TWI451585B - 用於網板印刷圖案對準之強化視覺系統 - Google Patents
用於網板印刷圖案對準之強化視覺系統 Download PDFInfo
- Publication number
- TWI451585B TWI451585B TW099120279A TW99120279A TWI451585B TW I451585 B TWI451585 B TW I451585B TW 099120279 A TW099120279 A TW 099120279A TW 99120279 A TW99120279 A TW 99120279A TW I451585 B TWI451585 B TW I451585B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- solar cell
- doped region
- forming process
- cell forming
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
- H10F77/206—Electrodes for devices having potential barriers
- H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F10/00—Individual photovoltaic cells, e.g. solar cells
- H10F10/10—Individual photovoltaic cells, e.g. solar cells having potential barriers
- H10F10/14—Photovoltaic cells having only PN homojunction potential barriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/121—The active layers comprising only Group IV materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
- H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/12—Stencil printing; Silk-screen printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/24—Stencils; Stencil materials; Carriers therefor
- B41N1/248—Mechanical details, e.g. fixation holes, reinforcement or guiding means; Perforation lines; Ink holding means; Visually or otherwise detectable marking means; Stencil units
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- General Health & Medical Sciences (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Photovoltaic Devices (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Screen Printers (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ITUD2009A000119A IT1394647B1 (it) | 2009-06-22 | 2009-06-22 | Sistema di visione migliorato per l'allineamento di uno schema di stampa serigrafica |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201121086A TW201121086A (en) | 2011-06-16 |
| TWI451585B true TWI451585B (zh) | 2014-09-01 |
Family
ID=42110952
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099120279A TWI451585B (zh) | 2009-06-22 | 2010-06-22 | 用於網板印刷圖案對準之強化視覺系統 |
Country Status (2)
| Country | Link |
|---|---|
| IT (1) | IT1394647B1 (it) |
| TW (1) | TWI451585B (it) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI476874B (zh) * | 2011-07-29 | 2015-03-11 | Hon Hai Prec Ind Co Ltd | 具有導電線路的玻璃板及其製造方法 |
| TWI424584B (zh) * | 2011-11-30 | 2014-01-21 | 友達光電股份有限公司 | 製作太陽能電池之方法 |
| CN108674010B (zh) * | 2018-06-28 | 2024-06-28 | 无锡奥特维科技股份有限公司 | 丝网印刷设备、叠片机及丝网印刷方法 |
| CN113905561B (zh) * | 2021-10-11 | 2023-02-24 | Oppo广东移动通信有限公司 | 具有纹理图案的壳体及其加工方法、电子设备 |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5709905A (en) * | 1997-01-28 | 1998-01-20 | Motorola, Inc. | Apparatus and method for automatic monitoring and control of stencil printing |
| JP2003197932A (ja) * | 2001-12-25 | 2003-07-11 | Kyocera Corp | 太陽電池素子およびその製造方法 |
| US6815001B1 (en) * | 1999-02-08 | 2004-11-09 | Canon Kabushiki Kaisha | Electronic device, method for producing electron source and image forming device, and apparatus for producing electronic device |
| JP2005011886A (ja) * | 2003-06-17 | 2005-01-13 | Sharp Corp | 太陽電池および太陽電池の製造方法 |
| US7171897B2 (en) * | 2003-06-05 | 2007-02-06 | Georgia Tech Research Corporation | System and methods for data-driven control of manufacturing processes |
| TW200818526A (en) * | 2006-10-04 | 2008-04-16 | Gigastorage Corp | Method for forming a solar cell |
| TW200818527A (en) * | 2006-10-04 | 2008-04-16 | Gigastorage Corp | Solar cell |
| JP2008139251A (ja) * | 2006-12-05 | 2008-06-19 | Toshiba Corp | イオン注入パターン検出方法 |
| TW200903820A (en) * | 2007-05-11 | 2009-01-16 | Jusung Eng Co Ltd | Method, apparatus and system of manufacturing solar cell |
| US7547362B2 (en) * | 2002-12-18 | 2009-06-16 | Lg Display Co., Ltd. | Dispenser for liquid crystal display panel and method for controlling gap between substrate and nozzle using the same |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10284359A (ja) * | 1997-04-11 | 1998-10-23 | Mitsubishi Electric Corp | ウエハの認識装置及びウエハの認識方法 |
| DE10146879A1 (de) * | 2001-09-26 | 2003-04-17 | Thermosensorik Gmbh | Verfahren zum Nachweis und zur Lokalisierung von Rissen in Silizium-Solarzellen und Silizium-Scheiben |
| DE102005061785B4 (de) * | 2005-12-23 | 2008-04-03 | Basler Ag | Verfahren und Vorrichtung zum Erkennen von Rissen in Silizium-Wafern |
| DE102007006525B4 (de) * | 2007-02-06 | 2009-05-14 | Basler Ag | Verfahren und Vorrichtung zur Detektierung von Defekten |
| DE102007057011B4 (de) * | 2007-11-23 | 2011-04-28 | Pi Photovoltaik-Institut Berlin Ag | Erfassungsvorrichtung und Verfahren zum Erfassen einer Beschädigung einer Solarzelle mittels Photolumineszenz |
| US8215473B2 (en) * | 2008-05-21 | 2012-07-10 | Applied Materials, Inc. | Next generation screen printing system |
| WO2010009297A2 (en) * | 2008-07-16 | 2010-01-21 | Applied Materials, Inc. | Hybrid heterojunction solar cell fabrication using a doping layer mask |
-
2009
- 2009-06-22 IT ITUD2009A000119A patent/IT1394647B1/it active
-
2010
- 2010-06-22 TW TW099120279A patent/TWI451585B/zh not_active IP Right Cessation
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5709905A (en) * | 1997-01-28 | 1998-01-20 | Motorola, Inc. | Apparatus and method for automatic monitoring and control of stencil printing |
| US6815001B1 (en) * | 1999-02-08 | 2004-11-09 | Canon Kabushiki Kaisha | Electronic device, method for producing electron source and image forming device, and apparatus for producing electronic device |
| JP2003197932A (ja) * | 2001-12-25 | 2003-07-11 | Kyocera Corp | 太陽電池素子およびその製造方法 |
| US7547362B2 (en) * | 2002-12-18 | 2009-06-16 | Lg Display Co., Ltd. | Dispenser for liquid crystal display panel and method for controlling gap between substrate and nozzle using the same |
| US7171897B2 (en) * | 2003-06-05 | 2007-02-06 | Georgia Tech Research Corporation | System and methods for data-driven control of manufacturing processes |
| JP2005011886A (ja) * | 2003-06-17 | 2005-01-13 | Sharp Corp | 太陽電池および太陽電池の製造方法 |
| TW200818526A (en) * | 2006-10-04 | 2008-04-16 | Gigastorage Corp | Method for forming a solar cell |
| TW200818527A (en) * | 2006-10-04 | 2008-04-16 | Gigastorage Corp | Solar cell |
| JP2008139251A (ja) * | 2006-12-05 | 2008-06-19 | Toshiba Corp | イオン注入パターン検出方法 |
| TW200903820A (en) * | 2007-05-11 | 2009-01-16 | Jusung Eng Co Ltd | Method, apparatus and system of manufacturing solar cell |
Also Published As
| Publication number | Publication date |
|---|---|
| IT1394647B1 (it) | 2012-07-05 |
| TW201121086A (en) | 2011-06-16 |
| ITUD20090119A1 (it) | 2010-12-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |