TWI447948B - - Google Patents
Info
- Publication number
- TWI447948B TWI447948B TW100131300A TW100131300A TWI447948B TW I447948 B TWI447948 B TW I447948B TW 100131300 A TW100131300 A TW 100131300A TW 100131300 A TW100131300 A TW 100131300A TW I447948 B TWI447948 B TW I447948B
- Authority
- TW
- Taiwan
Links
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100131300A TW201310692A (zh) | 2011-08-31 | 2011-08-31 | Ｌｅｄ之基板重製方法 |
| CN2012103141089A CN102969409A (zh) | 2011-08-31 | 2012-08-30 | Led的基板重制方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100131300A TW201310692A (zh) | 2011-08-31 | 2011-08-31 | Ｌｅｄ之基板重製方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201310692A TW201310692A (zh) | 2013-03-01 |
| TWI447948B true TWI447948B (fr) | 2014-08-01 |
Family
ID=47799425
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100131300A TW201310692A (zh) | 2011-08-31 | 2011-08-31 | Ｌｅｄ之基板重製方法 |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102969409A (fr) |
| TW (1) | TW201310692A (fr) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6706636B2 (en) * | 2002-02-13 | 2004-03-16 | Renesas Technology Corp. | Method of regenerating semiconductor wafer |
| JP3605927B2 (ja) * | 1996-02-28 | 2004-12-22 | 株式会社神戸製鋼所 | ウエハーまたは基板材料の再生方法 |
| TW200524031A (en) * | 2003-09-19 | 2005-07-16 | Mimasu Semiconductor Ind Co | Silicon wafer reclamation method and reclaimed wafer |
| TW200537611A (en) * | 2004-02-09 | 2005-11-16 | Mitsubishi Chem Corp | Substrate cleaning liquid for semiconductor device and cleaning method |
| TW200805464A (en) * | 2006-07-12 | 2008-01-16 | Kinik Co | Manufacturing process of recycled wafer |
| TW200913044A (en) * | 2007-09-03 | 2009-03-16 | Matsushita Electric Industrial Co Ltd | Method for reworking a wafer and apparatus for reworking a wafer |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5923946A (en) * | 1997-04-17 | 1999-07-13 | Cree Research, Inc. | Recovery of surface-ready silicon carbide substrates |
| CN101471403A (zh) * | 2007-12-27 | 2009-07-01 | 深圳市方大国科光电技术有限公司 | Led报废片再利用方法 |
| JP2011066355A (ja) * | 2009-09-18 | 2011-03-31 | Showa Denko Kk | 再生基板の製造方法、再生基板、窒化物半導体素子及びランプ |
-
2011
- 2011-08-31 TW TW100131300A patent/TW201310692A/zh not_active IP Right Cessation
-
2012
- 2012-08-30 CN CN2012103141089A patent/CN102969409A/zh active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3605927B2 (ja) * | 1996-02-28 | 2004-12-22 | 株式会社神戸製鋼所 | ウエハーまたは基板材料の再生方法 |
| US6706636B2 (en) * | 2002-02-13 | 2004-03-16 | Renesas Technology Corp. | Method of regenerating semiconductor wafer |
| TW200524031A (en) * | 2003-09-19 | 2005-07-16 | Mimasu Semiconductor Ind Co | Silicon wafer reclamation method and reclaimed wafer |
| TW200537611A (en) * | 2004-02-09 | 2005-11-16 | Mitsubishi Chem Corp | Substrate cleaning liquid for semiconductor device and cleaning method |
| TW200805464A (en) * | 2006-07-12 | 2008-01-16 | Kinik Co | Manufacturing process of recycled wafer |
| TW200913044A (en) * | 2007-09-03 | 2009-03-16 | Matsushita Electric Industrial Co Ltd | Method for reworking a wafer and apparatus for reworking a wafer |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102969409A (zh) | 2013-03-13 |
| TW201310692A (zh) | 2013-03-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |