TWI492832B - Injection Molding Machine and Injection Molding Machine - Google Patents
Injection Molding Machine and Injection Molding Machine Download PDFInfo
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- TWI492832B TWI492832B TW101124784A TW101124784A TWI492832B TW I492832 B TWI492832 B TW I492832B TW 101124784 A TW101124784 A TW 101124784A TW 101124784 A TW101124784 A TW 101124784A TW I492832 B TWI492832 B TW I492832B
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- movable member
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- 238000001746 injection moulding Methods 0.000 title claims description 28
- 238000012545 processing Methods 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 11
- 238000001514 detection method Methods 0.000 claims description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- 229910052742 iron Inorganic materials 0.000 claims 1
- 238000001179 sorption measurement Methods 0.000 description 34
- 238000002347 injection Methods 0.000 description 7
- 239000007924 injection Substances 0.000 description 7
- 230000007246 mechanism Effects 0.000 description 4
- 238000012544 monitoring process Methods 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/64—Mould opening, closing or clamping devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/1761—Means for guiding movable mould supports or injection units on the machine base or frame; Machine bases or frames
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
- B29C45/80—Measuring, controlling or regulating of relative position of mould parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/64—Mould opening, closing or clamping devices
- B29C2045/645—Mould opening, closing or clamping devices using magnetic means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
- B29C2945/76—Measuring, controlling or regulating
- B29C2945/76003—Measured parameter
- B29C2945/76083—Position
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
- B29C2945/76—Measuring, controlling or regulating
- B29C2945/76003—Measured parameter
- B29C2945/76167—Presence, absence of objects
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
- B29C2945/76—Measuring, controlling or regulating
- B29C2945/76494—Controlled parameter
- B29C2945/76568—Position
- B29C2945/76581—Position distance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
- B29C2945/76—Measuring, controlling or regulating
- B29C2945/76494—Controlled parameter
- B29C2945/76585—Dimensions, e.g. thickness
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
本發明係有關一種射出成形機及射出成形機的模厚調整方法。The present invention relates to a mold thickness adjustment method for an injection molding machine and an injection molding machine.
射出成形機從射出裝置射出熔融樹脂並填充於模具裝置的模腔,並使其固化來成形為成形品。模具裝置由固定模及可動模構成。模具裝置的閉模、鎖模及開模藉由鎖模裝置進行。The injection molding machine ejects the molten resin from the injection device, fills it in the cavity of the mold device, and solidifies it to form a molded article. The mold device is composed of a fixed mold and a movable mold. The mold closing, mold clamping and mold opening of the mold device are performed by a mold clamping device.
作為鎖模裝置,使用馬達等驅動源與肘節機構之方式者被廣泛利用,但肘節機構的特性上很難變更鎖模力,反應性或穩定性較差。並且,在肘節機構動作時產生彎曲力矩,安裝模具裝置之安裝面等會有應變。As a mold clamping device, a driving source such as a motor and a toggle mechanism are widely used. However, it is difficult to change the clamping force in the characteristics of the toggle mechanism, and the reactivity or stability is poor. Further, when the toggle mechanism is operated, a bending moment is generated, and the mounting surface of the mounting die device is strained.
因此,提出了於開閉模動作時使用線性馬達而於鎖模動作時使用電磁鐵的吸附力之鎖模裝置。該鎖模裝置具備:固定壓板,其安裝有固定模;可動壓板,其安裝有可動模;吸附板,其與可動壓板一同移動;後壓板,其配設於可動壓板與吸附板之間;及桿,其貫穿後壓板來連結可動壓板與吸附板。若在後壓板與吸附板之間產生基於電磁鐵之吸附力,則吸附力透過桿傳遞至可動壓板,並且在可動壓板與固定壓板之間產生鎖模力。Therefore, a mold clamping device using an adsorption force of an electromagnet during a mold clamping operation using a linear motor during the opening and closing mode operation has been proposed. The clamping device comprises: a fixed pressing plate mounted with a fixed mold; a movable pressing plate mounted with a movable mold; an adsorption plate moving together with the movable pressing plate; and a rear pressing plate disposed between the movable pressing plate and the adsorption plate; a rod penetrating the rear platen to join the movable platen and the adsorption plate. If an adsorption force based on the electromagnet is generated between the rear platen and the adsorption plate, the adsorption force is transmitted to the movable platen through the rod, and a clamping force is generated between the movable platen and the fixed platen.
然而,若更換模具裝置,則有時模具裝置的厚度發生變化,閉模結束時形成於後壓板與吸附板之間的間隙發生 變化。若間隙變動,則吸附力變動而鎖模力發生變化。However, if the mold device is replaced, the thickness of the mold device may change, and the gap formed between the rear platen and the adsorption plate may occur at the end of the mold closing. Variety. When the gap changes, the adsorption force changes and the clamping force changes.
對此,一直以來提出有根據模具裝置的厚度調整可動壓板與吸附板的間隔之模厚調整部(例如參閱專利文獻1)。模厚調整部在使可動模抵接於固定模之狀態下調整可動壓板與吸附板的間隔,並將間隙調整成設定值。In this regard, a mold thickness adjusting portion for adjusting the interval between the movable platen and the suction plate according to the thickness of the mold device has been proposed (for example, see Patent Document 1). The mold thickness adjusting portion adjusts the interval between the movable platen and the suction plate in a state in which the movable mold abuts against the fixed mold, and adjusts the gap to a set value.
專利文獻1:國際專利公開第05/090052號Patent Document 1: International Patent Publication No. 05/090052
在專利文獻1中提出有根據模具裝置的厚度調整可動壓板與吸附板的間隔之模厚調整部,但未提到具體的調整方法的詳細內容。Patent Document 1 proposes a mold thickness adjusting portion for adjusting the interval between the movable platen and the suction plate in accordance with the thickness of the mold device, but the details of the specific adjustment method are not mentioned.
本發明係鑒於上述課題而完成者,其目的在於提供一種適合更換模具裝置之射出成形機及射出成形機的模厚調整方法。The present invention has been made in view of the above problems, and an object thereof is to provide a mold thickness adjusting method for an injection molding machine and an injection molding machine suitable for replacing a mold device.
為了解決上述目的,本發明的基於態樣(1)之射出成形機的特徵為具備:第1固定構件,其安裝有固定模;第1可動構件,其安裝有可動模; 第2可動構件,其與該第1可動構件一同移動;第2固定構件,其配設於前述第1可動構件與前述第2可動構件之間;電磁鐵,其形成於前述第2可動構件及前述第2固定構件的其中一方,吸附另一方來產生鎖模力;模厚調整部,其調整前述第1可動構件與前述第2可動構件的間隔;模厚調整處理部,其控制該模厚調整部;以及移動限制部,其在前述第2可動構件與前述第2固定構件之間形成預定的間隙之狀態下,限制前述第2可動構件朝向開模方向的移動,在藉由該移動限制部限制前述移動之狀態下,前述模厚調整處理部驅動前述模厚調整部,使前述第1可動構件朝向閉模方向移動,並透過前述可動模及前述固定模而與前述第1固定構件接觸。In order to achieve the above object, an injection molding machine according to aspect (1) of the present invention is characterized by comprising: a first fixing member to which a fixed mold is attached; and a first movable member to which a movable mold is attached; a second movable member that moves together with the first movable member, a second fixed member that is disposed between the first movable member and the second movable member, and an electromagnet that is formed on the second movable member and One of the second fixing members adsorbs the other to generate a clamping force; the mold thickness adjusting portion adjusts a distance between the first movable member and the second movable member; and a mold thickness adjustment processing portion that controls the mold thickness And a movement restricting portion that restricts movement of the second movable member toward the mold opening direction in a state where a predetermined gap is formed between the second movable member and the second fixing member, and the movement is restricted by the movement In a state in which the movement is restricted, the mold thickness adjustment processing unit drives the mold thickness adjustment unit to move the first movable member toward the mold closing direction, and is in contact with the first fixing member through the movable mold and the fixed mold. .
