TWI491652B - Organic-inorganic hybrid material film and method for manufacturing the same - Google Patents
Organic-inorganic hybrid material film and method for manufacturing the same Download PDFInfo
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- TWI491652B TWI491652B TW102117508A TW102117508A TWI491652B TW I491652 B TWI491652 B TW I491652B TW 102117508 A TW102117508 A TW 102117508A TW 102117508 A TW102117508 A TW 102117508A TW I491652 B TWI491652 B TW I491652B
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- Prior art keywords
- group
- anhydride
- organic
- inorganic hybrid
- hybrid material
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- 239000000463 material Substances 0.000 title claims description 56
- 238000004519 manufacturing process Methods 0.000 title claims description 24
- 238000000034 method Methods 0.000 title description 8
- 239000007822 coupling agent Substances 0.000 claims description 38
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 34
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 claims description 33
- 229920000141 poly(maleic anhydride) Polymers 0.000 claims description 25
- 239000003054 catalyst Substances 0.000 claims description 17
- 239000002253 acid Substances 0.000 claims description 16
- 150000001412 amines Chemical class 0.000 claims description 15
- -1 aromatic monocarboxylic acid Chemical class 0.000 claims description 14
- 229910001925 ruthenium oxide Inorganic materials 0.000 claims description 13
- 238000006482 condensation reaction Methods 0.000 claims description 12
- 229920000642 polymer Polymers 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 150000004984 aromatic diamines Chemical class 0.000 claims description 11
- 125000003118 aryl group Chemical group 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 11
- 125000004191 (C1-C6) alkoxy group Chemical group 0.000 claims description 10
- 239000011889 copper foil Substances 0.000 claims description 10
- 230000007062 hydrolysis Effects 0.000 claims description 10
- 238000006460 hydrolysis reaction Methods 0.000 claims description 10
- 239000000126 substance Substances 0.000 claims description 10
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical group CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 claims description 9
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 9
- 239000012948 isocyanate Substances 0.000 claims description 9
- 150000002513 isocyanates Chemical class 0.000 claims description 9
- 238000007363 ring formation reaction Methods 0.000 claims description 9
- 239000002904 solvent Substances 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims description 8
- 238000006243 chemical reaction Methods 0.000 claims description 7
- 125000003161 (C1-C6) alkylene group Chemical group 0.000 claims description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 6
- 239000012024 dehydrating agents Substances 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 239000000178 monomer Substances 0.000 claims description 6
- 150000002923 oximes Chemical class 0.000 claims description 6
- 125000003320 C2-C6 alkenyloxy group Chemical group 0.000 claims description 5
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 5
- 239000003377 acid catalyst Substances 0.000 claims description 5
- 125000004104 aryloxy group Chemical group 0.000 claims description 5
- 229910052736 halogen Inorganic materials 0.000 claims description 5
- 150000002367 halogens Chemical class 0.000 claims description 5
- WJMXTYZCTXTFJM-UHFFFAOYSA-N 1,1,1,2-tetraethoxydecane Chemical compound C(C)OC(C(OCC)(OCC)OCC)CCCCCCCC WJMXTYZCTXTFJM-UHFFFAOYSA-N 0.000 claims description 4
- ITQTTZVARXURQS-UHFFFAOYSA-N 3-methylpyridine Chemical compound CC1=CC=CN=C1 ITQTTZVARXURQS-UHFFFAOYSA-N 0.000 claims description 4
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims description 4
- 125000003277 amino group Chemical group 0.000 claims description 4
- 150000008064 anhydrides Chemical class 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 claims description 4
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 claims description 3
- DRVWBEJJZZTIGJ-UHFFFAOYSA-N cerium(3+);oxygen(2-) Chemical group [O-2].[O-2].[O-2].[Ce+3].[Ce+3] DRVWBEJJZZTIGJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 3
- 229920005575 poly(amic acid) Polymers 0.000 claims description 3
- 108010026466 polyproline Proteins 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- SXPGQGNWEWPWQZ-UHFFFAOYSA-N 4-(triethoxymethyl)dodecan-1-amine Chemical compound NCCCC(C(OCC)(OCC)OCC)CCCCCCCC SXPGQGNWEWPWQZ-UHFFFAOYSA-N 0.000 claims description 2
- CEXAUEGEXJQTFI-UHFFFAOYSA-N NC=1C=C(C=CC1)C(C(OC)(OC)OC)CCCCCCCC Chemical compound NC=1C=C(C=CC1)C(C(OC)(OC)OC)CCCCCCCC CEXAUEGEXJQTFI-UHFFFAOYSA-N 0.000 claims description 2
- VEBISLDJMHOEEX-UHFFFAOYSA-N NC=1C=C(C=CC1)C(C(OCC)(OCC)OCC)CCCCCCCC Chemical compound NC=1C=C(C=CC1)C(C(OCC)(OCC)OCC)CCCCCCCC VEBISLDJMHOEEX-UHFFFAOYSA-N 0.000 claims description 2
- YHASWHZGWUONAO-UHFFFAOYSA-N butanoyl butanoate Chemical compound CCCC(=O)OC(=O)CCC YHASWHZGWUONAO-UHFFFAOYSA-N 0.000 claims description 2
- 150000001718 carbodiimides Chemical class 0.000 claims description 2
- MWKFXSUHUHTGQN-UHFFFAOYSA-N decan-1-ol Chemical group CCCCCCCCCCO MWKFXSUHUHTGQN-UHFFFAOYSA-N 0.000 claims description 2
- 125000003700 epoxy group Chemical group 0.000 claims description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 2
- DUCKXCGALKOSJF-UHFFFAOYSA-N pentanoyl pentanoate Chemical compound CCCCC(=O)OC(=O)CCCC DUCKXCGALKOSJF-UHFFFAOYSA-N 0.000 claims description 2
- WYVAMUWZEOHJOQ-UHFFFAOYSA-N propionic anhydride Chemical compound CCC(=O)OC(=O)CC WYVAMUWZEOHJOQ-UHFFFAOYSA-N 0.000 claims description 2
- JPEWDCTZJFUITH-UHFFFAOYSA-N 1-methoxydecane Chemical compound CCCCCCCCCCOC JPEWDCTZJFUITH-UHFFFAOYSA-N 0.000 claims 1
- GNPSQUCXOBDIDY-UHFFFAOYSA-N 4-(trimethoxymethyl)dodecane Chemical compound C(CCCCCCC)C(C(OC)(OC)OC)CCC GNPSQUCXOBDIDY-UHFFFAOYSA-N 0.000 claims 1
- NHHZJWLREYINFE-UHFFFAOYSA-N C(C(O)CO)OCCCC(C(OC)(OC)OC)CCCCCCCC Chemical compound C(C(O)CO)OCCCC(C(OC)(OC)OC)CCCCCCCC NHHZJWLREYINFE-UHFFFAOYSA-N 0.000 claims 1
- ROZSPJBPUVWBHW-UHFFFAOYSA-N [Ru]=O Chemical group [Ru]=O ROZSPJBPUVWBHW-UHFFFAOYSA-N 0.000 claims 1
- 150000008065 acid anhydrides Chemical class 0.000 claims 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims 1
- DIOQZVSQGTUSAI-NJFSPNSNSA-N decane Chemical group CCCCCCCCC[14CH3] DIOQZVSQGTUSAI-NJFSPNSNSA-N 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 description 10
- 239000004642 Polyimide Substances 0.000 description 8
- 229910000457 iridium oxide Inorganic materials 0.000 description 7
- 108010039918 Polylysine Proteins 0.000 description 6
- 125000000524 functional group Chemical group 0.000 description 6
- 229920000656 polylysine Polymers 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 4
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 4
- 229920002125 Sokalan® Polymers 0.000 description 4
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 4
- 125000002843 carboxylic acid group Chemical group 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 150000002466 imines Chemical class 0.000 description 4
- 229920000620 organic polymer Polymers 0.000 description 4
- 229920002098 polyfluorene Polymers 0.000 description 4
- 239000002243 precursor Substances 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- NJCOLSAFYMXOGO-UHFFFAOYSA-N 3-(trifluoromethyl)benzene-1,2,4,5-tetracarboxylic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C(C(F)(F)F)=C1C(O)=O NJCOLSAFYMXOGO-UHFFFAOYSA-N 0.000 description 3
