TWI608636B - 具非對稱性光形的發光裝置及其製造方法 - Google Patents

具非對稱性光形的發光裝置及其製造方法 Download PDF

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Publication number
TWI608636B
TWI608636B TW105102658A TW105102658A TWI608636B TW I608636 B TWI608636 B TW I608636B TW 105102658 A TW105102658 A TW 105102658A TW 105102658 A TW105102658 A TW 105102658A TW I608636 B TWI608636 B TW I608636B
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TW
Taiwan
Prior art keywords
horizontal direction
light
reflective
portions
led chip
Prior art date
Application number
TW105102658A
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English (en)
Chinese (zh)
Other versions
TW201727948A (zh
Inventor
傑 陳
王琮璽
Original Assignee
行家光電股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 行家光電股份有限公司 filed Critical 行家光電股份有限公司
Priority to TW105102658A priority Critical patent/TWI608636B/zh
Priority to US15/416,921 priority patent/US10230030B2/en
Priority to EP17153321.9A priority patent/EP3200248B1/en
Priority to KR1020170012784A priority patent/KR101908449B1/ko
Priority to JP2017012623A priority patent/JP6386110B2/ja
Publication of TW201727948A publication Critical patent/TW201727948A/zh
Application granted granted Critical
Publication of TWI608636B publication Critical patent/TWI608636B/zh
Priority to US16/251,056 priority patent/US10707391B2/en

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/814—Bodies having reflecting means, e.g. semiconductor Bragg reflectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls

Landscapes

  • Led Device Packages (AREA)
TW105102658A 2016-01-28 2016-01-28 具非對稱性光形的發光裝置及其製造方法 TWI608636B (zh)

Priority Applications (6)

Application Number Priority Date Filing Date Title
TW105102658A TWI608636B (zh) 2016-01-28 2016-01-28 具非對稱性光形的發光裝置及其製造方法
US15/416,921 US10230030B2 (en) 2016-01-28 2017-01-26 Light emitting device with asymmetrical radiation pattern and manufacturing method of the same
EP17153321.9A EP3200248B1 (en) 2016-01-28 2017-01-26 Light emitting device with asymmetrical radiation pattern and manufacturing method of the same
KR1020170012784A KR101908449B1 (ko) 2016-01-28 2017-01-26 비대칭 방사 패턴을 가진 발광 디바이스 및 제조 방법
JP2017012623A JP6386110B2 (ja) 2016-01-28 2017-01-27 非対称放射パターンを有する発光素子およびその製造方法
US16/251,056 US10707391B2 (en) 2016-01-28 2019-01-17 Light emitting device with asymmetrical radiation pattern and manufacturing method of the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW105102658A TWI608636B (zh) 2016-01-28 2016-01-28 具非對稱性光形的發光裝置及其製造方法

Publications (2)

Publication Number Publication Date
TW201727948A TW201727948A (zh) 2017-08-01
TWI608636B true TWI608636B (zh) 2017-12-11

Family

ID=59654072

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105102658A TWI608636B (zh) 2016-01-28 2016-01-28 具非對稱性光形的發光裝置及其製造方法

Country Status (3)

Country Link
JP (1) JP6386110B2 (ko)
KR (1) KR101908449B1 (ko)
TW (1) TWI608636B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11287106B1 (en) 2020-10-30 2022-03-29 Darwin Precisions Corporation Backlight module

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108400218B (zh) * 2018-01-22 2019-08-23 东莞中之光电股份有限公司 一种基于csp型式的led封装方法
CN110364608B (zh) * 2018-03-26 2022-02-25 行家光电股份有限公司 晶片级线型光源发光装置
JP6848997B2 (ja) * 2018-04-11 2021-03-24 日亜化学工業株式会社 発光装置
US10553768B2 (en) 2018-04-11 2020-02-04 Nichia Corporation Light-emitting device
JP7054005B2 (ja) 2018-09-28 2022-04-13 日亜化学工業株式会社 発光装置
US11784288B2 (en) * 2018-10-26 2023-10-10 Google Llc Light-emitting diodes with integrated optical elements
CN111162151A (zh) * 2018-11-07 2020-05-15 深圳市聚飞光电股份有限公司 一种led芯片封装方法及led灯珠
CN111162156A (zh) * 2018-11-07 2020-05-15 深圳市聚飞光电股份有限公司 一种led芯片封装方法及led灯珠
US20200203567A1 (en) * 2018-12-21 2020-06-25 Lumileds Holding B.V. Led package with increased contrast ratio
JP7454781B2 (ja) * 2020-01-28 2024-03-25 日亜化学工業株式会社 発光装置及びその製造方法
CN112563256B (zh) * 2020-12-07 2023-11-28 武汉华星光电技术有限公司 灯板、灯珠单元及其制备方法
TWI769065B (zh) * 2021-08-24 2022-06-21 友達光電股份有限公司 顯示裝置及其製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201425537A (zh) * 2012-09-21 2014-07-01 住友大阪水泥股份有限公司 複合波長變換粉體、含有複合波長變換粉體的樹脂組成物及發光裝置
TW201521238A (zh) * 2013-10-24 2015-06-01 東麗股份有限公司 螢光體組成物、螢光體片、螢光體片積層體及使用它們的ｌｅｄ晶片、ｌｅｄ封裝及其製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4144498B2 (ja) * 2002-10-01 2008-09-03 松下電器産業株式会社 線状光源装置及びその製造方法、並びに、面発光装置
JP2006216821A (ja) * 2005-02-04 2006-08-17 Citizen Electronics Co Ltd 発光ダイオード
US7791093B2 (en) * 2007-09-04 2010-09-07 Koninklijke Philips Electronics N.V. LED with particles in encapsulant for increased light extraction and non-yellow off-state color
KR101615497B1 (ko) * 2009-11-27 2016-04-27 삼성전자주식회사 발광소자 패키지 및 그 제조방법
JP2013127994A (ja) * 2010-03-29 2013-06-27 Sanyo Electric Co Ltd 発光装置、発光装置モジュール及び発光装置の製造方法
JP2012142426A (ja) * 2010-12-28 2012-07-26 Toshiba Corp Ｌｅｄパッケージ及びその製造方法
JP2013077679A (ja) * 2011-09-30 2013-04-25 Citizen Electronics Co Ltd 半導体発光装置とその製造方法
JP2013084690A (ja) * 2011-10-06 2013-05-09 Sharp Corp 発光ダイオードパッケージ、およびバックライト装置
US9810381B2 (en) * 2012-12-03 2017-11-07 Citizen Watch Co., Ltd. LED module
JP6694815B2 (ja) 2013-08-20 2020-05-20 ルミレッズ ホールディング ベーフェー 発光デバイス

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201425537A (zh) * 2012-09-21 2014-07-01 住友大阪水泥股份有限公司 複合波長變換粉體、含有複合波長變換粉體的樹脂組成物及發光裝置
TW201521238A (zh) * 2013-10-24 2015-06-01 東麗股份有限公司 螢光體組成物、螢光體片、螢光體片積層體及使用它們的ｌｅｄ晶片、ｌｅｄ封裝及其製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11287106B1 (en) 2020-10-30 2022-03-29 Darwin Precisions Corporation Backlight module

Also Published As

Publication number Publication date
KR101908449B1 (ko) 2018-10-17
KR20170090367A (ko) 2017-08-07
JP2017168819A (ja) 2017-09-21
TW201727948A (zh) 2017-08-01
JP6386110B2 (ja) 2018-09-05

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