TWI446405B - Ultraviolet (EUV) mask base - Google Patents
Ultraviolet (EUV) mask base Download PDFInfo
- Publication number
- TWI446405B TWI446405B TW097112501A TW97112501A TWI446405B TW I446405 B TWI446405 B TW I446405B TW 097112501 A TW097112501 A TW 097112501A TW 97112501 A TW97112501 A TW 97112501A TW I446405 B TWI446405 B TW I446405B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- substrate
- euv
- mark
- defect
- Prior art date
Links
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
- G03F1/24—Reflection masks; Preparation thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
- G03F1/84—Inspecting
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/7084—Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21K—HANDLING OF PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
- G21K2201/00—Arrangements for handling radiation or particles
- G21K2201/06—Arrangements for handling radiation or particles using diffractive, refractive or reflecting elements
- G21K2201/067—Construction details
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007108060 | 2007-04-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200849332A TW200849332A (en) | 2008-12-16 |
| TWI446405B true TWI446405B (zh) | 2014-07-21 |
Family
ID=39875443
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097112501A TWI446405B (zh) | 2007-04-17 | 2008-04-07 | Ultraviolet (EUV) mask base |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5327046B2 (fr) |
| TW (1) | TWI446405B (fr) |
| WO (1) | WO2008129914A1 (fr) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009210802A (ja) * | 2008-03-04 | 2009-09-17 | Asahi Glass Co Ltd | Euvリソグラフィ用反射型マスクブランク |
| JP5279840B2 (ja) * | 2008-11-27 | 2013-09-04 | Hoya株式会社 | 多層反射膜付基板及び反射型マスクブランク並びに反射型マスクの製造方法 |
| KR101650370B1 (ko) * | 2009-03-26 | 2016-08-23 | 호야 가부시키가이샤 | 반사형 마스크용 다층 반사막 부착 기판 및 반사형 마스크블랭크 그리고 그것들의 제조방법 |
| WO2012121159A1 (fr) * | 2011-03-07 | 2012-09-13 | 旭硝子株式会社 | Substrat multicouche, procédé de fabrication pour substrat multicouche, et procédé de contrôle de qualité pour substrat multicouche |
| WO2013031863A1 (fr) * | 2011-09-01 | 2013-03-07 | 旭硝子株式会社 | Ébauche de masque réfléchissant, procédé de fabrication d'une ébauche de masque réfléchissant et procédé permettant de procéder au contrôle de la qualité d'une ébauche de masque réfléchissant |
| KR101993322B1 (ko) | 2011-09-28 | 2019-06-26 | 호야 가부시키가이샤 | 마스크블랭크용 유리기판, 다층 반사막 부착 기판, 마스크블랭크 및 마스크, 그리고 그것들의 제조방법 |
| JP6460617B2 (ja) | 2012-02-10 | 2019-01-30 | Hoya株式会社 | 反射型マスクブランク、反射型マスクの製造方法、及び反射型マスクブランクの製造方法 |
| WO2013133321A1 (fr) * | 2012-03-07 | 2013-09-12 | 株式会社ニコン | Masque, unité de masque, dispositif d'exposition, appareil de traitement de substrat et procédé de fabrication de dispositif |
| JP6460619B2 (ja) * | 2012-03-12 | 2019-01-30 | Hoya株式会社 | 反射型マスクブランク及び反射型マスクの製造方法 |
| US9229316B2 (en) | 2012-03-28 | 2016-01-05 | Hoya Corporation | Method for producing substrate with multilayer reflective film, method for producing reflective mask blank and method for producing reflective mask |
