TWI602000B - Conductive tape, panel device and adhering method of the conductive tape - Google Patents

Description

Conductive material, panel device, and bonding method of conductive material

The present invention relates to a conductive bonding material, a panel device using the conductive bonding material, and a bonding method of the conductive bonding material.

In recent years, with the popularization of the use of electronic products, input and output devices that play an important role in electronic products, such as a display panel, a touch panel, or an integrated touch display panel, have been The focus of the designer's attention. The internal components of the panel (for example, the upper and lower substrates) can be assembled through the outer frame, so that the modular panel device can be easily assembled and applied in an electronic product.

The panel used in the panel device generally has a conductive member, such as a color filter unit and a TFT unit disposed in the display panel, or a conductive touch disposed on the touch panel. Control pattern (such as ITO film). The conductive member generates a charge in the panel. If the charge is excessively accumulated, the conductive member may be damaged, which may affect the display function of the panel (for example, short-circuiting a conductive line, a lattice defect, or a color deviation). Thereby, the panel device can be attached to the edge of the panel and the outer frame by using a conductive adhesive having conductivity and adhesion to transfer the electric charge on the panel to the outer frame to guide the outside of the panel device.

In the prior art, the conductive paste material generally has a rectangular shape and can be attached to the edge of the panel and the outer frame in a single direction. However, in the case where the panel has a narrow bezel design, the bonding area of the conductive bonding material and the edge of the panel in the width direction is limited, and thus there may be a situation of falling off. Therefore, in order to increase the bonding area of the conductive bonding material and the edge of the panel in the longitudinal direction, it is common practice to increase the length of the conductive bonding material, and then to laminate the edge of the panel and the outer frame with a conductive material having a large overall use area. This will increase the material cost of the conductive paste.

The invention provides a method for bonding a conductive material, a panel device and a conductive material, which is suitable for providing a large bonding area in the longitudinal direction of the panel device with a small overall use area, and is not easy to be used for the panel. The device is detached by external force.

The conductive paste of the present invention comprises a first bonding portion, a second bonding portion and a buffer portion. The first abutting portion extends in a first direction. The second abutting portion extends in a second direction. The buffer portion connects the first bonding portion and the second bonding portion, and the buffer portion is bent to protrude between the first bonding portion and the second bonding portion such that the second direction is different from the first direction.

The panel device of the present invention comprises an outer frame, a panel and a conductive paste. The panel is assembled to the outer frame. The conductive paste comprises a first bonding portion, a second bonding portion and a buffer portion. The first abutting portion extends in a first direction. The second abutting portion extends in a second direction. The buffer portion connects the first bonding portion and the second bonding portion. The first bonding portion is attached to the edge of the panel, the second bonding portion is attached to the outer frame, and the buffer portion is bent and protrudes between the first bonding portion and the second bonding portion to make the second direction Different from the first direction.

The method for bonding the conductive material of the present invention is suitable for bonding a conductive material to an outer frame of a panel device and a panel assembled to the outer frame, and the conductive material comprises a first bonding portion and a first a second bonding portion and a buffer portion connecting the first bonding portion and the second bonding portion. The bonding method of the conductive material comprises the steps of: bonding the first bonding portion of the conductive material to the edge of the panel, and extending the first bonding portion in a first direction. The buffer portion of the conductive paste is bent. Bonding the second bonding portion of the conductive material to the outer frame, and extending the second bonding portion in a second direction, and the buffer portion is bent and protrudes from the first bonding portion and the second bonding portion In between, the second direction is different from the first direction.

Based on the above, the conductive paste of the present invention includes a first bonding portion extending in the first direction, a second bonding portion extending in the second direction, and a buffer portion connecting the first bonding portion and the second bonding portion. The buffer portion is bent and protrudes between the first bonding portion and the second bonding portion. When the conductive bonding material is applied to the panel device, the bonding method of the conductive bonding material firstly bonds the first bonding portion to the edge of the panel, and then bends the buffer portion, so that the buffer portion is bent and protrudes from the first bonding. Between the portion and the second bonding portion, the second bonding portion is then attached to the outer frame such that the second direction is different from the first direction. Thereby, the conductive bonding material, the panel device and the bonding method of the conductive bonding material of the present invention are suitable for providing a large bonding area in the longitudinal direction of the panel device with a small overall use area, and are not easy The panel device is detached due to an external force.

