TWI538035B - 基板處理系統以及使用該系統的基板處理方法 - Google Patents

基板處理系統以及使用該系統的基板處理方法 Download PDF

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Publication number
TWI538035B
TWI538035B TW104108399A TW104108399A TWI538035B TW I538035 B TWI538035 B TW I538035B TW 104108399 A TW104108399 A TW 104108399A TW 104108399 A TW104108399 A TW 104108399A TW I538035 B TWI538035 B TW I538035B
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TW
Taiwan
Prior art keywords
substrate
module
washing liquid
wet
gas
Prior art date
Application number
TW104108399A
Other languages
English (en)
Chinese (zh)
Other versions
TW201523714A (zh
Inventor
丁振玉
李相善
韓晶閔
Original Assignee
Tes股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tes股份有限公司 filed Critical Tes股份有限公司
Publication of TW201523714A publication Critical patent/TW201523714A/zh
Application granted granted Critical
Publication of TWI538035B publication Critical patent/TWI538035B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
TW104108399A 2011-05-31 2012-05-30 基板處理系統以及使用該系統的基板處理方法 TWI538035B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110051974A KR101290527B1 (ko) 2011-05-31 2011-05-31 기판처리시스템 및 이를 이용한 기판처리방법

Publications (2)

Publication Number Publication Date
TW201523714A TW201523714A (zh) 2015-06-16
TWI538035B true TWI538035B (zh) 2016-06-11

Family

ID=47260077

Family Applications (2)

Application Number Title Priority Date Filing Date
TW104108399A TWI538035B (zh) 2011-05-31 2012-05-30 基板處理系統以及使用該系統的基板處理方法
TW101119337A TWI503877B (zh) 2011-05-31 2012-05-30 基板處理方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW101119337A TWI503877B (zh) 2011-05-31 2012-05-30 基板處理方法

Country Status (3)

Country Link
KR (1) KR101290527B1 (fr)
TW (2) TWI538035B (fr)
WO (1) WO2012165861A2 (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101463961B1 (ko) * 2013-02-15 2014-11-26 최대규 플라즈마 처리 시스템
KR101612416B1 (ko) * 2014-04-22 2016-04-15 피에스케이 주식회사 기판 처리 장치 및 기판 처리 방법
KR101718518B1 (ko) * 2014-07-24 2017-03-22 최도현 건식 및 습식 처리를 위한 단일 플랫폼의 기판처리설비
KR101718519B1 (ko) * 2014-07-24 2017-03-22 최도현 건식 및 습식 처리를 위한 단일 플랫폼의 기판처리설비
KR101612516B1 (ko) * 2014-07-24 2016-04-29 최도현 건식 및 습식 처리를 위한 단일 플랫폼의 기판처리설비
KR101678367B1 (ko) * 2014-12-19 2016-11-22 주식회사 테스 기판처리시스템
KR102129773B1 (ko) * 2016-04-07 2020-07-03 최도현 건식 및 습식 처리를 위한 단일 플랫폼의 기판처리설비
SG11202003653WA (en) 2017-10-23 2020-05-28 Lam Res Ag Systems and methods for preventing stiction of high aspect ratio structures and/or repairing high aspect ratio structures
KR102830705B1 (ko) 2018-10-03 2025-07-04 램 리서치 아게 고 종횡비 구조들의 마찰 방지 및/또는 보수를 위한 수소 플루오라이드, 알코올 및 첨가제를 포함하는 가스 혼합물
KR20230132361A (ko) 2021-01-25 2023-09-15 램 리써치 코포레이션 열적 에칭에 의한 선택적인 실리콘 트리밍
JP7478776B2 (ja) * 2021-07-07 2024-05-07 アプライド マテリアルズ インコーポレイテッド ゲートスタック形成のための統合湿式洗浄

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3953265A (en) * 1975-04-28 1976-04-27 International Business Machines Corporation Meniscus-contained method of handling fluids in the manufacture of semiconductor wafers
JPH0590239A (ja) * 1991-09-30 1993-04-09 Fujitsu Ltd 洗浄方法及び洗浄装置
JP3035450B2 (ja) * 1994-07-19 2000-04-24 大日本スクリーン製造株式会社 基板の洗浄処理方法
KR100238234B1 (ko) * 1997-03-20 2000-01-15 윤종용 반도체소자용 인-시튜 세정장치 및 그를 이용한 반도체 소자의 세정방법
US7568490B2 (en) * 2003-12-23 2009-08-04 Lam Research Corporation Method and apparatus for cleaning semiconductor wafers using compressed and/or pressurized foams, bubbles, and/or liquids
JP5016351B2 (ja) * 2007-03-29 2012-09-05 東京エレクトロン株式会社 基板処理システム及び基板洗浄装置
JP5058085B2 (ja) * 2008-07-02 2012-10-24 東京エレクトロン株式会社 基板洗浄装置

Also Published As

Publication number Publication date
WO2012165861A3 (fr) 2013-04-04
KR20120133341A (ko) 2012-12-10
TWI503877B (zh) 2015-10-11
WO2012165861A2 (fr) 2012-12-06
KR101290527B1 (ko) 2013-07-30
TW201523714A (zh) 2015-06-16
TW201248705A (en) 2012-12-01

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