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 238000002329 infrared spectrum Methods 0.000 description 3
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 3
- 229920000768 polyamine Polymers 0.000 description 3
- 150000003512 tertiary amines Chemical class 0.000 description 3
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical class C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 2
- NURQLCJSMXZBPC-UHFFFAOYSA-N 3,4-dimethylpyridine Chemical compound CC1=CC=NC=C1C NURQLCJSMXZBPC-UHFFFAOYSA-N 0.000 description 2
- HWWYDZCSSYKIAD-UHFFFAOYSA-N 3,5-dimethylpyridine Chemical compound CC1=CN=CC(C)=C1 HWWYDZCSSYKIAD-UHFFFAOYSA-N 0.000 description 2
- WECDUOXQLAIPQW-UHFFFAOYSA-N 4,4'-Methylene bis(2-methylaniline) Chemical compound C1=C(N)C(C)=CC(CC=2C=C(C)C(N)=CC=2)=C1 WECDUOXQLAIPQW-UHFFFAOYSA-N 0.000 description 2
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 2
- FKNQCJSGGFJEIZ-UHFFFAOYSA-N 4-methylpyridine Chemical compound CC1=CC=NC=C1 FKNQCJSGGFJEIZ-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 2
- ONIBWKKTOPOVIA-UHFFFAOYSA-N Proline Natural products OC(=O)C1CCCN1 ONIBWKKTOPOVIA-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 125000004018 acid anhydride group Chemical group 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 150000002484 inorganic compounds Chemical class 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- AWJUIBRHMBBTKR-UHFFFAOYSA-N isoquinoline Chemical compound C1=NC=CC2=CC=CC=C21 AWJUIBRHMBBTKR-UHFFFAOYSA-N 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 239000004584 polyacrylic acid Substances 0.000 description 2
- 239000011253 protective coating Substances 0.000 description 2
- IATRAKWUXMZMIY-UHFFFAOYSA-N strontium oxide Chemical compound [O-2].[Sr+2] IATRAKWUXMZMIY-UHFFFAOYSA-N 0.000 description 2
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- OJGWYOJJYMAKRJ-UHFFFAOYSA-N 1-(3,4-dicarboxyphenyl)-3-methyl-2,3-dihydro-1h-indene-5,6-dicarboxylic acid Chemical compound C12=CC(C(O)=O)=C(C(O)=O)C=C2C(C)CC1C1=CC=C(C(O)=O)C(C(O)=O)=C1 OJGWYOJJYMAKRJ-UHFFFAOYSA-N 0.000 description 1
- CGSKOGYKWHUSLC-UHFFFAOYSA-N 1-(4-aminophenyl)-1,3,3-trimethyl-2h-inden-5-amine Chemical compound C12=CC=C(N)C=C2C(C)(C)CC1(C)C1=CC=C(N)C=C1 CGSKOGYKWHUSLC-UHFFFAOYSA-N 0.000 description 1
- MLCFMTKUMPZHJF-UHFFFAOYSA-N 2,3,6,7-tetrachloro-4h-naphthalene-1,3,5,8-tetracarboxylic acid Chemical compound ClC1=C(Cl)C(C(O)=O)=C2C(C(=O)O)=C(Cl)C(Cl)(C(O)=O)CC2=C1C(O)=O MLCFMTKUMPZHJF-UHFFFAOYSA-N 0.000 description 1
- SDWGBHZZXPDKDZ-UHFFFAOYSA-N 2,6-dichloronaphthalene-1,4,5,8-tetracarboxylic acid Chemical compound C1=C(Cl)C(C(O)=O)=C2C(C(=O)O)=CC(Cl)=C(C(O)=O)C2=C1C(O)=O SDWGBHZZXPDKDZ-UHFFFAOYSA-N 0.000 description 1
- JZWGLBCZWLGCDT-UHFFFAOYSA-N 2,7-dichloronaphthalene-1,4,5,8-tetracarboxylic acid Chemical compound ClC1=CC(C(O)=O)=C2C(C(=O)O)=CC(Cl)=C(C(O)=O)C2=C1C(O)=O JZWGLBCZWLGCDT-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- MFAWEYJGIGIYFH-UHFFFAOYSA-N 2-[4-(trimethoxymethyl)dodecoxymethyl]oxirane Chemical compound C(C1CO1)OCCCC(C(OC)(OC)OC)CCCCCCCC MFAWEYJGIGIYFH-UHFFFAOYSA-N 0.000 description 1
- IIQLVLWFQUUZII-UHFFFAOYSA-N 2-amino-5-(4-amino-3-carboxyphenyl)benzoic acid Chemical compound C1=C(C(O)=O)C(N)=CC=C1C1=CC=C(N)C(C(O)=O)=C1 IIQLVLWFQUUZII-UHFFFAOYSA-N 0.000 description 1
- FFXSDAGPJYALFE-UHFFFAOYSA-N 2-amino-5-(4-amino-3-hydroxyphenoxy)phenol Chemical compound C1=C(O)C(N)=CC=C1OC1=CC=C(N)C(O)=C1 FFXSDAGPJYALFE-UHFFFAOYSA-N 0.000 description 1
- KHAFBBNQUOEYHB-UHFFFAOYSA-N 2-amino-5-(4-amino-3-hydroxyphenyl)sulfonylphenol Chemical compound C1=C(O)C(N)=CC=C1S(=O)(=O)C1=CC=C(N)C(O)=C1 KHAFBBNQUOEYHB-UHFFFAOYSA-N 0.000 description 1
- RCYNJDVUURMJOZ-UHFFFAOYSA-N 2-amino-5-[(4-amino-3-hydroxyphenyl)methyl]phenol Chemical compound C1=C(O)C(N)=CC=C1CC1=CC=C(N)C(O)=C1 RCYNJDVUURMJOZ-UHFFFAOYSA-N 0.000 description 1
- MGEZXQDSORSNTI-UHFFFAOYSA-N 2-heptan-2-ylpyridine Chemical compound CCCCCC(C)C1=CC=CC=N1 MGEZXQDSORSNTI-UHFFFAOYSA-N 0.000 description 1
- NMWDYLYNWRFEMR-UHFFFAOYSA-N 2-methylpyridine Chemical compound CC1=CC=CC=N1.CC1=CC=CC=N1 NMWDYLYNWRFEMR-UHFFFAOYSA-N 0.000 description 1
- IVVWBIJMWBNKFV-UHFFFAOYSA-N 3,3'-Dichloro-4,4'-diaminodiphenyl ether Chemical compound C1=C(Cl)C(N)=CC=C1OC1=CC=C(N)C(Cl)=C1 IVVWBIJMWBNKFV-UHFFFAOYSA-N 0.000 description 1
- JRBJSXQPQWSCCF-UHFFFAOYSA-N 3,3'-Dimethoxybenzidine Chemical compound C1=C(N)C(OC)=CC(C=2C=C(OC)C(N)=CC=2)=C1 JRBJSXQPQWSCCF-UHFFFAOYSA-N 0.000 description 1
- NUIURNJTPRWVAP-UHFFFAOYSA-N 3,3'-Dimethylbenzidine Chemical compound C1=C(N)C(C)=CC(C=2C=C(C)C(N)=CC=2)=C1 NUIURNJTPRWVAP-UHFFFAOYSA-N 0.000 description 1
- CDVZKYLSVNAIHH-UHFFFAOYSA-N 3,6-bis(trifluoromethyl)benzene-1,2,4,5-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(F)(F)F)=C(C(O)=O)C(C(O)=O)=C1C(F)(F)F CDVZKYLSVNAIHH-UHFFFAOYSA-N 0.000 description 1
- GWHLJVMSZRKEAQ-UHFFFAOYSA-N 3-(2,3-dicarboxyphenyl)phthalic acid Chemical compound OC(=O)C1=CC=CC(C=2C(=C(C(O)=O)C=CC=2)C(O)=O)=C1C(O)=O GWHLJVMSZRKEAQ-UHFFFAOYSA-N 0.000 description 1
- PEQMXHDQUPCPQJ-UHFFFAOYSA-N 3-(3,4-dicarboxyphenyl)-1,1,3-trimethyl-2h-indene-4,5-dicarboxylic acid Chemical compound C1=CC(C(O)=O)=C(C(O)=O)C2=C1C(C)(C)CC2(C)C1=CC=C(C(O)=O)C(C(O)=O)=C1 PEQMXHDQUPCPQJ-UHFFFAOYSA-N 0.000 description 1
- GDGWSSXWLLHGGV-UHFFFAOYSA-N 3-(4-aminophenyl)-1,1,3-trimethyl-2h-inden-5-amine Chemical compound C12=CC(N)=CC=C2C(C)(C)CC1(C)C1=CC=C(N)C=C1 GDGWSSXWLLHGGV-UHFFFAOYSA-N 0.000 description 1
- PAHZZOIHRHCHTH-UHFFFAOYSA-N 3-[2-(2,3-dicarboxyphenyl)propan-2-yl]phthalic acid Chemical compound C=1C=CC(C(O)=O)=C(C(O)=O)C=1C(C)(C)C1=CC=CC(C(O)=O)=C1C(O)=O PAHZZOIHRHCHTH-UHFFFAOYSA-N 0.000 description 1
- IBOFVQJTBBUKMU-UHFFFAOYSA-N 4,4'-methylene-bis-(2-chloroaniline) Chemical compound C1=C(Cl)C(N)=CC=C1CC1=CC=C(N)C(Cl)=C1 IBOFVQJTBBUKMU-UHFFFAOYSA-N 0.000 description 1
- VILWHDNLOJCHNJ-UHFFFAOYSA-N 4-(3,4-dicarboxyphenyl)sulfanylphthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1SC1=CC=C(C(O)=O)C(C(O)=O)=C1 VILWHDNLOJCHNJ-UHFFFAOYSA-N 0.000 description 1
- OMHDKWZCHRDYQA-UHFFFAOYSA-N 4-(4-amino-3-chlorophenyl)sulfanyl-2-chloroaniline Chemical compound C1=C(Cl)C(N)=CC=C1SC1=CC=C(N)C(Cl)=C1 OMHDKWZCHRDYQA-UHFFFAOYSA-N 0.000 description 1
- JIYCXGLGOPBQSU-UHFFFAOYSA-N 4-(4-amino-3-chlorophenyl)sulfonyl-2-chloroaniline Chemical compound C1=C(Cl)C(N)=CC=C1S(=O)(=O)C1=CC=C(N)C(Cl)=C1 JIYCXGLGOPBQSU-UHFFFAOYSA-N 0.000 description 1
- MQMUKCHPSDDMII-UHFFFAOYSA-N 4-(4-amino-3-ethoxyphenyl)sulfonyl-2-ethoxyaniline Chemical compound C1=C(N)C(OCC)=CC(S(=O)(=O)C=2C=C(OCC)C(N)=CC=2)=C1 MQMUKCHPSDDMII-UHFFFAOYSA-N 0.000 description 1
- HGPTYGHIMKRTRN-UHFFFAOYSA-N 4-(4-amino-3-methoxyphenoxy)-2-methoxyaniline Chemical compound C1=C(N)C(OC)=CC(OC=2C=C(OC)C(N)=CC=2)=C1 HGPTYGHIMKRTRN-UHFFFAOYSA-N 0.000 description 1
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- YQDPRQNMTIDSJA-UHFFFAOYSA-N 4-(4-amino-3-methylphenyl)sulfanyl-2-methylaniline Chemical compound C1=C(N)C(C)=CC(SC=2C=C(C)C(N)=CC=2)=C1 YQDPRQNMTIDSJA-UHFFFAOYSA-N 0.000 description 1
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Landscapes
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Description
本發明係與有機-無機混成材料薄膜的製造方法有關,特別有關於一種聚馬來酸酐-聚醯亞胺-氧化矽混成材料薄膜的製造方法。The present invention relates to a method for producing an organic-inorganic hybrid material film, and more particularly to a method for producing a polymaleic anhydride-polyimine-ruthenium oxide mixed material film.