並且,本發明的基於態樣(2)之射出成形機的模厚調整方法,是具備:第1固定構件,其安裝有固定模;第1可動構件,其安裝有可動模;第2可動構件,其與該第1可動構件一同移動;第2固定構件,其配設於前述第1可動構件與前述第2可動構件之間;電磁鐵,其形成於前述第2可動構件及前述第2固定構件的其中一方,吸附另一方來產生鎖模力;以及 模厚調整部,其調整前述第1可動構件與前述第2可動構件的間隔,之射出成形機的模厚調整方法,其特徵為:在前述第2可動構件與前述第2固定構件之間形成預定間隙,並且在限制前述第2可動構件朝向開模方向的移動之狀態下,驅動前述模厚調整部,使前述第1可動構件朝向閉模方向移動,並透過前述可動模及前述固定模而與前述第1固定構件接觸。Further, the mold thickness adjustment method of the injection molding machine according to the aspect (2) of the present invention includes: a first fixing member to which a fixed mold is attached; a first movable member to which a movable mold is attached; and a second movable member And moving together with the first movable member; the second fixing member is disposed between the first movable member and the second movable member; and the electromagnet is formed on the second movable member and the second fixed One of the members, adsorbing the other to create a clamping force; A mold thickness adjusting unit that adjusts a gap between the first movable member and the second movable member to adjust a mold thickness of the injection molding machine, and is formed between the second movable member and the second fixed member The predetermined thickness and the movement of the second movable member in the mold opening direction are restricted, and the mold thickness adjusting portion is driven to move the first movable member toward the mold closing direction and to pass through the movable mold and the fixed mold. It is in contact with the first fixing member.
根據本發明,可提供一種適合更換模具裝置的射出成形機及射出成形機的模厚調整方法。According to the present invention, it is possible to provide a mold thickness adjusting method of an injection molding machine and an injection molding machine suitable for replacing a mold device.
以下,參閱附圖對用於實施本發明之形態進行說明,但在各附圖中,對於同一或對應之結構附加同一或對應之符號而省略說明。並且,將進行閉模時之可動壓板的移動方向設為前方,將進行開模時之可動壓板的移動方向設為後方來進行說明。In the following, the embodiments for carrying out the invention will be described with reference to the accompanying drawings. In addition, the moving direction of the movable platen when the mold is closed is set to the front, and the moving direction of the movable platen when the mold is opened is set to the rear.
第1圖係顯示本發明依據一實施形態之射出成形機閉模時的狀態圖。第2圖係顯示本發明依據一實施形式之射出成形機開模時的狀態圖。Fig. 1 is a view showing a state in which the injection molding machine according to the embodiment is closed when the mold is closed. Fig. 2 is a view showing a state in which the injection molding machine according to an embodiment of the present invention is opened.
圖中,10為鎖模裝置,Fr為射出成形機的框架,Gd為由鋪設於該框架Fr上之2根導軌所構成之導引件,11 為固定壓板(第1固定構件)。固定壓板11可設置於能夠沿著向模開閉方向(圖中左右方向)延伸之導引件Gd移動之位置調整底座Ba上。另外,固定壓板11也可以載置於框架Fr上。In the figure, 10 is a mold clamping device, Fr is a frame of an injection molding machine, and Gd is a guide member composed of two guide rails laid on the frame Fr, 11 To fix the pressure plate (first fixing member). The fixed platen 11 can be disposed on the position adjustment base Ba which is movable along the guide member Gd extending in the mold opening and closing direction (the horizontal direction in the drawing). Further, the fixed platen 11 may be placed on the frame Fr.
與固定壓板11相向而配設可動壓板(第1可動構件)12。可動壓板12固定於可動底座Bb上,可動底座Bb能夠在導引件Gd上行走。藉此,可動壓板12能夠相對於固定壓板11朝向模開閉方向移動。A movable platen (first movable member) 12 is disposed to face the fixed platen 11. The movable platen 12 is fixed to the movable base Bb, and the movable base Bb can travel on the guide Gd. Thereby, the movable platen 12 can move toward the mold opening and closing direction with respect to the fixed platen 11.
與固定壓板11隔著預定間隔且與固定壓板11平行地配設後壓板(第2固定構件)13。後壓板13藉由腳部13a而固定於框架Fr上。A rear platen (second fixing member) 13 is disposed in parallel with the fixed platen 11 at a predetermined interval from the fixed platen 11. The rear platen 13 is fixed to the frame Fr by the leg portion 13a.
4根作為連結構件之連接桿14(圖中僅顯示4根連接桿14中的2根)架設於固定壓板11與後壓板13之間。固定壓板11藉由連接桿14固定於後壓板13。沿著連接桿14進退自如地配設可動壓板12。在可動壓板12中與連接桿14對應之部位形成用以使連接桿14貫穿之未圖示之導引孔。另外,亦可形成缺口部來代替導引孔。Four connecting rods 14 (only two of the four connecting rods 14 are shown in the drawing) are bridged between the fixed platen 11 and the rear platen 13. The fixed platen 11 is fixed to the rear platen 13 by a connecting rod 14. The movable platen 12 is disposed to retreat freely along the connecting rod 14. A guide hole (not shown) through which the connecting rod 14 is inserted is formed in a portion of the movable platen 12 corresponding to the connecting rod 14. In addition, a notch portion may be formed instead of the guide hole.
在連接桿14的前端部(圖中右端部)形成未圖示之螺紋部,藉由將螺母n1螺合緊固於該螺紋部,使連接桿14的前端部固定於固定壓板11。連接桿14的後端部固定於後壓板13。A screw portion (not shown) is formed at a distal end portion (right end portion in the drawing) of the connecting rod 14, and the distal end portion of the connecting rod 14 is fixed to the fixed pressure plate 11 by screwing the nut n1 to the screw portion. The rear end portion of the connecting rod 14 is fixed to the rear pressure plate 13.
固定模15與可動模16分別安裝於固定壓板11與可動壓板12,固定模15與可動模16隨著可動壓板12的進退而接觸分離,進行閉模、鎖模及開模。另外,隨著進行 鎖模,未圖示之模腔空間形成於固定模15與可動模16之間,從射出裝置17的射出噴嘴18所射出之未圖示之熔融樹脂填充於模腔空間。由固定模15及可動模16構成模具裝置19。The fixed mold 15 and the movable mold 16 are attached to the fixed platen 11 and the movable platen 12, respectively, and the fixed mold 15 and the movable mold 16 are contacted and separated with the advancement and retraction of the movable platen 12 to perform mold closing, mold clamping, and mold opening. In addition, along with In the mold clamping, a cavity space (not shown) is formed between the fixed mold 15 and the movable mold 16, and a molten resin (not shown) which is emitted from the injection nozzle 18 of the injection device 17 is filled in the cavity space. The mold device 19 is constituted by the fixed mold 15 and the movable mold 16.
