TWI416459B - Active matrix display device, thermal detection and control circuit and thermal detection and control method thereof - Google Patents

Abstract

The present invention relates to an active matrix display device, a thermal detection and control circuit and a thermal detection and control method thereof. The thermal detection and control circuit includes a thermal protection circuit and a control logic circuit. The thermal protection circuit detects an integrated circuit (IC) temperature of a source driving circuit, generates an output signal according to the IC temperature, sequentially synchronizes the output signal with an initial gate start signal generated from a timing controller and performs a logic operation applied to the synchronized output signal and an initial source control signal so as to produce a new source control signal for controlling a channel switching circuit of the source driving circuit. The control logic circuit performs a logic operation applied to the output signal and the initial gate start signal so as to produce a new gate start signal for determining whether or not to enable a gate driving circuit of the active matrix display device. Moreover, the thermal protection circuit can be integrated into the source driving circuit.

Description

Active matrix display and temperature sensing control circuit thereof and temperature sensing control method

The present invention relates to the field of display technology, and in particular to an active matrix display and a temperature sensing control circuit thereof and a temperature sensing control method.

Active matrix displays, such as active matrix liquid crystal displays, are widely used in mobile phones, notebook computers, desktop displays, and televisions due to their high image quality, small size, light weight, and wide application range. Electronic products have replaced traditional cathode ray tube (CRT) displays as the mainstream of displays.

At present, the application of the liquid crystal display panel is oriented toward large size and high screen update frequency (for example, 120 Hz or 240 Hz) and high resolution, and the problem is that the source drive integrated circuit follows the panel. The increase of the data line load, the speed of data update and the large number of output channel circuits concentrated in one integrated circuit will generate a large amount of heat to increase the temperature of the volume circuit, and the excessively high volume circuit temperature has the risk of burning the circuit.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an active matrix display that avoids the risk of burnout of the circuit due to excessive temperature.

It is still another object of the present invention to provide a temperature sensing control circuit that avoids the risk of burnout of the circuit due to excessive temperature.

It is still another object of the present invention to provide a temperature sensing control method that avoids the risk of burnout of the circuit due to excessive temperature.

An active matrix display according to an embodiment of the present invention includes a timing controller, a gate driving circuit, a source driving circuit, and a control logic circuit. The timing controller is configured to generate an initial gate start signal and an initial source control signal; the source driving circuit includes a plurality of source driving integrated circuits, each of the source driving integrated circuits includes a channel switching circuit, an output stage circuit, and a heat a protection circuit, wherein the output stage circuit comprises a plurality of output channels, the output channels are electrically coupled to the plurality of data lines by the channel switch circuit to provide display data to the data lines, and the thermal protection circuit senses the source drive integrated circuit The internal temperature, the output signal is generated according to the internal temperature, and the output signal is synchronized with the initial gate start signal and the initial source control signal is logically operated to obtain a new source control signal to control the on/off state of the channel switch circuit. The control logic circuit performs a logic operation on the output signal generated by the thermal protection circuit of the source driving integrated circuit and the initial gate start signal to obtain a new gate start signal to determine whether the gate driving circuit is enabled.

In an embodiment of the invention, each of the source driving integrated circuits further includes a charge sharing switch circuit electrically coupled to each of the data lines to a predetermined potential and controlled by a new source control signal, wherein the charge The on/off state of the sharing switch circuit is opposite to the on/off state of the channel switch circuit.

In an embodiment of the invention, the thermal protection circuit of each of the source driving integrated circuits includes a thermal sensing circuit, a reference voltage generating circuit, a comparator, and a second control logic circuit; wherein the thermal sensing circuit senses The source drives the internal temperature of the integrated circuit and outputs a sensing voltage corresponding to the internal temperature, the reference voltage generating circuit is configured to generate at least one reference voltage, and the comparator generates the output signal according to the sensing voltage and the reference voltage, and the second The control logic circuit synchronizes the output signal with the initial gate start signal and logically operates the initial source control signal to obtain the new source control signal.

In an embodiment of the invention, the second control logic circuit includes an edge-triggered D-type flip-flop and an OR gate; wherein the edge-triggered D-type flip-flop uses the initial gate start signal as an edge trigger signal for the above The output signal is synchronized, or the gate performs a new source control signal on the output signal of the initial source control signal and the edge-triggered D-type flip-flop.

In an embodiment of the invention, the second control logic circuit further includes an inverter for performing an inversion operation on the new source control signal to control the electrical coupling of each data line to a preset potential. The on/off state of the charge sharing switch circuit.

