TWI497653B - 半導體封裝用插件 - Google Patents

半導體封裝用插件 Download PDF

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Publication number
TWI497653B
TWI497653B TW101119816A TW101119816A TWI497653B TW I497653 B TWI497653 B TW I497653B TW 101119816 A TW101119816 A TW 101119816A TW 101119816 A TW101119816 A TW 101119816A TW I497653 B TWI497653 B TW I497653B
Authority
TW
Taiwan
Prior art keywords
package
receiving opening
semiconductor package
fixing body
insert
Prior art date
Application number
TW101119816A
Other languages
English (en)
Chinese (zh)
Other versions
TW201308524A (zh
Inventor
李載學
姜景元
宋宰玄
Original Assignee
Isc股份有限公司
Ｕｎｉｓｅｐ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Isc股份有限公司, Ｕｎｉｓｅｐ股份有限公司 filed Critical Isc股份有限公司
Publication of TW201308524A publication Critical patent/TW201308524A/zh
Application granted granted Critical
Publication of TWI497653B publication Critical patent/TWI497653B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Packaging Frangible Articles (AREA)
TW101119816A 2011-06-01 2012-06-01 半導體封裝用插件 TWI497653B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110052997A KR101218348B1 (ko) 2011-06-01 2011-06-01 반도체 패키지용 인서트

Publications (2)

Publication Number Publication Date
TW201308524A TW201308524A (zh) 2013-02-16
TWI497653B true TWI497653B (zh) 2015-08-21

Family

ID=47260115

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101119816A TWI497653B (zh) 2011-06-01 2012-06-01 半導體封裝用插件

Country Status (3)

Country Link
KR (1) KR101218348B1 (fr)
TW (1) TWI497653B (fr)
WO (1) WO2012165908A2 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101882706B1 (ko) * 2011-11-21 2018-07-30 삼성전자주식회사 반도체 패키지용 인서트 및 이를 포함하는 테스트 장치
KR101532391B1 (ko) * 2014-04-10 2015-06-30 주식회사 아이에스시 푸셔 장치
KR102036202B1 (ko) * 2018-10-26 2019-10-24 (주) 나노에이스 회동 레버를 이용한 반도체칩의 네 코너 고정식 지지체
KR102213075B1 (ko) * 2020-01-07 2021-02-08 (주)마이크로컨텍솔루션 반도체 칩 패키지 테스트 소켓
CN113178421B (zh) * 2021-04-08 2022-03-29 深圳市磐锋精密技术有限公司 一种手机集成电路的多芯片封装定位装置及其定位方法
TWI867861B (zh) * 2023-11-23 2024-12-21 力成科技股份有限公司 半導體元件測試用插件裝置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5500605A (en) * 1993-09-17 1996-03-19 At&T Corp. Electrical test apparatus and method
US20020190739A1 (en) * 1999-01-21 2002-12-19 Farnworth Warren M. CSP BGA test socket with insert and method
US6636060B1 (en) * 1999-07-16 2003-10-21 Advantest Corporation Insert for electric devices testing apparatus
US7477063B1 (en) * 2007-08-17 2009-01-13 Powertech Technologies, Inc. Universal insert tool for fixing a BGA package under test

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100865890B1 (ko) * 2007-03-23 2008-10-29 세크론 주식회사 테스트 보조체
KR101032648B1 (ko) * 2011-02-10 2011-05-06 주식회사 아이에스시테크놀러지 테스트용 소켓

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5500605A (en) * 1993-09-17 1996-03-19 At&T Corp. Electrical test apparatus and method
US20020190739A1 (en) * 1999-01-21 2002-12-19 Farnworth Warren M. CSP BGA test socket with insert and method
US20030011393A1 (en) * 1999-01-21 2003-01-16 Farnworth Warren M. CSP BGA test socket with insert and method
US6636060B1 (en) * 1999-07-16 2003-10-21 Advantest Corporation Insert for electric devices testing apparatus
US7477063B1 (en) * 2007-08-17 2009-01-13 Powertech Technologies, Inc. Universal insert tool for fixing a BGA package under test

Also Published As

Publication number Publication date
KR20120134219A (ko) 2012-12-12
KR101218348B1 (ko) 2013-01-03
WO2012165908A3 (fr) 2013-03-28
TW201308524A (zh) 2013-02-16
WO2012165908A2 (fr) 2012-12-06

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