TWI447977B - 壓電多層組件 - Google Patents

壓電多層組件 Download PDF

Info

Publication number: TWI447977B
Authority: TW; Taiwan
Prior art keywords: piezoelectric; piezoelectric ceramic; layer; layers; stack
Prior art date: 2007-09-26

Application number

TW097134029A

Other languages

English (en)

Chinese (zh)

Other versions

TW200919791A (en

Inventor

Alexander Glazunov

Original Assignee

Epcos Ag

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2007-09-26

Filing date

2008-09-05

Publication date

2014-08-01

2008-09-05 Application filed by Epcos Ag filed Critical Epcos Ag

2009-05-01 Publication of TW200919791A publication Critical patent/TW200919791A/zh

2014-08-01 Application granted granted Critical

2014-08-01 Publication of TWI447977B publication Critical patent/TWI447977B/zh

Links

239000000919 ceramic Substances 0.000 claims description 112
239000000463 material Substances 0.000 claims description 18
238000003825 pressing Methods 0.000 claims description 12
238000000034 method Methods 0.000 claims description 10
229910010293 ceramic material Inorganic materials 0.000 claims description 8
238000007650 screen-printing Methods 0.000 claims description 5
229910052751 metal Inorganic materials 0.000 claims description 3
239000002184 metal Substances 0.000 claims description 3
239000004020 conductor Substances 0.000 claims description 2
238000007639 printing Methods 0.000 claims description 2
230000000694 effects Effects 0.000 description 8
239000011888 foil Substances 0.000 description 4
238000002360 preparation method Methods 0.000 description 4
238000010586 diagram Methods 0.000 description 3
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
239000000654 additive Substances 0.000 description 2
238000006243 chemical reaction Methods 0.000 description 2
229910052451 lead zirconate titanate Inorganic materials 0.000 description 2
239000007769 metal material Substances 0.000 description 2
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
230000000996 additive effect Effects 0.000 description 1
230000002411 adverse Effects 0.000 description 1
239000000956 alloy Substances 0.000 description 1
229910045601 alloy Inorganic materials 0.000 description 1
239000011230 binding agent Substances 0.000 description 1
229910052802 copper Inorganic materials 0.000 description 1
239000010949 copper Substances 0.000 description 1
239000007772 electrode material Substances 0.000 description 1
230000001939 inductive effect Effects 0.000 description 1
238000005304 joining Methods 0.000 description 1
HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
238000004519 manufacturing process Methods 0.000 description 1
238000002156 mixing Methods 0.000 description 1
229910052759 nickel Inorganic materials 0.000 description 1
239000012811 non-conductive material Substances 0.000 description 1
229910052763 palladium Inorganic materials 0.000 description 1
229910052709 silver Inorganic materials 0.000 description 1
239000004332 silver Substances 0.000 description 1

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
- H10N30/508—Piezoelectric or electrostrictive devices having a stacked or multilayer structure adapted for alleviating internal stress, e.g. cracking control layers
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
- H10N30/053—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by integrally sintering piezoelectric or electrostrictive bodies and electrodes
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
Fuel-Injection Apparatus (AREA)

TW097134029A 2007-09-26 2008-09-05 壓電多層組件 TWI447977B (zh)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
DE102007046077A DE102007046077A1 (de)	2007-09-26	2007-09-26	Piezoelektrisches Vielschichtbauelement

Publications (2)

Publication Number	Publication Date
TW200919791A TW200919791A (en)	2009-05-01
TWI447977B true TWI447977B (zh)	2014-08-01

Family

ID=40120071

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW097134029A TWI447977B (zh)	2007-09-26	2008-09-05	壓電多層組件

Country Status (9)

Country	Link
US (1)	US8080919B2 (de)
EP (1)	EP2201619B1 (de)
JP (1)	JP2010541232A (de)
CN (1)	CN101874314A (de)
BR (1)	BRPI0817248A2 (de)
DE (1)	DE102007046077A1 (de)
RU (1)	RU2462792C2 (de)
TW (1)	TWI447977B (de)
WO (1)	WO2009043802A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE102012107341B4 (de)	2012-08-09	2020-07-09	Tdk Electronics Ag	Verfahren zum Befüllen von mindestens einer Kavität eines Vielschichtbauelements mit einem Füllmaterial
US8780503B2 (en)	2012-10-16	2014-07-15	Seagate Technology Llc	Multi-layer piezoelectric transducer with inactive layers
RU2572292C1 (ru) *	2014-11-10	2016-01-10	Федеральное государственное бюджетное образовательное учреждение высшего образования "Тверской государственный университет"	Способ изготовления многослойных пьезокерамических элементов
US11557710B2 (en)	2018-10-31	2023-01-17	Taiwan Semiconductor Manufacturing Company, Ltd.	Fully-wet via patterning method in piezoelectric sensor

Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TW543160B (en) *	2001-06-29	2003-07-21	Siemens Ag	Re-contacting for an electrical component as well as piezoelectrical component in several-layers construction
US7073265B2 (en) *	2003-02-12	2006-07-11	Denso Corporation	Stacked piezoelectric device and method of fabricating same
TW200624264A (en) *	2005-01-14	2006-07-16	Nano Dynamics Inc	Piezo-actuator and method thereof
US7208862B2 (en) *	2002-01-17	2007-04-24	Epcos Ag	Piezoelectric component and method for the production thereof

Family Cites Families (18)