The above described features and advantages of the invention will be apparent from the following description.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view of an electrically conductive paste of an embodiment of the present invention. 2 is a schematic view of the conductive bonding material of FIG. 1 in use. Figure 3 is a cross-sectional view of the conductive paste of Figure 1 taken along line I-I'. 4 to 6 are schematic cross-sectional views showing a conductive bonding material according to another modification of the present invention. Referring to FIG. 1 to FIG. 3 , in the embodiment, the conductive paste 100 includes a first bonding portion 110 , a second bonding portion 120 , and a buffer portion 130 . The first bonding portion 110 extends in the first direction D1. The second bonding portion 120 extends in the second direction D2. The buffer portion 130 connects the first bonding portion 110 and the second bonding portion 120, and the buffer portion 130 is bent and protrudes between the first bonding portion 110 and the second bonding portion 120 to make the second direction D2 different. In the first direction D1.

Specifically, in the present embodiment, the conductive paste 100 includes a conductive substrate 140 and a conductive paste 150 (shown in FIG. 3). The conductive substrate 140 has an elongated shape to form the first bonding portion 110, the second bonding portion 120 and the buffer portion 130 located therebetween, and the conductive paste 150 is disposed on the conductive substrate 140. Preferably, the conductive adhesive 150 is located on the conductive substrate 140 corresponding to the first bonding portion 110 and the second bonding portion 120, and may be further located on the conductive substrate 140 corresponding to the buffer portion 130. . That is, the present embodiment places the conductive paste 150 on the entire surface of the conductive substrate 140. As such, the conductive clad material 100 exhibits a strip shape extending in a single direction before use (as shown in FIG. 1). When the conductive adhesive material 100 is in the use state, the first bonding portion 110 and the second bonding portion 120 can be respectively attached to the two inner members of the panel device 50 with the corresponding conductive adhesive 150, and the buffer portion 130 is bent. After being folded, the first bonding portion 110 and the second bonding portion 120 are protruded between the first bonding portion 110 and the second bonding portion 120, and further protruded between the first bonding portion 110 and the second bonding portion 120 by the conductive adhesive 150. The first bonding portion 110 and the second bonding portion 120 are respectively extended in the first direction D1 and the second direction D2, and the second direction D2 is different from the first direction D1 (as shown in FIG. 2).

In the present embodiment, the conductive paste 100 has electrical conductivity at the place where the conductive paste 150 is disposed, and can effectively guide the electric charge generated by the internal member, and has a good bonding effect, and can be firmly attached to the internal member. on. In addition, the conductive substrate 140 preferably also has electrical conductivity, such as a conductive patch or a conductive metal sheet, and may be other conductive materials, but the invention is not limited thereto. Thereby, the conductive paste 100 has electrical conductivity and conformability, and can be attached to the inner member of the panel device 50 (shown in the subsequent drawings) for guiding the electric charge inside the panel device 50. Moreover, since both the conductive substrate 140 and the conductive paste 150 have electrical conductivity, even if the conductive paste 150 of the conductive paste 100 is cracked due to the bending of the buffer portion 130, the conductive paste 150 cannot transfer charges, or the conductive paste 100 is in the buffer portion. The conductive paste is not disposed at 130, and the conductive paste 100 can still maintain conductivity by the conductive substrate 140. However, the present invention is not limited to the above embodiment, and it can be adjusted as needed.

For example, in the embodiment of FIG. 4, the conductive paste 100a includes a conductive substrate 140 and a conductive paste 150a, wherein the conductive paste 150a is disposed on the conductive substrate 140 corresponding to the first bonding portion 110 and the second bonding portion. At the portion 120, the conductive paste 150a is not disposed on the conductive substrate 140 corresponding to the buffer portion 130. Therefore, the conductive bonding material 100a can still be adhered to the inner member through the first adhesive portion 110 and the second bonding portion 120 through the conductive adhesive 150, and the buffer portion 130 can still be bent and protruded from the first bonding portion. 110 is between the second bonding portion 120.

Similarly, in the embodiment of FIG. 5, the conductive paste 100b is similar to the aforementioned conductive paste 100, which includes the conductive substrate 140 and the conductive paste 150, and further includes the reinforcement 160. The reinforcing material 160 and the conductive paste 150 are respectively disposed on opposite surfaces of the conductive substrate 140. Thereby, the conductive bonding material 100b is adhered to the inner member through the first bonding portion 110 and the second bonding portion 120 through the conductive adhesive 150, and the reinforcing member 160 can be used to strengthen the overall structural strength of the conductive bonding material 100b. Similarly, in the embodiment of FIG. 6, the conductive paste 100c is similar to the foregoing conductive paste 100a, and includes a conductive substrate 140 and a conductive paste 150a, and further includes a reinforcing member 160, wherein the conductive paste 150a is located at the conductive base. The material 140 corresponds to the first bonding portion 110 and the second bonding portion 120 (the conductive adhesive 150 is not disposed on the conductive substrate 140 corresponding to the buffer portion 130), and the reinforcing member 160 and the conductive adhesive 150 are respectively disposed. On opposite surfaces of the conductive substrate 140, the overall structural strength of the conductive paste 100c is reinforced. It can be seen that the present invention does not limit the composition and arrangement of the conductive stickers, which can be adjusted according to requirements.