吸附板22(第2可動構件)是與可動壓板12平行地配設。吸附板22藉由安裝板27固定於滑動底座Sb,滑動底座Sb能夠在導引件Gd上行走。藉此,吸附板22在比後壓板13更靠後方進退自如。吸附板22亦可由磁性材料形成。另外,也可以不用安裝板27,此情形時,吸附板22為直接固定於滑動底座Sb。The suction plate 22 (second movable member) is disposed in parallel with the movable platen 12. The suction plate 22 is fixed to the slide base Sb by a mounting plate 27, and the slide base Sb can travel on the guide Gd. Thereby, the suction plate 22 can move forward and backward more than the rear pressure plate 13. The adsorption plate 22 can also be formed of a magnetic material. Alternatively, the mounting plate 27 may not be used. In this case, the suction plate 22 is directly fixed to the sliding base Sb.
桿39配設成在後端部與吸附板22連結而在前端部與可動壓板12連結。因此,桿39在閉模時隨著吸附板22前進而前進並使可動壓板12前進,而在開模時隨著吸附板22後退而後退並使可動壓板12後退。為此,在後壓板13的中央部分形成用以使桿39貫穿之桿孔41。The rod 39 is disposed to be coupled to the suction plate 22 at the rear end portion and coupled to the movable platen 12 at the front end portion. Therefore, the rod 39 advances with the advancement of the suction plate 22 at the time of mold closing, and advances the movable platen 12, and retreats as the suction plate 22 retreats at the time of mold opening, and the movable platen 12 retreats. To this end, a rod hole 41 for penetrating the rod 39 is formed in a central portion of the rear platen 13.
線性馬達28為用以使可動壓板12進退之模開閉驅動部,例如配設於與可動壓板12連結之吸附板22與框架Fr之間。另外,線性馬達28亦可配設於可動壓板12與框架Fr之間。The linear motor 28 is a mold opening and closing drive unit for moving the movable platen 12 forward and backward, and is disposed, for example, between the suction plate 22 coupled to the movable platen 12 and the frame Fr. Further, the linear motor 28 may be disposed between the movable platen 12 and the frame Fr.
線性馬達28具備定子29及可動件31。定子29形成為在框架Fr上與導引件Gd平行且與滑動底座Sb的移動範圍對應。可動件31形成為在滑動底座Sb的下端與定子29相向且跨及於預定範圍。The linear motor 28 includes a stator 29 and a movable member 31. The stator 29 is formed to be parallel to the guide Gd on the frame Fr and to correspond to the range of movement of the slide base Sb. The movable member 31 is formed to face the stator 29 at a lower end of the slide base Sb and to span a predetermined range.
可動件31具備磁芯34及線圈35。並且,磁芯34具 備朝向定子29突出且以預定間距形成之複數個磁極齒33,線圈35捲裝於各磁極齒33。另外,磁極齒33形成為在相對於可動壓板12的移動方向為垂直之方向上相互平行。並且,定子29具備未圖示之磁芯及在該磁芯上延伸而形成之未圖示之永久磁鐵。該永久磁鐵是藉由使N極及S極的各磁極交替受磁所形成。配置檢測可動件31的位置之位置感測器53。並且,檢測供給於線圈35之電流的電流值之電流感測器54設置於線圈35與電源之間。The mover 31 includes a magnetic core 34 and a coil 35. And the magnetic core 34 has A plurality of magnetic pole teeth 33 projecting toward the stator 29 and formed at a predetermined pitch are provided, and the coils 35 are wound around the respective magnetic pole teeth 33. Further, the magnetic pole teeth 33 are formed to be parallel to each other in a direction perpendicular to the moving direction of the movable platen 12. Further, the stator 29 includes a magnetic core (not shown) and a permanent magnet (not shown) formed by extending the magnetic core. The permanent magnet is formed by alternately magnetizing the magnetic poles of the N pole and the S pole. A position sensor 53 that detects the position of the movable member 31 is disposed. Further, a current sensor 54 that detects a current value of a current supplied to the coil 35 is provided between the coil 35 and the power source.
若藉由向線圈35供給預定電流來驅動線性馬達28,則可動件31被進退。隨此,吸附板22及可動壓板12被進退,能夠進行閉模及開模。根據位置感測器53的檢測結果回饋控制線性馬達28,以使可動件31的位置成為設定值。When the linear motor 28 is driven by supplying a predetermined current to the coil 35, the movable member 31 is advanced and retracted. As a result, the suction plate 22 and the movable platen 12 are advanced and retracted, and the mold can be closed and opened. The linear motor 28 is fed back in response to the detection result of the position sensor 53 so that the position of the movable member 31 becomes a set value.
另外,本實施形態中,雖是將永久磁鐵配設於定子29上,將線圈35配設於可動件31上,但是亦能夠將線圈配設於定子上,將永久磁鐵配設於可動件上。此情形時,線圈不會隨著線性馬達28的驅動而移動,因此能夠容易地進行用來對線圈供給電力之配線。Further, in the present embodiment, the permanent magnet is disposed on the stator 29, and the coil 35 is disposed on the movable member 31. However, the coil may be disposed on the stator and the permanent magnet may be disposed on the movable member. . In this case, since the coil does not move with the driving of the linear motor 28, the wiring for supplying electric power to the coil can be easily performed.
另外,作為模開閉驅動部可使用旋轉馬達及將旋轉馬達的旋轉運動轉換成直線運動之滾珠螺桿機構或者液壓缸或空氣壓缸等流體壓缸等來代替線性馬達28。Further, instead of the linear motor 28, a rotary motor and a ball screw mechanism that converts the rotational motion of the rotary motor into a linear motion or a fluid pressure cylinder such as a hydraulic cylinder or an air cylinder can be used as the mold opening and closing drive unit.
電磁鐵單元37是用來在後壓板13與吸附板22之間生成吸附力。該吸附力經由桿39傳遞至可動壓板12,在可動壓板12與固定壓板11之間產生鎖模力。The electromagnet unit 37 is for generating an adsorption force between the rear platen 13 and the adsorption plate 22. This adsorption force is transmitted to the movable platen 12 via the rod 39, and a clamping force is generated between the movable platen 12 and the fixed platen 11.
另外,藉由固定壓板11、可動壓板12、後壓板13、吸附板22、線性馬達28、電磁鐵單元37及桿39等構成鎖模裝置10。Further, the mold clamping device 10 is constituted by the fixed platen 11, the movable platen 12, the rear platen 13, the suction plate 22, the linear motor 28, the electromagnet unit 37, the rod 39, and the like.
