TWI620337B - 太陽電池模組的製造方法 - Google Patents

太陽電池模組的製造方法 Download PDF

Info

Publication number: TWI620337B
Authority: TW; Taiwan
Prior art keywords: solar cell; adhesive film; cell module; width; manufacturing
Prior art date: 2013-04-30

Application number

TW103115108A

Other languages

English (en)

Chinese (zh)

Other versions

TW201503399A (zh

Inventor

伊藤由佳

広

堀內猛

竹村賢三

Original Assignee

日立化成股份有限公司

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2013-04-30

Filing date

2014-04-28

Publication date

2018-04-01

2014-04-28 Application filed by 日立化成股份有限公司 filed Critical 日立化成股份有限公司

2015-01-16 Publication of TW201503399A publication Critical patent/TW201503399A/zh

2018-04-01 Application granted granted Critical

2018-04-01 Publication of TWI620337B publication Critical patent/TWI620337B/zh

Links

238000004519 manufacturing process Methods 0.000 title claims abstract description 42
239000002313 adhesive film Substances 0.000 claims abstract description 86
238000000034 method Methods 0.000 claims abstract description 32
238000003825 pressing Methods 0.000 claims abstract description 23
239000012528 membrane Substances 0.000 claims 1
229920005989 resin Polymers 0.000 abstract description 38
239000011347 resin Substances 0.000 abstract description 38
239000002245 particle Substances 0.000 description 33
230000000052 comparative effect Effects 0.000 description 16
239000000758 substrate Substances 0.000 description 16
239000003795 chemical substances by application Substances 0.000 description 15
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
239000000853 adhesive Substances 0.000 description 12
230000001070 adhesive effect Effects 0.000 description 11
RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 8
229910000679 solder Inorganic materials 0.000 description 8
229920001187 thermosetting polymer Polymers 0.000 description 8
229910052759 nickel Inorganic materials 0.000 description 6
-1 amine imides Chemical class 0.000 description 5
RJGDLRCDCYRQOQ-UHFFFAOYSA-N anthrone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3CC2=C1 RJGDLRCDCYRQOQ-UHFFFAOYSA-N 0.000 description 5
239000003822 epoxy resin Substances 0.000 description 5
238000010438 heat treatment Methods 0.000 description 5
229910052751 metal Inorganic materials 0.000 description 5
239000002184 metal Substances 0.000 description 5
229920000647 polyepoxide Polymers 0.000 description 5
BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
229910052782 aluminium Inorganic materials 0.000 description 4
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
239000011247 coating layer Substances 0.000 description 4
238000002788 crimping Methods 0.000 description 4
239000011521 glass Substances 0.000 description 4
229910052709 silver Inorganic materials 0.000 description 4
239000004332 silver Substances 0.000 description 4
239000004593 Epoxy Substances 0.000 description 3
238000012790 confirmation Methods 0.000 description 3
239000007822 coupling agent Substances 0.000 description 3
238000005336 cracking Methods 0.000 description 3
230000000694 effects Effects 0.000 description 3
229920001971 elastomer Polymers 0.000 description 3
239000010419 fine particle Substances 0.000 description 3
239000000463 material Substances 0.000 description 3
230000002940 repellent Effects 0.000 description 3
239000005871 repellent Substances 0.000 description 3
239000005060 rubber Substances 0.000 description 3
150000003839 salts Chemical class 0.000 description 3
238000007789 sealing Methods 0.000 description 3
238000012360 testing method Methods 0.000 description 3
QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
229920000800 acrylic rubber Polymers 0.000 description 2
150000001412 amines Chemical class 0.000 description 2
PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
238000007664 blowing Methods 0.000 description 2
239000011248 coating agent Substances 0.000 description 2
238000000576 coating method Methods 0.000 description 2
229910052802 copper Inorganic materials 0.000 description 2
239000010949 copper Substances 0.000 description 2
229930003836 cresol Natural products 0.000 description 2
QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
YLQWCDOCJODRMT-UHFFFAOYSA-N fluoren-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3C2=C1 YLQWCDOCJODRMT-UHFFFAOYSA-N 0.000 description 2
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
229910052737 gold Inorganic materials 0.000 description 2
239000010931 gold Substances 0.000 description 2
239000011159 matrix material Substances 0.000 description 2
239000003094 microcapsule Substances 0.000 description 2
238000012986 modification Methods 0.000 description 2