In addition, referring to FIG. 1 to FIG. 2 , in the embodiment, the conductive paste 100 may further be provided with a fold line to bend the buffer portion 130 in a simple manner. Specifically, in the conductive bonding material 100, the first bonding portion 110 has a first folding line L1, the buffer portion 130 has a second folding line L2, and the second bonding portion 120 has a third folding line L3. The first fold line L1 is located between the first bonding portion 110 and the buffer portion 130, the third fold line L3 is located between the second bonding portion 120 and the buffer portion 130, and the buffer portion 130 is distinguished by the second fold line L2. Two overlapping regions 132a and 132b corresponding to the first folding line L1 and the third folding line L3, respectively, are shown. In other words, the first fold line L1, the second fold line L2, and the third fold line L3 distinguish the first overlapping portion 110, the two overlapping regions 132a and 132b of the buffer portion 130, and the second bonding portion 120.

Furthermore, in the present embodiment, the first fold line L1, the second fold line L2 and the third fold line L3 meet at the same point, so that the buffer portion 130 and the two overlapping regions 132a and 132b each have a triangular shape. The two overlapping regions 132a and 132b are symmetric with the second fold line L2 as a center line, and the shapes and areas of the two overlapping regions 132a and 132b are substantially equal, so that the first fold line L1 and the third fold line L3 are also the second fold line L2. The centerline is symmetrical. In this manner, after the buffer portion 130 is bent, the two overlapping regions 132 a and 132 b overlap each other, and the third folding line L3 overlaps the first folding line L1 to protrude between the first bonding portion 110 and the second bonding portion 120 . That is, the second fold line L2 of the buffer portion 130 protrudes outward, so that the two overlapping regions 132a and 132b are overlapped with each other through the conductive adhesive 150, and the third fold line L3 is overlapped with the first fold line L1, thereby causing the buffer portion 130 to be bent. The rear portion protrudes between the first bonding portion 110 and the second bonding portion 120. However, the present invention is not limited to the above embodiment, and it can be adjusted as needed.

Further, in the present embodiment, the first bonding portion 110 has a first pit P1, and the buffer portion 130 has a second pit P2 and a third pit P3. The pits can be recesses of any shape. The first pit P1 and the second pit P2 constitute a first fold line L1, and the second pit point P2 and the third pit point P3 constitute a second fold line L2. That is, the buffer portion 130 is adapted to bend along the line connecting the first pit P1 and the second pit P2 to form a first fold line L1 on the first bonding portion 110, and is adapted to be along the second pit point P2. The line of the third pit P3 is bent to form a second fold line L2 on the buffer portion 130. At this time, the two overlapping regions 132 a and 132 b of the buffer portion 130 overlap each other with the second folding line L2 as a center line, and the buffer portion 130 protrudes from the first bonding portion 110 and the second bonding portion 120 . Moreover, the protruding buffer portion 130 is adapted to be bent toward the second bonding portion 120 to form a third folding line L3 overlapping the first folding line L1 on the second bonding portion 120 after being bent. However, in other embodiments, the first fold line L1, the second fold line L2, and the third fold line L3 may also be printed lines or other applicable physical marks, or may be directly formed by bending without a virtual line without a mark. The present invention is not limited to the above embodiment.

7 to 9 are schematic flow charts showing a method of bonding the conductive paste of FIG. 1 to a panel device. Referring to FIG. 7 to FIG. 9 , in the present embodiment, the conductive paste 100 is suitable for application in the panel device 50 , for example, to the internal components of the panel device 50 for guiding electric charge. The panel device 50 includes an outer frame 52 , a panel 54 , and a conductive paste 100 . The panel 54 is assembled to the outer frame 52 , and the conductive paste 100 is attached to the outer frame 52 and the panel 54 . Furthermore, the outer frame 52 can be a front frame, a back frame or other suitable frame for assembling the panel 54 and other internal components, and the number of the outer frames 52 used by the panel device 50 can be one or Multiple. Similarly, the panel 54 can be a display panel, a touch panel, or other suitable panel, and the number of panels 54 employed by the panel device 50 can be one or more. Therefore, the bonding method of the conductive bonding material 100 is suitable for bonding the conductive bonding material 100 to the outer frame 52 of the panel device 50 and the panel 54 assembled to the outer frame 52, and the number of the conductive bonding materials 100 may be one or more. The outer frame 52 may be a conductive material, and the present invention is not limited thereto.

