TWI461277B - 印紋用模板及其製造方法 - Google Patents

印紋用模板及其製造方法 Download PDF

Info

Publication number: TWI461277B
Authority: TW; Taiwan
Prior art keywords: printing; template; side chain; crystalline polymer; fine pattern
Prior art date: 2009-06-08

Application number

TW098138018A

Other languages

English (en)

Chinese (zh)

Other versions

TW201043427A (en

Inventor

Shinichi Nakano

Shinichiro Kawahara

Shinji Matsui

Makoto Okada

Original Assignee

Nitta Corp

Hyogo Ken

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2009-06-08

Filing date

2009-11-10

Publication date

2014-11-21

2009-11-10 Application filed by Nitta Corp, Hyogo Ken filed Critical Nitta Corp

2010-12-16 Publication of TW201043427A publication Critical patent/TW201043427A/zh

2014-11-21 Application granted granted Critical

2014-11-21 Publication of TWI461277B publication Critical patent/TWI461277B/zh

Links

238000000034 method Methods 0.000 title claims description 15
238000004519 manufacturing process Methods 0.000 title claims description 14
229920000642 polymer Polymers 0.000 claims description 55
239000002344 surface layer Substances 0.000 claims description 52
238000002844 melting Methods 0.000 claims description 27
230000008018 melting Effects 0.000 claims description 27
239000010410 layer Substances 0.000 claims description 26
NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 17
125000000217 alkyl group Chemical group 0.000 claims description 7
239000000463 material Substances 0.000 claims description 7
239000000178 monomer Substances 0.000 claims description 7
125000004432 carbon atom Chemical group C* 0.000 claims description 5
238000004381 surface treatment Methods 0.000 claims description 5
229910004298 SiO 2 Inorganic materials 0.000 claims description 4
229910052799 carbon Inorganic materials 0.000 claims description 4
239000011521 glass Substances 0.000 claims description 4
KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 3
RJGDLRCDCYRQOQ-UHFFFAOYSA-N anthrone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3CC2=C1 RJGDLRCDCYRQOQ-UHFFFAOYSA-N 0.000 claims description 3
238000010030 laminating Methods 0.000 claims description 3
229910052707 ruthenium Inorganic materials 0.000 claims description 3
OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
230000000379 polymerizing effect Effects 0.000 claims description 2
239000011342 resin composition Substances 0.000 description 13
239000000758 substrate Substances 0.000 description 13
239000011248 coating agent Substances 0.000 description 12
238000000576 coating method Methods 0.000 description 12
238000001459 lithography Methods 0.000 description 11
239000007788 liquid Substances 0.000 description 6
-1 2-hydroxyhexyl Chemical group 0.000 description 4
238000010438 heat treatment Methods 0.000 description 4
238000005259 measurement Methods 0.000 description 4
QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
238000005227 gel permeation chromatography Methods 0.000 description 3
238000003475 lamination Methods 0.000 description 3
125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
239000004926 polymethyl methacrylate Substances 0.000 description 3
239000002904 solvent Substances 0.000 description 3
SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
239000004793 Polystyrene Substances 0.000 description 2
MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
230000015572 biosynthetic process Effects 0.000 description 2
229920001577 copolymer Polymers 0.000 description 2
238000010586 diagram Methods 0.000 description 2
238000000113 differential scanning calorimetry Methods 0.000 description 2
238000001312 dry etching Methods 0.000 description 2
238000001035 drying Methods 0.000 description 2
238000010894 electron beam technology Methods 0.000 description 2
238000010528 free radical solution polymerization reaction Methods 0.000 description 2
239000000203 mixture Substances 0.000 description 2
238000000465 moulding Methods 0.000 description 2
230000035699 permeability Effects 0.000 description 2
229920002223 polystyrene Polymers 0.000 description 2
238000003786 synthesis reaction Methods 0.000 description 2
VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 1
VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
239000005977 Ethylene Substances 0.000 description 1
CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
239000004698 Polyethylene Substances 0.000 description 1
239000004743 Polypropylene Substances 0.000 description 1
OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
229910052782 aluminium Inorganic materials 0.000 description 1
QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
125000002511 behenyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
238000012662 bulk polymerization Methods 0.000 description 1
125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
238000003490 calendering Methods 0.000 description 1
125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
238000003486 chemical etching Methods 0.000 description 1
238000001816 cooling Methods 0.000 description 1
LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
239000013078 crystal Substances 0.000 description 1
208000028659 discharge Diseases 0.000 description 1
KHAYCTOSKLIHEP-UHFFFAOYSA-N docosyl prop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCCCCCOC(=O)C=C KHAYCTOSKLIHEP-UHFFFAOYSA-N 0.000 description 1
238000010556 emulsion polymerization method Methods 0.000 description 1
125000004494 ethyl ester group Chemical group 0.000 description 1
125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
239000005038 ethylene vinyl acetate Substances 0.000 description 1
229920006244 ethylene-ethyl acrylate Polymers 0.000 description 1
230000001747 exhibiting effect Effects 0.000 description 1
238000001125 extrusion Methods 0.000 description 1
239000012530 fluid Substances 0.000 description 1
239000001530 fumaric acid Substances 0.000 description 1
239000007789 gas Substances 0.000 description 1
125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
NGYRYRBDIPYKTL-UHFFFAOYSA-N icosyl prop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCCCOC(=O)C=C NGYRYRBDIPYKTL-UHFFFAOYSA-N 0.000 description 1
230000001771 impaired effect Effects 0.000 description 1
230000001678 irradiating effect Effects 0.000 description 1
VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
239000011976 maleic acid Substances 0.000 description 1
LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
229910052760 oxygen Inorganic materials 0.000 description 1
239000001301 oxygen Substances 0.000 description 1
125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
230000035515 penetration Effects 0.000 description 1
238000001020 plasma etching Methods 0.000 description 1
238000009832 plasma treatment Methods 0.000 description 1
229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
229920000768 polyamine Polymers 0.000 description 1
239000004417 polycarbonate Substances 0.000 description 1
229920000515 polycarbonate Polymers 0.000 description 1
229920000728 polyester Polymers 0.000 description 1
229920000573 polyethylene Polymers 0.000 description 1
229920000139 polyethylene terephthalate Polymers 0.000 description 1
239000005020 polyethylene terephthalate Substances 0.000 description 1
238000006116 polymerization reaction Methods 0.000 description 1
229920001155 polypropylene Polymers 0.000 description 1
229920005606 polypropylene copolymer Polymers 0.000 description 1
239000004800 polyvinyl chloride Substances 0.000 description 1
229920000915 polyvinyl chloride Polymers 0.000 description 1
239000004576 sand Substances 0.000 description 1
238000001878 scanning electron micrograph Methods 0.000 description 1
239000002094 self assembled monolayer Substances 0.000 description 1
239000013545 self-assembled monolayer Substances 0.000 description 1
238000004528 spin coating Methods 0.000 description 1
238000005507 spraying Methods 0.000 description 1
125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
238000010558 suspension polymerization method Methods 0.000 description 1
229920003002 synthetic resin Polymers 0.000 description 1
239000000057 synthetic resin Substances 0.000 description 1
229910052715 tantalum Inorganic materials 0.000 description 1
GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
229920005992 thermoplastic resin Polymers 0.000 description 1
LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
238000002834 transmittance Methods 0.000 description 1
238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1