230000004048 modification Effects 0.000 description 2
229920003986 novolac Polymers 0.000 description 2
239000005011 phenolic resin Substances 0.000 description 2
229920000058 polyacrylate Polymers 0.000 description 2
229920000768 polyamine Polymers 0.000 description 2
229920000139 polyethylene terephthalate Polymers 0.000 description 2
239000005020 polyethylene terephthalate Substances 0.000 description 2
239000004065 semiconductor Substances 0.000 description 2
150000003463 sulfur Chemical class 0.000 description 2
229920001169 thermoplastic Polymers 0.000 description 2
238000003466 welding Methods 0.000 description 2
XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
LGZNZXOHAFRWEN-UHFFFAOYSA-N 3-[4-(2,5-dioxopyrrol-3-yl)triazin-5-yl]pyrrole-2,5-dione Chemical compound O=C1NC(=O)C(C=2C(=NN=NC=2)C=2C(NC(=O)C=2)=O)=C1 LGZNZXOHAFRWEN-UHFFFAOYSA-N 0.000 description 1
229910015900 BF3 Inorganic materials 0.000 description 1
229930185605 Bisphenol Natural products 0.000 description 1
ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
239000004594 Masterbatch (MB) Substances 0.000 description 1
ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
239000006087 Silane Coupling Agent Substances 0.000 description 1
RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
INKDAKMSOSCDGL-UHFFFAOYSA-N [O].OC1=CC=CC=C1 Chemical compound [O].OC1=CC=CC=C1 INKDAKMSOSCDGL-UHFFFAOYSA-N 0.000 description 1
150000008065 acid anhydrides Chemical class 0.000 description 1
NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
239000004840 adhesive resin Substances 0.000 description 1
229920006223 adhesive resin Polymers 0.000 description 1
230000015572 biosynthetic process Effects 0.000 description 1
IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
230000000903 blocking effect Effects 0.000 description 1
229910052796 boron Inorganic materials 0.000 description 1
WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Substances FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 1
238000001354 calcination Methods 0.000 description 1
229910052799 carbon Inorganic materials 0.000 description 1
238000005253 cladding Methods 0.000 description 1
239000011246 composite particle Substances 0.000 description 1
238000007796 conventional method Methods 0.000 description 1
239000013078 crystal Substances 0.000 description 1
230000008021 deposition Effects 0.000 description 1
239000004205 dimethyl polysiloxane Substances 0.000 description 1
235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
238000001035 drying Methods 0.000 description 1
230000007613 environmental effect Effects 0.000 description 1
239000005038 ethylene vinyl acetate Substances 0.000 description 1
238000010304 firing Methods 0.000 description 1
239000011888 foil Substances 0.000 description 1
238000007731 hot pressing Methods 0.000 description 1
125000002883 imidazolyl group Chemical group 0.000 description 1
AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
239000010410 layer Substances 0.000 description 1
239000007788 liquid Substances 0.000 description 1
238000005065 mining Methods 0.000 description 1
239000000203 mixture Substances 0.000 description 1
150000002923 oximes Chemical class 0.000 description 1
229920001568 phenolic resin Polymers 0.000 description 1
KHUXNRRPPZOJPT-UHFFFAOYSA-N phenoxy radical Chemical group O=C1C=C[CH]C=C1 KHUXNRRPPZOJPT-UHFFFAOYSA-N 0.000 description 1
239000004033 plastic Substances 0.000 description 1
229920003023 plastic Polymers 0.000 description 1
229920003192 poly(bis maleimide) Polymers 0.000 description 1
229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
229920006122 polyamide resin Polymers 0.000 description 1
229920001225 polyester resin Polymers 0.000 description 1
239000004645 polyester resin Substances 0.000 description 1
229920001721 polyimide Polymers 0.000 description 1
239000009719 polyimide resin Substances 0.000 description 1
229920001296 polysiloxane Polymers 0.000 description 1
229920002635 polyurethane Polymers 0.000 description 1
239000004814 polyurethane Substances 0.000 description 1
229920005749 polyurethane resin Polymers 0.000 description 1
230000001681 protective effect Effects 0.000 description 1
239000011342 resin composition Substances 0.000 description 1
238000010008 shearing Methods 0.000 description 1
239000000377 silicon dioxide Substances 0.000 description 1
238000005476 soldering Methods 0.000 description 1
239000002904 solvent Substances 0.000 description 1
239000000126 substance Substances 0.000 description 1
238000012546 transfer Methods 0.000 description 1
229920006337 unsaturated polyester resin Polymers 0.000 description 1