複合材料同時兼具有機聚合物和無機化合物的特性,可以結合各種材料的優點,而擁有優良性質。例如,高分子具有易加工、強韌、具彈性、抗腐蝕、絕緣以及便宜等優點,但其耐熱性質與機械強度較差;而陶瓷材料則具有堅硬、低活性、絕佳的耐熱性與機械強度優點,但重量較重且易碎。如果能夠結合各種材料的優點而彌補其缺點就能夠得到擁有優秀性質的嶄新材料。已知一些工業上廣泛使用的混合物,由以下的有機聚合物例如聚乙烯、聚丙烯、聚苯乙烯、聚甲基丙烯酸甲酯、尼龍、聚酯類或聚醯亞胺;及無機化合物,例如碳酸鈣、黏土及氧化矽組成。然而,已知各種發展中的包含具有互相結合且構成複合結構的有機聚合物基團及無機氧化物基團的有機-無機混成物的混成材料,展現比上述傳統的複合材料佳的特性。The composite material combines the characteristics of organic polymers and inorganic compounds, and can combine the advantages of various materials to have excellent properties. For example, polymers have the advantages of easy processing, toughness, elasticity, corrosion resistance, insulation and low cost, but their heat resistance and mechanical strength are poor; while ceramic materials have hard, low activity, excellent heat resistance and mechanical strength. Advantage, but heavy and fragile. If you can combine the advantages of various materials to make up for its shortcomings, you can get new materials with excellent properties. Some industrially widely used mixtures are known, from the following organic polymers such as polyethylene, polypropylene, polystyrene, polymethyl methacrylate, nylon, polyesters or polyimine; and inorganic compounds, for example Calcium carbonate, clay and strontium oxide. However, various developing mixed materials containing an organic-inorganic hybrid having organic polymer groups and inorganic oxide groups which are combined with each other and constitute a composite structure are known, exhibiting better characteristics than the above-described conventional composite materials.
此有機-無機聚合物混成物中的有機聚合物,例如聚醯亞胺具有優良的耐熱性、機械物性和耐藥品性等性能,因此,廣泛被使用於航空宇宙領域、電子材料領域等。目前普遍被使用者大多為芳香族聚醯亞胺。大部分的芳香族聚醯亞胺係不溶於溶劑且為非熱塑性,較難以加工。聚醯亞胺的前驅物為聚醯胺酸,其係溶劑可溶的,故採取以聚醯胺酸溶液成為所欲的形狀,然後使其醯亞胺化的方法。The organic polymer in the organic-inorganic polymer mixture, for example, polyimide, has excellent heat resistance, mechanical properties, and chemical resistance, and is therefore widely used in the field of aerospace, electronic materials, and the like. At present, most of the users are mostly aromatic polyimine. Most aromatic polyimines are insoluble in solvents and non-thermoplastic, making them difficult to process. The precursor of polyimine is polylysine which is solvent-soluble, so a method in which a poly-proline solution is used in a desired shape and then ruthenium is obtained.
然而,醯亞胺化反應係伴隨著水的脫離、蒸發,而且在熱醯亞胺化時的反應溫度亦達到300℃以上,此溫度係遠超過水的沸點,於厚膜狀成形品成形時,容易發生鼓起等與表面性有關的不良情況。因此,成形時之操作條件例如溫度設定等難以適當選擇。省略該醯亞胺化反應的聚醯胺酸之製品,係無法具有聚醯亞胺特有的耐熱性。又,聚醯胺酸溶液在水存在下容易水解,故其保存方法係有困難的。However, the hydrazine imidization reaction is accompanied by the detachment and evaporation of water, and the reaction temperature at the time of thermal imidization also reaches 300 ° C or more, which is far above the boiling point of water, and is formed when a thick film shaped article is formed. It is prone to bulging and other undesirable conditions related to surface properties. Therefore, it is difficult to appropriately select the operating conditions at the time of molding, such as temperature setting. The product of the polyaminic acid in which the oxime imidization reaction is omitted cannot have the heat resistance peculiar to polyimine. Further, since the polyaminic acid solution is easily hydrolyzed in the presence of water, the preservation method is difficult.
聚醯亞胺對於應用在電子領域有用的,其可被使用於當作在半導體裝置上的絕緣膜或保護塗膜。尤其,全芳香族聚醯亞胺由於其優異的耐熱性、機械特性、電特性,對於可撓性電路基板或積體電路等的高密度化、多機能化等的貢獻大。Polyimine is useful for applications in the electronics field and can be used as an insulating film or protective coating film on a semiconductor device. In particular, the wholly aromatic polyimine has a large contribution to high density, multi-function, and the like of a flexible circuit board or an integrated circuit due to its excellent heat resistance, mechanical properties, and electrical properties.
於是,當形成微細電路的層間絕緣膜或保護塗膜時,以往係使用聚醯亞胺前驅體溶液。如此的聚醯亞胺前驅體溶液,已知有使二胺化合物與四羧酸二酐反應而獲得之聚醯胺酸(PAA)溶液,或含有聚醯胺酸酯、聚醯胺酸三甲基矽酯、聚醯胺酸雙(二乙基醯胺)等之各種溶液。該等聚醯亞胺前驅體溶液,均為高聚合度之聚合物溶液,當從聚合物溶液獲得聚醯亞胺塗膜時,一般係藉由將該聚合物溶液塗覆於銅、玻璃等基材上並且加熱,而實施溶劑之除去及醯亞胺化,獲得聚醯亞胺塗膜。Therefore, when an interlayer insulating film or a protective coating film of a fine circuit is formed, a polyimide polyimide precursor solution has conventionally been used. Such a polyimide precursor solution is known as a polyacrylic acid (PAA) solution obtained by reacting a diamine compound with a tetracarboxylic dianhydride, or a polyglycinate or a polyamidite trihydrate. Various solutions such as sulfonate, poly(diethylguanamine). The polyimine precursor solutions are all polymer solutions having a high degree of polymerization. When the polyimide film is obtained from the polymer solution, the polymer solution is generally applied to copper, glass, etc. The substrate was heated and heated, and solvent removal and hydrazine imidation were carried out to obtain a polyimide film.
但是,塗覆高聚合度之聚合物溶液時,由於其聚合度高,為了使溶液成為可塗佈之黏度,會有必需降低溶質濃度的問題。又,若為了提高生產性而提高溶質濃度,則溶液之黏度會增高,則會有無法塗佈的問題。此外,若溶質濃度高且為了使其具有可塗佈之黏度而使聚合物低分子量化,則會有無法獲得機械性、耐熱性優異之塗膜的問題。再者,聚合物溶液極難以在維持其聚合度的狀態下長期保存。However, when a polymer solution having a high degree of polymerization is applied, since the degree of polymerization is high, in order to make the solution a coatable viscosity, there is a problem that it is necessary to lower the concentration of the solute. Moreover, if the solute concentration is increased in order to improve productivity, the viscosity of the solution will increase, and there is a problem that coating cannot be applied. Further, when the solute concentration is high and the polymer has a low viscosity in order to have a coatable viscosity, there is a problem that a coating film excellent in mechanical properties and heat resistance cannot be obtained. Further, it is extremely difficult for the polymer solution to be stored for a long period of time while maintaining the degree of polymerization.
本發明之一目的,在於提供一種聚馬來酸酐-聚醯亞胺-氧化矽有機-無機混成材料薄膜,其聚馬來酸酐聚醯亞胺部分,主鏈為聚馬來酸酐,側鏈則以接枝之方式使其末端具有可交聯之反應性官能基,其中側鏈含有短鏈段的聚亞醯胺之結構,側鏈短可降低聚合度,避免聚合物溶液過黏,不易塗佈成膜的問題。An object of the present invention is to provide a polymaleic anhydride-polyimine-ruthenium oxide organic-inorganic hybrid material film having a polymaleic anhydride polyimide portion, a main chain of polymaleic anhydride, and a side chain. By grafting, the terminal has a crosslinkable reactive functional group, wherein the side chain contains a short-segment polyamine structure, the side chain is short to reduce the degree of polymerization, and the polymer solution is prevented from being too sticky and difficult to coat. The problem of film formation.