電磁鐵單元37是由形成於後壓板13側之電磁鐵49及形成於吸附板22側之吸附部51所構成。吸附部51是形成於吸附板22的吸附面(前端面)的預定部份,例如,是形成在吸附板22中包圍桿39且與電磁鐵49相向之部分。並且,在後壓板13的吸附面(後端部)的預定部份,例如在桿39周圍形成容納電磁鐵49的線圈48之槽45。比槽45更靠內側形成磁芯46。在磁芯46的周圍捲裝線圈48。在後壓板13中除磁芯46以外的部分形成磁軛47。The electromagnet unit 37 is composed of an electromagnet 49 formed on the side of the rear platen 13 and an adsorption portion 51 formed on the side of the adsorption plate 22. The adsorption portion 51 is a predetermined portion formed on the adsorption surface (front end surface) of the adsorption plate 22, and is formed, for example, in a portion of the adsorption plate 22 that surrounds the rod 39 and faces the electromagnet 49. Further, a predetermined portion of the suction surface (rear end portion) of the rear platen 13, for example, a groove 45 for accommodating the coil 48 of the electromagnet 49 is formed around the rod 39. The magnetic core 46 is formed on the inner side of the groove 45. The coil 48 is wound around the magnetic core 46. A portion other than the magnetic core 46 in the rear platen 13 is formed with a yoke 47.
另外,本實施形式中,雖是與後壓板13分開形成電磁鐵49,與吸附板22分開形成吸附部51,但亦可作為後壓板13的一部分來形成電磁鐵,作為吸附板22的一部分來形成吸附部。並且,亦可相反配置電磁鐵和吸附部。例如,亦可在吸附板22側設置電磁鐵49,在後壓板13側設置吸附部51。並且,電磁鐵49的線圈48的數量亦可為複數個。Further, in the present embodiment, the electromagnet 49 is formed separately from the rear platen 13, and the adsorption portion 51 is formed separately from the adsorption plate 22. However, the electromagnet may be formed as a part of the rear platen 13 as a part of the adsorption plate 22. An adsorption portion is formed. Further, the electromagnet and the adsorption portion may be arranged in reverse. For example, the electromagnet 49 may be provided on the side of the adsorption plate 22, and the adsorption portion 51 may be provided on the side of the rear platen 13. Further, the number of the coils 48 of the electromagnet 49 may be plural.
在電磁鐵單元37中,若對線圈48供給電流,則電磁鐵49被驅動而對吸附部51進行吸附,從而能夠產生鎖模力。In the electromagnet unit 37, when a current is supplied to the coil 48, the electromagnet 49 is driven to adsorb the adsorption portion 51, and a clamping force can be generated.
藉由控制裝置60控制鎖模裝置10的線性馬達28及電磁鐵49的驅動。控制裝置60具備CPU及記憶體等, 按照由CPU所運算之結果來對線性馬達28的線圈35或電磁鐵49的線圈48供給電流。於控制裝置60連接鎖模力感測器55。鎖模力感測器55是設置於鎖模裝置10中至少1根連接桿14的預定位置(固定壓板11與後壓板13之間的預定位置),用以檢測施加於該連接桿14之荷載。鎖模力感測器55是由例如包含檢測連接桿14的伸長量之應變規等所構成。藉由鎖模力感測器55檢測出之荷載被傳送至控制裝置60。The drive of the linear motor 28 and the electromagnet 49 of the mold clamping device 10 is controlled by the control device 60. The control device 60 includes a CPU, a memory, and the like. A current is supplied to the coil 35 of the linear motor 28 or the coil 48 of the electromagnet 49 in accordance with the result of calculation by the CPU. The clamping force sensor 55 is connected to the control device 60. The clamping force sensor 55 is a predetermined position (a predetermined position between the fixed platen 11 and the rear platen 13) provided in the at least one connecting rod 14 of the clamping device 10 for detecting the load applied to the connecting rod 14. . The clamping force sensor 55 is constituted by, for example, a strain gauge or the like including the amount of elongation of the detecting connecting rod 14. The load detected by the clamping force sensor 55 is transmitted to the control device 60.
接著,對鎖模裝置10的動作進行說明。Next, the operation of the mold clamping device 10 will be described.
藉由控制裝置60的模開閉處理部61控制閉模製程。第2圖的狀態(開模的狀態)下,模開閉處理部61對線圈35供給電流來驅動線性馬達28。如第1圖所示,可動壓板12前進,使可動模16與固定模15相抵接。此時,在後壓板13與吸附板22之間,亦即電磁鐵49與吸附部51之間形成間隙δ。另外,與鎖模力相比,閉模所需的力十分地小。The mold closing process is controlled by the mold opening and closing processing unit 61 of the control device 60. In the state of the second drawing (the state of the mold opening), the mold opening and closing processing unit 61 supplies a current to the coil 35 to drive the linear motor 28. As shown in Fig. 1, the movable platen 12 advances to bring the movable die 16 into contact with the fixed die 15. At this time, a gap δ is formed between the rear platen 13 and the adsorption plate 22, that is, between the electromagnet 49 and the adsorption portion 51. In addition, the force required to close the mold is very small compared to the clamping force.
接著,控制裝置60的鎖模處理部62控制鎖模製程。鎖模處理部62對電磁鐵49的線圈48供給電流,將吸附部51吸附於電磁鐵49。該吸附力是經由桿39而傳遞至可動壓板12,在可動壓板12與固定壓板11之間產生鎖模力。Next, the mold clamping processing unit 62 of the control device 60 controls the mold clamping process. The mold clamping processing unit 62 supplies a current to the coil 48 of the electromagnet 49, and adsorbs the adsorption unit 51 to the electromagnet 49. This suction force is transmitted to the movable platen 12 via the rod 39, and a clamping force is generated between the movable platen 12 and the fixed platen 11.
鎖模力藉由鎖模力感測器55檢測。檢測出之鎖模力被傳送至控制裝置60,鎖模處理部62為了使鎖模力成為設定值而調整供給於線圈48之電流,並進行回饋控制。 在此期間,在射出裝置17中熔融之熔融樹脂從射出噴嘴18射出,填充於模具裝置19的模腔空間。The clamping force is detected by the clamping force sensor 55. The detected clamping force is transmitted to the control device 60, and the mold clamping processing unit 62 adjusts the current supplied to the coil 48 in order to set the clamping force to a set value, and performs feedback control. During this period, the molten resin melted in the injection device 17 is emitted from the injection nozzle 18 and filled in the cavity space of the mold device 19.
若模腔空間內的樹脂冷卻固化,則模開閉處理部61控制開模製程。在第1圖的狀態下,鎖模處理部62停止對電磁鐵49的線圈48供給電流。隨此,線性馬達28被驅動,可動壓板12後退,如第2圖所示,可動模16後退而進行開模。When the resin in the cavity space is cooled and solidified, the die opening and closing processing portion 61 controls the mold opening process. In the state of Fig. 1, the mold clamping processing unit 62 stops supplying current to the coil 48 of the electromagnet 49. Accordingly, the linear motor 28 is driven, and the movable platen 12 is retracted. As shown in Fig. 2, the movable mold 16 is retracted to perform mold opening.
然而,若更換模具裝置19,則模具裝置19的厚度發生變化,閉模結束時形成於後壓板13與吸附板22之間的間隙δ發生變化。若間隙δ變動,則吸附力變動而鎖模力發生變化。However, when the mold device 19 is replaced, the thickness of the mold device 19 changes, and the gap δ formed between the rear platen 13 and the suction plate 22 at the end of the mold closing changes. When the gap δ changes, the adsorption force fluctuates and the clamping force changes.
因此,射出成形機具備可因應模具裝置19的厚度調整可動壓板12與吸附板22的間隔之模厚調整部70。模厚調整部70是由:模厚調整用馬達71、齒輪72、螺母73及桿39等所構成。桿39貫穿吸附板22的中心部份,桿39的後端部形成有螺紋43。使螺紋43可與相對吸附板22旋轉自如地被支承之螺母73相螺合。螺母73的外周面形成未圖示之齒輪,該齒輪與安裝於模厚調整用馬達71的輸出軸71a之齒輪72相嚙合。由螺母73及螺紋43構成運動方向轉換部,在該運動方向轉換部中,螺母73的旋轉運動轉換成桿39的直進運動。並且,電流感測器56設置於模厚調整用馬達71與電源之間,用以檢測供給於模厚調整用馬達71的驅動用線圈之電流的電流值。Therefore, the injection molding machine includes a mold thickness adjusting portion 70 that can adjust the interval between the movable platen 12 and the suction plate 22 in accordance with the thickness of the mold device 19. The mold thickness adjusting portion 70 is composed of a mold thickness adjusting motor 71, a gear 72, a nut 73, a rod 39, and the like. The rod 39 penetrates the central portion of the suction plate 22, and the rear end portion of the rod 39 is formed with a thread 43. The thread 43 can be screwed with a nut 73 that is rotatably supported by the suction plate 22. A gear (not shown) is formed on the outer peripheral surface of the nut 73, and this gear meshes with the gear 72 attached to the output shaft 71a of the mold thickness adjusting motor 71. The nut 73 and the screw 43 constitute a movement direction changing portion in which the rotational motion of the nut 73 is converted into the linear motion of the rod 39. Further, the current sensor 56 is provided between the mold thickness adjusting motor 71 and the power source, and detects a current value of a current supplied to the driving coil of the mold thickness adjusting motor 71.
若供給預定電流來驅可動模厚調整用馬達71,則螺 母73相對螺紋43旋轉預定量,來調整桿39相對於吸附板22之位置。從而,調整可動壓板12與吸附板22的間隔,而能夠將閉模結束時的間隙δ設為最佳值。If a predetermined current is supplied to drive the movable mold thickness adjusting motor 71, the screw The female 73 is rotated by a predetermined amount with respect to the thread 43 to adjust the position of the rod 39 with respect to the suction plate 22. Therefore, the interval between the movable platen 12 and the suction plate 22 is adjusted, and the gap δ at the end of the mold closing can be set to an optimum value.
模厚調整用馬達71可以是伺服馬達,亦可包含檢測模厚調整用馬達71的輸出軸71a的旋轉量等之編碼部71b。根據編碼部71b的檢測結果回饋控制供給於模厚調整用馬達71之電流,以使可動壓板12與吸附板22的間隔成為目標值。The mold thickness adjustment motor 71 may be a servo motor or may include an encoder portion 71b that detects the amount of rotation of the output shaft 71a of the mold thickness adjustment motor 71. The current supplied to the mold thickness adjusting motor 71 is controlled by the feedback result of the encoding unit 71b so that the interval between the movable platen 12 and the suction plate 22 becomes a target value.
接著,根據第3圖對模厚調整部70的動作進行說明。模厚調整部70的動作是由控制裝置60的模厚調整處理部63所控制。Next, the operation of the mold thickness adjusting unit 70 will be described based on Fig. 3 . The operation of the mold thickness adjusting unit 70 is controlled by the mold thickness adjustment processing unit 63 of the control device 60.
若隨著更換模具裝置19,使新的可動模16安裝於可動壓板12,新的固定模15安裝於固定壓板11,則控制裝置60驅動線性馬達28來使吸附板22前進,直到間隙δ成為預定值(>0)為止。此時,控制裝置60的間隙監控部64例如根據來自位置感測器53的資訊來監控間隙δ。根據位置感測器53所檢測之線性馬達28的可動件31的位置來確定吸附板22的位置並確定間隙δ。當間隙δ成為預定值時,與吸附板22及可動壓板12一同前進之可動模16,是沒有與固定模15接觸。將可動模16與固定模15的接觸稱為“模具接觸”。When the new movable mold 16 is attached to the movable platen 12 as the mold unit 19 is replaced, and the new fixed mold 15 is attached to the fixed platen 11, the control unit 60 drives the linear motor 28 to advance the suction plate 22 until the gap δ becomes The predetermined value (>0). At this time, the gap monitoring unit 64 of the control device 60 monitors the gap δ based on, for example, information from the position sensor 53. The position of the suction plate 22 is determined based on the position of the movable member 31 of the linear motor 28 detected by the position sensor 53 and the gap δ is determined. When the gap δ becomes a predetermined value, the movable mold 16 that advances together with the suction plate 22 and the movable platen 12 is not in contact with the fixed mold 15. The contact of the movable mold 16 with the fixed mold 15 is referred to as "mold contact".
另外,為了使間隙δ在成為預定值之前不會產生模具接觸,模厚調整處理部63可在驅動線性馬達28之前驅動模厚調整部70來先將吸附板22與可動壓板12的間隔充 分縮窄。並且,當從開始驅動線性馬達28之後的經過時間已達到預定時間時而間隙δ未達到預定值的情況時,由於會產生模具接觸,因此模厚調整處理部63可驅動模厚調整部70來使吸附板22與可動壓板12的間隔縮窄。Further, in order to prevent the gap δ from coming into contact with the mold before the predetermined value is reached, the mold thickness adjustment processing portion 63 may drive the mold thickness adjusting portion 70 to charge the gap between the suction plate 22 and the movable platen 12 before driving the linear motor 28. The narrowing is narrow. Further, when the elapsed time from the start of driving the linear motor 28 has reached the predetermined time and the gap δ does not reach the predetermined value, since the mold contact occurs, the mold thickness adjustment processing portion 63 can drive the mold thickness adjusting portion 70. The interval between the suction plate 22 and the movable platen 12 is narrowed.
接著,在控制裝置60的移動限制部65限制吸附板22的後退之狀態下,模厚調整處理部63驅動模厚調整部70來使可動壓板12前進(參閱第3圖),使可動模16與固定模15接觸(參閱第1圖)。Then, in a state where the movement restricting portion 65 of the control device 60 restricts the retraction of the suction plate 22, the mold thickness adjustment processing portion 63 drives the mold thickness adjusting portion 70 to advance the movable platen 12 (see FIG. 3) to move the movable mold 16 It is in contact with the fixed mold 15 (refer to Fig. 1).
移動限制部65在模厚調整處理部63驅動模厚調整部70來擴大吸附板22與可動壓板12的間隔的期間,例如驅動線性馬達28來限制吸附板22的後退。從而,可動壓板12前進而進行模具接觸。於模具接觸時結束模厚調整。為了控制模具接觸後過量驅動模厚調整部70,控制裝置60亦可以具備檢測模具接觸之接觸檢測部66。When the mold thickness adjustment processing unit 63 drives the mold thickness adjustment unit 70 to increase the interval between the suction plate 22 and the movable platen 12, the movement restricting unit 65 drives the linear motor 28 to restrict the retraction of the suction plate 22, for example. Thereby, the movable platen 12 advances to make mold contact. The mold thickness adjustment is ended when the mold is in contact. In order to control the excessive driving of the mold thickness adjusting portion 70 after the mold is contacted, the control device 60 may further include a contact detecting portion 66 that detects the contact of the mold.
接觸檢測部66是藉由檢測有無因模具接觸而產生之反作用力、或者有無因模具接觸而產生之鎖模力,來檢測出有無模具接觸。The contact detecting unit 66 detects the presence or absence of the mold contact by detecting the presence or absence of a reaction force generated by the contact of the mold or the presence or absence of a mold clamping force due to the contact of the mold.
(1)若因模具接觸而產生反作用力,則用於限制吸附板22的後退之線性馬達28的驅動力上升。(2)若線性馬達28的驅動力達到上限值並弱於模厚調整部70的驅動力,則吸附板22後退。上述(1)~(2)是在模厚調整部70的驅動力高於線性馬達28的驅動力的情況下發生。(1) When a reaction force is generated by the contact of the mold, the driving force of the linear motor 28 for restricting the retreat of the suction plate 22 is increased. (2) When the driving force of the linear motor 28 reaches the upper limit and is weaker than the driving force of the mold thickness adjusting portion 70, the suction plate 22 moves backward. The above (1) to (2) occur when the driving force of the mold thickness adjusting portion 70 is higher than the driving force of the linear motor 28.
在上述(1)~(2)的情況下,接觸檢測部66也可 以根據線性馬達28的驅動力是否為預定值以上,來檢測有無因模具接觸而產生之反作用力。線性馬達28的驅動力例如與供給於線性馬達28的線圈35之電流的電流值成比例,因此能夠藉由電流感測器54檢測出。In the case of the above (1) to (2), the contact detecting unit 66 may also The presence or absence of a reaction force due to the contact of the mold is detected based on whether or not the driving force of the linear motor 28 is equal to or greater than a predetermined value. The driving force of the linear motor 28 is, for example, proportional to the current value of the current supplied to the coil 35 of the linear motor 28, and thus can be detected by the current sensor 54.
另外,在上述(2)的情況下,接觸檢測部66亦可根據吸附板22的位置是否從停止位置後退預定量以上來判斷有無因模具接觸而產生之反作用力。吸附板22的位置,由於是根據線性馬達28的可動件31的位置而確定,因此能夠藉由位置感測器53檢測出。Further, in the case of the above (2), the contact detecting unit 66 may determine whether or not there is a reaction force generated by the contact of the mold, depending on whether or not the position of the suction plate 22 is retracted by a predetermined amount or more from the stop position. Since the position of the suction plate 22 is determined based on the position of the movable member 31 of the linear motor 28, it can be detected by the position sensor 53.
(3)若因模具接觸而產生反作用力,則為了使可動壓板12前進,模厚調整部70的驅動力上升。上述(3)是模厚調整部70的驅動力在低於線性馬達28的驅動力的情況下發生。(3) When the reaction force is generated by the contact of the mold, the driving force of the mold thickness adjusting portion 70 is increased in order to advance the movable platen 12. The above (3) is caused when the driving force of the mold thickness adjusting portion 70 is lower than the driving force of the linear motor 28.
在上述(3)的情況下,接觸檢測部66亦可根據模厚調整部70的驅動力是否為預定值以上來檢測有無因模具接觸而產生之反作用力。模厚調整部70的驅動力,由於例如是與供給於模厚調整用馬達71的驅動用線圈之電流的電流值成比例,因此能夠藉由電流感測器56檢測出。In the case of the above-described (3), the contact detecting unit 66 can detect whether or not the reaction force generated by the contact of the mold is detected based on whether or not the driving force of the mold thickness adjusting unit 70 is equal to or greater than a predetermined value. The driving force of the mold thickness adjusting portion 70 is detected by the current sensor 56 because it is proportional to the current value of the current supplied to the driving coil of the mold thickness adjusting motor 71, for example.
(4)藉由模具接觸產生鎖模力。因此,接觸檢測部66亦可根據鎖模力是否為預定值以上來判斷有無模具接觸。鎖模力可藉由鎖模力感測器55檢測。(4) The clamping force is generated by the contact of the mold. Therefore, the contact detecting unit 66 can also determine whether or not the mold is in contact based on whether or not the clamping force is equal to or greater than a predetermined value. The clamping force can be detected by the clamping force sensor 55.
如此地,接觸檢測部66是根據來自位置感測器53、電流感測器54、電流感測器56或鎖模力感測器55的資訊,檢測出有無模具接觸,因此無需用以檢測有無模具接 觸之專用感測器。In this manner, the contact detecting unit 66 detects the presence or absence of the mold contact based on the information from the position sensor 53, the current sensor 54, the current sensor 56, or the clamping force sensor 55, so that it is not necessary to detect the presence or absence of the mold. Mold connection Touch the dedicated sensor.
在為了將間隙δ維持成預定值而藉由移動限制部65限制吸附板22的後退直至藉由接觸檢測部66檢測出模具接觸之狀態下,模厚調整處理部63驅動模厚調整部70。若藉由接觸檢測部66檢測出模具接觸,則解除模厚調整部70的驅動。The mold thickness adjustment processing unit 63 drives the mold thickness adjustment unit 70 in a state where the movement of the suction plate 22 is restricted by the movement restricting portion 65 until the mold contact is detected by the contact detecting portion 66 in order to maintain the gap δ at a predetermined value. When the contact of the mold is detected by the contact detecting unit 66, the driving of the mold thickness adjusting unit 70 is released.
以上,對本發明的實施形態進行了說明,但本發明不限於上述的實施形態,在不脫離本發明的範圍內,能夠對上述實施形態加以各種變形或置換。The embodiments of the present invention have been described above, but the present invention is not limited to the above-described embodiments, and various modifications and changes can be made to the above-described embodiments without departing from the scope of the invention.
例如,上述實施形式的移動限制部65,為了將間隙δ維持成預定值,驅動線性馬達28來限制吸附板22的後退,但亦可藉由制動器裝置的制動力限制吸附板22的後退。制動器裝置沒有特別限定,例如可以為相對於導引件Gd制動滑動底座Sb之裝置。如此,當藉由制動器裝置的制動力來限制吸附板22的後退時,有無接觸的檢測,是可以根據來自電流感測器56或鎖模力感測器55的資訊來進行。For example, the movement restricting portion 65 of the above-described embodiment drives the linear motor 28 to restrict the retraction of the suction plate 22 in order to maintain the gap δ at a predetermined value. However, the retraction of the suction plate 22 can be restricted by the braking force of the brake device. The brake device is not particularly limited, and may be, for example, a device that brakes the slide base Sb with respect to the guide Gd. Thus, when the retraction of the suction plate 22 is restricted by the braking force of the brake device, the presence or absence of contact detection can be performed based on information from the current sensor 56 or the clamping force sensor 55.
