TWI497058B - Detecting system for chip-acquisition procedure and method thereof - Google Patents

Description

Detection system and method for residual wafer after extraction

The present invention relates to a detection system and method thereof, and more particularly to a detection system for a residual wafer after pick-up and a method thereof for detecting whether a residual wafer after the capture has an error condition.

In a semiconductor process, each wafer needs to be processed through dozens or even hundreds of process steps, each of which includes a plurality of circuit regions on the completed wafer; and then the entire completed wafer is moved to have A viscous film, and the film is held by a frame to form a carrier. When the film is stretched to the outside, the adhered circuit regions are separated from each other following the cutting grooves on the wafer such that the circuit regions form a plurality of chips, at which time the wafers formed on the carrier are formed. Not yet classified.

Basically, before or after the wafer is cut, a series of electrical detection steps can be performed on the circuit regions or the wafers by using the detector, and the detection results of the wafers and the corresponding detection results on the carrier tray can be used. The location is stored in a wafer map file. Then, the carrier tray to which the wafer is attached is transferred to a sorter, and the respective wafers are sorted according to the detection data recorded in the wafer pattern to select the electrical specifications in the wafer (ie, no Defective) of a single wafer, but does not meet the electrical specifications (ie, defective) crystal The sheet will continue to adhere to the film without being picked from the carrier, repeating the sorting steps of picking up the defect free wafer/retaining the defective wafer until the sorting process of the wafer is completed.

However, since the film may be offset at the placement position of the sorter due to the degree of distraction, for example, in the same wafer, the position of the sorter is inconsistent with the position information stored in the wafer file, This causes the sorter to fail to properly pick up a defect-free wafer from the wafer, such as misidentifying a defective wafer into a defect-free wafer. In particular, as the size of the wafer becomes smaller and smaller, the sorter locates all of the wafers on the carrier with only a few of the wafer locations at the carrier as reference points, relative to tens of thousands of wafers on the wafer. In this case, it is not easy to properly position each wafer. For example, when the film is offset on the sorter, if there is a wafer position deviation, the position of the adjacent wafer and/or the same row or the same row of wafers may be misjudged, so that the sorter The defect-free wafer cannot be accurately picked up, causing the defective wafer to be picked up and leaving the defect-free wafer on the film.

Even the defective wafer is subjected to subsequent processing steps (for example, a packaging process), resulting in an increase in production cost, and further shipment of the fabricated defective wafer to a downstream customer, causing loss to the customer and affecting the reputation of the wafer manufacturer. Although the prior art manually selects the remaining wafers on the film according to the wafer pattern ratio to confirm whether the defective wafer is mistaken as a defect-free wafer, this method is quite time consuming, and the wafer is The size is getting smaller and smaller, and the human eye is easy to misjudge. Therefore, there is a need to develop a new type of detection system to solve the problem of excessive production cost in the above semiconductor process.

An object of the present invention is to provide a detection system for a residual wafer after picking, which is stably supported by a support unit and accurately positions the carrier unit to avoid the bearing The wafer on the cell is offset to improve the accuracy of the detection of the residual wafer after the capture.

Another object of the present invention is to provide a detection system for a residual wafer after film removal, by comparing a residual wafer position projection image and a residual wafer coordinate value by a comparison unit to determine whether each residual wafer position projection image corresponds to Each residual wafer coordinate value, when at least one residual wafer position projection image does not correspond to at least one residual wafer coordinate value, indicates that the wafer capture error occurs, that is, the wafer corresponding to the wafer position projection image should be stopped for subsequent operation. Process to avoid the production costs of this subsequent process.

In order to achieve the above object, a preferred embodiment of the present invention provides a detection system for a residual wafer after picking, for detecting a corresponding relationship between a plurality of wafers and a plurality of wafer coordinate values, and a detection system for the residual wafer after the extraction The method includes: a body; a carrying unit having a plurality of carrying positions, wherein a part of the carrying positions correspond to the wafers, and the other portions of the carrying positions do not carry the wafers, wherein the wafers are disposed The bearing positions of the part are opaque, and the carrying positions of the other part are in a light transmitting state; a supporting unit is disposed on the body for supporting the carrying unit, so that The supporting unit is positioned on the main body; a cover assembly pivotally connecting the supporting unit to cover the supporting unit on the supporting unit, so that the carrying unit is interposed between the supporting unit and the supporting unit Between the units; a light source disposed in the cover assembly for generating a light to illuminate the carrying unit such that the light penetrates the carrying positions of the other portion to Projecting a plurality of the carrying positions of the portion and the carrying positions of the other portion to form a plurality of wafer position projection images; an image capturing unit disposed in the body for capturing the wafer position projections And a comparison unit coupled to the image capturing unit for receiving the wafer position projection images and comparing the wafer position projection images and the wafer coordinate values to determine each of the wafer positions Whether the projected image corresponds to each of the wafer coordinate values.

Another preferred embodiment of the present invention provides a method for detecting a residual wafer after being taken, which is applicable to a detection system including a body, a carrying unit, a supporting unit, a cover assembly, a light source, and a a reflection unit, an image capture unit, a comparison unit, and a display device for detecting a corresponding relationship between the plurality of wafers and the plurality of wafer coordinate values, the detection method comprising the following steps: (a) the support unit Supporting the carrying unit, so that the supporting unit positions the carrying unit on the body, wherein the carrying unit is provided with a plurality of carrying positions, and a part of the carrying positions correspondingly carry the chips, and the other parts of the carrying units Positioning the wafers; (b) the cover assembly covers the carrier unit on the support unit such that the carrier unit is interposed between the cover assembly and the support unit; (c) the light source generates a Light illuminating the carrying unit such that the light penetrates the carrying positions of the other portion to project the portion of the carrying position and the other portion The carrying positions are on the reflective unit to form a plurality of wafer position projection images; (d) the image capturing unit captures the wafer position projection images; (e) the comparing unit receives the wafer position projection images; (f) The comparing unit compares the wafer position projection images with the wafer coordinate values to determine whether each of the wafer position projection images corresponds to each of the wafer coordinate values.

The detection system of the residual wafer after the drawing of the present invention is stably supported by the supporting unit and accurately positions the carrying unit to avoid wafer deviation on the carrying unit. And comparing the residual wafer position projection image and the residual wafer coordinate value to determine whether each residual wafer position projection image corresponds to each residual wafer coordinate value, and when at least one residual wafer position projection image does not correspond to at least one residual wafer coordinate When the value indicates that the wafer capture error occurs, the wafer corresponding to the wafer position projection image should be stopped for subsequent processing to avoid the subsequent processing. Cheng's production costs.

10‧‧‧Detection system for residual wafer after extraction

100‧‧‧ body

200‧‧‧bearing unit

202‧‧‧film

204‧‧‧ Carrying position

206‧‧‧Frame

208‧‧‧ notch

210‧‧‧ first side

212‧‧‧Second side

214‧‧‧ wafer

216‧‧‧ wafer

300‧‧‧Support unit

302‧‧‧Support board

304‧‧‧First opening

306‧‧‧Second opening

308‧‧‧First Positioning Department

310‧‧‧ film ring

312‧‧‧Adjustment Department

314‧‧‧First direction

400‧‧‧Cover assembly

402‧‧‧ Cover

404‧‧‧Box ring

406‧‧‧Second Positioning Department

408‧‧‧ concave area

500‧‧‧Light source

502‧‧‧Light

504‧‧‧ wafer position projection image

600‧‧‧Image capture unit

700‧‧‧Comparative unit

800‧‧‧ display device

900‧‧‧Reflective unit

S600~S616‧‧‧Steps

1 is a perspective view showing a detection system for a residual wafer after being taken in accordance with an embodiment of the present invention.

2 is a partial perspective view showing a detection system for a residual wafer after being taken in accordance with an embodiment of the present invention.

Figure 3 is a top view of the carrier unit and its bearing position corresponding to the coordinate data in accordance with an embodiment of the present invention.

FIG. 4A is a plan view showing the supporting unit supporting the carrying unit according to an embodiment of the invention.

FIG. 4B is a bottom view showing the supporting unit supporting the carrying unit according to an embodiment of the invention.

Figure 4C is a cross-sectional view taken along line A-A' of Figure 4B of the present invention.

Figure 5 is a partial elevational view of the optical path assembly of the detection system for residual wafers after picking up in accordance with an embodiment of the present invention.

FIG. 6 is a flow chart showing a method for detecting a residual wafer after being taken in accordance with an embodiment of the present invention.

Referring to FIG. 1-2, FIG. 1 is a perspective view showing a detecting system 10 for removing a residual wafer according to an embodiment of the present invention, and FIG. 2 is a view showing a residual wafer after being taken in accordance with an embodiment of the present invention. A partial side view of the detection system 10. The detection system 10 of the residual wafer after the extraction The main body 100, the carrying unit 200, the supporting unit 300, the cover assembly 400, the light source 500, the image capturing unit 600, the comparing unit 700, the display device 800, and the reflecting unit 900 are included.

The detecting system 10 for the residual wafer after the drawing of the present invention is used for detecting the corresponding relationship between the plurality of wafers 216 and the plurality of wafer coordinate values, which is stably supported by the supporting unit 300 and accurately positions the carrying unit 200 to avoid The wafer 216 on the carrier unit 200 is offset to improve the accuracy of the detection of the residual wafer after the capture. Further, the comparison unit 700 compares the wafer position projection images and the wafer coordinate values to determine whether each of the wafer position projection images corresponds to each of the wafer coordinate values to avoid the subsequent process. Production costs.

As shown in FIG. 1-2, the body 100 is configured to accommodate the support unit 300, the image capturing unit 600, the comparing unit 700, and the reflecting unit 900. The supporting unit 300 is disposed on a platform 102 of the body 100, so that the supporting unit 300 supports the carrying unit 200, wherein the carrying unit 200 is configured to carry a wafer 214 composed of a plurality of wafers 216. The image capturing unit 600 is disposed corresponding to the reflecting unit 900. The comparison unit 700 is coupled to the image capturing unit 600. The reflection unit 900 is disposed corresponding to the other side of the support unit 300.

In the first to fourth embodiments, the cover assembly 400 pivotally connects the support unit 300 so that the cover assembly 400 can cover the support unit 300 to press the wafer onto the support unit 300, and the load unit The cover plate assembly 400 is disposed between the cover plate assembly 400 and the support unit 300, or the cover plate assembly 400 is split by the support unit 300. The light source 500 is disposed within the cover assembly 400 to be disposed corresponding to the carrying unit 200. The display device 800 is disposed on the body 100 and coupled to the comparison unit 700.

Referring to Figures 1-3, Figure 3 is a top view of the carrier unit 200 and its carrying position 204 corresponding to the coordinate data in accordance with an embodiment of the present invention. The carrying unit 200 includes a film 202 and a frame 206 connecting the film 202, the film 202 is disposed between the cover plate assembly 400 and the support unit 300. In one embodiment, the film 202 is attached to the inner periphery of the frame 206 such that the inner periphery of the frame 206 supports the film 202 such that the wafer on the film 202 is accurately positioned without deviation.

Specifically, as shown in FIGS. 1-3, the film 202 has a plurality of load-bearing locations 204. A portion of the load-bearing locations 204 correspondingly carry the wafers 216, and another portion of the load-bearing locations 204 does not carry the wafers 216. The portion of the carrier 204 in which the portions of the wafers 216 are disposed is opaque, and the portion 204 of the other portion is in a light transmitting state. In other words, there is a loading location 204 of the wafer 216 that does not allow light to pass through, such that the reflective unit 900 forms a projection of a dark area, each dark area indicating that a wafer is present at a load bearing location 204 to block light; The load bearing position 204 of 216 allows light to pass through so that the reflective unit 900 forms a projection of a bright area, each bright area indicating that there is no wafer present at a load bearing location 204 without blocking light.