In an embodiment of the invention, the control logic circuit performs an operation on the output signal generated by the thermal protection circuit of each source-driven integrated circuit, or performs a non-gate operation, and then performs an AND operation on the initial gate start signal. The above new gate start signal.

In an embodiment of the invention, the control logic circuit performs the above-mentioned output signal execution and gate operation on the output signal generated by the thermal protection circuit of each source driving integrated circuit, and then performs the gate operation on the initial gate start signal. The new gate starts signal.

A temperature sensing control circuit according to an embodiment of the invention is suitable for application to an active matrix display, wherein the active matrix display comprises a timing controller, a source driving circuit, a gate driving circuit and a plurality of data lines; the timing controller is used for An initial gate start signal and an initial source control signal are generated. The source drive circuit includes an output stage circuit and a channel switch circuit. The output stage circuit includes a plurality of output channels, and each output channel is electrically coupled to each by a channel switch circuit. The data line provides display information to each data line. The temperature sensing control circuit of the embodiment includes: a thermal protection circuit and a control logic circuit; the thermal protection circuit senses the integrated circuit temperature in the source driving circuit, generates an output signal according to the integrated circuit temperature, and outputs the signal and the initial signal. After the gate start signal is synchronized, the initial source control signal is logically operated to obtain a new source control signal to control the channel switch circuit; the control logic circuit performs a logic operation on the output signal and the initial gate start signal. A new gate start signal is used to determine whether the gate drive circuit is enabled.

In an embodiment of the invention, the new source control signal generated by the thermal protection circuit of the temperature sensing control circuit further controls a charge sharing switch circuit electrically coupled to each data line to a preset potential, and The on/off state of the charge sharing switch circuit is opposite to the on/off state of the channel switch circuit.

In an embodiment of the invention, the thermal protection circuit of the temperature sensing control circuit includes: a thermal protection circuit, a reference voltage generating circuit, a comparator, and a second control logic circuit; wherein the thermal protection circuit senses the source driving circuit The integrated circuit temperature outputs a sensing voltage corresponding to the integrated circuit temperature, the reference voltage generating circuit generates at least one reference voltage, and the comparator generates the output signal according to the sensing voltage and the reference voltage, and the second control logic The circuit synchronizes the output signal with the initial gate start signal and logically operates the initial source control signal to obtain the new source control signal.

In an embodiment of the invention, the second control logic circuit of the temperature sensing control circuit includes an edge-triggered D-type flip-flop and an OR gate; wherein the edge-triggered D-type flip-flop uses the initial gate start signal as The edge trigger signal synchronizes the output signal, or the gate performs a new source control signal on the output signal of the initial source control signal and the edge trigger D-type flip-flop to perform the above-mentioned new source control signal.

In an embodiment of the invention, the second control logic circuit of the temperature sensing control circuit further includes an inverter, and performs an inversion operation on the new source control signal to control electrical coupling of each data line. The on/off state of the charge sharing switch circuit to the preset potential.

A temperature sensing control method according to an embodiment of the present invention is suitable for execution in an active matrix display, wherein the active matrix display includes a timing controller, a source driving circuit, a gate driving circuit, and a plurality of data lines; An initial gate start signal and an initial source control signal are generated. The source drive circuit includes an output stage circuit, and the output stage circuit includes a plurality of output channels for outputting display data. The temperature sensing control method of the embodiment includes the steps of: sensing a volume circuit temperature of the source driving circuit; generating an output signal according to the integrated circuit temperature; synchronizing the output signal with the initial gate start signal and initial source control The signal is logically operated to obtain a new source control signal; the new source control signal is used to determine whether each output channel provides display data to each data line; and the output signal and the initial gate start signal are logically operated to obtain new signals. The gate start signal; and the new gate start signal is used to determine whether the gate drive circuit is enabled.

In an embodiment of the invention, the temperature sensing control method further includes the step of: determining, by using the inverted new source control signal, whether each data line performs charge sharing with a preset potential.

In an embodiment of the invention, the step of generating an output signal according to the integrated circuit temperature includes: generating a sensing voltage according to the integrated circuit temperature; and generating the output according to the comparison between the sensing voltage and a set of reference voltages. Signal.

In an embodiment of the invention, the reference voltage includes a first reference voltage and a second reference voltage greater than the first reference voltage, and the step of generating an output signal according to the comparison between the sensing voltage and the reference voltage comprises: The measured voltage is less than the first reference voltage, and the output signal is determined to be a high level; when the sensing voltage is greater than the second reference voltage, the output signal is determined to be a low level; and when the sensing voltage is between the first reference voltage and the second reference voltage , to maintain the current level of the output signal unchanged.