Specifically, in the present embodiment, the panel 54 includes a lower substrate 54a, an upper substrate 54b, and a polarizer 54c, wherein the upper substrate 54b is disposed on the lower substrate 54a and exposes an edge of the lower substrate 54a, and the polarizer 54c is disposed. On the upper substrate 54b, the edges of the upper substrate 54b and the lower substrate 54a are exposed. However, in other embodiments, the polarizer 54c may be disposed on the lower substrate 54a, or the polarizer 54c may be disposed on the lower substrate 54a and the upper substrate 54b, or the polarizer 54c may not be used, and the upper substrate 54b and/or the lower surface may be exposed. The edge of the substrate 54a, the present invention is not limited to the above embodiment. In addition, the panel 54 further includes a conductive member (not shown) disposed on the upper substrate 54b and/or the lower substrate 54a. Taking the display panel as the panel 54 as an example, the conductive member is, for example, a color filter unit located inside the upper substrate 54b or a thin film transistor unit positioned inside the lower substrate 54a. Alternatively, the conductive member may also be a conductive touch pattern in the touch panel as the panel 54. The invention does not limit the type, number and location of the conductive members. The conductive member generates a charge in the panel 54, so that the conductive paste 100 is preferably disposed on the upper substrate 54b and/or the lower substrate 54a having the conductive member, thereby guiding the electric charge generated by the conductive member. Thereby, the bonding method in which the conductive bonding material 100 is applied to the panel device 50 will be sequentially described below with reference to FIGS. 7 to 9.

First, referring to FIG. 7 , the first bonding portion 110 of the conductive bonding material 100 is attached to the edge of the panel 54 to extend the first bonding portion 110 in the first direction D1. Specifically, the first bonding portion 110 is adhered to the edge of the upper substrate 54b and/or the lower substrate 54a of the panel 54 in the first direction D1 by the conductive paste 150 (shown in FIG. 3). Furthermore, since the upper substrate 54b exposes the edge of the lower substrate 54a and the polarizer 54c exposes the edges of the upper substrate 54b and the lower substrate 54a, the first bonding portion 110 can be simultaneously bonded to the upper substrate 54b and the lower substrate. The edge of 54a is exposed by the polarizer 54c. In addition, since the upper substrate 54b and the lower substrate 54a are each provided with a conductive member, the first bonding portion 110 simultaneously bonds the edges of the upper substrate 54b and the lower substrate 54a. Alternatively, only one of the upper substrate 54b and the lower substrate 54a may be provided with a conductive member. At this time, the first bonding portion 110 can still be attached to the edges of the upper substrate 54b and the lower substrate 54a at the same time, or can be attached only to the edges of the upper substrate 54b or the lower substrate 54a on which the conductive members are disposed. Moreover, depending on the actual situation (for example, the relative position of the member or the size of the conductive member 100), the first bonding portion 110 may also be attached to the outer frame 52 while being attached to the edge of the panel 54, but the invention is not limited to the above embodiment. .

Next, referring to FIG. 7 and FIG. 8, the buffer portion 130 of the conductive paste 100 is bent. Specifically, in the step of bending the buffer portion 130, the first bonding portion 110 is a fixed end and the second bonding portion 120 is a movable end, and the first folding line L1 and the second folding line L2 are sequentially bent and buffered. In the portion 130, the buffer portion 130 is bent, and the two overlapping regions 132a and 132b overlap each other, and the third fold line L3 is superposed on the first fold line L1 to protrude between the first bonding portion 110 and the second bonding portion 120.

Further, the step of sequentially bending the buffer portion 130 along the first fold line L1 and the second fold line L2 includes: first along the first fold line L1 (ie, the line connecting the first pit point P1 and the second pit point P2) The buffer portion 130 is bent in the bending direction (i.e., toward the inside of the panel 54) as shown in FIG. Next, the buffer portion 130 is bent in the direction opposite to the bending direction (i.e., toward the outside of the panel 54) along the second folding line L2 (i.e., the line connecting the second pit P2 and the third pit P3), as shown in FIG. In this manner, after the buffer portion 130 is bent, the conductive paste 150 (shown in FIG. 3 ) is attached to the opposite portions (ie, the two overlapping regions 132 a and 132 b ) to protrude from the first bonding portion 110 and the second bonding portion 120 . Between the two overlapping regions 132a and 132b are overlapped with each other and have substantially the same shape and area. Thereafter, the protruding buffer portion 130 can be bent outwardly toward the panel 54 such that the buffer portion 130 is bent to form a third fold line L3 that overlaps the first fold line L1 on the second bonding portion 120. The first fold line L1, the second fold line L2 and the third fold line L3 meet at the same point (ie, the second pit point P2), so that the buffer portion 130 and the two overlapping regions 132a and 132b each have a triangular shape, but the invention is not limited thereto. .