另外,若上述實施形式的控制裝置60被安裝新的模具裝置19,則驅動線性馬達28並進行使吸附板22前進至預定位置之控制,但該控制亦可以在臨時固定新的模具裝置19之狀態下進行。例如,該控制可在以藉由起重機等統一吊起可動模16及固定模15的狀態將模具裝置19臨時固定在固定壓板11之狀態下進行。然後,可動壓板12前進而與模具裝置19接觸,接著,模具裝置19被鎖 模。在鎖模狀態下,固定模15與可動模16分別由螺栓等正式固定在固定壓板11與可動壓板12上。另外,模具裝置19,亦可臨時固定於可動壓板12來代替固定於固定壓板11。Further, if the control device 60 of the above-described embodiment is mounted with the new mold device 19, the linear motor 28 is driven and the control for advancing the suction plate 22 to the predetermined position is performed, but the control can also temporarily fix the state of the new mold device 19. Go on. For example, this control can be performed in a state where the mold device 19 is temporarily fixed to the fixed platen 11 in a state where the movable mold 16 and the fixed mold 15 are uniformly lifted by a crane or the like. Then, the movable platen 12 is advanced to come into contact with the mold device 19, and then the mold device 19 is locked. mold. In the mold clamping state, the fixed mold 15 and the movable mold 16 are integrally fixed to the fixed pressure plate 11 and the movable pressure plate 12 by bolts or the like, respectively. Further, the mold device 19 may be temporarily fixed to the movable platen 12 instead of being fixed to the fixed platen 11.
另外,上述實施形態的接觸檢測部66雖是檢測可動模16與固定模15的接觸,但也可以只要檢測出透過可動模16及固定模15之可動壓板12與固定壓板11的接觸即可。例如在將模具裝置19臨時固定在固定壓板11時,接觸檢測部66檢測出可動壓板12與可動模16的接觸即可。另外,在將模具裝置19臨時固定在可動壓板12時,接觸檢測部66檢測出固定模15與固定壓板11的接觸即可。在任何情況下,都藉由接觸產生反作用力或鎖模力,因此接觸檢測部66能夠根據來自位置感測器53等的資訊檢測出有無接觸。Further, although the contact detecting unit 66 of the above-described embodiment detects the contact between the movable mold 16 and the fixed mold 15, the contact between the movable platen 12 that has passed through the movable mold 16 and the fixed mold 15 and the fixed platen 11 may be detected. For example, when the mold device 19 is temporarily fixed to the fixed platen 11, the contact detecting portion 66 may detect the contact between the movable platen 12 and the movable mold 16. Further, when the mold device 19 is temporarily fixed to the movable platen 12, the contact detecting portion 66 may detect the contact between the fixed die 15 and the fixed platen 11. In any case, a reaction force or a clamping force is generated by the contact, and therefore the contact detecting portion 66 can detect the presence or absence of contact based on information from the position sensor 53 or the like.
另外,上述實施形態的模厚調整,雖是藉由控制裝置60自動進行,但亦可手動進行。Further, although the mold thickness adjustment of the above embodiment is automatically performed by the control device 60, it may be manually performed.
另外,在上述實施形態中,在後壓板13與吸附板22之間形成預定間隙δ來限制吸附板22的後退之狀態下,驅動模厚調整部70來使可動壓板12前進,透過模具裝置19與固定壓板11接觸,藉此進行模厚調整,但亦可利用其他方法進行模厚調整。例如,可檢測驅動線性馬達28來使可動壓板12前進並透過模具裝置19與固定壓板11接觸時的間隙,因應檢測值與目標值之差異來驅動模厚調整部70,藉此進行模厚調整。當檢測值小於目標值時, 為了擴大間隙,可驅動模厚調整部70來擴大可動壓板12與吸附板22的間隔。擴大間隔之量,亦可以是與檢測值與目標值之差的絕對值大致相同。另外,當檢測值大於目標值時,為了縮小間隙,可驅動模厚調整部70來縮小可動壓板12與吸附板22的間隔。縮小間隔之量,亦可與檢測值與目標值之差的絕對值大致相同。接觸的檢測或間隙的檢測等,是由與上述實施形態相同的結構所進行。例如,接觸的檢測,是由接觸檢測部66進行,間隙的檢測,是由間隙監控部64進行,模厚調整部70的控制是由模厚調整處理部63進行。目標值是使用預先藉由試驗等所確定,而被記錄於記憶體等記錄媒體者。Further, in the above-described embodiment, a predetermined gap δ is formed between the rear platen 13 and the suction plate 22 to restrict the retraction of the suction plate 22, and the mold thickness adjusting portion 70 is driven to advance the movable platen 12 to pass through the mold device 19. The mold thickness adjustment is performed by contacting the fixed platen 11, but the mold thickness adjustment may be performed by other methods. For example, the linear motor 28 can be detected to advance the movable platen 12 and pass through the gap when the mold device 19 comes into contact with the fixed platen 11, and the die thickness adjustment portion 70 is driven in response to the difference between the detected value and the target value, thereby performing the mold thickness adjustment. . When the detected value is less than the target value, In order to enlarge the gap, the mold thickness adjusting portion 70 can be driven to enlarge the interval between the movable platen 12 and the suction plate 22. The amount of the interval may be increased to be substantially the same as the absolute value of the difference between the detected value and the target value. Further, when the detected value is larger than the target value, in order to reduce the gap, the mold thickness adjusting portion 70 may be driven to reduce the interval between the movable platen 12 and the suction plate 22. The amount of the interval is reduced, and may be substantially the same as the absolute value of the difference between the detected value and the target value. The detection of the contact, the detection of the gap, and the like are performed by the same configuration as that of the above embodiment. For example, the detection of the contact is performed by the contact detecting unit 66, and the detection of the gap is performed by the gap monitoring unit 64, and the control of the mold thickness adjusting unit 70 is performed by the mold thickness adjustment processing unit 63. The target value is recorded on a recording medium such as a memory by using a test or the like in advance.
10‧‧‧鎖模裝置10‧‧‧Clamping device
11‧‧‧固定壓板(第1固定構件)11‧‧‧Fixed platen (1st fixing member)
12‧‧‧可動壓板(第1可動構件)12‧‧‧ movable platen (1st movable member)
13‧‧‧後壓板(第2固定構件)13‧‧‧ Rear platen (2nd fixing member)
15‧‧‧固定模15‧‧‧Fixed mode
16‧‧‧可動模16‧‧‧ movable mold
22‧‧‧吸附板(第2可動構件)22‧‧‧Adsorption plate (2nd movable member)
39‧‧‧桿39‧‧‧ pole
48‧‧‧線圈48‧‧‧ coil
49‧‧‧電磁鐵49‧‧‧Electromagnet
53‧‧‧位置感測器53‧‧‧ position sensor
54‧‧‧電磁鐵用電流感測器54‧‧‧Electromagnetic current sensor
55‧‧‧鎖模力感測器55‧‧‧Clamping force sensor
56‧‧‧模厚調整部用電流感測器56‧‧• Current sensor for the thickness adjustment unit
60‧‧‧控制裝置60‧‧‧Control device
61‧‧‧模開閉處理部61‧‧‧Mold opening and closing processing department
62‧‧‧鎖模處理部62‧‧‧Clocking Processing Department
63‧‧‧模厚調整處理部63‧‧‧Mold thickness adjustment processing department
64‧‧‧間隙監控部64‧‧‧Gap Monitoring Department
65‧‧‧移動限制部65‧‧‧Mobile Restriction Department
66‧‧‧接觸檢測部66‧‧‧Contact Detection Department
70‧‧‧模厚調整部70‧‧‧Mold thickness adjustment department
第1圖係表示本發明的基於一實施形態之射出成形機閉模時的狀態之圖。Fig. 1 is a view showing a state in which the injection molding machine according to the embodiment of the present invention is closed.