In an embodiment of the invention, the step of synchronizing the output signal with the initial gate start signal and the initial source control signal to obtain a new source control signal includes: inputting the output signal to D-type flip-flop, with the initial gate start signal as the edge trigger signal of the D-type flip-flop; and the OR signal of the output signal of the D-type flip-flop and the initial source control signal to obtain the above new Source control signal.

A temperature sensing control method according to another embodiment of the present invention is suitable for application to an active matrix display, wherein the active matrix display includes a timing controller, a plurality of source driving integrated circuits, a gate driving circuit, and a plurality of materials. The timing controller is configured to generate an initial gate start signal and an initial source control signal, each of the source drive integrated circuits includes an output stage circuit and the output stage circuit includes a plurality of output channels to output display data. The temperature sensing control method of the embodiment includes the steps of: sensing a working temperature of each of the source driving integrated circuits to obtain a plurality of operating temperatures; respectively generating a plurality of output signals according to the respective operating temperatures; and each output signal and the initial After the gate start signal is synchronized, the initial source control signal is logically operated to obtain a plurality of new source control signals; respectively, each new source control signal is used to determine whether the output channels of the respective source drive integrated circuits will be Display data is provided to each data line; a new gate start signal is performed on each output signal and the initial gate start signal; and the new gate start signal is used to determine whether the gate drive circuit is enabled .

In an embodiment of the invention, the temperature sensing control method performs logic to obtain a new gate start signal for each output signal and the initial gate start signal, and includes the steps of: performing or not on each output signal. The gate operation is performed; and the new gate start signal is obtained by performing a gate operation on the result of the NOR operation and the initial gate start signal.

In an embodiment of the present invention, in the temperature sensing control method, the new gate start signal is logically generated for each output signal and the initial gate start signal, and includes the steps of: performing a gate on each output signal. The operation and the new gate start signal are performed by performing the gate operation and the initial gate start signal again.

The embodiment of the present invention configures a temperature sensing control circuit in the active matrix display, thereby generating a corresponding control signal to control the operation of the gate driving circuit when sensing that the temperature of the integrated circuit in the source driving circuit is too high The connection between the source driving circuit and the data line is cut off, so as to avoid the phenomenon that the power consumption is too high and the temperature is too high, so as to effectively avoid the risk of the circuit being burnt due to excessive temperature.

The above and other objects, features and advantages of the present invention will become more <RTIgt;

Please refer to FIG. 1 , which is a schematic structural diagram of an active matrix display according to an embodiment of the present invention. As shown in FIG. 1, the active matrix display 10 includes an array substrate 12, a source driving circuit, a gate driving circuit, and a printed circuit board 14. In this embodiment, the source driving circuit includes a plurality of source driving integrated circuits X1 to X6, and the gate driving circuit includes a plurality of gate driving integrated circuits Y1 to Y6 disposed on both sides of the array substrate 12 as a bilateral The gate drive circuit is not intended to limit the invention.

A plurality of data lines DL, a plurality of gate lines GL, and a plurality of pixels P electrically coupled to the data lines DL and the gate lines GL are formed on the array substrate 12 (only one of them is illustrated in FIG. 1 as an example) The array substrate 12 has a display area as shown by a broken line in FIG. 1, and a pixel P is formed in the display area.

The source driving integrated circuits X1 to X6 are electrically coupled between the array substrate 12 and the printed circuit board 14 and electrically connected to the data lines DL to provide display data to the data lines DL. In this embodiment, the source driving integrated circuits X1 to X6 are packaged in a chip-on-film (COF) package (not limited thereto), and include a flexible circuit. The board 131 and the driving wafer 133 are bonded to the driving circuit board 133 on the flexible circuit board 131, whereby the source driving integrated circuits X1 to X6 are electrically coupled to the array substrate 12 and the printed circuit board 14 via the flexible circuit board 131.

The gate driving integrated circuits Y1 to Y6 are electrically coupled to the array substrate 12 to provide a gate driving signal to the gate line GL to control the on/off state of the transistors in the pixel P. Similarly, the gate driving integrated circuits Y1 to Y6 of the embodiment are also COF packaged, but are not limited thereto, and may be other packaging methods such as a COG (Chip-on-Glass) package, or It is directly integrated on the array substrate 12 to form a gate-on-array (GOA).

A timing controller 141 and a main control logic circuit 1320 are formed on the printed circuit board 14. The timing controller 141 generates an initial gate start signal YDIO to each of the source drive integrated circuits X1 XX6 and the main control logic circuit 1320. The main control logic circuit 1320 receives the output generated by each of the source drive integrated circuits X1 to X6. The signals VC_out1~VC_out6 and the initial gate start signal YDIO provided by the timing controller 141 perform corresponding logic operations to generate a new gate start signal YDIO_T; here, the output signals VC_out1~VC_out6 are respectively combined with the source drive products. The operating temperatures of the body circuits X1 to X6 are related, so that the new gate start signal YDIO_T is also related to the operating temperatures of the respective source driving integrated circuits X1 to X6.

Referring to FIG. 1, FIG. 2 and FIG. 3 together, FIG. 2 and FIG. 3 illustrate an embodiment of the circuit structure of the driving wafer 133 in the source driving integrated circuits X1 to X6. As shown in FIGS. 2 and 3, the drive wafer 133 includes an output stage circuit 1338, a channel switch circuit 1339a, a charge sharing switch circuit 1339b, and a built-in thermal protection circuit 1330. The output stage circuit 1338 includes a plurality of output channels CH. The input channels CH are electrically coupled to the plurality of data lines DL by the channel switching circuit 1339a to provide display data to the respective data lines DL. The charge sharing switch circuit 1339b is electrically connected. The respective data lines DL are coupled to a predetermined potential such as the common voltage VCOM shown in FIG. 2 or the analog ground potential AGND shown in FIG. 3. The thermal protection circuit 1330 controls the on/off states of the channel switching circuit 1339a and the charge sharing switch circuit 1339b. Here, the on/off state of the channel switching circuit 1339a is opposite to the on/off state of the charge sharing switch circuit 1339b. Further, the channel switching circuit 1339a may include a plurality of switching transistors such as an N-type transistor or a P-type transistor; similarly, the charge sharing switching circuit 1339b may also include a plurality of switching transistors, and the conductivity types of the switching transistors It may be the same or different from the conductivity type of the switching transistor in the channel switching circuit 1339a.

Please refer to FIG. 1 , FIG. 4 , FIG. 5 and FIG. 6 . FIG. 4 is a circuit diagram of a thermal sensing control circuit in the active matrix display 10 , and FIG. 5 illustrates the thermal sensation associated with FIG. 4 . A timing diagram of a plurality of signals of the control circuit is measured. FIG. 6 illustrates an embodiment of a circuit diagram of the main control logic circuit 1320 of the active matrix display 10.

Specifically, the thermal sensing control circuit 132 shown in FIG. 4 includes a plurality of the foregoing thermal protection circuits 1330 and the foregoing main control logic circuit 1320; each of the thermal protection circuits 1330 is built in each of the source driving integrated circuits. The internal temperature of each of the source drive integrated circuits X1 to X6 (that is, the operating temperature of the integrated circuit) is sensed in X1 to X6, but this is not intended to limit the present invention. Each of the thermal protection circuits 1330 can also be thermally connected to each of the source drive integrated circuits X1 to X6 (that is, the temperature changes of the respective source drive integrated circuits X1 to X6 can be effectively sensed) and the respective sources The drive integrated circuits X1 to X6 are separately provided as long as the operation temperature of each of the source drive integrated circuits X1 to X6 is sensed.

In the above, the thermal protection circuit 1330 includes a thermal sensing circuit 1331, a reference voltage generating circuit 1332, a comparator 1333, and a secondary control logic circuit 1334, wherein the secondary control logic circuit 1334 includes an edge-triggered D-type flip-flop 1335, or a gate 1336, and Inverter 1137.

More specifically, the thermal sensing circuit 1331 is electrically coupled to the inverting input terminal (-) of the comparator 1333 for sensing a corresponding one of the source driving integrated circuits X1 X X6, such as X1 (or X6). The operating temperature, for example, t1 (or t6), generates a corresponding sensing voltage example VD1 (or VD6) according to the sensed operating temperature t1 (or t6), and inputs the generated sensing voltage VD1 (or VD6) to the comparator. Inverting input (-) of 1333. As can be seen from FIG. 5, the thermal sensing circuit 1331 is a circuit having a negative temperature coefficient. In other words, the higher the sensed operating temperature is, the lower the sensing voltage is generated; it is understood that the present invention is not Limited to this example, the thermal sensing circuit 1331 can also employ a circuit having a positive temperature coefficient as needed for practical applications.

The reference voltage generating circuit 1332 is electrically coupled to the non-inverting input terminal (+) of the comparator 1333 for generating at least one reference voltage, such as a set of reference voltages Vt+ and Vt- in the embodiment, and the reference voltage Vt - greater than the reference voltage Vt+. As shown in FIG. 5, the reference voltage Vt- corresponds to the sensing voltage when the sensed operating temperature is the reference temperature t-, and the reference voltage Vt+ corresponds to the sensing voltage when the sensed operating temperature is the reference temperature t+; Wherein the reference temperature t+ is greater than the reference temperature t-.