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Publication number	Priority date	Publication date	Assignee	Title
ES2087089T3 (es) *	1989-11-14	1996-07-16	Battelle Memorial Institute	Metodo para fabricar un accionador piezoelectrico apilado multicapa.
JPH04299588A (ja) *	1991-03-28	1992-10-22	Nec Corp	電歪効果素子
DE19646676C1 (de) *	1996-11-12	1998-04-23	Siemens Ag	Piezoaktor mit neuartiger Kontaktierung und Herstellverfahren
JP2001160636A (ja) *	1999-09-20	2001-06-12	Denso Corp	圧電素子
DE10134787A1 (de)	2001-07-11	2003-01-23	Hans-Joachim Horn	Dachaussenhaut-Module
DE10307825A1 (de) *	2003-02-24	2004-09-09	Epcos Ag	Elektrisches Vielschichtbauelement und Schichtstapel
CN100563039C (zh) *	2004-03-09	2009-11-25	京瓷株式会社	叠层型压电元件及其制造方法
JP4817610B2 (ja) *	2004-03-29	2011-11-16	京セラ株式会社	積層型圧電素子およびその製造方法ならびにこれを用いた噴射装置
DE102004031402A1 (de) *	2004-06-29	2006-02-09	Siemens Ag	Piezoelektrisches Bauteil mit Sollbruchstelle, Verfahren zum Herstellen des Bauteils und Verwendung des Bauteils
DE102004031404B4 (de)	2004-06-29	2010-04-08	Siemens Ag	Piezoelektrisches Bauteil mit Sollbruchstelle und elektrischem Anschlusselement, Verfahren zum Herstellen des Bauteils und Verwendung des Bauteils
JP4876467B2 (ja) *	2004-12-06	2012-02-15	株式会社デンソー	積層型圧電素子
JP4843948B2 (ja) *	2005-01-21	2011-12-21	Ｔｄｋ株式会社	積層型圧電素子
ATE538502T1 (de)	2005-02-15	2012-01-15	Murata Manufacturing Co	Mehrschichtiges piezoelektrisches bauelement
JP4942659B2 (ja) *	2005-08-29	2012-05-30	京セラ株式会社	積層型圧電素子及びこれを用いた噴射装置
US8288921B2 (en) *	2005-09-29	2012-10-16	Kyocera Corporation	Multilayer piezoelectric element and injector using the same
JP2007157849A (ja)	2005-12-01	2007-06-21	Denso Corp	積層型圧電素子の製造方法
DE102006026644A1 (de) *	2006-06-08	2007-12-13	Robert Bosch Gmbh	Piezoelektrischer Aktor
JP4933554B2 (ja)	2006-09-28	2012-05-16	京セラ株式会社	積層型圧電素子、これを用いた噴射装置及び燃料噴射システム、並びに積層型圧電素子の製造方法

2007
- 2007-09-26 DE DE102007046077A patent/DE102007046077A1/de not_active Withdrawn
2008
- 2008-09-05 TW TW097134029A patent/TWI447977B/zh not_active IP Right Cessation
- 2008-09-25 JP JP2010526292A patent/JP2010541232A/ja active Pending
- 2008-09-25 CN CN200880117642A patent/CN101874314A/zh active Pending
- 2008-09-25 RU RU2010116291/28A patent/RU2462792C2/ru not_active IP Right Cessation
- 2008-09-25 WO PCT/EP2008/062858 patent/WO2009043802A1/de not_active Ceased
- 2008-09-25 BR BRPI0817248-0A patent/BRPI0817248A2/pt active Search and Examination
- 2008-09-25 EP EP08835093.9A patent/EP2201619B1/de not_active Not-in-force
2010
- 2010-03-24 US US12/731,028 patent/US8080919B2/en not_active Expired - Fee Related

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TW543160B (en) *	2001-06-29	2003-07-21	Siemens Ag	Re-contacting for an electrical component as well as piezoelectrical component in several-layers construction
US7208862B2 (en) *	2002-01-17	2007-04-24	Epcos Ag	Piezoelectric component and method for the production thereof
US7073265B2 (en) *	2003-02-12	2006-07-11	Denso Corporation	Stacked piezoelectric device and method of fabricating same
TW200624264A (en) *	2005-01-14	2006-07-16	Nano Dynamics Inc	Piezo-actuator and method thereof

Also Published As

Publication number	Publication date
RU2462792C2 (ru)	2012-09-27
WO2009043802A1 (de)	2009-04-09
US20100225205A1 (en)	2010-09-09
EP2201619B1 (de)	2013-07-10
RU2010116291A (ru)	2011-11-10
US8080919B2 (en)	2011-12-20
TW200919791A (en)	2009-05-01
DE102007046077A1 (de)	2009-04-02
EP2201619A1 (de)	2010-06-30
BRPI0817248A2 (pt)	2015-06-16
JP2010541232A (ja)	2010-12-24
CN101874314A (zh)	2010-10-27

Legal Events

Date	Code	Title	Description
2020-05-01	MM4A	Annulment or lapse of patent due to non-payment of fees

Publication	Publication Date	Title
TWI447977B (zh)	2014-08-01	壓電多層組件
JP2008130842A (ja)	2008-06-05	積層型圧電素子
JP5141046B2 (ja)	2013-02-13	積層型圧電素子
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JP4506172B2 (ja)	2010-07-21	積層型圧電素子
JP4623305B2 (ja)	2011-02-02	積層電子部品の製造方法
JP5821303B2 (ja)	2015-11-24	圧電素子及び圧電素子の製造方法
JP4023622B2 (ja)	2007-12-19	積層電子部品の製造方法
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JP4074282B2 (ja)	2008-04-09	積層型電子部品の製造方法
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