As shown in FIGS. 1-3, the frame 206 is disposed between the cover assembly 400 and the support unit 300. The frame 206 connects the film 202 to fix the film 202. The outer periphery of the frame 206 has a plurality of notches 208, a first side 210 of the opposite sides of the notches 208, and at least a second side 212 adjacent to the first side 210 for positioning the The carrying unit 200 is on the supporting unit. Here, two opposing second side edges 212 are depicted, but are not limited thereto, such as one or more second side edges 212.

Referring to FIGS. 1-3 and 4A-4C, FIG. 4A is a plan view showing the supporting unit 200 supporting the carrying unit 200 according to an embodiment of the present invention, and FIG. 4B is a supporting unit according to an embodiment of the present invention. 300 supports the bottom view of the carrying unit 200, and FIG. 4C shows the basis A cross-sectional view taken along line A-A' in Fig. 4A of the present invention. The supporting unit 300 is fixed on the platform 102 of the body 100 for supporting the carrying unit 200 and positioning the carrying unit 200 on the body 100. The support unit 300 includes a support plate 302 , a plurality of first positioning portions 308 , a diaphragm ring 310 , and an adjustment portion 312 .

The support plate 302 is fixed to the body 100 and has a first opening 304 and at least one second opening 306 disposed around the first opening 304. The support plate 302 is used to support the frame 206. The first opening 304 passes through the film ring 310, and the second openings 306 pass through the adjusting portions 312.

The plurality of first positioning portions 308 are disposed on the support plate 302 and located around the first opening 304 for positioning the carrying unit 200. In an embodiment, the first positioning portion 308 is configured to accurately engage the recess 208, the first side 210 and the second side 212 of the outer periphery of the frame 206 to accurately position the carrying unit 200. On the support plate 302 of the support unit 300.

The film ring 310 passes through the first opening 304 for contacting the film 202 such that the upper circumference of the film ring 310 supports the film 202. Specifically, the film ring 310 includes a plurality of adjusting portions 312 correspondingly passing through the second openings 306 for adjusting the film ring 310 to protrude from the supporting plate 302 by a predetermined height. The ring 310 moves along the first direction 314 in the first opening 304 of the support plate 302, that is, the adjusting portion 312 passes through the second opening 306 to adjust the support ring 310 to the support. The amount of movement of the first opening 304 of the plate 302 to control the degree of slack or tension of the film 202 causes the wafer 216 to not deviate from the wafer coordinate values.

Continuing to refer to the first 1-2, the cover assembly 400 includes a cover 402 and a frame ring 404. The frame ring 404 is attached to the cover 402. The frame ring 404 has a plurality of second positioning portions 406. The second positioning portion 406 is pressed against the frame 206 of the carrying unit 200 to fix the carrying unit 200 on the supporting unit 300. In an embodiment, a concave portion 408 is disposed in the cover 402 of the inner periphery of the frame ring 404, and the concave portion 408 is used for inserting the film 202 supported by the film ring 310 of the supporting unit 300. The support unit 300 can tightly fix the wafer 216 on the carrier unit 200. In other words, the support unit 300 stably supports and accurately positions the carrier unit 200 to prevent the wafer 216 on the carrier unit 200 from being deviated to improve the accuracy of the detection of the residual wafer after the capture.

Referring to Figures 1-2 and 5, Figure 5 is a partial elevational view of the optical path assembly of the detection system 10 for residual wafers after picking up in accordance with an embodiment of the present invention. The light source 500 is disposed in the cover assembly 400 for generating a light 502 to illuminate the carrying unit 200 such that the light 502 penetrates the carrying positions of the other portion to project the portion The load bearing locations and the other load bearing locations of the other portion are formed to form a plurality of wafer position projected images 504.

As shown in FIG. 1-2 and FIG. 5 , the image capturing unit 600 is disposed in the body 100 for capturing the wafer position projection images 504 . In an embodiment, the orientation of the image capturing unit 600 can be adjusted to be suitable for capturing the wafer position projected image 504 of the reflective unit 900.