本發明之另一目的,在於提供一種聚馬來酸酐-聚醯亞胺-氧化矽有機-無機混成材料薄膜的製造方法,藉由使用化學環化法,可避免使用熱環化法之厚膜狀成形品表面容易發生鼓起的現象。Another object of the present invention is to provide a method for producing a polymaleic anhydride-polyimine-iridium oxide organic-inorganic hybrid material film, which can avoid thick film using thermal cyclization method by using chemical cyclization method The surface of the molded article is prone to bulging.
本發明之又一目的,在於提供一種膠片,具有優異的耐熱性、機械特性,且可應用於銅箔基板和電路板之絕緣層材料。Still another object of the present invention is to provide a film which has excellent heat resistance and mechanical properties and which can be applied to an insulating layer material of a copper foil substrate and a circuit board.
本發明之再一目的,在於提供一種銅箔基板,具有優異的耐熱性、機械特性,與電子元件接合後於高溫、高濕度等嚴苛環境下操作而不會影響其品質。Still another object of the present invention is to provide a copper foil substrate which has excellent heat resistance and mechanical properties, and which is bonded to an electronic component and operated in a severe environment such as high temperature and high humidity without affecting the quality thereof.
為了達成上述之目的,本發明係為一種聚馬來酸酐-聚醯亞胺-氧化矽有機-無機混成材料薄膜,以聚馬來酸酐為主鏈,側鏈則接枝有聚醯亞胺及氧化矽基團。該有機-無機混成材料可由第二圖中結構式(9)和(10)或第三圖中結構式(19)和(20)表示。In order to achieve the above object, the present invention is a polymaleic anhydride-polyimine-iridium oxide organic-inorganic hybrid material film, which is mainly composed of polymaleic anhydride, and side chains are grafted with polyimine and A cerium oxide group. The organic-inorganic hybrid material can be represented by structural formulas (9) and (10) in the second figure or structural formulas (19) and (20) in the third figure.
本發明係為一種聚馬來酸酐-聚醯亞胺-氧化矽有機-無機混成材料薄膜的製造方法,包含以下步驟:(a)使二酐與芳族二胺於一溶劑中反應,以製備聚醯胺酸溶液;(b)以聚馬來酸酐與步驟(a)獲得的聚醯胺酸溶液在低於 80℃之溫度反應,以製備聚馬來酸酐之側鏈接枝有-NH-CO-官能基以及羧酸基之寡聚合物;(c)添加一矽烷偶合劑;(d)於步驟(c)製得的溶液中加入催化劑進行化學合環反應;(e)於步驟(d)製得的溶液中加入式Si(R3 )4 所示之烷氧化矽單體(其中R3 彼此可相同或不同且代表鹵素、C1-6 烷氧基、C2-6 烯氧基及芳氧基),在水與酸催化劑或鹼催化劑存在下,於15℃至100℃之溫度範圍內,進行水解及縮合反應,因而Si(R3 )4 中之矽烷醇基與進行水解縮合反應後的該矽烷偶合劑產生共價鍵結而形成聚馬來酸酐-聚醯亞胺-氧化矽混成材料溶液;(f)將聚馬來酸酐-聚醯亞胺-氧化矽混成材料溶液塗佈於一基材上,經升溫固化獲得聚馬來酸酐-聚醯亞胺-氧化矽混成材料薄膜。The invention relates to a method for producing a polymaleic anhydride-polyimine-iridium oxide organic-inorganic hybrid material film, comprising the steps of: (a) reacting a dianhydride with an aromatic diamine in a solvent to prepare a polyaminic acid solution; (b) reacting the polymaleic anhydride with the polyaminic acid solution obtained in the step (a) at a temperature lower than 80 ° C to prepare a side chain of the polymaleic anhydride -NH-CO a functional group and a carboxylic acid group-containing oligopolymer; (c) adding a decane coupling agent; (d) adding a catalyst to the solution prepared in the step (c) for chemical ring-closing reaction; (e) in the step (d) The obtained solution is added with an alkoxylated oxime monomer represented by the formula Si(R 3 ) 4 (wherein R 3 may be the same or different from each other and represent a halogen, a C 1-6 alkoxy group, a C 2-6 alkenyloxy group and The aryloxy group is subjected to hydrolysis and condensation reaction in the presence of water and an acid catalyst or a base catalyst at a temperature ranging from 15 ° C to 100 ° C, whereby the decyl alcohol group in Si(R 3 ) 4 is subjected to hydrolysis condensation reaction. After the decane coupling agent is covalently bonded to form a polymaleic anhydride-polyimine-ruthenium oxide mixed material solution; (f) polymaleic anhydride-polyimine- Hybrid material of the coating solution on a silicon substrate, is obtained by heating a cured polymaleic anhydride - Polyimide - silicon oxide film hybrid material.
本發明提供一種膠片,係一玻璃布含浸於前述之聚馬來酸酐-聚醯亞胺-氧化矽混成材料薄膜而成。The present invention provides a film obtained by impregnating a glass cloth of the above-mentioned polymaleic anhydride-polyimine-cerium oxide mixed material film.
本發明提供一種銅箔基板,係由至少一銅箔與前述之膠片壓合而成。The invention provides a copper foil substrate which is formed by pressing at least one copper foil with the aforementioned film.
S10~S20...步驟S10~S20. . . step
第一圖係本發明之一實施例的聚馬來酸酐-聚醯亞胺-氧化矽有機-無機混成材料薄膜的製造方法的流程圖。The first figure is a flow chart of a method for producing a polymaleic anhydride-polyimine-iridium oxide organic-inorganic hybrid material film according to an embodiment of the present invention.
第二圖係本發明之一實施例的聚馬來酸酐-聚醯亞胺-氧化矽有機-無機混成材料薄膜的製造方法的流程圖,其中使用之矽烷偶合劑係為式H2 N-R1 -Si(R2 )3 所示之胺基偶合劑。The second drawing is a flow chart of a method for producing a polymaleic anhydride-polyimine-iridium oxide organic-inorganic hybrid material film according to an embodiment of the present invention, wherein the decane coupling agent used is a formula H 2 NR 1 - An amine-based coupling agent represented by Si(R 2 ) 3 .
第三圖係本發明之另一實施例的聚馬來酸酐-聚醯亞胺-氧化矽有機-無機混成材料薄膜的製造方法的流程圖,其中使用之矽烷偶合劑係為式OCN-R1 -Si(R2 )3 所示之異氰酸偶合劑。3 is a flow chart showing a method for producing a polymaleic anhydride-polyimine-ruthenium oxide organic-inorganic hybrid material film according to another embodiment of the present invention, wherein the decane coupling agent used is a formula OCN-R 1 An isocyanate coupling agent represented by -Si(R 2 ) 3 .
第四圖係本發明聚馬來酸酐-聚醯亞胺-氧化矽混成材料之IR光譜圖。The fourth figure is an IR spectrum of the polymaleic anhydride-polyimine-cerium oxide mixed material of the present invention.
第五圖係第四圖之分析結果。The fifth picture is the analysis result of the fourth figure.
第六圖係本發明聚馬來酸酐-聚醯亞胺-氧化矽有機-無機混成材料的玻璃轉化溫度之量測。The sixth graph is a measure of the glass transition temperature of the polymaleic anhydride-polyimine-cerium oxide organic-inorganic hybrid material of the present invention.
第七圖係本發明聚馬來酸酐-聚醯亞胺-氧化矽有機-無機混成材料的5wt%熱重損失溫度之量測。The seventh graph is a measurement of the 5 wt% thermogravimetric loss temperature of the polymaleic anhydride-polyimine-cerium oxide organic-inorganic hybrid material of the present invention.
請參考第一圖,第一圖係本發明之一實施例的聚馬來酸酐-聚醯亞胺-氧化矽有機-無機混成材料薄膜的製造方法的流程圖。如第一圖所示,聚馬來酸酐-聚醯亞胺-氧化矽有機-無機混成材料薄膜的製造方法包含以下步驟:使二酐與芳族二胺於一溶劑中反應,以製備聚醯胺酸溶液(S10);以聚馬來酸酐與步驟(S10)獲得的聚醯胺酸溶液在低於80℃之溫度反應,以製備聚馬來酸酐之側鏈接枝有-NH-CO-官能基以及羧酸基之寡聚合物(S12);添加一矽烷偶合劑(S14);於步驟(S14)製得的溶液中加入催化劑進行化學合環反應(S16);於步驟(S16)製得的溶液中加入式Si(R3 )4 所示之烷氧化矽單體(其中R3 彼此可相同或不同且代表鹵素、C1-6 烷氧基、C2-6 烯氧基及芳氧基),在水與酸催化劑或鹼催化劑存在下,於15℃至100℃之溫度範圍內,進行水解及縮合反應,因而Si(R3 )4 中之矽烷醇基與進行水解縮合反應後的該矽烷偶合劑產生共價鍵結而形成聚馬來酸酐-聚醯亞胺-氧化矽混成材料溶液(S18);將聚馬來酸酐-聚醯亞胺-氧化矽混成材料溶液塗佈於一基材上,經升溫固化獲得聚馬來酸酐-聚醯亞胺-氧化矽混成材料薄膜(S20)。Referring to the first drawing, the first drawing is a flow chart of a method for producing a polymaleic anhydride-polyimide-cerium oxide organic-inorganic hybrid material film according to an embodiment of the present invention. As shown in the first figure, the method for producing a polymaleic anhydride-polyimine-iridium oxide organic-inorganic hybrid material film comprises the steps of: reacting a dianhydride with an aromatic diamine in a solvent to prepare a polyfluorene. An amine acid solution (S10); a polymaleic acid solution obtained by reacting polymaleic anhydride with the step (S10) at a temperature lower than 80 ° C to prepare a side chain of polymaleic anhydride having a -NH-CO-functionality And a carboxylic acid group-containing oligopolymer (S12); adding a decane coupling agent (S14); adding a catalyst to the solution prepared in the step (S14) to carry out a chemical ring-closing reaction (S16); and obtaining the step (S16) a solution of alkoxylated oxime monomer represented by the formula Si(R 3 ) 4 (wherein R 3 may be the same or different from each other and represent a halogen, a C 1-6 alkoxy group, a C 2-6 alkenyloxy group, and an aryloxy group). Hydrolysis and condensation reaction in the presence of water and an acid catalyst or a base catalyst at a temperature ranging from 15 ° C to 100 ° C, whereby the stanol group in Si(R 3 ) 4 is subjected to hydrolysis condensation reaction The decane coupling agent is covalently bonded to form a polymaleic anhydride-polyimine-ruthenium oxide mixed material solution (S18); polymaleic anhydride-polymerized Imine - silicon oxide hybrid material solution was coated on a substrate, cured by heating to obtain polymaleic anhydride - Polyimide - hybrid material, silicon oxide film (S20).