Classifications

- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
- B29C33/3857—Manufacturing moulds, e.g. shaping the mould surface by machining by making impressions of one or more parts of models, e.g. shaped articles and including possible subsequent assembly of the parts
- B29C33/3878—Manufacturing moulds, e.g. shaping the mould surface by machining by making impressions of one or more parts of models, e.g. shaped articles and including possible subsequent assembly of the parts used as masters for making successive impressions
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical

Landscapes

Engineering & Computer Science (AREA)
Chemical & Material Sciences (AREA)
Nanotechnology (AREA)
Mechanical Engineering (AREA)
Manufacturing & Machinery (AREA)
Physics & Mathematics (AREA)
General Physics & Mathematics (AREA)
Crystallography & Structural Chemistry (AREA)
Mathematical Physics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
Theoretical Computer Science (AREA)
Health & Medical Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Medicinal Chemistry (AREA)
Polymers & Plastics (AREA)
Organic Chemistry (AREA)
Shaping Of Tube Ends By Bending Or Straightening (AREA)
Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Moulds For Moulding Plastics Or The Like (AREA)

TW098138018A 2009-06-08 2009-11-10 印紋用模板及其製造方法 TWI461277B (zh)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2009137553		2009-06-08

Publications (2)

Publication Number	Publication Date
TW201043427A TW201043427A (en)	2010-12-16
TWI461277B true TWI461277B (zh)	2014-11-21

Family

ID=43308585

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW098138018A TWI461277B (zh)	2009-06-08	2009-11-10	印紋用模板及其製造方法

Country Status (5)

