TWI466217B - - Google Patents

Info

Publication number
TWI466217B
TWI466217B TW100103424A TW100103424A TWI466217B TW I466217 B TWI466217 B TW I466217B TW 100103424 A TW100103424 A TW 100103424A TW 100103424 A TW100103424 A TW 100103424A TW I466217 B TWI466217 B TW I466217B
Authority
TW
Taiwan
Application number
TW100103424A
Other languages
Chinese (zh)
Other versions
TW201232691A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW100103424A priority Critical patent/TW201232691A/zh
Publication of TW201232691A publication Critical patent/TW201232691A/zh
Application granted granted Critical
Publication of TWI466217B publication Critical patent/TWI466217B/zh

Links

TW100103424A 2011-01-28 2011-01-28 Equipment and operation method for enhancing throughput of wafer rapid thermal processing TW201232691A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW100103424A TW201232691A (en) 2011-01-28 2011-01-28 Equipment and operation method for enhancing throughput of wafer rapid thermal processing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW100103424A TW201232691A (en) 2011-01-28 2011-01-28 Equipment and operation method for enhancing throughput of wafer rapid thermal processing

Publications (2)

Publication Number Publication Date
TW201232691A TW201232691A (en) 2012-08-01
TWI466217B true TWI466217B (de) 2014-12-21

Family

ID=47069677

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100103424A TW201232691A (en) 2011-01-28 2011-01-28 Equipment and operation method for enhancing throughput of wafer rapid thermal processing

Country Status (1)

Country Link
TW (1) TW201232691A (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118231307B (zh) * 2024-05-22 2024-10-15 瑶光半导体(浙江)有限公司 一种晶片传送系统及方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI223679B (en) * 1997-07-17 2004-11-11 Memc Electronic Materials Method and system for controlling growth of a silicon crystal
TW200805553A (en) * 2006-05-26 2008-01-16 Brooks Automation Inc Linearly distributed semiconductor workpiece processing tool

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI223679B (en) * 1997-07-17 2004-11-11 Memc Electronic Materials Method and system for controlling growth of a silicon crystal
TW200805553A (en) * 2006-05-26 2008-01-16 Brooks Automation Inc Linearly distributed semiconductor workpiece processing tool

Also Published As

Publication number Publication date
TW201232691A (en) 2012-08-01

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