於步驟S10中製備聚醯胺酸之二酐實例,例如但不限於以下化合物,馬來酸酐、經取代之馬來酸酐、四氫鄰苯二甲酸酐、經取代之四氫鄰苯二甲酸酐、甲撐鄰苯二甲酸酐、經取代之甲撐鄰苯二甲酸酐等、芳族雙酐例如苯均四酸二酐(PMDA)、4,4-二酞酸二酐(BPDA)、4,4-六氟亞異丙基二酞酸二酐(6FDA)、1-(三氟甲基)-2,3,5,6-苯四羧酸二酐(P3FDA)、1,4-雙(三氟甲基)-2,3,5,6-苯四羧酸二酐(P6GDA)、1-(3',4'-二羧基苯基)-1,3,3-三甲基茚滿-5,6-二羧酸二酐、1-(3',4'-二羧基苯基)-1,3,3-三甲基茚滿-6,7-二羧酸二酐、1-(3',4'-二羧基苯基)-3-甲基茚滿-5,6-二羧酸二酐、1-(3',4'-二羧基苯基)-3-甲基茚滿-6,7-二羧酸二酐、2,3,9,10-二萘嵌苯四羧酸二酐、1,4,5,8-萘四羧酸二酐、2,6-二氯萘-1,4,5,8-四羧酸二酐、2,7-二氯萘-1,4,5,8-四羧酸二酐、2,3,6,7-四氯萘-2,4,5,8-四羧酸二酐、菲-1,8,9,10-四羧酸二酐、3,3',4,4'-二苯甲酮四羧酸二酐、1,2',3,3'-二苯甲酮四羧酸二酐、3,3',4,4'-聯苯四羧酸二酐、3,3',4,4'-二苯甲酮四羧酸二酐、2,2',3,3'-聯苯四羧酸二酐、4,4'-亞異丙基二酞酸二酐、3,3'-亞異丙基二酞酸二酐、4,4'-氧基二酞酸二酐、4,4'-磺醯基二酞酸二酐、3,3'-氧基二酞酸二酐、4,4'-亞甲基二酞酸二酐、4,4'-硫基二酞酸二酐、4,4'-亞乙基二酞酸二酐、2,3,6,7-萘四羧酸二酐、1,2,4,5-萘四羧酸二酐、1,2,5,6-萘四羧酸二酐、苯-1,2,3,4-四羧酸二酐、吡嗪-2,3,5,6-四羧酸二酐等,其中較好為苯均四酸二酐(PMDA)、4,4-二酞酸二酐(BPDA)、4,4-六氟亞異丙基二酞酸二酐(6FDA)、1-(三氟甲基)-2,3,5,6-苯四羧酸二酐(P3FDA)、1,4-雙(三氟甲基)-2,3,5,6-苯四羧酸二酐(P6GDA)。An example of a polyphthalic acid dianhydride prepared in step S10, such as but not limited to the following compounds, maleic anhydride, substituted maleic anhydride, tetrahydrophthalic anhydride, substituted tetrahydrophthalic anhydride , a phthalic anhydride, a substituted phthalic anhydride, an aromatic dianhydride such as pyromellitic dianhydride (PMDA), 4,4-diphthalic acid dianhydride (BPDA), 4 , 4-hexafluoroisopropylidene dicarboxylic acid dianhydride (6FDA), 1-(trifluoromethyl)-2,3,5,6-benzenetetracarboxylic dianhydride (P3FDA), 1,4-double (trifluoromethyl)-2,3,5,6-benzenetetracarboxylic dianhydride (P6GDA), 1-(3',4'-dicarboxyphenyl)-1,3,3-trimethylhydrazine Full-5,6-dicarboxylic dianhydride, 1-(3',4'-dicarboxyphenyl)-1,3,3-trimethylindan-6,7-dicarboxylic dianhydride, 1 -(3',4'-dicarboxyphenyl)-3-methylindan-5,6-dicarboxylic dianhydride, 1-(3',4'-dicarboxyphenyl)-3-methyl Indole-6,7-dicarboxylic dianhydride, 2,3,9,10-perylene tetracarboxylic dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride, 2,6- Dichloronaphthalene-1,4,5,8-tetracarboxylic dianhydride, 2,7-dichloronaphthalene-1,4,5,8-tetracarboxylic dianhydride, 2,3,6,7-tetrachloro Naphthalene-2,4,5,8-tetracarboxylic dianhydride, phenanthrene-1,8,9,10-tetracarboxylic dianhydride, 3,3',4,4'-diphenyl Ketotetracarboxylic dianhydride, 1,2',3,3'-benzophenonetetracarboxylic dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride, 3,3', 4,4'-benzophenonetetracarboxylic dianhydride, 2,2',3,3'-biphenyltetracarboxylic dianhydride, 4,4'-isopropylidene dicarboxylic acid dianhydride, 3, 3'-isopropylidenediphthalic acid dianhydride, 4,4'-oxydiphthalic acid dianhydride, 4,4'-sulfonyldicarboxylic acid dianhydride, 3,3'-oxydicdic acid Dihydride, 4,4'-methylene diruthenic acid dianhydride, 4,4'-thiodiphthalic acid dianhydride, 4,4'-ethylene dicarboxylic acid dianhydride, 2,3,6, 7-naphthalenetetracarboxylic dianhydride, 1,2,4,5-naphthalenetetracarboxylic dianhydride, 1,2,5,6-naphthalenetetracarboxylic dianhydride, benzene-1,2,3,4-tetra a carboxylic acid dianhydride, pyrazine-2,3,5,6-tetracarboxylic dianhydride, etc., among which pyromellitic dianhydride (PMDA), 4,4-diphthalic acid dianhydride (BPDA), 4,4-hexafluoroisopropylidene dicarboxylic acid dianhydride (6FDA), 1-(trifluoromethyl)-2,3,5,6-benzenetetracarboxylic dianhydride (P3FDA), 1,4- Bis(trifluoromethyl)-2,3,5,6-benzenetetracarboxylic dianhydride (P6GDA).