Finally, referring to FIG. 9 , the second bonding portion 120 of the conductive bonding material 100 is attached to the outer frame 52 to extend the second bonding portion 120 in the second direction D2, and the buffer portion 130 is bent and protruded. The second direction D2 is different from the first direction D1 between the first bonding portion 110 and the second bonding portion 120. Specifically, after the buffering portion 130 is bent, the first bonding portion 110 and the second bonding portion 120 each extend toward the first direction D1 and the second direction D2, and the second direction D2 is different from the first direction D1. At this time, the second bonding portion 120 can be further adhered to the outer frame 52 in the second direction D2 with the conductive paste 150 (shown in FIG. 3 ) for fixing. Moreover, depending on the actual situation (for example, the relative position of the member or the size of the conductive member 100), the second bonding portion 120 may also be attached to the edge of the panel 54 while being attached to the outer frame 52, but the invention is not limited to the above implementation. the way. In this manner, the conductive paste 100 is simultaneously bonded to the edge of the panel 54 and the outer frame 52 , so that the electric charge generated by the conductive members in the panel 54 on the upper substrate 54 b and the lower substrate 54 a is transmitted to the outer frame 52 through the conductive paste 100 .

Based on the above, in the embodiment, the first bonding portion 110 of the conductive bonding material 100 is attached to the edge of the upper substrate 54b and/or the lower substrate 54a on the panel 54 where the conductive member is disposed to generate electric charge accumulation, and It is attached to the outer frame 52 at the same time according to the actual situation. In order to prevent the first bonding portion 110 from being pulled off due to the external displacement of the panel device 50 by the external force of the panel device 50 (for example, the upper substrate 54b and the lower substrate 54a), the panel 54 and the first bonding portion 110 are preferably Has a wide range of fit areas. Further, the conductive strip 100 having the strip shape is attached to the edge of the panel 54 with the first bonding portion 110, and the length direction of the first bonding portion 110 is parallel to the first direction D1, so that the first sticker The joint portion 110 produces a strip-shaped and wide-ranging bonding area on the panel 54. In addition, the conductive strip 100 having the strip shape is attached to the outer frame 52 by the second bonding portion 120, and can be simultaneously attached to the edge of the panel 54 according to actual conditions, wherein the length direction of the second bonding portion 120 is parallel to In the second direction D2, the second bonding portion 120 generates a strip-shaped and wide-ranging bonding area on the outer frame 52. Thereby, the conductive paste 100 is simultaneously attached to the edge of the panel 54 and the outer frame 52 to guide the electric charge generated on the panel 54 to the outer frame 52, and has a good bonding effect.

Therefore, the conductive bonding material 100 of the present embodiment has a long strip design, and a buffer portion 130 is disposed between the first bonding portion 110 and the second bonding portion 120 to increase the conductive bonding material 100 on the panel 54 and the outside. The area of the fit on the frame 52. Furthermore, the first bonding portion 110 and the second bonding portion 120 of the conductive bonding material 100 extend in different first directions D1 and second directions D2 after bending the buffer portion 130, so that the first bonding is performed. The longitudinal direction of the portion 110 is parallel to the first direction D1 and the longitudinal direction of the second bonding portion 120 is parallel to the second direction D2. In this way, the elongated first bonding portion 110 is attached to the edge of the panel 54 along the first direction D1, and the bonding area of the first bonding portion 110 in the longitudinal direction (parallel to the first direction D1) can be increased, and the length is long. The strip-shaped second bonding portion 120 is bonded to the outer frame 52 in the second direction D2, and the bonding area of the second bonding portion 120 in the longitudinal direction (parallel to the second direction D2) can be increased.