In the first and fifth embodiments, the comparison unit 700 is coupled to the image capturing unit 600 for receiving the wafer position projection images 504 and comparing the wafer position projection images 504 with the wafer coordinate values. To determine whether each of the wafer position projection images 504 corresponds to each of the wafer coordinate values. In one embodiment, the wafer coordinate values are, for example, stored in a memory (not shown) of the detection system 10. Specifically, the comparing unit 700 of the present invention compares the wafer position projection images with the wafer coordinate values to determine each of the wafer position projection images. Corresponding to each of the wafer coordinate values, when each of the wafer position projection images does not correspond to each of the wafer coordinate values, the wafer 214 corresponding to the wafer position projection image is stopped for subsequent processing, To avoid the production costs of this subsequent process.

As shown in FIG. 1-2 and FIG. 5, the reflection unit 900 is disposed on the body 100 for reflecting the wafer position projection image to the image capturing unit 600. In one embodiment, the reflective unit 900 is synchronously aligned with the carrying unit 200, the supporting unit 300, and the cover assembly 400 for accurately reflecting the wafer position projection image to the image capturing unit 600. The function of the reflecting unit 900 is to directly reflect the light 502 to the image capturing unit 600 for capturing, so as to shorten the path of light transmission, and effectively reduce the volume of the body 100. Moreover, the orientation of the reflective unit 900 can be adjusted to accommodate reflection of the wafer position projected image 504 from the carrier unit 200.

As shown in FIG. 1-2, the display device 800 is disposed on the body 100 for displaying a corresponding overlapping image between the wafer position projection image 504 and the wafer coordinate values for the user to view from the screen. Determining whether each of the wafer position projection images corresponds to each of the wafer coordinate values.

In accordance with the above, and more importantly, the detection system 10 of the present invention utilizes the light source 500 to illuminate each wafer 216 on the wafer 214 to form a projected image 504 for each wafer position, i.e., whether or not the wafer 216 is present at the load location, each load. The state of the position produces a projection to form a global projection, so when the support unit 300 and the cover assembly 400 are accurately positioned and the carrier unit 200 is fixed therebetween, the comparison unit 700 can correctly receive the wafer position projection. The image 504 determines whether each of the wafer position projection images corresponds to each of the wafer coordinate values to determine whether to perform the subsequent process.

Referring to Figures 1-5 and Figure 6, Figure 6 illustrates an embodiment of the present invention. A flow chart of a method for detecting a residual wafer after skimming. The detection method of the residual wafer after the extraction is applied to a detection system 10, the detection system 10 includes a body 100, a carrying unit 200, a supporting unit 300, a cover assembly 400, a light source 500, and a reflecting unit 900. An image capturing unit 600, a comparing unit 700, and a display device 800 for detecting a corresponding relationship between the plurality of wafers 216 and a plurality of wafer coordinate values, the detecting method comprising the following steps:

In the step S600, the supporting unit 300 supports the carrying unit 200, so that the supporting unit 300 positions the carrying unit 200 on the body 100, wherein the carrying unit 200 is provided with a plurality of carrying positions, and a part of the carrying units The locations correspond to the wafers 216, and the other locations of the locations do not carry the wafers 216. In one embodiment, the load locations of the portions of the wafers 216 are opaque, and the load locations of the other portions are light transmissive.

In step S602, the amount of movement of the support unit 300 relative to the carrying unit 200 is adjusted to support the carrying unit 200.

In step S604, the cover assembly covers the supporting unit 200 on the supporting unit 300 such that the carrying unit 200 is interposed between the cover assembly 400 and the supporting unit 300.

In step S606, the light source 500 generates a light ray 502 to illuminate the carrying unit 200, so that the light ray 502 penetrates the carrying positions of the other portion to project the part of the carrying positions and The other portions of the carrying locations are on the reflective unit 900 to form a plurality of wafer position projected images 504.

In step S608, the wafer position projection image 504 is reflected by the reflection unit 900 to the image capturing unit 600.