步驟S10中製備聚醯胺酸之芳族二胺實例包含(但不限於)例如4,4'-氧基二苯胺(ODA)、5-胺基-1-(4'-胺基苯基)-1,3,3-三甲基茚滿、6-胺基-1-(4'-胺基苯基)-1,3,3-三甲基茚滿、4,4'-亞甲基雙(鄰-氯苯胺)、3,3'-二氯二苯胺、3,3'-磺醯基二苯胺、4,4'-二胺基二苯甲酮、1,5-二胺基萘、雙(4-胺基苯基)二乙基矽烷、雙(4-胺基苯基)二苯基矽烷、雙(4-胺基苯基)乙基膦氧化物、N-(雙(4-胺基苯基))-N-甲基胺、N-(雙(4-胺基苯基))-N-苯基胺、4,4'-亞甲基雙(2-甲基苯胺)、4,4'-亞甲基雙(2-甲氧基苯胺)、5,5'-亞甲基雙(2-胺基苯酚)、4,4'-亞甲基雙(2-甲基苯胺)、4,4'-氧基雙(2-甲氧基苯胺)、4,4'-氧基雙(2-氯苯胺)、2,2'-雙(4-胺基苯酚)、5,5'-氧基雙(2-胺基苯酚)、4,4'-硫基雙(2-甲基苯胺)、4,4'-硫基雙(2-甲氧基苯胺)、4,4'-硫基雙(2-氯苯胺)、4,4'-磺醯基雙(2-甲基苯胺)、4,4'-磺醯基雙(2-乙氧基苯胺)、4,4'-磺醯基雙(2-氯苯胺)、5,5'-磺醯基雙(2-胺基苯酚)、3,3'-二甲基-4, 4'-二胺基二苯甲酮、3,3'-二甲氧基-4,4'-二胺基二苯甲酮、3,3'-二氯-4,4'-二胺基二苯甲酮、4,4'-二胺基聯苯、間-苯二胺、對-苯二胺、4,4'-亞甲基二苯胺、4,4'-硫基二苯胺、4,4'-磺醯基二苯胺、4,4'-亞異丙基二苯胺、3,3'-二甲基聯苯胺、3,3'-二甲氧基聯苯胺、3,3'-二羧基聯苯胺、2,4-甲苯基二胺、2,5-甲苯基二胺、2,6-甲苯基二胺、間-二甲苯基二胺、2,4-二胺基-5-氯甲苯、2,4-二胺基-6-氯甲苯等。較好為4,4'-氧基二苯胺(ODA)。Examples of the aromatic diamines for preparing polyamic acid in step S10 include, but are not limited to, for example, 4,4'-oxydiphenylamine (ODA), 5-amino-1-(4'-aminophenyl) -1,3,3-trimethylindan, 6-amino-1-(4'-aminophenyl)-1,3,3-trimethylindan, 4,4'-methylene Bis(o-chloroaniline), 3,3'-dichlorodiphenylamine, 3,3'-sulfonyldiphenylamine, 4,4'-diaminobenzophenone, 1,5-diaminonaphthalene , bis(4-aminophenyl)diethyldecane, bis(4-aminophenyl)diphenylnonane, bis(4-aminophenyl)ethylphosphine oxide, N-(double (4) -aminophenyl))-N-methylamine, N-(bis(4-aminophenyl))-N-phenylamine, 4,4'-methylenebis(2-methylaniline) , 4,4'-methylenebis(2-methoxyaniline), 5,5'-methylenebis(2-aminophenol), 4,4'-methylenebis(2-methyl Aniline), 4,4'-oxybis(2-methoxyaniline), 4,4'-oxybis(2-chloroaniline), 2,2'-bis(4-aminophenol), 5 , 5'-oxybis(2-aminophenol), 4,4'-thiobis(2-methylaniline), 4,4'-thiobis(2-methoxyaniline), 4, 4'-thiobis(2-chloroaniline), 4,4'-sulfonylbis(2-methylaniline), 4,4'-sulfonylbis(2-ethoxyaniline), 4, 4'-sulfonyl bis (2- Chloroaniline), 5,5'-sulfonylbis(2-aminophenol), 3,3'-dimethyl-4,4'-diaminobenzophenone, 3,3'-dimethyl Oxy-4,4'-diaminobenzophenone, 3,3'-dichloro-4,4'-diaminobenzophenone, 4,4'-diaminobiphenyl, m- Phenylenediamine, p-phenylenediamine, 4,4'-methylenediphenylamine, 4,4'-thiodiphenylamine, 4,4'-sulfonyldiphenylamine, 4,4'-isopropylidene Diphenylamine, 3,3'-dimethylbenzidine, 3,3'-dimethoxybenzidine, 3,3'-dicarboxybenzidine, 2,4-tolyldiamine, 2,5- Tolyldiamine, 2,6-tolyldiamine, m-xylylenediamine, 2,4-diamino-5-chlorotoluene, 2,4-diamino-6-chlorotoluene, and the like. It is preferably 4,4'-oxydiphenylamine (ODA).
於步驟S10中所使用的溶劑例如N-甲基吡咯烷酮、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、二乙二醇單甲醚;就混合溶劑而言,較佳使用例如N-甲基吡咯烷酮與二乙二醇單甲醚、N-甲基吡咯烷酮與甲醇、N-甲基吡咯烷酮與2-甲氧基乙醇等組合。The solvent used in the step S10 is, for example, N-methylpyrrolidone, N,N-dimethylformamide, N,N-dimethylacetamide, diethylene glycol monomethyl ether; Preferably, for example, N-methylpyrrolidone is combined with diethylene glycol monomethyl ether, N-methylpyrrolidone and methanol, N-methylpyrrolidone and 2-methoxyethanol.
於步驟S12所使用之聚馬來酸酐為一種高分子,主鏈上含有馬來酸酐之結構。The polymaleic anhydride used in the step S12 is a polymer having a structure of maleic anhydride in its main chain.
於步驟S14所使用之矽烷偶合劑可為式H2 N-R1 -Si(R2 )3 所示之胺基偶合劑(其中R1 代表C1-6 伸烷基、伸芳基,R2 彼此可相同或不同且代表C1-6 烷氧基),使其中之胺基與步驟(b)製得之聚馬來酸酐之酸酐基反應,得到胺基偶合劑接枝之聚醯胺酸,其中胺基偶合劑之莫耳數小於芳族二胺之莫耳數。分子式H2 N-R1 -Si(R2 )3 所示之胺基偶合劑係選自下列所組成之組群:3-胺基丙基三甲氧基矽烷(APrTMOS)、3-胺基丙基三乙氧基矽烷(APrTEOS)、3-胺基苯基三甲氧基矽烷(APTMOS)、3-胺基苯基三乙氧基矽烷(APTEOS)及其組合。The decane coupling agent used in the step S14 may be an amine coupling agent represented by the formula H 2 NR 1 -Si(R 2 ) 3 (wherein R 1 represents a C 1-6 alkylene group, an extended aryl group, and R 2 each other The same or different and representing C 1-6 alkoxy), wherein the amine group is reacted with the acid anhydride group of the polymaleic anhydride obtained in the step (b) to obtain an amino coupling agent grafted polylysine, Wherein the number of moles of the amine coupling agent is less than the number of moles of the aromatic diamine. The amine coupling agent represented by the formula H 2 NR 1 -Si(R 2 ) 3 is selected from the group consisting of 3-aminopropyltrimethoxydecane (APrTMOS), 3-aminopropyltri Ethoxydecane (APrTEOS), 3-aminophenyltrimethoxydecane (APTMOS), 3-aminophenyltriethoxydecane (APTEOS), and combinations thereof.
或者,步驟S14之矽烷偶合劑可為式OCN-R1 -Si(R2 )3 所示之異氰酸偶合劑(其中R1 代表C1-6 伸烷基、伸芳基,R2 彼此可相同或不同且代表C1-6 烷氧基),使其中之異氰酸基與步驟(b)製得之聚馬來酸酐側鏈上芳族二胺之氫氧基反應。Alternatively, the decane coupling agent of the step S14 may be an isocyanate coupling agent represented by the formula OCN-R 1 -Si(R 2 ) 3 (wherein R 1 represents a C 1-6 alkylene group, an extended aryl group, and R 2 each other The same or different and representing a C 1-6 alkoxy group, wherein the isocyanato group is reacted with the hydroxyl group of the aromatic diamine on the side chain of the polymaleic anhydride obtained in the step (b).
步驟S16所使用之催化劑可為吡啶與3-甲基吡啶(beta-picoline)。催化劑亦可使用具有與該吡啶約略相同之活性的三級胺以及貝他甲基吡啶。這些三級胺包括2-甲基吡啶(alpha picoline);3,4-二甲吡啶;3,5-二甲吡啶;4-甲基吡啶;4-異丙基吡啶;N,N-二甲基苄基胺;異喹啉;4-苄基吡啶、N,N-二甲基十二胺、三乙基胺與類似者。另外,步驟(d)可加入脫水劑,例如乙酐、丙酸酐、丁酸酐、戊酸酐與其混合物;芳族單羧酸之酐;脂族酐與芳族酐之混合物;碳二亞胺;以及脂族烯酮。催化劑及脫水劑用量通常類似於酐脫水材料之莫耳數,可使用更低或更高的量,此係取決於所欲之轉化率與所用之催化劑,其常在相對於該聚醯胺酸中之醯胺酸(amide acid)基團以莫耳過量使用,每當量聚醯胺酸通常為約1.2至2.4莫耳。The catalyst used in the step S16 may be pyridine or 3-picoline. The catalyst may also use a tertiary amine having a similar activity to the pyridine as well as betaheptylpyridine. These tertiary amines include 2-picoline (alpha picoline); 3,4-dimethylpyridine; 3,5-dimethylpyridine; 4-methylpyridine; 4-isopropylpyridine; N,N-dimethyl Benzylamine; isoquinoline; 4-benzylpyridine, N,N-dimethyldodecylamine, triethylamine and the like. Further, in step (d), a dehydrating agent such as acetic anhydride, propionic anhydride, butyric anhydride, valeric anhydride and a mixture thereof; an anhydride of an aromatic monocarboxylic acid; a mixture of an aliphatic anhydride and an aromatic anhydride; carbodiimide; Aliphatic ketene. The amount of catalyst and dehydrating agent is generally similar to the molar number of the anhydride dehydrating material, and lower or higher amounts may be used depending on the desired conversion rate and the catalyst used, which is often relative to the polylysine. The amide acid group is used in molar excess, typically from about 1.2 to 2.4 moles per equivalent of polyglycolic acid.
步驟S18中的式Si(R3 )4 所示之烷氧化矽單體係選自下列所組成之組群:四甲氧基矽烷、四乙氧基矽烷、四丙氧基矽烷及其組合。The alkoxylated oxime system of the formula Si(R 3 ) 4 in the step S18 is selected from the group consisting of tetramethoxy decane, tetraethoxy decane, tetrapropoxy decane and combinations thereof.
另外,於步驟S18之後可再加入式R4 Si(R5 )3 所示之分子間作用力偶合劑單體(其中R4 為末端帶有環氧基之基,R5 彼此可相同或不同且代表鹵素、C1-6 烷氧基、C2-6 烯氧基及芳氧基)進行水解縮合反應後並與氧化矽部份產生共價鍵結。式R4 Si(R5 )3 所示之分子間作用力偶合劑單體可選自下列所組成之組群:γ -縮水甘油氧基丙基三甲氧基矽烷(GTMOS)、γ -縮水甘油氧基丙基三乙氧基矽烷(GTEOS)及其組合。In addition, an intermolecular force coupler monomer represented by the formula R 4 Si(R 5 ) 3 may be further added after the step S18 (wherein R 4 is a group having an epoxy group at the terminal, and R 5 may be the same or different from each other and The halogen, C 1-6 alkoxy group, C 2-6 alkenyloxy group and aryloxy group are subjected to a hydrolysis condensation reaction and are covalently bonded to the cerium oxide moiety. The intermolecular force coupler monomer of the formula R 4 Si(R 5 ) 3 may be selected from the group consisting of γ -glycidoxypropyltrimethoxydecane (GTMOS), γ -glycidyloxy Propyltriethoxydecane (GTEOS) and combinations thereof.
