TWI565778B - 電子組件用黏著劑 - Google Patents

電子組件用黏著劑 Download PDF

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Publication number
TWI565778B
TWI565778B TW101140402A TW101140402A TWI565778B TW I565778 B TWI565778 B TW I565778B TW 101140402 A TW101140402 A TW 101140402A TW 101140402 A TW101140402 A TW 101140402A TW I565778 B TWI565778 B TW I565778B
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TW
Taiwan
Prior art keywords
adhesive composition
wafer
adhesive
adhesive layer
wiring board
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TW101140402A
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English (en)
Chinese (zh)
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TW201323558A (zh
Inventor
村田容子
堀口有亮
佐野美惠子
吉娜 洪
Original Assignee
亨克爾股份有限及兩合公司
漢高智慧財產控股公司
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=48192591&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWI565778(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 亨克爾股份有限及兩合公司, 漢高智慧財產控股公司 filed Critical 亨克爾股份有限及兩合公司
Publication of TW201323558A publication Critical patent/TW201323558A/zh
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/003—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07332—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848—Three or more layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
TW101140402A 2011-11-02 2012-10-31 電子組件用黏著劑 TWI565778B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201161554698P 2011-11-02 2011-11-02

Publications (2)

Publication Number Publication Date
TW201323558A TW201323558A (zh) 2013-06-16
TWI565778B true TWI565778B (zh) 2017-01-11

Family

ID=48192591

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101140402A TWI565778B (zh) 2011-11-02 2012-10-31 電子組件用黏著劑

Country Status (6)

Country Link
US (2) US9305892B2 (2)
JP (1) JP6165754B2 (2)
KR (1) KR101924049B1 (2)
CN (1) CN104039913B (2)
TW (1) TWI565778B (2)
WO (1) WO2013066597A1 (2)

Families Citing this family (53)

* Cited by examiner, † Cited by third party
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WO2013035204A1 (ja) * 2011-09-09 2013-03-14 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 電子装置用組成物
WO2013035205A1 (ja) * 2011-09-09 2013-03-14 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン アンダーフィル用組成物
JP5435520B1 (ja) * 2013-03-29 2014-03-05 古河電気工業株式会社 有機電子デバイス用素子封止用樹脂組成物、有機電子デバイス用素子封止用樹脂シート、有機エレクトロルミネッセンス素子、及び画像表示装置
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KR102272146B1 (ko) 2014-01-29 2021-07-01 쇼와덴코머티리얼즈가부시끼가이샤 수지 조성물, 수지 조성물을 사용한 반도체 장치의 제조 방법, 및 고체 촬상 소자
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JP2017103289A (ja) * 2015-11-30 2017-06-08 日立化成株式会社 半導体用接着剤、半導体装置、及び半導体装置の製造方法
JP6791626B2 (ja) * 2015-12-14 2020-11-25 デクセリアルズ株式会社 熱硬化性接着シート、及び半導体装置の製造方法
JP6707856B2 (ja) * 2015-12-22 2020-06-10 日立化成株式会社 先供給型アンダーフィル材、電子部品装置の製造方法、及び電子部品装置
JP6638380B2 (ja) * 2015-12-22 2020-01-29 日立化成株式会社 先供給型アンダーフィル材及びその硬化物、並びに電子部品装置及びその製造方法
JP6631238B2 (ja) * 2015-12-22 2020-01-15 日立化成株式会社 先供給型アンダーフィル材、先供給型アンダーフィル材の硬化物、電子部品装置及び電子部品装置の製造方法
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JP7344471B2 (ja) 2018-04-26 2023-09-14 三菱瓦斯化学株式会社 樹脂組成物、積層体、樹脂組成物層付き半導体ウェハ、樹脂組成物層付き半導体搭載用基板、及び半導体装置
WO2019208604A1 (ja) 2018-04-26 2019-10-31 三菱瓦斯化学株式会社 樹脂組成物、積層体、樹脂組成物層付き半導体ウェハ、樹脂組成物層付き半導体搭載用基板、及び半導体装置
JP6597845B2 (ja) * 2018-06-25 2019-10-30 日立化成株式会社 先供給型アンダーフィル材、電子部品装置及び電子部品装置の製造方法
JP7295939B2 (ja) * 2018-07-24 2023-06-21 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 難燃性接着剤組成物
JP2020107754A (ja) * 2018-12-27 2020-07-09 東京応化工業株式会社 電子部品の製造方法、及びキット
JP7110090B2 (ja) * 2018-12-28 2022-08-01 東京エレクトロン株式会社 基板処理方法および基板処理システム
CN114127180B (zh) 2019-06-28 2023-06-09 三菱瓦斯化学株式会社 薄膜、层叠体、带薄膜层的半导体晶圆、带薄膜层的半导体搭载用基板和半导体装置
KR20220030921A (ko) 2019-06-28 2022-03-11 미츠비시 가스 가가쿠 가부시키가이샤 필름, 적층체, 필름층이 형성된 반도체 웨이퍼, 필름층이 형성된 반도체 탑재용 기판, 및 반도체 장치
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US12195566B2 (en) 2019-06-28 2025-01-14 Mitsubishi Gas Chemical Company, Inc. Film, laminate, semiconductor wafer with film layer, substrate for mounting semiconductor with film layer, and semiconductor device
JP7406336B2 (ja) * 2019-10-11 2023-12-27 三星電子株式会社 半導体装置の製造方法
JP6844680B2 (ja) * 2019-12-12 2021-03-17 昭和電工マテリアルズ株式会社 先供給型アンダーフィル材、先供給型アンダーフィル材の硬化物、電子部品装置及び電子部品装置の製造方法
JP6844685B2 (ja) * 2019-12-26 2021-03-17 昭和電工マテリアルズ株式会社 先供給型アンダーフィル材及びその硬化物、並びに電子部品装置及びその製造方法
WO2021152934A1 (ja) * 2020-01-29 2021-08-05 株式会社村田製作所 電極付き受動部品及び電極付き受動部品の集合体
GB2593754B (en) 2020-04-01 2022-12-28 Henkel Ag & Co Kgaa Redox curable compositions and methods of manufacture thereof
FR3113771B1 (fr) * 2020-08-27 2022-10-21 Commissariat Energie Atomique Procédé de fabrication d'un substrat-poignée destiné au collage temporaire d'un substrat.
CN114316872B (zh) * 2020-09-29 2023-09-05 上海飞凯材料科技股份有限公司 一种临时粘合剂及其应用和应用方法
CN113427839A (zh) * 2021-08-26 2021-09-24 金石(天津)科技发展有限公司 复合膜袋及其制备方法
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Citations (2)

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