In step S610, the image capturing unit 600 captures the wafer position projections. Image 504.

In step S612, the comparison unit 700 receives the wafer position projection images 504.

In step S614, the comparing unit 700 compares the wafer position projection images 504 with the wafer coordinate values to determine whether each of the wafer position projection images 504 corresponds to each of the wafer coordinate values. In the first and fifth embodiments, the comparison unit 700 is coupled to the image capturing unit 600 for receiving the wafer position projection images 504 and comparing the wafer position projection images 504 with the wafer coordinate values. To determine whether each of the wafer position projection images 504 corresponds to each of the wafer coordinate values. In one embodiment, the wafer coordinate values are, for example, stored in a memory (not shown) of the detection system 10. Specifically, the comparing unit 700 of the present invention compares the wafer position projection images with the wafer coordinate values to determine whether each of the wafer position projection images corresponds to each of the wafer coordinate values, and each of the When the wafer position projection images are not corresponding to each of the wafer coordinate values, the wafer 214 corresponding to the wafer position projection image is stopped for subsequent processing to avoid the production cost of the subsequent process.

In step S616, the display device 800 displays the corresponding positions between the wafer position projection images 504 and the wafer coordinate values.

In summary, the detection system of the residual wafer after the drawing of the present invention is stably supported by the supporting unit and accurately positions the carrying unit to avoid wafer deviation on the carrying unit, so as to improve the detection of the residual wafer after the drawing. The correctness. And comparing the residual wafer position projection image and the residual wafer coordinate value by a comparing unit to determine whether each residual wafer position projection image corresponds to each residual wafer coordinate value, and when at least one residual wafer position projection image does not correspond to At least one residual wafer coordinate value, indicating that the wafer capture error occurs, that is, should stop The wafer position projects the wafer corresponding to the image for subsequent processing to avoid the production cost of the subsequent process.

While the invention has been described above in terms of the preferred embodiments, the invention is not intended to limit the invention, and the invention may be practiced without departing from the spirit and scope of the invention. The scope of protection of the present invention is therefore defined by the scope of the appended claims.

10‧‧‧Detection system for residual wafer after extraction

100‧‧‧ body

102‧‧‧ platform

200‧‧‧bearing unit

202‧‧‧film

206‧‧‧Frame

214‧‧‧ wafer

216‧‧‧ wafer

300‧‧‧Support unit

308‧‧‧First Positioning Department

312‧‧‧Adjustment Department

400‧‧‧Cover assembly

402‧‧‧ Cover

404‧‧‧Box ring

406‧‧‧Second Positioning Department

408‧‧‧ concave area

500‧‧‧Light source

700‧‧‧Comparative unit

800‧‧‧ display device

Claims (14)