第二圖係本發明之一實施例的聚馬來酸酐-聚醯亞胺-氧化矽有機-無機混成材料薄膜的製造方法的流程圖,其中使用之矽烷偶合劑係為式H2 N-R1 -Si(R2 )3 所示之胺基偶合劑。如第二圖所示,首先將結構式(1)所示之芳族二胺與結構式(2)所示之二酐在溶劑中反應產生結構式(3)及(4)所示之聚醯胺酸,其中結構式(1)中的X表示選自C、O及苯環所組成之族群所構成的結構;Y為H或CF3 。接著,加入聚馬來酸酐及與結構式(3)及(4)所示之聚醯胺酸溶液在低於 80℃之溫度反應,以製備聚馬來酸酐之側鏈接枝有-NH-CO-官能基以及羧酸基之寡聚合物,再加入式H2 N-R1 -Si(R2 )3 所示之胺基偶合劑(其中R1 代表C1-6 伸烷基、伸芳基,R2 彼此可相同或不同且代表C1-6 烷氧基),使其中之胺基與聚馬來酸酐之酸酐基反應,得到如結構式(5)所示之胺基偶合劑接枝之聚醯胺酸及結構式(6)所示之聚醯胺酸。接著,加入催化劑進行化學合環反應,得到如結構式(7)所示之胺基偶合劑接枝之聚醯亞胺及結構式(8)所示之聚醯亞胺。然後,加入四乙氧基矽烷(TEOS),在水與酸催化劑或鹼催化劑存在下,於15℃至100℃之溫度範圍內,進行水解及縮合反應,因而TEOS中的矽烷醇基與進行水解縮合反應後的胺基偶合劑產生共價鍵結而形成如結構式(9)所示之聚馬來酸酐-聚醯亞胺-氧化矽混成材料與結構式(10)所示之聚醯亞胺。由於聚馬來酸酐的側鏈上含有可熱交聯之反應性官能基,所以無法採用一般直接加熱至約300℃將聚亞醯胺酸合環成為聚亞醯胺。因此,本發明使用化學合環法,選擇適當的鹼作為觸媒及選擇性地加入脫水劑,在100℃反應約4小時,即可形成如結構式(7)所示之胺基偶合劑接枝之聚醯亞胺及結構式(8)所示之聚醯亞胺。The second drawing is a flow chart of a method for producing a polymaleic anhydride-polyimine-iridium oxide organic-inorganic hybrid material film according to an embodiment of the present invention, wherein the decane coupling agent used is a formula H 2 NR 1 - An amine-based coupling agent represented by Si(R 2 ) 3 . As shown in the second figure, the aromatic diamine represented by the structural formula (1) and the dianhydride represented by the structural formula (2) are first reacted in a solvent to produce a polymer represented by the structural formulas (3) and (4). Proline, wherein X in the structural formula (1) represents a structure consisting of a group consisting of C, O and a benzene ring; Y is H or CF 3 . Next, the polymaleic anhydride is added and the polyamine acid solutions represented by the structural formulas (3) and (4) are reacted at a temperature lower than 80 ° C to prepare a side chain of polymaleic anhydride having -NH-CO. - an oligopolymer having a functional group and a carboxylic acid group, and further an amine coupling agent represented by the formula H 2 NR 1 -Si(R 2 ) 3 (wherein R 1 represents a C 1-6 alkylene group, an aryl group, R 2 may be the same or different from each other and represents a C 1-6 alkoxy group, and an amine group thereof is reacted with an acid anhydride group of polymaleic anhydride to obtain an amino group coupling agent represented by the formula (5). Polylysine and polylysine represented by structural formula (6). Next, a catalyst is added to carry out a chemical ring-closing reaction to obtain a polyimine imine grafted with an amine-based coupling agent represented by the structural formula (7) and a polyfluorene imine represented by the structural formula (8). Then, tetraethoxy decane (TEOS) is added, and hydrolysis and condensation reaction are carried out in the presence of water and an acid catalyst or a base catalyst at a temperature ranging from 15 ° C to 100 ° C, whereby the stanol group in TEOS is hydrolyzed. The amine coupling agent after the condensation reaction is covalently bonded to form a polymaleic anhydride-polyimine-cerium oxide mixed material represented by the structural formula (9) and a polyfluorene represented by the structural formula (10). amine. Since the side chain of the polymaleic anhydride contains a thermally crosslinkable reactive functional group, it is not possible to use a general direct heating to about 300 ° C to form a polyphosphite ring into a polymethyleneamine. Therefore, the present invention uses a chemical ring-closing method, selecting an appropriate base as a catalyst and selectively adding a dehydrating agent, and reacting at 100 ° C for about 4 hours to form an amine-based coupling agent as shown in the structural formula (7). The polyimine of the branch and the polyimine of the formula (8).
第三圖係本發明之另一實施例的聚馬來酸酐-聚醯亞胺-氧化矽有機-無機混成材料薄膜的製造方法的流程圖,其中使用之矽烷偶合劑係為式OCN-R1 -Si(R2 )3 所示之異氰酸偶合劑。如第三圖所示,首先將結構式(11)所示之芳族二胺與結構式(12)所示之二酐在溶劑中反應產生結構式(13)及(14)所示之聚醯胺酸,其中結構式(11)中的X表示選自C、O及苯環所組成之族群所構成的結構;Y為H或CF3 。接著,加入聚馬來酸酐及與結構式(13)及(14)所示之聚醯胺酸溶液在低於80℃之溫度反應,以製備聚馬來酸酐之側鏈接枝有-NH-CO-官能基以及羧酸基之寡聚合物,再加入式OCN-R1 -Si(R2 )3 所示之異氰酸偶合劑(其中R1 代表C1-6 伸烷基、伸芳基,R2 彼此可相同或不同且代表C1-6 烷氧基),使其中之異氰酸基與聚馬來酸酐側鏈上芳族二胺之氫氧基反應,得到如結構式(15)所示具有異氰酸偶合劑鍵結之聚醯胺酸及結構式(16)所示之聚醯胺酸。接著,加入催化劑進行化學合環反應,得到如結構式(17)所示具有異氰酸偶合劑鍵結之聚醯亞胺及結構式(18)所示之聚醯亞胺。然後,加入四乙氧基矽烷(TEOS),在水與酸催化劑或鹼催化劑存在下,於15℃至100℃之溫度範圍內,進行水解及縮合反應,因而TEOS中的矽烷醇基與進行水解縮合反應後的異氰酸偶合劑產生共價鍵結而形成如結構式(19)所示之聚馬來酸酐-聚醯亞胺-氧化矽混成材料與結構式(20)所示之聚醯亞胺。由於聚馬來酸酐的側鏈上含有可熱交聯之反應性官能基,所以無法採用一般直接加熱至約300℃將聚亞醯胺酸合環成為聚亞醯胺。因此,本發明使用化學合環法,選擇適當的鹼作為觸媒及選擇性地加入脫水劑,在100℃反應約4小時,即可形成如結構式(17)所示具有異氰酸偶合劑鍵結之聚醯亞胺及結構式(18)所示之聚醯亞胺。3 is a flow chart showing a method for producing a polymaleic anhydride-polyimine-ruthenium oxide organic-inorganic hybrid material film according to another embodiment of the present invention, wherein the decane coupling agent used is a formula OCN-R 1 An isocyanate coupling agent represented by -Si(R 2 ) 3 . As shown in the third figure, the aromatic diamine represented by the structural formula (11) and the dianhydride represented by the structural formula (12) are first reacted in a solvent to produce a polymer represented by the structural formulas (13) and (14). Proline, wherein X in the structural formula (11) represents a structure consisting of a group consisting of C, O and a benzene ring; Y is H or CF 3 . Next, the polymaleic anhydride is added and the polyamic acid solution represented by the structural formulas (13) and (14) is reacted at a temperature lower than 80 ° C to prepare a side chain of the polymaleic anhydride having -NH-CO. - an oligopolymer having a functional group and a carboxylic acid group, and further an isocyanate coupling agent represented by the formula OCN-R 1 -Si(R 2 ) 3 (wherein R 1 represents a C 1-6 alkylene group, an aryl group) , R 2 may be the same or different from each other and represents a C 1-6 alkoxy group, and the isocyanate group thereof is reacted with the hydroxyl group of the aromatic diamine on the side chain of the polymaleic anhydride to obtain a structural formula (15). A polylysine having an isocyanate coupling agent and a poly-proline represented by the formula (16). Next, a catalyst is added to carry out a chemical ring-closing reaction to obtain a polyimine which has an isocyanate coupling agent as shown in the structural formula (17) and a polyimine which is represented by the structural formula (18). Then, tetraethoxy decane (TEOS) is added, and hydrolysis and condensation reaction are carried out in the presence of water and an acid catalyst or a base catalyst at a temperature ranging from 15 ° C to 100 ° C, whereby the stanol group in TEOS is hydrolyzed. The isocyanate coupling agent after the condensation reaction is covalently bonded to form a polymaleic anhydride-polyimine-ruthenium oxide mixed material represented by the structural formula (19) and a polyfluorene represented by the structural formula (20). Imine. Since the side chain of the polymaleic anhydride contains a thermally crosslinkable reactive functional group, it is not possible to use a general direct heating to about 300 ° C to form a polyphosphite ring into a polymethyleneamine. Therefore, the present invention uses a chemical ring-closing method, selecting an appropriate base as a catalyst and selectively adding a dehydrating agent, and reacting at 100 ° C for about 4 hours to form an isocyanate coupling agent as shown in Structural Formula (17). A bonded polyimine and a polyimine represented by the formula (18).