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/137—Batch treatment of the devices
- H10F71/1375—Apparatus for automatic interconnection of photovoltaic cells in a module
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/90—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers
- H10F19/902—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells
- H10F19/904—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells characterised by the shapes of the structures
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/93—Interconnections
- H10F77/933—Interconnections for devices having potential barriers
- H10F77/935—Interconnections for devices having potential barriers for photovoltaic devices or modules
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

Photovoltaic Devices (AREA)

TW103115108A 2013-04-30 2014-04-28 太陽電池模組的製造方法 TWI620337B (zh)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2013095559		2013-04-30
JP2013-095559		2013-04-30

Publications (2)

Publication Number	Publication Date
TW201503399A TW201503399A (zh)	2015-01-16
TWI620337B true TWI620337B (zh)	2018-04-01

Family

ID=51807321

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW103115108A TWI620337B (zh)	2013-04-30	2014-04-28	太陽電池模組的製造方法

Country Status (3)

Country	Link
JP (1)	JP6326890B2 (ja)
CN (1)	CN104134719B (ja)
TW (1)	TWI620337B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP6986726B2 (ja) *	2017-02-28	2021-12-22	アートビーム有限会社	太陽電池および太陽電池の製造方法
CN110277458A (zh) *	2017-03-09	2019-09-24	伟创力有限公司	叠瓦式阵列太阳能电池及制造包括叠瓦式阵列太阳能电池的太阳能组件的方法
TWI631814B (zh)	2017-08-11	2018-08-01	財團法人工業技術研究院	太陽光電模組
WO2019159255A1 (ja) *	2018-02-14	2019-08-22	三菱電機株式会社	太陽電池モジュールの製造方法

Citations (6)

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TW201010111A (en) *	2008-05-09	2010-03-01	Kuraray Europe Gmbh	Method for producing photovoltaic modules in a vacuum laminator with reduced process vacuum
WO2012077784A1 (ja) *	2010-12-09	2012-06-14	ソニーケミカル＆インフォメーションデバイス株式会社	太陽電池モジュール及び太陽電池モジュールの製造方法
TW201241137A (en) *	2011-02-18	2012-10-16	3M Innovative Properties Co	Adhesive tape and solar assembly and article made thereof
CN102769064A (zh) *	2011-05-05	2012-11-07	中国科学院微电子研究所	一种太阳能电池正面栅线电极的制备方法
CN102810530A (zh) *	2011-05-31	2012-12-05	日立化成工业株式会社	太阳能电池单元
TW201308674A (zh) *	2011-08-09	2013-02-16	晶元光電股份有限公司	光電元件與其製造方法

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JP5052154B2 (ja) *	2007-02-16	2012-10-17	三洋電機株式会社	太陽電池モジュールの製造方法
JP5101409B2 (ja) *	2008-03-25	2012-12-19	有限会社エコ＆エンジニアリング	太陽電池素子の接続方法及び接続装置
JP5072759B2 (ja) *	2008-07-25	2012-11-14	三洋電機株式会社	太陽電池の製造方法及び太陽電池モジュールの製造方法
JP5602498B2 (ja) *	2009-07-30	2014-10-08	三洋電機株式会社	太陽電池モジュール
JP5648638B2 (ja) *	2009-08-19	2015-01-07	三洋電機株式会社	太陽電池、太陽電池モジュールおよび太陽電池システム
JP5480120B2 (ja) *	2010-12-07	2014-04-23	デクセリアルズ株式会社	太陽電池モジュール、太陽電池モジュールの製造方法、太陽電池セル及びタブ線の接続方法
KR101732633B1 (ko) *	2011-05-26	2017-05-04	엘지전자 주식회사	태양전지 모듈
JP2013033819A (ja) *	2011-08-01	2013-02-14	Jx Nippon Oil & Energy Corp	太陽電池モジュール及びその製造方法
JP5840418B2 (ja) *	2011-08-23	2016-01-06	デクセリアルズ株式会社	導電性接着剤及び太陽電池モジュール
JP5877604B2 (ja) *	2011-09-05	2016-03-08	デクセリアルズ株式会社	太陽電池モジュールの製造方法、太陽電池モジュール及びタブ線の接続方法

2014
- 2014-03-20 JP JP2014058443A patent/JP6326890B2/ja not_active Expired - Fee Related
- 2014-04-28 TW TW103115108A patent/TWI620337B/zh not_active IP Right Cessation
- 2014-04-29 CN CN201410177439.1A patent/CN104134719B/zh not_active Expired - Fee Related

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Publication number	Priority date	Publication date	Assignee	Title
TW201010111A (en) *	2008-05-09	2010-03-01	Kuraray Europe Gmbh	Method for producing photovoltaic modules in a vacuum laminator with reduced process vacuum
WO2012077784A1 (ja) *	2010-12-09	2012-06-14	ソニーケミカル＆インフォメーションデバイス株式会社	太陽電池モジュール及び太陽電池モジュールの製造方法
TW201241137A (en) *	2011-02-18	2012-10-16	3M Innovative Properties Co	Adhesive tape and solar assembly and article made thereof
CN102769064A (zh) *	2011-05-05	2012-11-07	中国科学院微电子研究所	一种太阳能电池正面栅线电极的制备方法
CN102810530A (zh) *	2011-05-31	2012-12-05	日立化成工业株式会社	太阳能电池单元
TW201308674A (zh) *	2011-08-09	2013-02-16	晶元光電股份有限公司	光電元件與其製造方法

Also Published As

Publication number	Publication date
CN104134719A (zh)	2014-11-05
JP6326890B2 (ja)	2018-05-23
TW201503399A (zh)	2015-01-16
JP2014232864A (ja)	2014-12-11
CN104134719B (zh)	2018-05-04

Legal Events

Date	Code	Title	Description
2025-01-01	MM4A	Annulment or lapse of patent due to non-payment of fees

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