第2圖係表示本發明的基於一實施形態之射出成形機開模時的狀態之圖。Fig. 2 is a view showing a state at the time of mold opening of the injection molding machine according to the embodiment of the present invention.
第3圖係表示本發明的基於一實施形式之射出成形機的模厚調整的說明圖。Fig. 3 is an explanatory view showing the adjustment of the mold thickness of the injection molding machine according to the embodiment of the present invention.
10‧‧‧鎖模裝置10‧‧‧Clamping device
11‧‧‧固定壓板(第1固定構件)11‧‧‧Fixed platen (1st fixing member)
12‧‧‧可動壓板(第1可動構件)12‧‧‧ movable platen (1st movable member)
13‧‧‧後壓板(第2固定構件)13‧‧‧ Rear platen (2nd fixing member)
13a‧‧‧腳部13a‧‧‧foot
14‧‧‧連接桿14‧‧‧ Connecting rod
15‧‧‧固定模15‧‧‧Fixed mode
16‧‧‧可動模16‧‧‧ movable mold
17‧‧‧射出裝置17‧‧‧Injection device
18‧‧‧射出噴嘴18‧‧‧Injection nozzle
19‧‧‧模具裝置19‧‧‧Molding device
22‧‧‧吸附板(第2可動構件)22‧‧‧Adsorption plate (2nd movable member)
27‧‧‧安裝板27‧‧‧Installation board
28‧‧‧線性馬達28‧‧‧Linear motor
29‧‧‧定子29‧‧‧ Stator
31‧‧‧可動件31‧‧‧ movable parts
33‧‧‧磁極齒33‧‧‧Magnetic teeth
34、46‧‧‧磁芯34, 46‧‧‧ magnetic core
35、48‧‧‧線圈35, 48‧‧‧ coil
37‧‧‧電磁鐵單元37‧‧‧Electromagnetic unit
39‧‧‧桿39‧‧‧ pole
41‧‧‧桿孔41‧‧‧ rod holes
43‧‧‧螺紋43‧‧‧Thread
45‧‧‧槽45‧‧‧ slots
47‧‧‧磁軛47‧‧‧Y yoke
49‧‧‧電磁鐵49‧‧‧Electromagnet
51‧‧‧吸附部51‧‧‧Adsorption Department
53‧‧‧位置感測器53‧‧‧ position sensor
54‧‧‧電磁鐵用電流感測器54‧‧‧Electromagnetic current sensor
55‧‧‧鎖模力感測器55‧‧‧Clamping force sensor
56‧‧‧模厚調整部用電流感測器56‧‧• Current sensor for the thickness adjustment unit
60‧‧‧控制裝置60‧‧‧Control device
61‧‧‧模開閉處理部61‧‧‧Mold opening and closing processing department
62‧‧‧鎖模處理部62‧‧‧Clocking Processing Department
63‧‧‧模厚調整處理部63‧‧‧Mold thickness adjustment processing department
64‧‧‧間隙監控部64‧‧‧Gap Monitoring Department
65‧‧‧移動限制部65‧‧‧Mobile Restriction Department
66‧‧‧接觸檢測部66‧‧‧Contact Detection Department
70‧‧‧模厚調整部70‧‧‧Mold thickness adjustment department
71‧‧‧模厚調整用馬達71‧‧‧Mould thickness adjustment motor
71a‧‧‧輸出軸71a‧‧‧ Output shaft
71b‧‧‧編碼部71b‧‧‧ coding department
72‧‧‧齒輪72‧‧‧ Gears
73、n1‧‧‧螺母73, n1‧‧‧ nuts
Ba‧‧‧位置調整底座Ba‧‧‧ Position adjustment base
Bb‧‧‧可動底座Bb‧‧‧ movable base
Fr‧‧‧框架Fr‧‧ frame
Gd‧‧‧導引件Gd‧‧‧Guide
Sb‧‧‧滑動底座Sb‧‧‧ sliding base
δ‧‧‧間隙Δ‧‧‧ gap
Claims (7)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011232292A JP5774441B2 (en) | 2011-10-21 | 2011-10-21 | Injection molding machine and mold thickness adjusting method for injection molding machine |
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| Publication Number | Publication Date |
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| TW201321162A TW201321162A (en) | 2013-06-01 |
| TWI492832B true TWI492832B (en) | 2015-07-21 |
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| TW101124784A TWI492832B (en) | 2011-10-21 | 2012-07-10 | Injection Molding Machine and Injection Molding Machine |
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| JP (1) | JP5774441B2 (en) |
| KR (1) | KR101330041B1 (en) |
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| TW (1) | TWI492832B (en) |
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| JP6000891B2 (en) * | 2013-03-29 | 2016-10-05 | 住友重機械工業株式会社 | Injection molding machine |
| JP6187869B2 (en) * | 2013-11-22 | 2017-08-30 | 新東工業株式会社 | Device for detecting the amount of movement of a moving member in a mold making apparatus |
| JP6144212B2 (en) * | 2014-01-17 | 2017-06-07 | 住友重機械工業株式会社 | Injection molding machine and injection molding method |
| KR20250059003A (en) | 2023-10-24 | 2025-05-02 | 한국항공우주연구원 | Apparatus and method for providing uniform temperature distribution for precise measurement |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200600313A (en) * | 2004-03-19 | 2006-01-01 | Sumitomo Heavy Industries | Mold clamping device and mold thickness adjusting method |
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| JPS5973228A (en) * | 1982-10-20 | 1984-04-25 | Mitsubishi Electric Corp | Machining electric condition set/display unit of electric discharge machining device |
| JPH05237893A (en) * | 1992-03-02 | 1993-09-17 | Toshiba Mach Co Ltd | Mold clamping device of injection molding machine |
| JP2550420Y2 (en) * | 1992-01-30 | 1997-10-15 | 東芝機械株式会社 | Mold clamping device of injection molding machine |
| JP4021815B2 (en) * | 2003-07-10 | 2007-12-12 | 住友重機械工業株式会社 | Clamping device |
| WO2008143277A1 (en) * | 2007-05-21 | 2008-11-27 | Sumitomo Heavy Industries, Ltd. | Mold clamping device and mold clamping device control method |
| DE112008002284T5 (en) * | 2007-08-28 | 2010-07-22 | Sumitomo Heavy Industries, Ltd. | Mold clamping device and mold closing control method |
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2011
- 2011-10-21 JP JP2011232292A patent/JP5774441B2/en not_active Expired - Fee Related
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2012
- 2012-07-10 TW TW101124784A patent/TWI492832B/en not_active IP Right Cessation
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200600313A (en) * | 2004-03-19 | 2006-01-01 | Sumitomo Heavy Industries | Mold clamping device and mold thickness adjusting method |
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|---|---|
| KR101330041B1 (en) | 2013-11-15 |
| JP5774441B2 (en) | 2015-09-09 |
| TW201321162A (en) | 2013-06-01 |
| CN103057063A (en) | 2013-04-24 |
| CN103057063B (en) | 2015-01-28 |
| KR20130044174A (en) | 2013-05-02 |
| JP2013086488A (en) | 2013-05-13 |
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