TWI665752B - 重複地測量位於自動裝配機區域中的元件載體 - Google Patents

重複地測量位於自動裝配機區域中的元件載體 Download PDF

Info

Publication number: TWI665752B
Authority: TW; Taiwan
Prior art keywords: component carrier; components; mark; assembly; detected
Prior art date: 2015-04-22

Application number

TW105109102A

Other languages

English (en)

Chinese (zh)

Other versions

TW201642730A (zh

Inventor

克里斯托夫格魯伯

賴克特蕾芙

西爾維斯特德梅爾

鮑里斯布爾德克

Original Assignee

德商先進裝配系統有限責任兩合公司

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2015-04-22

Filing date

2016-03-24

Publication date

2019-07-11

2016-03-24 Application filed by 德商先進裝配系統有限責任兩合公司 filed Critical 德商先進裝配系統有限責任兩合公司

2016-12-01 Publication of TW201642730A publication Critical patent/TW201642730A/zh

2019-07-11 Application granted granted Critical

2019-07-11 Publication of TWI665752B publication Critical patent/TWI665752B/zh

Links

238000000034 method Methods 0.000 claims abstract description 63
238000004590 computer program Methods 0.000 claims abstract description 13
238000005259 measurement Methods 0.000 claims description 22
230000008569 process Effects 0.000 claims description 20
239000003550 marker Substances 0.000 claims description 13
238000012545 processing Methods 0.000 claims description 13
238000001514 detection method Methods 0.000 claims description 6
238000012544 monitoring process Methods 0.000 claims description 5
230000008859 change Effects 0.000 claims description 4
238000006073 displacement reaction Methods 0.000 description 22
239000000969 carrier Substances 0.000 description 8
230000036961 partial effect Effects 0.000 description 6
239000010902 straw Substances 0.000 description 4
230000008901 benefit Effects 0.000 description 3
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230000003287 optical effect Effects 0.000 description 3
230000009467 reduction Effects 0.000 description 3
238000005516 engineering process Methods 0.000 description 2
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238000012546 transfer Methods 0.000 description 2
235000012431 wafers Nutrition 0.000 description 2
238000012935 Averaging Methods 0.000 description 1
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
230000002411 adverse Effects 0.000 description 1
238000003491 array Methods 0.000 description 1
238000006243 chemical reaction Methods 0.000 description 1
229910052802 copper Inorganic materials 0.000 description 1
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230000001934 delay Effects 0.000 description 1
230000001419 dependent effect Effects 0.000 description 1
230000007613 environmental effect Effects 0.000 description 1
238000004519 manufacturing process Methods 0.000 description 1
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238000000053 physical method Methods 0.000 description 1
230000000630 rising effect Effects 0.000 description 1
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230000036962 time dependent Effects 0.000 description 1
239000002918 waste heat Substances 0.000 description 1

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0015—Orientation; Alignment; Positioning
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0456—Mounting of components, e.g. of leadless components simultaneously punching the circuit board
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/083—Quality monitoring using results from monitoring devices, e.g. feedback loops
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/089—Calibration, teaching or correction of mechanical systems, e.g. of the mounting head
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Operations Research (AREA)
Supply And Installment Of Electrical Components (AREA)
Automatic Assembly (AREA)

TW105109102A 2015-04-22 2016-03-24 重複地測量位於自動裝配機區域中的元件載體 TWI665752B (zh)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
??102015106224.0		2015-04-22
DE102015106224.0A DE102015106224B4 (de)	2015-04-22	2015-04-22	Verfahren zum wiederholten Vermessen eines in einem Bestückbereich eines Bestückautomaten befindlichen Bauelementeträgers sowie Bestückautomat und Computerprogramm zur Durchführung dieses Verfahrens

Publications (2)

Publication Number	Publication Date
TW201642730A TW201642730A (zh)	2016-12-01
TWI665752B true TWI665752B (zh)	2019-07-11

Family

ID=57110795

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW105109102A TWI665752B (zh)	2015-04-22	2016-03-24	重複地測量位於自動裝配機區域中的元件載體

Country Status (4)