With the above design, in the case where the panel 54 is designed with a narrow bezel (for example, the width of the edge of the upper substrate 54b exposed by the polarizer 54c is less than 1.5 mm), although the edge width of the panel 54 is limited, the edge of the panel 54 is lowered and the first The bonding area of the bonding portion 110 in the width direction (parallel to the second direction D2), but the strip-shaped conductive material 100 can increase the length of the first bonding portion 110 and the edge of the panel 54 in the longitudinal direction (parallel to the first The bonding area on one direction D1). As the bonding area of the first bonding portion 110 and the edge of the panel 54 increases, the probability that the conductive bonding material 100 will fall off due to the external force of the panel device 50 is also reduced. Similarly, the elongated second bonding portion 120 can also form an appropriate bonding area with the outer frame 52 in the longitudinal direction (parallel to the second direction D2), thereby increasing the fixing property.

Furthermore, in the present embodiment, the bonding area of the first bonding portion 110 in the longitudinal direction thereof (parallel to the first direction D1) is increased and the second bonding portion 120 is increased in the longitudinal direction thereof (parallel to the first On the premise of the bonding area on the two directions D2), the conductive bonding material 100 is designed to be strip-shaped (increasing the overall length and reducing the overall width thereof), and the overall use area of the conductive bonding material 100 can be effectively reduced. Therefore, the design of the conductive bonding material 100 can effectively reduce the overall use area and material cost of the conductive bonding material 100 compared to the conventional technical solution of bonding the panel and the outer frame with a rectangular conductive material.

In addition, in the present embodiment, the first bonding portion 110 and the second bonding portion 120 extend in different directions and generate a desired bonding area with the panel 54 and the outer frame 52 respectively in the longitudinal direction thereof. The buffer portion 130 can also be used to prevent the conductive paste 100 from providing a buffer space when the panel device 50 is subjected to an external force. In other words, when the panel device 50 is subjected to an external force to cause a slight displacement of the outer frame 52 and the panel 54, the buffer portion 130 can be used to generate the displacement between the first and second abutting portions 110 and 120 in response to the displacement of the outer frame 52 and the panel 54. The buffer space is provided during the pulling, that is, the two overlapping regions 132a and 132b are allowed to be separated slightly, so that the conductive bonding material 100 is not detached from the outer frame 52 and the panel 54, so that the conductive device 100 is detached due to the external force of the panel device 50. It can also be reduced.

In summary, the conductive paste of the present invention includes a first bonding portion extending in a first direction, a second bonding portion extending in a second direction, and a buffer connecting the first bonding portion and the second bonding portion. And the buffer portion is bent and protrudes between the first bonding portion and the second bonding portion. When the conductive material is applied to the panel device, the bonding method of the conductive material firstly bonds the first bonding portion to the edge of the panel, for example, to the upper substrate and/or the lower substrate of the panel, and then bends. The buffer portion is configured such that the buffer portion is bent and protrudes between the first bonding portion and the second bonding portion, and then the second bonding portion is attached to the outer frame such that the second direction is different from the first direction. The electric charge generated by the conductive member in the panel can be led through the conductive material to cause the outer frame. Thereby, the conductive bonding material, the panel device and the bonding method of the conductive bonding material of the present invention are suitable for providing a large bonding area in the longitudinal direction of the panel device with a small overall use area, and are not easy The panel device is detached due to an external force.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

50‧‧‧ Panel device
52‧‧‧Front frame
54‧‧‧ panel
54a‧‧‧lower substrate
54b‧‧‧Upper substrate
54c‧‧‧ polarizer
100, 100a, 100b, 100c‧‧‧ conductive materials
110‧‧‧First Fit
120‧‧‧Second Placing Department
130‧‧‧ buffer
132a and 132b‧‧‧ overlap zone
140‧‧‧Electrical substrate
150, 150a‧‧‧ conductive adhesive
160‧‧‧Strength
D1‧‧‧ first direction
D2‧‧‧ second direction
L1‧‧‧ first fold line
L2‧‧‧ second fold line
L3‧‧‧ third fold line
P1‧‧‧ first pit
P2‧‧‧ second pit
P3‧‧‧ third pit

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view of an electrically conductive paste of an embodiment of the present invention. 2 is a schematic view of the conductive bonding material of FIG. 1 in use. Figure 3 is a cross-sectional view of the conductive paste of Figure 1 taken along line I-I'. 4 to 6 are schematic cross-sectional views showing a conductive bonding material according to another modification of the present invention. 7 to 9 are schematic flow charts showing a method of bonding the conductive paste of FIG. 1 to a panel device.