The output of the comparator 1333 is electrically coupled to the main control logic circuit 1320 and the edge-triggered D-type flip-flop 1335, so that an output signal generated by its output, such as VC_out1 (or VC_out6), is input to the main control logic circuit 1320 and the edge. The data input terminal D of the D-type flip-flop 1335 is triggered. As shown in FIG. 5, the level of the output signal VC_out1 is determined by the relative magnitude relationship between the sensing voltage VD1 and the reference voltages Vt+ and Vt-. When the sensed operating temperature t1 is higher than the reference temperature t+, the corresponding sensing voltage VD1 When the reference signal Vt+ is less than the reference voltage Vt+, the output signal VC_out1 jumps to a high level; after that, when the sensed operating temperature t1 is lower than the reference temperature t-, the corresponding sensing voltage VD1 is greater than the reference voltage Vt-, and the output signal VC_out1 is outputted at this time. Only when the sensed operating temperature t1 is between the reference temperature t- and the reference temperature t+, the corresponding sensing voltage VD1 is between the reference voltage Vt+ and the reference voltage Vt- At this time, the level of the output signal VC_out1 remains at the current level. Similarly, the level of the output signal VC_out6 is determined by the relative magnitude relationship between the sense voltage VD6 and the reference voltages Vt+ and Vt-.

The clock input terminal (CK) of the edge-triggered D-type flip-flop 1335 receives the initial gate start signal YDIO from the timing controller 141 as an edge trigger signal due to the electrical coupling relationship, so that the output signal such as VC_out1 (or VC_out6) The output signal VQ1 (or VQ6) synchronized with the initial gate start signal YDIO.

Or the gate 1336 receives the synchronized output signal VQ1 (or VQ6) and the initial source control signal STB generated by the timing controller 141 shown in FIG. 1 due to the electrical coupling relationship, and outputs the synchronized output signal VQ1 (or VQ6) performs a new source control signal VCT_EN1 (or VCT_EN6) after performing or gate operation with the initial source control signal STB. In this embodiment, the new source control signal VCT_EN1 (or VCT_EN6) will be used as the control signal of the channel switch circuit 1339a to determine the on/off states of the respective switch transistors in the channel switch circuit 1339a. As can be seen from FIG. 5, when the synchronized output signal VQ1 (or VQ6) is at a high level, indicating that the current operating temperature of the source driving integrated circuit X1 (or X6) is too high, the new source source control signal is new. VCT_EN1 (or VCT_EN6) turns off the channel switching circuit 1338 in the source driving integrated circuit X1 (or X6), so that the source driving integrated circuit X1 (or X6) stops providing display data to the data line DL, thus avoiding large When the current is pumped, the power consumption is too high; after that, the output signal VQ1 (or VQ6) to be synchronized is low, indicating that the operating temperature of the source drive integrated circuit X1 (or X6) has dropped to Within the operating temperature range, the new source control signal VCT_EN1 (or VCT_EN6) turns on the channel switching circuit 1338 in the source driving integrated circuit X1 (or X6), so that the source driving integrated circuit X1 (or X6) can Continue to provide display information to the data line DL.

The inverter 1337 is electrically coupled to the output of the OR gate 1336 to invert the new source control signal VCT_EN1 (or VCT_EN6) to obtain a new source control signal after the inversion. In this embodiment, the inverted new source control signal VCT_EN1 (or VCT_EN6) will serve as the control signal of the charge sharing switch circuit 1339b to determine the on/off states of the respective switching transistors in the charge sharing switch circuit 1339b. Here, since the on/off state of the charge share switching circuit 1339b is opposite to the on/off state of the channel switch circuit 1339a, during the period in which the source drive integrated circuit X1 (or X6) stops providing the display data to the data line DL, The data line DL is charge-shared with a preset potential such as VCOM or AGND to effectively eliminate the image sticking phenomenon in the display process of the active matrix display 10.

