TWI459491B - 基板之處理裝置及處理方法 - Google Patents

基板之處理裝置及處理方法 Download PDF

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Publication number
TWI459491B
TWI459491B TW095125429A TW95125429A TWI459491B TW I459491 B TWI459491 B TW I459491B TW 095125429 A TW095125429 A TW 095125429A TW 95125429 A TW95125429 A TW 95125429A TW I459491 B TWI459491 B TW I459491B
Authority
TW
Taiwan
Prior art keywords
substrate
receiving portion
processing
transport
transported
Prior art date
Application number
TW095125429A
Other languages
English (en)
Chinese (zh)
Other versions
TW200739791A (en
Inventor
廣瀨治道
末吉秀樹
Original Assignee
芝浦機械電子裝置股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 芝浦機械電子裝置股份有限公司 filed Critical 芝浦機械電子裝置股份有限公司
Publication of TW200739791A publication Critical patent/TW200739791A/zh
Application granted granted Critical
Publication of TWI459491B publication Critical patent/TWI459491B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3211—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/38—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations with angular orientation of workpieces

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Specific Conveyance Elements (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning In General (AREA)
  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW095125429A 2005-07-25 2006-07-12 基板之處理裝置及處理方法 TWI459491B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005214583A JP4643384B2 (ja) 2005-07-25 2005-07-25 基板の処理装置及び処理方法

Publications (2)

Publication Number Publication Date
TW200739791A TW200739791A (en) 2007-10-16
TWI459491B true TWI459491B (zh) 2014-11-01

Family

ID=37673075

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095125429A TWI459491B (zh) 2005-07-25 2006-07-12 基板之處理裝置及處理方法

Country Status (4)

Country Link
JP (1) JP4643384B2 (ja)
KR (1) KR101340422B1 (ja)
CN (1) CN1903683B (ja)
TW (1) TWI459491B (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4685618B2 (ja) * 2005-12-13 2011-05-18 芝浦メカトロニクス株式会社 基板の処理装置
KR100865767B1 (ko) * 2007-03-15 2008-10-28 우진선행기술 주식회사 기판 슬림화 장치 및 기판 슬림화 방법
CN101531465B (zh) * 2009-04-01 2010-12-29 上海多林化工科技有限公司 平板玻璃自动蒙砂生产线
JP4992137B1 (ja) * 2011-10-15 2012-08-08 株式会社Ａｋシステム 板状被処理材の取扱装置
US9650727B2 (en) * 2013-07-03 2017-05-16 Applied Materials, Inc. Reactor gas panel common exhaust
CN110641919A (zh) * 2019-10-31 2020-01-03 张家港市超声电气有限公司 用于硅片的吸片传动机构
CN116237314A (zh) * 2023-02-28 2023-06-09 福建晟哲自动化科技有限公司 一种大尺寸基板精密清洗工艺及设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000049206A (ja) * 1998-07-28 2000-02-18 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2004140336A (ja) * 2002-08-19 2004-05-13 Sumitomo Precision Prod Co Ltd 昇降式基板処理装置及びこれを備えた基板処理システム
JP2004349475A (ja) * 2003-05-22 2004-12-09 Shibaura Mechatronics Corp 基板の処理装置、搬送装置及び処理方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100596050B1 (ko) * 2002-10-31 2006-07-03 삼성코닝정밀유리 주식회사 유리기판의 이송시스템
KR100500171B1 (ko) 2003-06-19 2005-07-07 주식회사 디엠에스 기판의 경사 이송장치 및 경사 이송방법과 이를 적용한 기판의 처리방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000049206A (ja) * 1998-07-28 2000-02-18 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2004140336A (ja) * 2002-08-19 2004-05-13 Sumitomo Precision Prod Co Ltd 昇降式基板処理装置及びこれを備えた基板処理システム
JP2004349475A (ja) * 2003-05-22 2004-12-09 Shibaura Mechatronics Corp 基板の処理装置、搬送装置及び処理方法

Also Published As

Publication number Publication date
KR101340422B1 (ko) 2013-12-11
CN1903683B (zh) 2012-04-11
JP4643384B2 (ja) 2011-03-02
KR20070013225A (ko) 2007-01-30
TW200739791A (en) 2007-10-16
JP2007035790A (ja) 2007-02-08
CN1903683A (zh) 2007-01-31

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