100‧‧‧ Conductive materials

110‧‧‧First Fit

120‧‧‧Second Placing Department

130‧‧‧ buffer

132a and 132b‧‧‧ overlap zone

L1‧‧‧ first fold line

L2‧‧‧ second fold line

L3‧‧‧ third fold line

P1‧‧‧ first pit

P2‧‧‧ second pit

P3‧‧‧ third pit

Claims (31)

An electric conductive material comprising: a first bonding portion extending along a first direction; a second bonding portion extending along a second direction; and a buffer portion connecting the first bonding portion and the first portion a second bonding portion, wherein the buffer portion is bent, the boundary between the first bonding portion and the buffer portion is overlapped with the boundary between the second bonding portion and the buffer portion, and the buffer portion protrudes from the first portion Between the bonding portion and the second bonding portion, the second direction is different from the first direction. The conductive bonding material of claim 1, wherein the first bonding portion has a first folding line at a boundary between the first bonding portion and the buffer portion, and the buffer portion has a second folding line. The second bonding portion has a third folding line at the boundary between the second bonding portion and the buffer portion, and the buffer portion distinguishes two corresponding to the first folding line and the third folding line by the second folding line. In the overlap region, after the buffer portion is bent, the two overlapping regions overlap each other, and the third fold line is superposed on the first fold line to protrude between the first bonding portion and the second bonding portion. The conductive bonding material of claim 2, wherein the first bonding portion has a first concave portion, the buffer portion has a second concave portion and a third concave portion, the first concave point and The second concave point constitutes the first fold line, and the second concave point and the third concave point constitute the second fold line, and the buffer portion is bent and formed on the second conforming portion to coincide with the first The third fold line of the fold line. The conductive patch of claim 2, wherein the first fold line, the second fold line and the third fold line intersect at a same point, such that the buffer portion and the two overlap regions each have a triangular shape. The conductive adhesive material according to claim 1, comprising a conductive substrate and a conductive adhesive, the conductive substrate forming the first bonding portion, the second bonding portion and the buffer portion, the conductive adhesive Disposed on the conductive substrate. The conductive adhesive material according to claim 5, wherein the conductive adhesive material corresponds to the first bonding portion and the second bonding portion on the conductive substrate. The conductive adhesive material according to claim 6, wherein the conductive adhesive is located on the conductive substrate corresponding to the buffer portion, and the buffer portion is bent and then adhered to the conductive rubber. Partially protruding between the first bonding portion and the second bonding portion. The conductive material according to claim 5, wherein the conductive substrate comprises a conductive patch or a conductive metal sheet. The conductive adhesive material according to claim 5, further comprising a reinforcing material, wherein the reinforcing material and the conductive adhesive are respectively disposed on opposite surfaces of the conductive substrate. A panel device includes: an outer frame; a panel assembled to the outer frame; and a conductive bonding material, comprising: a first bonding portion extending along a first direction; and a second bonding portion along a Extending in the second direction; a buffering portion that connects the first bonding portion and the second bonding portion, the first bonding portion is attached to an edge of the panel, the second bonding portion is attached to the outer frame, and the buffer portion is After being bent, a boundary between the first bonding portion and the buffer portion is overlapped with a boundary between the second bonding portion and the buffer portion, and the buffer portion protrudes from the first bonding portion and the second bonding portion Between the portions, the second direction is different from the first direction. The panel device of claim 10, wherein the panel comprises a lower substrate and an upper substrate, the upper substrate is disposed on the lower substrate, and the first bonding portion is attached to the upper substrate and/or The edge of the lower substrate. The panel device of claim 11, wherein the panel further comprises at least one conductive member disposed on the upper substrate and/or the lower substrate, and the first bonding portion is attached to the conductive portion The edge of the upper substrate and/or the lower substrate causes the electric charge generated by the conductive member on the upper substrate and/or the lower substrate to be transmitted to the outer frame through the conductive paste. The panel device of claim 11, wherein the panel further comprises at least one polarizer disposed on the upper substrate and/or the lower substrate and exposing an edge of the upper substrate and/or the lower substrate And the first bonding portion is attached to the upper substrate and/or the edge of the lower substrate exposed by the polarizer. The panel device of claim 10, wherein the first bonding portion has a first fold line at an interface between the first bonding portion and the buffer portion, and the buffer portion has a second folding line. The second bonding portion has a third folding line at the boundary between the second bonding portion and the buffer portion, and the buffer portion is distinguished by the second folding line Corresponding to the two overlapping regions of the first fold line and the third fold line respectively, the buffer portion is bent, and the two overlapping regions overlap each other, and the third fold line is coincident with the first fold line to protrude from the first fit. Between the portion and the second bonding portion. The panel device of claim 14, wherein the first bonding portion has a first recess, the buffer portion has a second recess and a third recess, the first recess and the The second concave point constitutes the first fold line, and the second concave point and the third concave point constitute the