TWI568821B - Protect the tape - Google Patents

Protect the tape Download PDF

Info

Publication number
TWI568821B
TWI568821B TW101106964A TW101106964A TWI568821B TW I568821 B TWI568821 B TW I568821B TW 101106964 A TW101106964 A TW 101106964A TW 101106964 A TW101106964 A TW 101106964A TW I568821 B TWI568821 B TW I568821B
Authority
TW
Taiwan
Prior art keywords
protective tape
metal layer
substrate
layer
adhesive layer
Prior art date
Application number
TW101106964A
Other languages
English (en)
Chinese (zh)
Other versions
TW201243012A (en
Inventor
Keisho Shinohara
Original Assignee
Tatsuta Electric Wire & Cable Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsuta Electric Wire & Cable Co Ltd filed Critical Tatsuta Electric Wire & Cable Co Ltd
Publication of TW201243012A publication Critical patent/TW201243012A/zh
Application granted granted Critical
Publication of TWI568821B publication Critical patent/TWI568821B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating processes for reflow soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/28—Metal sheet
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/31—Applications of adhesives in processes or use of adhesives in the form of films or foils as a masking tape for painting
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • C09J2400/163—Metal in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/22—Presence of unspecified polymer
    • C09J2400/226—Presence of unspecified polymer in the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Laminated Bodies (AREA)
TW101106964A 2011-03-04 2012-03-02 Protect the tape TWI568821B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011047111A JP5963395B2 (ja) 2011-03-04 2011-03-04 保護テープ

Publications (2)

Publication Number Publication Date
TW201243012A TW201243012A (en) 2012-11-01
TWI568821B true TWI568821B (zh) 2017-02-01

Family

ID=46797991

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101106964A TWI568821B (zh) 2011-03-04 2012-03-02 Protect the tape

Country Status (5)

Country Link
JP (1) JP5963395B2 (ja)
KR (1) KR101843415B1 (ja)
CN (1) CN103416107A (ja)
TW (1) TWI568821B (ja)
WO (1) WO2012121022A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI696867B (zh) * 2019-03-22 2020-06-21 友達光電股份有限公司 膠帶結構及使用其之顯示面板和顯示裝置

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11107789B2 (en) * 2016-03-30 2021-08-31 Mitsui Chemicals Tohcello, Inc. Method for manufacturing semiconductor device
JP6809077B2 (ja) * 2016-09-20 2021-01-06 日本電気株式会社 搬送パレットおよび搬送方法
CN110000005B (zh) * 2019-02-13 2020-11-24 浙江润洁环境科技股份有限公司 一种电除尘器外壳的制备工艺及应用该外壳的电除尘器
TWI710288B (zh) * 2020-01-22 2020-11-11 頎邦科技股份有限公司 電路板的散熱片貼合方法及其貼合裝置
TWI825705B (zh) * 2022-05-09 2023-12-11 山太士股份有限公司 保護膠帶以及半導體裝置的製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101323760A (zh) * 2007-04-09 2008-12-17 日东电工株式会社 双面压敏粘合带或片和具有双面压敏粘合带的布线电路板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0548376U (ja) * 1991-11-28 1993-06-25 甲府日本電気株式会社 マスキングテープ
JPH0974266A (ja) * 1995-09-07 1997-03-18 Lintec Corp 半導体チップ固定用接着剤テープおよび半導体チップ固定用接着剤の供給方法
JPH10107408A (ja) * 1996-09-30 1998-04-24 Ibiden Co Ltd 半田層を備えたプリント配線板及びその表面処理方法
JP4727139B2 (ja) * 2002-11-28 2011-07-20 信越化学工業株式会社 シリコーン粘着剤組成物及び粘着テープ
JP3649288B1 (ja) * 2004-03-15 2005-05-18 千住金属工業株式会社 はんだ付け用耐熱性マスキングテープおよびプリント基板のはんだ付け方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101323760A (zh) * 2007-04-09 2008-12-17 日东电工株式会社 双面压敏粘合带或片和具有双面压敏粘合带的布线电路板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI696867B (zh) * 2019-03-22 2020-06-21 友達光電股份有限公司 膠帶結構及使用其之顯示面板和顯示裝置

Also Published As

Publication number Publication date
TW201243012A (en) 2012-11-01
KR20140048841A (ko) 2014-04-24
JP5963395B2 (ja) 2016-08-03
KR101843415B1 (ko) 2018-03-29
WO2012121022A1 (ja) 2012-09-13
JP2012186240A (ja) 2012-09-27
CN103416107A (zh) 2013-11-27

Similar Documents

Publication Publication Date Title
TWI568821B (zh) Protect the tape
KR101823830B1 (ko) 다이싱 테이프 일체형 반도체 이면용 필름 및 그의 제조 방법, 및 반도체 장치의 제조 방법
EP2231402A2 (en) High temperature composite tape and method for manufacturing the same
KR101949302B1 (ko) 적층 필름 및 차폐 인쇄 배선판
TWI696682B (zh) 表面保護膜
JP2010239022A (ja) フレキシブルプリント配線基板及びこれを用いた半導体装置
WO2008091119A1 (en) Surface protective film
JP7075893B2 (ja) 両面粘着シートおよび半導体装置の製造方法
KR20090112445A (ko) 화면 보호 윈도우의 제조 방법
JP2007534023A (ja) 電子インク表示装置及びその製造方法
CN109632800A (zh) Fob类产品邦定效果的检测方法
KR101425580B1 (ko) 캐리어 필름을 이용한 커버레이 필름 가접 방법
JP4628154B2 (ja) フレキシブルプリント配線基板、および半導体装置
JP6918452B2 (ja) 発光素子用基板及びモジュール
JP4916057B2 (ja) Ｆｐｃ用保護フィルム、ｆｐｃ用保護フィルム付樹脂導体箔積層体およびそれを用いたフレキシブルプリント配線基板の製造方法
TW540257B (en) Component of printed circuit boards
KR20130070888A (ko) 백색 난연성 반사층 조성물을 사용한 백색 커버레이 필름 및 이를 포함하는 연성인쇄회로 기판
TWI634817B (zh) 用於電路板沖壓製程的覆蓋膜
JP6934225B2 (ja) 積層体
CN113198663B (zh) 弯折屏的镀膜修复设备以及修复方法
JP5288898B2 (ja) 接着シートの貼付装置および貼付方法、ならびに電子部品の実装装置および実装方法
KR102807618B1 (ko) 광학 적층체, 이를 포함하는 투명 디스플레이 및 그 제조 방법
JP6421330B2 (ja) 熱伝導シート
KR20110072763A (ko) 반사 커버레이 필름 및 그 제조방법
JP4595900B2 (ja) 多層金属箔張り積層板の製造方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees