | 2006-07-06 | A scribing material for a brittle material and a method for manufacturing the same, a scribing method using a scribing wheel, a scribing device, and a scribing tool |
| TW100128327A TWI466837B (zh) | 2005-07-06 | 2006-07-06 | The brittle material is a scribing wheel, a scribing method using the scribing wheel and a scribing device, and a scribing tool |
| TW100128329A TWI409232B (zh) | 2005-07-06 | 2006-07-06 | Method for manufacturing scratches for brittle materials |
| TW100128328A TWI409231B (zh) | 2005-07-06 | 2006-07-06 | Method for manufacturing scratches for brittle materials |
| TW102135325A TWI498299B (zh) | 2005-07-06 | 2006-07-06 | A scribing material for a brittle material and a method for manufacturing the same, a scribing method using a scribing wheel, a scribing device, and a scribing tool |
Country Status (11)
| Country | Link |
|---|---|
| US (3) | US7975589B2 (fr) |
| EP (3) | EP2551084A1 (fr) |
| JP (7) | JP5055119B2 (fr) |
| KR (8) | KR101164851B1 (fr) |
| CN (7) | CN102285006B (fr) |
| AU (1) | AU2006266678A1 (fr) |
| BR (1) | BRPI0615530A2 (fr) |
| PL (1) | PL2551085T3 (fr) |
| SG (1) | SG162814A1 (fr) |
| TW (7) | TWI393682B (fr) |
| WO (1) | WO2007004700A1 (fr) |
Families Citing this family (71)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006009113A1 (fr) * | 2004-07-16 | 2006-01-26 | Mitsuboshi Diamond Industrial Co., Ltd. | Molette d'outil de découpe et procédé de fabrication de celle-ci, outil manuel de traçage et dispositif de traçage |
| TWI393682B (zh) * | 2005-07-06 | 2013-04-21 | Mitsuboshi Diamond Ind Co Ltd | A scribing method for brittle materials and a method of manufacturing the same, using the scribing method of the scribing wheel and the scribing device, and the scribing tool |
| JP4219945B2 (ja) * | 2006-08-10 | 2009-02-04 | トーヨー産業株式会社 | ガラス切断用カッターホイル |
| JP5508847B2 (ja) | 2007-04-12 | 2014-06-04 | 三星ダイヤモンド工業株式会社 | スクライブ装置及び方法 |
| US7837138B2 (en) * | 2007-05-03 | 2010-11-23 | Riley Power, Inc. | Swing hammer for particulate size reduction system |
| DE102007033242A1 (de) * | 2007-07-12 | 2009-01-15 | Jenoptik Automatisierungstechnik Gmbh | Verfahren und Vorrichtung zum Trennen einer Planplatte aus sprödbrüchigem Material in mehrere Einzelplatten mittels Laser |
| WO2009034759A1 (fr) * | 2007-09-13 | 2009-03-19 | Sharp Kabushiki Kaisha | Molette coupante |
| DE102007045383A1 (de) * | 2007-09-22 | 2008-07-17 | Bohle Ag | Verfahren zur Herstellung von Schneidrädchen |
| US7983652B1 (en) * | 2008-01-10 | 2011-07-19 | At&T Mobility Ii Llc | Emergency call notification for network services |
| JP5450964B2 (ja) * | 2008-02-29 | 2014-03-26 | 三星ダイヤモンド工業株式会社 | スクライブ装置及びスクライブ方法 |
| EP2119679A1 (fr) * | 2008-05-16 | 2009-11-18 | 3S Swiss Solar Systems AG | Procédé de traitement d'une strate |
| JP5237370B2 (ja) * | 2008-06-05 | 2013-07-17 | 三星ダイヤモンド工業株式会社 | スクライビングホイール及び脆性材料基板のスクライブ方法 |
| JP5173885B2 (ja) | 2009-02-24 | 2013-04-03 | 三星ダイヤモンド工業株式会社 | スクライブ装置及びスクライブ方法 |
| TWI428301B (zh) * | 2009-10-29 | 2014-03-01 | Mitsuboshi Diamond Ind Co Ltd | Scribing wheel and its manufacturing method |
| JP4960429B2 (ja) * | 2009-10-29 | 2012-06-27 | 三星ダイヤモンド工業株式会社 | スクライビングホイールの製造方法 |
| JP5281544B2 (ja) * | 2009-10-30 | 2013-09-04 | 三星ダイヤモンド工業株式会社 | ブレイク装置 |
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| JP5538090B2 (ja) | 2010-06-23 | 2014-07-02 | 株式会社ジャパンディスプレイ | ガラスカッター |
| JP5118736B2 (ja) * | 2010-09-28 | 2013-01-16 | 三星ダイヤモンド工業株式会社 | スクライブ方法及びスクライビングホイール |
| JP5365602B2 (ja) * | 2010-10-08 | 2013-12-11 | 三星ダイヤモンド工業株式会社 | スクライビングホイール及びその製造方法 |
| JP5156080B2 (ja) * | 2010-11-05 | 2013-03-06 | 三星ダイヤモンド工業株式会社 | 貼り合せ基板のスクライブ方法 |
| JP2012115991A (ja) * | 2010-11-29 | 2012-06-21 | Mitsuboshi Diamond Industrial Co Ltd | スクライビングホイール |
| TWI462885B (zh) * | 2010-12-13 | 2014-12-01 | Mitsuboshi Diamond Ind Co Ltd | Method of breaking the substrate |
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Citations (2)
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Patent Citations (2)
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| US20040123717A1 (en) * | 2002-04-02 | 2004-07-01 | Kazuya Maekawa | Cutter wheel, device and method using the cutter wheel, method of dividing laminated substrate, and method and device for manufacturing cutter wheel |
| TW200420510A (en) * | 2003-01-29 | 2004-10-16 | Mitsuboshi Diamond Ind Co Ltd | Substrate dividing apparatus and method for dividing substrate |
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