| WO2014050891A1 (fr) * | 2012-09-28 | 2014-04-03 | 旭硝子株式会社 | Ébauche de masque réfléchissant destinée à une lithographie par ultraviolets extrêmes et son procédé de fabrication, et masque réfléchissant destiné à une lithographie par ultraviolets extrêmes et son procédé de fabrication |
| JP6106413B2 (ja) * | 2012-11-13 | 2017-03-29 | Hoya株式会社 | 反射型マスクブランク及び反射型マスクの製造方法 |
| JP6114009B2 (ja) * | 2012-11-13 | 2017-04-12 | Hoya株式会社 | 反射型マスクブランク及び反射型マスクの製造方法 |
| JP6147514B2 (ja) * | 2013-01-31 | 2017-06-14 | Hoya株式会社 | マスクブランク用基板の製造方法、多層反射膜付き基板の製造方法、マスクブランクの製造方法、および転写用マスクの製造方法 |
| WO2014129527A1 (fr) * | 2013-02-22 | 2014-08-28 | Hoya株式会社 | Procédé de fabrication de blanc de masque réfléchissant, et procédé de fabrication de masque réfléchissant |
| JP6282844B2 (ja) * | 2013-11-06 | 2018-02-21 | Hoya株式会社 | 薄膜付き基板及び転写用マスクの製造方法 |
| JP6713251B2 (ja) * | 2015-03-30 | 2020-06-24 | Hoya株式会社 | 多層反射膜付き基板、反射型マスクブランク及び反射型マスク、並びにそれらの製造方法 |
| JP6565471B2 (ja) * | 2015-08-19 | 2019-08-28 | Agc株式会社 | マスクブランクス用ガラス基板 |
| JP6586934B2 (ja) | 2015-09-17 | 2019-10-09 | Agc株式会社 | 反射型マスクブランク、及び反射型マスクブランクの製造方法 |
| JP2017075997A (ja) * | 2015-10-13 | 2017-04-20 | 旭硝子株式会社 | 反射型マスクブランク、及び反射型マスクブランクの製造方法 |
| KR102646681B1 (ko) | 2016-03-31 | 2024-03-12 | 호야 가부시키가이샤 | 반사형 마스크 블랭크의 제조 방법, 반사형 마스크의 제조 방법 및 반도체 장치의 제조 방법 |
| JP7492456B2 (ja) * | 2018-11-07 | 2024-05-29 | Hoya株式会社 | 多層反射膜付き基板、反射型マスクブランク、反射型マスクの製造方法、及び半導体装置の製造方法 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000029202A (ja) * | 1998-07-15 | 2000-01-28 | Nikon Corp | マスクの製造方法 |
| JP4397496B2 (ja) * | 2000-02-25 | 2010-01-13 | Okiセミコンダクタ株式会社 | 反射型露光マスクおよびeuv露光装置 |
| JP2003248299A (ja) * | 2002-02-26 | 2003-09-05 | Toshiba Corp | マスク基板およびその製造方法 |
| JP4212025B2 (ja) * | 2002-07-04 | 2009-01-21 | Hoya株式会社 | 反射型マスクブランクス及び反射型マスク並びに反射型マスクの製造方法 |
| JP2004170948A (ja) * | 2002-10-30 | 2004-06-17 | Nikon Corp | パターン転写用マスク、マスク作製方法及び露光方法 |
| JP2004193269A (ja) * | 2002-12-10 | 2004-07-08 | Hitachi Ltd | マスクの製造方法および半導体集積回路装置の製造方法 |
| JP2005241688A (ja) * | 2004-02-24 | 2005-09-08 | Toppan Printing Co Ltd | フォトマスクの描画方法 |
| JP4408732B2 (ja) * | 2004-03-24 | 2010-02-03 | Necエレクトロニクス株式会社 | ホールパターンの形成方法 |
| JP4157486B2 (ja) * | 2004-03-24 | 2008-10-01 | 株式会社東芝 | 描画パターンデータの生成方法及びマスクの描画方法 |
| JP2006113221A (ja) * | 2004-10-14 | 2006-04-27 | Renesas Technology Corp | マスクの修正方法 |
| JP2006332153A (ja) * | 2005-05-24 | 2006-12-07 | Hoya Corp | 反射型マスクブランク及び反射型マスク並びに半導体装置の製造方法 |
| JP5279840B2 (ja) * | 2008-11-27 | 2013-09-04 | Hoya株式会社 | 多層反射膜付基板及び反射型マスクブランク並びに反射型マスクの製造方法 |
-
2008
- 2008-03-14 WO PCT/JP2008/054808 patent/WO2008129914A1/fr not_active Ceased
- 2008-03-14 JP JP2009510806A patent/JP5327046B2/ja active Active
- 2008-04-07 TW TW097112501A patent/TWI446405B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2008129914A1 (ja) | 2010-07-22 |
| WO2008129914A1 (fr) | 2008-10-30 |
| TW200849332A (en) | 2008-12-16 |
| JP5327046B2 (ja) | 2013-10-30 |
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