The main control logic circuit 1320 shown in FIG. 6 includes a NAND gate and a NAND gate for performing the non-gate operation on the output signals VC_out1~VC_out6 of the respective source driving integrated circuits X1~X6, and then starting with the initial gate. The signal YDIO performs a gate operation to obtain a new gate start signal YDIO_T to determine whether to enable the gate drive integrated circuits Y1~Y6 in the gate drive circuit. As can be seen from FIG. 5, at least one of the output signals VC_out1~VC_out6 (only VC_out1 and VC_out6 are shown in FIG. 5) is at a high level (representing the operating temperature of at least one of the source driving integrated circuits X1 to X6). When it is too high, even if the initial pulse of the initial gate start signal YDIO comes, the new gate start signal YDIO_T remains at the low level until the next start pulse and the operating temperatures of all source drive integrated circuits X1~X6 are within the operating temperature range.

In other embodiments, the main control logic circuit 1320 may also have other suitable circuit structures. For example, when the sensed operating temperature is too high, the output signals VC_out1~VC_out6 generated by the corresponding comparator 1333 are low level instead of the foregoing embodiment. In the high level on time, the main control logic circuit 1320 can adopt the circuit structure shown in FIG. Specifically, the main control logic circuit 1320 shown in FIG. 7 includes two gates for performing gate operations on the output signals VC_out1~VC_out6 of the respective source drive integrated circuits X1~X6, and then initial gate start signal YDIO. A new gate start signal YDIO_T is performed to perform the gate operation to determine whether the gate drive integrated circuits Y1 to Y6 in the gate drive circuit are enabled, which can achieve the same purpose.

In summary, the embodiment of the present invention configures a temperature sensing control circuit in an active matrix display, thereby generating a corresponding control signal to control the gate when sensing that the temperature of the integrated circuit in the source driving circuit is too high. The operation of the driving circuit and the connection of the source driving circuit and the data line are cut off, so that the phenomenon that the power consumption is too high and the temperature is too high is avoided, so as to effectively avoid the risk of the circuit being burnt due to excessive temperature.

In addition, any skilled in the art can appropriately change the structure of the active matrix display and the thermal sensing control circuit proposed in the above embodiments of the present invention, for example, appropriately changing the number of source driving integrated circuits and the gate driving integrated circuit. The number, the circuit structure of the main control logic circuit, the circuit structure of the secondary control logic circuit, etc., can be achieved as long as the risk of burning due to excessive temperature is avoided.

While the present invention has been described in its preferred embodiments, the present invention is not intended to limit the invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application.

10. . . Active matrix display

12. . . Array substrate

14. . . A printed circuit board

X1~X6. . . Source drive integrated circuit

Y1~Y6. . . Gate drive integrated circuit

DL. . . Data line

GL. . . Gate line

1320‧‧‧Main control logic

141‧‧‧Timing controller

131‧‧‧Soft circuit board

133‧‧‧Drive chip

VC_out1~VC_out6‧‧‧ output signal

YDIO‧‧‧ initial gate start signal

YDIO_T‧‧‧ new gate start signal

VCOM‧‧‧share voltage

P‧‧‧ pixels

1330‧‧‧ Thermal protection circuit

1338‧‧‧Output stage circuit

1339a‧‧‧channel switch circuit

1339b‧‧‧Charge sharing switch circuit

CH‧‧‧ output channel

AGND‧‧‧ analog ground potential

132‧‧‧ Thermal sensing control circuit

1331‧‧‧ Thermal sensing circuit

1332‧‧‧reference voltage generation circuit

1333‧‧‧ comparator

1334‧‧‧ control logic circuits

1335‧‧‧Edge-triggered D-type flip-flops

1336‧‧‧ or gate

1337‧‧‧Inverter

VD1, VD6‧‧‧ sense voltage

Vt+, Vt-‧‧‧ reference voltage

STB‧‧‧Initial source control signal

VQ1, VQ6‧‧‧ synchronized output signals

VCT_EN1, VCT_EN6‧‧‧ new source control signals

t+, t-‧‧‧ reference temperature

FIG. 1 is a schematic structural diagram of an active matrix display according to an embodiment of the present invention.

2 is a view showing an embodiment of a circuit structure of a driving chip in the source driving integrated circuit shown in FIG. 1.

3 is a view showing another embodiment of the circuit structure of the driving chip in the source driving integrated circuit shown in FIG. 1.

4 is a circuit diagram of a thermal sensing control circuit of the active matrix display of FIG. 1.

FIG. 5 is a timing diagram showing a plurality of signals related to the thermal sensing control circuit shown in FIG.

6 is a diagram showing an embodiment of a circuit diagram of a main control logic circuit of the active matrix display shown in FIG. 1.

FIG. 7 illustrates another embodiment of a circuit diagram of a main control logic circuit of the active matrix display of FIG. 1.