A detection system for the residual wafer after the pick-up, for detecting a corresponding relationship between the plurality of wafers and the plurality of wafer coordinate values, the detection system of the residual wafer after the extraction comprises: a body; a carrier unit having a plurality of bearing positions and a film in which a portion of the carrying positions correspond to the wafers, and the other portions of the carrying positions do not carry the wafers, wherein the carrying positions of the portions of the wafers are In the opaque state, the other part of the carrying position is in a light transmitting state; a supporting unit is disposed on the body for supporting the carrying unit, so that the supporting unit positions the carrying unit on the body a cover assembly pivotally connecting the support unit to cover the support unit on the support unit such that the load bearing unit is interposed between the cover assembly and the support unit, wherein the cover assembly is provided with a cover unit a concave area for inserting the film of the supporting unit to fix the carrying positions; a light source disposed in the cover assembly for generating a light to illuminate the carrying list Passing the light through the bearing positions of the other portion to form a plurality of wafer position projection images by projecting the portions of the bearing positions and the other portions of the bearing positions; an image defect a unit is disposed in the body for capturing the image of the wafer position projection; and a comparison unit coupled to the image capturing unit for receiving the image of the wafer position projection and comparing the projections of the wafer positions The image and the wafer coordinate values are used to determine whether each of the wafer position projection images corresponds to each of the wafer coordinate values. A detection system for a residual wafer after extraction as described in claim 1 of the patent application, wherein The carrying unit includes: the film disposed between the cover plate assembly and the supporting unit, the film having the carrying positions; and a frame disposed between the cover plate assembly and the supporting unit, the frame connecting the A film is used to fix the film. A detection system for a residual wafer after stripping as described in claim 2, wherein the frame has a plurality of notches, a first side of the opposite sides of the notches, and a first side adjacent to the first side At least one second side is configured to position the carrying unit on the supporting unit. The detecting system for the residual wafer after the drawing is described in claim 2, wherein the supporting unit comprises: a supporting plate fixed to the body, having a first opening and being disposed around the first opening The at least one second opening is adjacent to the support plate for supporting the frame; the plurality of first positioning portions are disposed on the support plate and located around the first opening for positioning the carrying unit; A membrane ring is passed through the first opening for supporting the film. The detection system of the residual wafer after the drawing is described in claim 4, wherein the film ring further comprises at least one adjusting portion, and the adjusting portion correspondingly passes through the second opening for adjusting the film The amount of movement of the first opening in the support plate. The detection system for the residual wafer after the extraction according to the first aspect of the invention, wherein the cover assembly comprises: a cover; and a frame ring attached to the cover, having a plurality of second positioning portions, Frame ring by these The positioning portion abuts the carrying unit to fix the carrying unit on the supporting unit. The detecting system for the residual wafer after the picking of the first aspect of the patent application includes a reflecting unit disposed on the body for reflecting the projected image of the wafer position to the image capturing unit. The detecting system for the residual wafer after the picking is described in claim 7, wherein the reflecting unit is synchronously aligned with the carrying unit, the supporting unit and the cover assembly. The detection system for the residual wafer after the capture of the first aspect of the patent application, further comprising a display device disposed on the body for displaying the corresponding positions between the projected images of the wafer positions and the coordinate values of the wafers Overlapping images. The invention relates to a detection system for a residual wafer, which is suitable for a detection system. The detection system comprises a body, a carrying unit, a supporting unit, a cover assembly, a light source, a reflecting unit, an image capturing unit, and a a comparison unit and a display device for detecting a corresponding relationship between the plurality of wafers and the plurality of wafer coordinate values, the detection method comprising the following steps: (a) the support unit supports the carrier unit to enable the support unit Positioning the carrying unit on the body, wherein the carrying unit is provided with a plurality of carrying positions, a part of the carrying positions correspondingly carrying the wafers, and the carrying positions of the other part do not carry the chips; (b) The cover assembly covers the supporting unit on the supporting unit such that the carrying unit is interposed between the cover assembly and the supporting unit; (c) the light source generates a light to illuminate the carrying unit, so that the light Passing through the other part of the carrying position to project the part of the carrying position and the carrying position of the other part to the reflecting unit , The position of the wafer to form a plurality of the projected image; (d) the image capturing unit captures the plurality of wafer position of the projected image; (e) the comparing unit receives the wafer position projection images; and (f) the comparing unit compares the wafer position projection images with the wafer coordinate values to determine whether each of the wafer position projection images corresponds to each A set of wafer coordinate values. The method for detecting a residual wafer after the extraction according to claim 10, wherein in step (a), the bearing positions of the portions of the wafers are opaque. The other part of the carrying position is in a light transmitting state. The method for detecting a residual wafer after the extraction according to claim 10, wherein after the step (a), the method further comprises the following steps: (a1) adjusting the amount of movement of the supporting unit relative to the carrying unit to support The carrying unit. The method for detecting a residual wafer after the extraction according to claim 10, wherein after the step (c), the method further comprises the following steps: (c1) reflecting the wafer position projection image by the reflection unit to the image capture unit. The method for detecting a residual wafer after the extraction according to claim 10, wherein after the step (f), the method further comprises the steps of: (g) displaying the wafer position projection images and the wafer coordinates by the display device; The values overlap between images.