(實施例)(Example)
本發明將以下列實施例進一步加以說明,惟該實施例僅用以說明而不限制本發明之範圍。首先,取1.602克(8毫莫耳)之4,4’-氧基二苯胺(ODA)溶於二甲基乙醯胺(DMAc)中,溶解後緩慢加入4.443克(10毫莫耳)之4,4-六氟亞異丙基二酞酸二酐(6FDA),通入氮氣並予以激烈攪拌,於室溫下反應24小時,得到澄清黏滯之聚醯胺酸(PAA)溶液。此時加入20毫莫耳的醋酸酐(acetic anhydride)及20毫莫耳的吡啶(pyridine)升溫到100℃,維持4小時,進行化學合環。所得溶液回到室溫後,加入886毫克(4毫莫耳)的3-異氰酸三乙氧基矽烷,於室溫下攪拌反應4小時,使其接上聚醯亞胺末端,隨後加入1.250克的四甲氧基矽烷(TMOS),攪拌30分鐘後加入30毫克的去離子水使其於室溫下反應24小時後,得到聚馬來酸酐-聚醯亞胺-氧化矽混成材料溶液。The invention is further illustrated by the following examples, which are intended to illustrate and not to limit the scope of the invention. First, 1.602 g (8 mmol) of 4,4'-oxydiphenylamine (ODA) was dissolved in dimethylacetamide (DMAc), and after dissolution, 4.443 g (10 mmol) was slowly added. 4,4-hexafluoroisopropylidene dicarboxylic acid dianhydride (6FDA) was purged with nitrogen and vigorously stirred at room temperature for 24 hours to obtain a clear viscous polyamine acid (PAA) solution. At this time, 20 mmol of acetic anhydride and 20 mmol of pyridine were added to raise the temperature to 100 ° C for 4 hours to carry out chemical ring formation. After the solution was returned to room temperature, 886 mg (4 mmol) of 3-isocyanatotriethoxydecane was added, and the reaction was stirred at room temperature for 4 hours, and then attached to the polyimine end, followed by addition. 1.250 g of tetramethoxy decane (TMOS), stirred for 30 minutes, added 30 mg of deionized water and allowed to react at room temperature for 24 hours to obtain a polymaleic anhydride-polyimine-ruthenium oxide mixed material solution. .
對所得的聚馬來酸酐-聚醯亞胺-氧化矽混成材料進行特性量測,聚馬來酸酐-聚醯亞胺-氧化矽混成材料之IR光譜圖及其分析結果、Tg約為150℃,以及5wt%熱重損失溫度約為288℃,如第四圖至第七圖所示。第四圖係 本發 明 聚馬來酸酐- 聚醯亞胺-氧化矽混成材料 之IR光譜圖 。波數 1538cm-1及1650cm-1為聚醯胺酸(PAA)結構中N-H彎曲(N-H bending)和C=O伸展(C=O stretching)吸收峰。在PAA環化後形成聚醯亞胺(PI)結構後,以上兩個吸收峰消失,而新的吸收峰形成,其中波數1380cm-1為PI結構中三級胺的吸收峰,波數730cm-1和1770cm-1為PI結構中C=O的吸收峰。Characterization of the obtained polymaleic anhydride-polyimine-ruthenium oxide mixed material, IR spectrum of polymaleic anhydride-polyimine-ruthenium oxide mixed material and analysis result thereof, Tg is about 150 ° C And the 5 wt% thermogravimetric loss temperature is about 288 ° C, as shown in the fourth to seventh figures. FIG fourth present invention based polymaleic anhydride - Polyimide - IR spectra of hybrid material of silicon oxide. The wave numbers 1538 cm-1 and 1650 cm-1 are absorption peaks of NH bending and C=O stretching in the structure of polyacrylic acid (PAA). After the formation of poly(imine) (PI) structure after PAA cyclization, the above two absorption peaks disappear, and a new absorption peak is formed, wherein the wave number of 1380 cm-1 is the absorption peak of the tertiary amine in the PI structure, and the wave number is 730 cm. -1 and 1770 cm-1 are absorption peaks of C=O in the PI structure.
另外,本發明提供一種膠片,係一玻璃布含浸於前述之聚馬來酸酐-聚醯亞胺-氧化矽混成材料薄膜而成。此膠片具有優異的耐熱性、機械特性,且可應用於銅箔基板和電路板之絕緣層材料。Further, the present invention provides a film obtained by impregnating a glass cloth of the above-mentioned polymaleic anhydride-polyimine-ruthenium oxide mixed material film. This film has excellent heat resistance and mechanical properties, and can be applied to an insulating layer material of a copper foil substrate and a circuit board.
本發明提供一種銅箔基板,係由一銅箔與前述之膠片壓合而成。此銅箔基板具有優異的耐熱性、機械特性,與電子元件接合後於高溫、高濕度等嚴苛環境下操作而不會影響其品質。The invention provides a copper foil substrate which is formed by pressing a copper foil with the aforementioned film. The copper foil substrate has excellent heat resistance and mechanical properties, and is bonded to an electronic component and operated in a severe environment such as high temperature and high humidity without affecting the quality thereof.
以上所述僅為本發明之較佳實施例,非用以限定本發明之專利範圍,其他運用本發明之專利精神之等效變化,均應俱屬本發明之專利範圍。The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the invention, and other equivalent variations of the patent spirit of the present invention are all within the scope of the invention.
S10~S20...步驟S10~S20. . . step
Claims (14)
(a)使二酐與芳族二胺於一溶劑中反應,以製備聚醯胺酸溶液;
(b)以聚馬來酸酐與步驟(a)獲得的聚醯胺酸溶液在低於 80℃之溫度反應,以製備聚馬來酸酐之側鏈接枝有-NH-CO-官能基以及羧酸基之寡聚合物;
(c)添加一矽烷偶合劑;
(d)於步驟(c)製得的溶液中加入催化劑進行化學合環反應;
(e)於步驟(d)製得的溶液中加入式Si(R3 )4 所示之烷氧化矽單體(其中R3 彼此可相同或不同且代表鹵素、C1-6 烷氧基、C2-6 烯氧基及芳氧基),在水與酸催化劑或鹼催化劑存在下,於15℃至100℃之溫度範圍內,進行水解及縮合反應,因而Si(R3 )4 中之矽烷醇基與進行水解縮合反應後的該矽烷偶合劑產生共價鍵結而形成聚馬來酸酐-聚醯亞胺-氧化矽混成材料溶液;
(f)將聚馬來酸酐-聚醯亞胺-氧化矽混成材料溶液塗佈於一基材上,經升溫固化獲得聚馬來酸酐-聚醯亞胺-氧化矽混成材料薄膜。A method for producing an organic-inorganic hybrid material film, comprising the steps of:
(a) reacting a dianhydride with an aromatic diamine in a solvent to prepare a polyaminic acid solution;
(b) reacting the polymaleic anhydride with the polyamic acid solution obtained in the step (a) at a temperature lower than 80 ° C to prepare a side chain of the polymaleic anhydride having a -NH-CO-functional group and a carboxylic acid Oligomeric polymer;
(c) adding a decane coupling agent;
(d) adding a catalyst to the solution prepared in the step (c) for a chemical ring-closing reaction;
(e) adding, in the solution prepared in the step (d), an alkoxylated oxime monomer represented by the formula Si(R 3 ) 4 (wherein R 3 may be the same or different from each other and represent a halogen, a C 1-6 alkoxy group, C 2-6 alkenyloxy group and aryloxy group), in the presence of water and an acid catalyst or a base catalyst, in a temperature range of 15 ° C to 100 ° C, hydrolysis and condensation reaction, and thus Si(R 3 ) 4 The decyl alcohol group is covalently bonded to the decane coupling agent after the hydrolysis condensation reaction to form a polymaleic anhydride-polyimine-ruthenium oxide mixed material solution;
(f) Applying a solution of a polymaleic anhydride-polyimine-cerium oxide mixed material onto a substrate, and curing at elevated temperature to obtain a film of a polymaleic anhydride-polyimine-cerium oxide mixed material.
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|---|---|---|---|---|
| JP2001316620A (en) * | 2000-05-11 | 2001-11-16 | Jsr Corp | Composition for forming film and material for forming insulating film |
| JP2005068408A (en) * | 2003-08-01 | 2005-03-17 | Arakawa Chem Ind Co Ltd | Alkoxy group-containing silane-modified block copolymer type polyamic acid, block copolymerized polyimide-silica hybrid cured material and metal laminate |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001316620A (en) * | 2000-05-11 | 2001-11-16 | Jsr Corp | Composition for forming film and material for forming insulating film |
| JP2005068408A (en) * | 2003-08-01 | 2005-03-17 | Arakawa Chem Ind Co Ltd | Alkoxy group-containing silane-modified block copolymer type polyamic acid, block copolymerized polyimide-silica hybrid cured material and metal laminate |
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