Country	Link
JP (1)	JP5329661B2 (ja)
KR (1)	KR101355036B1 (ja)
CN (1)	CN102458800B (ja)
TW (1)	TWI461277B (ja)
WO (1)	WO2010143321A1 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP5463072B2 (ja) *	2009-05-12	2014-04-09	ニッタ株式会社	微細構造の製造方法
JP5463087B2 (ja) *	2009-06-22	2014-04-09	ニッタ株式会社	微細構造の製造方法
JP2012143915A (ja) *	2011-01-10	2012-08-02	Scivax Kk	インプリント用型
JP6304735B2 (ja) *	2013-05-10	2018-04-04	ニッタ株式会社	インプリント用レジスト材およびそれを用いた微細構造の製造方法
JP6531898B2 (ja) *	2015-03-12	2019-06-19	ニッタ株式会社	インプリント用モールドおよびその製造方法、並びに微細構造の製造方法
JP7245973B2 (ja) *	2019-02-04	2023-03-27	パナソニックＩｐマネジメント株式会社	パターンの形成方法および装置
CN110316694B (zh) *	2019-07-09	2022-03-15	嘉兴学院	一种具有微纳米形态模具的加工方法
CN113189840A (zh) *	2021-04-16	2021-07-30	深圳先进技术研究院	微纳结构制作方法及微纳结构制作装置

Citations (7)

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Publication number	Priority date	Publication date	Assignee	Title
JPS4944076A (ja) *	1972-09-01	1974-04-25
JPS63202685A (ja) *	1987-02-18	1988-08-22	Nitto Electric Ind Co Ltd	アクリル系剥離剤
JPS6422907A (en) *	1987-07-17	1989-01-25	Dainippon Printing Co Ltd	Heat mold release agent
TW440519B (en) *	1999-04-23	2001-06-16	Dainippon Printing Co Ltd	Shaped sheet and method for producing the same
JP2006523728A (ja) *	2003-04-14	2006-10-19	ミヌタ・テクノロジー・カンパニー・リミテッド	微細パターンの形成に用いられるモールド用樹脂組成物およびそれからの有機モールドの製作方法
TWI280159B (en) *	2005-03-29	2007-05-01	Li Bing Huan	Method for fabricating nano-adhesive
JP2009119695A (ja) *	2007-11-14	2009-06-04	Hitachi High-Technologies Corp	ナノプリント用樹脂スタンパ

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Publication number	Priority date	Publication date	Assignee	Title
JP4394248B2 (ja) *	1999-04-23	2010-01-06	大日本印刷株式会社	賦型シート及びその製造方法
JPWO2005075184A1 (ja) *	2004-02-04	2007-10-11	住友重機械工業株式会社	加圧成形装置、金型及び加圧成形方法
JP2009001002A (ja) *	2007-05-24	2009-01-08	Univ Waseda	モールド、その製造方法および転写微細パターンを有する基材の製造方法

2009
- 2009-10-27 KR KR1020117028874A patent/KR101355036B1/ko active Active
- 2009-10-27 JP JP2011518202A patent/JP5329661B2/ja active Active
- 2009-10-27 WO PCT/JP2009/068383 patent/WO2010143321A1/ja not_active Ceased
- 2009-10-27 CN CN200980159699.3A patent/CN102458800B/zh not_active Expired - Fee Related
- 2009-11-10 TW TW098138018A patent/TWI461277B/zh active

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS4944076A (ja) *	1972-09-01	1974-04-25
JPS63202685A (ja) *	1987-02-18	1988-08-22	Nitto Electric Ind Co Ltd	アクリル系剥離剤
JPS6422907A (en) *	1987-07-17	1989-01-25	Dainippon Printing Co Ltd	Heat mold release agent
TW440519B (en) *	1999-04-23	2001-06-16	Dainippon Printing Co Ltd	Shaped sheet and method for producing the same
JP2006523728A (ja) *	2003-04-14	2006-10-19	ミヌタ・テクノロジー・カンパニー・リミテッド	微細パターンの形成に用いられるモールド用樹脂組成物およびそれからの有機モールドの製作方法
TWI280159B (en) *	2005-03-29	2007-05-01	Li Bing Huan	Method for fabricating nano-adhesive
JP2009119695A (ja) *	2007-11-14	2009-06-04	Hitachi High-Technologies Corp	ナノプリント用樹脂スタンパ

Also Published As

Publication number	Publication date
TW201043427A (en)	2010-12-16
JP5329661B2 (ja)	2013-10-30
KR20120014022A (ko)	2012-02-15
KR101355036B1 (ko)	2014-01-24
CN102458800A (zh)	2012-05-16
CN102458800B (zh)	2014-04-23
JPWO2010143321A1 (ja)	2012-11-22
WO2010143321A1 (ja)	2010-12-16

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