TWI397644B - 氣密式密封及製造密封構件的方法 - Google Patents

氣密式密封及製造密封構件的方法 Download PDF

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Publication number
TWI397644B
TWI397644B TW099106028A TW99106028A TWI397644B TW I397644 B TWI397644 B TW I397644B TW 099106028 A TW099106028 A TW 099106028A TW 99106028 A TW99106028 A TW 99106028A TW I397644 B TWI397644 B TW I397644B
Authority
TW
Taiwan
Prior art keywords
substrate
cover
tape
sealing member
strip
Prior art date
Application number
TW099106028A
Other languages
English (en)
Chinese (zh)
Other versions
TW201040416A (en
Inventor
羅納德Ｓ 寇克
Original Assignee
全球Ｏｌｅｄ科技公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 全球Ｏｌｅｄ科技公司 filed Critical 全球Ｏｌｅｄ科技公司
Publication of TW201040416A publication Critical patent/TW201040416A/zh
Application granted granted Critical
Publication of TWI397644B publication Critical patent/TWI397644B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8721—Metallic sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8723—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED

Landscapes

  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
TW099106028A 2009-03-04 2010-03-02 氣密式密封及製造密封構件的方法 TWI397644B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/397,418 US7948178B2 (en) 2009-03-04 2009-03-04 Hermetic seal

Publications (2)

Publication Number Publication Date
TW201040416A TW201040416A (en) 2010-11-16
TWI397644B true TWI397644B (zh) 2013-06-01

Family

ID=42060448

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099106028A TWI397644B (zh) 2009-03-04 2010-03-02 氣密式密封及製造密封構件的方法

Country Status (7)

Country Link
US (1) US7948178B2 (2)
EP (1) EP2404319B1 (2)
JP (1) JP5165800B2 (2)
KR (1) KR101278251B1 (2)
CN (1) CN102414812B (2)
TW (1) TWI397644B (2)
WO (1) WO2010101763A1 (2)

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KR20110064670A (ko) * 2009-12-08 2011-06-15 삼성모바일디스플레이주식회사 게터 조성물 및 상기 게터 조성물을 포함하는 유기 발광 장치
KR101663840B1 (ko) * 2010-03-01 2016-10-07 가부시키가이샤 제이올레드 유기 ｅｌ 장치 및 그 제조 방법
KR101127595B1 (ko) * 2010-05-04 2012-03-23 삼성모바일디스플레이주식회사 유기 발광 표시 장치 및 그 제조방법
KR20130065219A (ko) * 2011-12-09 2013-06-19 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
US9386714B2 (en) * 2012-12-05 2016-07-05 Nokia Technologies Oy Apparatus for housing an electronic component, a method
CN103383992B (zh) * 2013-08-13 2015-12-02 深圳市华星光电技术有限公司 Oled器件的封装方法及用该方法封装的oled器件
DE102013110174B4 (de) * 2013-09-16 2025-04-10 Pictiva Displays International Limited Elektronisches Bauelement und Verfahren zur Herstellung eines elektronischen Bauelements
CN103531718B (zh) * 2013-10-25 2015-12-09 上海大学 Oled封装结构
WO2016024946A1 (en) * 2014-08-11 2016-02-18 Raytheon Company Hermetically sealed package having stress reducing layer
US9334154B2 (en) 2014-08-11 2016-05-10 Raytheon Company Hermetically sealed package having stress reducing layer
JP2018084764A (ja) * 2016-11-25 2018-05-31 株式会社ブイ・テクノロジー フレキシブル表示装置及びフレキシブル表示装置の封止方法
US11551028B2 (en) 2017-04-04 2023-01-10 Hailo Technologies Ltd. Structured weight based sparsity in an artificial neural network
US10387298B2 (en) 2017-04-04 2019-08-20 Hailo Technologies Ltd Artificial neural network incorporating emphasis and focus techniques
US11238334B2 (en) 2017-04-04 2022-02-01 Hailo Technologies Ltd. System and method of input alignment for efficient vector operations in an artificial neural network
US12430543B2 (en) 2017-04-04 2025-09-30 Hailo Technologies Ltd. Structured sparsity guided training in an artificial neural network
US11544545B2 (en) 2017-04-04 2023-01-03 Hailo Technologies Ltd. Structured activation based sparsity in an artificial neural network
US11615297B2 (en) 2017-04-04 2023-03-28 Hailo Technologies Ltd. Structured weight based sparsity in an artificial neural network compiler
CN110429206B (zh) * 2019-08-07 2021-11-23 京东方科技集团股份有限公司 封装盖板、显示装置、显示面板及显示面板的封装方法
KR20220000440A (ko) * 2020-06-25 2022-01-04 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법
US11591879B2 (en) * 2021-01-29 2023-02-28 Halliburton Energy Services, Inc. Thermoplastic with swellable metal for enhanced seal
CN115642131B (zh) * 2022-10-14 2025-10-31 南通大学 一种二维材料异质结器件

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TW200733788A (en) * 2006-01-25 2007-09-01 Samsung Sdi Co Ltd Organic light-emitting display device with frit seal and reinforcing structure bonded to frame
TW200733792A (en) * 2006-01-20 2007-09-01 Eastman Kodak Co Desiccant sealing arrangement for OLED devices

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TW200603416A (en) * 2004-04-02 2006-01-16 Gen Electric Organic electronic packages having hermetically sealed edges and methods of manufacturing such packages
TW200733792A (en) * 2006-01-20 2007-09-01 Eastman Kodak Co Desiccant sealing arrangement for OLED devices
TW200733788A (en) * 2006-01-25 2007-09-01 Samsung Sdi Co Ltd Organic light-emitting display device with frit seal and reinforcing structure bonded to frame

Also Published As

Publication number Publication date
JP5165800B2 (ja) 2013-03-21
WO2010101763A1 (en) 2010-09-10
KR101278251B1 (ko) 2013-06-24
EP2404319A1 (en) 2012-01-11
EP2404319B1 (en) 2019-06-19
CN102414812A (zh) 2012-04-11
TW201040416A (en) 2010-11-16
KR20110134891A (ko) 2011-12-15
US20100225231A1 (en) 2010-09-09
JP2012519938A (ja) 2012-08-30
US7948178B2 (en) 2011-05-24
CN102414812B (zh) 2015-04-22

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