second fold line, and the buffer portion is bent to form a coincidence on the first fold line on the second adhesive portion The third fold line. The panel device of claim 14, wherein the first fold line, the second fold line and the third fold line intersect at a same point such that the buffer portion and the two overlap regions each have a triangular shape. The panel device of claim 10, wherein the conductive paste comprises a conductive substrate and a conductive paste, the conductive substrate forming the first bonding portion, the second bonding portion and the buffer portion The conductive paste is disposed on the conductive substrate. The panel device of claim 17, wherein the conductive adhesive layer corresponds to the first bonding portion and the second bonding portion on the conductive substrate. The panel device of claim 18, wherein the conductive adhesive is located on the conductive substrate corresponding to the buffer portion, and the buffer portion is bent and then bonded to the two portions by the conductive adhesive. And protruding between the first bonding portion and the second bonding portion. The panel device of claim 17, wherein the conductive substrate comprises a conductive patch or a conductive metal sheet. The panel device of claim 17, wherein the conductive paste further comprises a reinforcing material, and the reinforcing material and the conductive adhesive are respectively disposed on opposite surfaces of the conductive substrate. A method for bonding a conductive material, which is suitable for bonding a conductive material to an outer frame of a panel device and a panel assembled to the outer frame, and the conductive material comprises a first bonding portion and a a second bonding portion and a buffer portion connecting the first bonding portion and the second bonding portion, and the bonding method of the conductive bonding material comprises: bonding the first bonding portion of the conductive bonding material to The edge of the panel extends the first bonding portion along a first direction; the buffer portion of the conductive bonding material is bent; and the second bonding portion of the conductive bonding material is attached to the outer frame, Extending the second bonding portion in a second direction, and after the buffer portion is bent, a boundary between the first bonding portion and the buffer portion is overlapped with a boundary between the second bonding portion and the buffer portion. And the buffer portion protrudes between the first bonding portion and the second bonding portion such that the second direction is different from the first direction. The method of bonding a conductive material according to claim 22, wherein the first bonding portion has a first folding line at a boundary between the first bonding portion and the buffer portion, the buffer portion having a a second fold line having a third fold line at a boundary between the second sticking portion and the buffer portion, wherein the buffer portion is respectively distinguished by the second fold line and corresponding to the first fold line and the first fold line The two overlapping regions of the three-fold line, and in the step of bending the buffer portion, the first bonding portion is a fixed end and the second bonding portion is a movable end along the first folding line and the second The polyline bends the buffer in sequence The portion of the first bonding portion and the second bonding portion protrudes between the first bonding portion and the second bonding portion. The method of bonding a conductive material according to claim 23, wherein the step of sequentially bending the buffer along the first fold line and the second fold line comprises bending along the first fold line toward a bend direction The buffer portion is folded, and the buffer portion is reversely bent in the bending direction along the second folding line, so that the two overlapping regions overlap each other and the third folding line overlaps the first folding line. The method of bonding a conductive material according to claim 23, wherein the first bonding portion has a first concave portion, the buffer portion has a second concave portion and a third concave portion, the first a pit and the second pit constitute the first fold line, the second pit and the third pit form the second fold line, and the buffer is sequentially bent along the first fold line and the second fold line In the step of the portion, the buffer portion is bent to form the third fold line superposed on the first fold line on the second bonding portion. The method of bonding a conductive material according to claim 23, wherein in the step of bending the buffer portion, the first fold line, the second fold line and the third fold line intersect at a same point, so that the The buffer portion and the two overlapping regions each have a triangular shape. The method of bonding a conductive material according to claim 22, wherein the conductive material comprises a conductive substrate and a conductive paste, the conductive substrate forming the first bonding portion and the second bonding And the buffer portion, the conductive paste is disposed on the conductive substrate to adhere to the panel and the outer frame. The method of bonding a conductive material according to claim 27, wherein the conductive adhesive layer corresponds to the first bonding portion and the second bonding portion on the conductive substrate, and the first A bonding portion is adhered to the edge of the panel with the conductive adhesive, and the second bonding portion is adhered to the outer frame with the conductive adhesive. The bonding method of the conductive material according to claim 28, wherein the conductive adhesive is located on the conductive substrate corresponding to the buffer portion, and in the step of bending the buffer portion, After the buffer portion is bent, the conductive adhesive is bonded to the two portions to protrude between the first bonding portion and the second bonding portion. The method of bonding a conductive material according to claim 27, wherein the conductive substrate comprises a conductive patch or a conductive metal sheet. The method of bonding a conductive material according to claim 27, wherein the conductive material further comprises a reinforcing material, and the reinforcing material and the conductive rubber are respectively disposed on opposite surfaces of the conductive substrate.