132. . . Thermal sensing control circuit

1320. . . Main control logic

1330. . . Thermal protection circuit

1331. . . Thermal sensing circuit

1332. . . Reference voltage generating circuit

1333. . . Comparators

1334. . . Secondary control logic

1335. . . Edge triggered D-type flip-flop

1336. . . Gate

1337. . . inverter

VD1, VD6. . . Sense voltage

Vt+, Vt-. . . Reference voltage

VC_out1, VC_out6. . . Output signal

YDIO. . . Initial gate start signal

YDIO_T. . . New gate start signal

STB. . . Initial source control signal

VQ1, VQ6. . . Synchronized output signal

VCT_EN1, VCT_EN6. . . New source control signal

Claims (20)

An active matrix display includes: a timing controller for generating an initial gate start signal and an initial source control signal; a gate drive circuit; a source drive circuit including a plurality of source drive products Each of the source driving integrated circuits includes: a channel switching circuit; an output stage circuit comprising a plurality of output channels, wherein the output channels are electrically coupled to the plurality of data lines by the channel switching circuit Providing display data to the data lines; and a thermal protection circuit sensing an internal temperature of the source driving integrated circuit, generating an output signal according to the internal temperature, and starting the output signal and the initial gate After the signal is synchronized, a logic operation is performed with the initial source control signal to obtain a new source control signal to control the on/off state of the channel switching circuit; and a control logic circuit for driving the integrated source The output signals generated by the thermal protection circuits of the circuit perform a logic operation with the initial gate start signal to obtain a new gate start signal to determine whether The gate drive circuit is enabled. The active matrix display of claim 1, wherein each of the source driving integrated circuits further comprises a charge sharing switch circuit, the charge sharing switch circuit electrically coupling the data lines to a pre- The potential is set and controlled by the new source control signal, and the on/off state of the charge sharing switch circuit is opposite to the on/off state of the channel switching circuit. The active matrix display of claim 1, wherein the thermal protection circuit of each of the source driving integrated circuits comprises: a thermal sensing circuit that senses the source driving integrated circuit The internal temperature outputs a sensing voltage corresponding to the internal temperature; a reference voltage generating circuit for generating a set of reference voltages; and a comparator for generating the output signal according to the sensing voltage and the set of reference voltages; A second control logic circuit synchronizes the output signal with the initial gate start signal and performs the logic operation on the initial source control signal to obtain the new source control signal. The active matrix display of claim 3, wherein the second control logic circuit comprises: an edge-triggered D-type flip-flop, wherein the initial gate start signal is used as an edge trigger signal to perform the output signal Synchronizing; and an OR gate, the new source control signal is performed by performing an OR gate operation on the output signal of the initial source control signal and the edge trigger D-type flip-flop. The active matrix display of claim 4, wherein the second control logic circuit further comprises an inverter for performing an inverting operation on the new source control signal to control electrical coupling. The data lines are connected to an on/off state of a charge sharing switch circuit of a predetermined potential. The active matrix display of claim 1, wherein the control logic circuit performs the non-gate operation on the output signals generated by the thermal protection circuits of the source driving integrated circuit The new gate start signal is generated by the initial gate start signal and the gate operation. The active matrix display of claim 1, wherein the control logic circuit performs the gate operation on the output signals generated by the thermal protection circuits of the source driving integrated circuits, and then the initial The gate start signal and the gate operation are performed to obtain the new gate start signal. A temperature sensing control circuit is applied to an active matrix display, the active matrix display includes a timing controller, a source driving circuit, a gate driving circuit and a plurality of data lines, wherein the timing controller is used to generate a An initial gate start signal and an initial source control signal, the source drive circuit includes an output stage circuit and a channel switch circuit, the output stage circuit includes a plurality of output channels, and the output channels are controlled by the channel switch circuit Electrically coupled to the data lines to provide display data to the data lines; the temperature sensing control circuit includes: a thermal protection circuit that senses an integrated circuit temperature in the source driving circuit, according to the product The body circuit temperature generates an output signal, and synchronizes the output signal with the initial gate start signal and performs a logic operation on the initial source control signal to obtain a new source control signal to control the channel switch circuit. And a control logic circuit, performing a logic operation on the output signal and the initial gate start signal to obtain a new gate start signal To decide whether to enable the gate drive circuit. The temperature sensing control circuit of claim 8, wherein the new source control signal generated by the thermal protection circuit further controls electrically coupling the data lines to a charge sharing switch of a predetermined potential. In the circuit, the on/off state of the charge sharing switch circuit is opposite to the on/off state of the channel switching circuit. The temperature sensing control circuit of claim 8, wherein the thermal protection circuit comprises: a thermal sensing circuit, sensing the integrated circuit temperature of the source driving circuit, and outputting an integrated circuit a sensing voltage corresponding to the temperature; a reference voltage generating circuit for generating a set of reference voltages; a comparator for generating the output signal according to the sensing voltage and the set of reference voltages; and a second control logic circuit The output signal is synchronized with the initial gate start signal and the logic operation is performed by the initial source control signal to obtain the new source control signal. The temperature sensing control circuit of claim 10, wherein the second control logic circuit comprises: an edge-triggered D-type flip-flop, wherein the initial gate start signal is used as an edge trigger signal for the output signal Performing synchronization; and an OR gate, the new source control signal is obtained by performing an OR gate operation on the output signal of the initial source control signal and the edge trigger D-type flip-flop. The temperature sensing control circuit of claim 11, wherein the second control logic circuit further comprises an inverter, and performing an inversion operation on the new source control signal to control the electrical coupling. The data lines are connected to an on/off state of a charge sharing switch circuit of a predetermined potential. A temperature sensing control method is suitable for being applied to an active matrix display, the active matrix display comprising a timing controller, a source driving circuit, a gate driving circuit and a plurality of data lines, wherein the timing controller is used for Generating an initial gate start signal and an initial source control signal, the source drive circuit includes an output stage circuit, the output stage circuit includes a plurality of output channels for outputting a display data; and the temperature sensing control method includes Step: sensing an integrated circuit temperature of the source driving circuit; generating an output signal according to the integrated circuit temperature; synchronizing the output signal with the initial gate start signal and performing the initial source control signal a logic operation to obtain a new source control signal; using the new source control signal to determine whether the output channels provide the display data to the data lines; the output signal and the initial gate start signal Performing a logic operation to obtain a new gate start signal; and using the new gate start signal to determine whether the gate drive circuit is enabled. The temperature sensing control method of claim 13, further comprising the step of: determining whether the data lines are subjected to charge sharing with a predetermined potential by using the inverted new source control signal. The temperature sensing control method of claim 13, wherein the step of generating the output signal according to the integrated circuit temperature comprises: generating a sensing voltage according to the integrated circuit temperature; and according to the sensing voltage A comparison of a set of reference voltages produces the output signal. The temperature sensing control method of claim 15, wherein the set of reference voltages comprises a first reference voltage and a second reference voltage greater than the first reference voltage, and the sensing voltage and the group are The step of generating the output signal by comparing the reference voltage includes: determining that the output signal is at a high level when the sensing voltage is less than the first reference voltage; and determining that the output signal is when the sensing voltage is greater than the second reference voltage a low level; and maintaining the current level of the output signal unchanged when the sensing voltage is between the first reference voltage and the second reference voltage. The temperature sensing control method of claim 13, wherein the output signal is synchronized with the initial gate start signal and the logic operation is performed on the initial source control signal to obtain the new source. The step of controlling the signal includes: inputting the output signal to a D-type flip-flop, and using the initial gate start signal as an edge trigger signal of the D-type flip-flop; and one of the D-type flip-flops The output signal is ORed with the initial source control signal to obtain the new source control signal. A temperature sensing control method is applicable to an active matrix display, the active matrix display comprises a timing controller, a plurality of source driving integrated circuits, a gate driving circuit and a plurality of data lines, wherein the timing controller is used To generate an initial gate start signal and an initial source control signal, each of the source drive integrated circuits includes an output stage circuit and the output stage circuit includes a plurality of output channels for outputting a display data; The temperature sensing control method includes the steps of: sensing a working temperature of each of the source driving integrated circuits to obtain a plurality of operating temperatures; respectively generating a plurality of output signals according to the operating temperatures; Synchronizing the signal with the initial gate start signal and performing a logic operation on the initial source control signal to obtain a plurality of new source control signals; determining the source drivers by using the new source control signals respectively Whether the output channels of the integrated circuit provide the display data to the data lines; performing a logic operation on the output signals and the initial gate start signal To give a new start gate signal; and utilizing the new gate start signal to decide whether to enable the gate drive circuit. The temperature sensing control method of claim 18, wherein performing the logic operation on the output signals and the initial gate start signal comprises the step of: generating the new gate start signal: Outputting a signal execution or a non-gate operation; and performing a AND gate operation on the result of the OR gate operation with the initial gate start signal to obtain the new gate start signal. The temperature sensing control method of claim 18, wherein performing the logic operation on the output signals and the initial gate start signal comprises the step of: generating the new gate start signal: The output signal performs a gate operation; and the gate operation is performed by performing a gate operation on the result of the gate operation and the initial gate start signal to obtain the new gate start signal.