Country	Link
CN (1)	CN106068073B (de)
AT (1)	AT517157B1 (de)
DE (1)	DE102015106224B4 (de)
TW (1)	TWI665752B (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN107498286A (zh) *	2017-10-09	2017-12-22	上海玖锶自动化技术有限公司	一种适用于agv的装配方法及系统及流水线
DE102017131322B4 (de) *	2017-12-27	2019-07-04	Asm Assembly Systems Gmbh & Co. Kg	Verwenden von bestückfähigen Markierungsbausteinen für ein stufenweises Bestücken eines Trägers mit Bauelementen
DE102020113002B3 (de) *	2020-05-13	2021-08-26	Asm Assembly Systems Gmbh & Co. Kg	Bestimmen der Genauigkeit einer Bestückmaschine bei mehrfacher Verwendung eines Test-Bauelements
DE102020115598B3 (de) *	2020-06-12	2021-08-26	Asm Assembly Systems Gmbh & Co. Kg	Verfahren und Bestückmaschine zum Bestücken von Bauelementeträgern basierend auf einem Rekalibrieren der Bestückmaschine im realen Bestückbetrieb, Computerprogramm zum Steuern einer Bestückmaschine
DE102021120270B3 (de) *	2021-08-04	2022-10-27	Asm Assembly Systems Gmbh & Co. Kg	Verfahren zum Erfassen von eindeutigen Bauelementkennungen von elektronischen Bauelementen in einem Bestückvorgang eines Bestückautomaten sowie Bestückautomat

Citations (8)

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JPH0413530A (ja) *	1990-04-27	1992-01-17	Mitsubishi Electric Corp	産業用組立ロボット教示方法
JPH07273494A (ja) *	1994-03-30	1995-10-20	Matsushita Electric Ind Co Ltd	電子部品実装方法
US20020044432A1 (en) *	2000-06-12	2002-04-18	Matsushita Electric Industrial Co., Ltd.	Component mounting method and component mounting apparatus
EP1437933A2 (de) *	2003-01-09	2004-07-14	Siemens Aktiengesellschaft	Vorrichtung zum Bestücken von Substraten mit Bauelementen und Verfahren zum Kalibrieren einer solchen Vorrichtung
JP2004260223A (ja) *	2004-06-17	2004-09-16	Fujitsu Ltd	半導体ベアチップ実装装置
US20040245319A1 (en) *	2003-06-03	2004-12-09	Asm Assembly Automation Ltd.	Substrate alignment method and apparatus
TW200715436A (en) *	2005-08-24	2007-04-16	Shibaura Mechatronics Corp	Electronic component mounting device and method
TW201337483A (zh) *	2012-03-14	2013-09-16	Giga Byte Tech Co Ltd	電路板定位校正系統及方法

Family Cites Families (5)

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Publication number	Priority date	Publication date	Assignee	Title
CH698357B1 (de) *	2006-12-22	2013-09-13	Kulicke & Soffa Die Bonding Gmbh	Verfahren zum Kalibrieren der x-y Positionierung eines Positionierwerkzeugs, sowie Vorrichtung mit einem derartigen Positionierwerkzeug.
CH698334B1 (de) *	2007-10-09	2011-07-29	Esec Ag	Verfahren für die Entnahme und Montage von auf einem Wafertisch bereitgestellten Halbleiterchips auf einem Substrat.
WO2009047214A2 (en) *	2007-10-09	2009-04-16	Oerlikon Assembly Equipment Ag, Steinhausen	Method for picking up semiconductor chips from a wafer table and mounting the removed semiconductor chips on a substrate
US8492175B1 (en)	2011-11-28	2013-07-23	Applied Micro Circuits Corporation	System and method for aligning surface mount devices on a substrate
DE102013204590B3 (de) *	2013-03-15	2014-07-24	Asm Assembly Systems Gmbh & Co. Kg	Erkennen eines schwingenden Bauelementeträgers während einer Bestückung mit Bauelementen

2015
- 2015-04-22 DE DE102015106224.0A patent/DE102015106224B4/de active Active
2016
- 2016-03-24 TW TW105109102A patent/TWI665752B/zh active
- 2016-04-08 CN CN201610217862.9A patent/CN106068073B/zh active Active
- 2016-04-20 AT ATA205/2016A patent/AT517157B1/de active

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH0413530A (ja) *	1990-04-27	1992-01-17	Mitsubishi Electric Corp	産業用組立ロボット教示方法
JPH07273494A (ja) *	1994-03-30	1995-10-20	Matsushita Electric Ind Co Ltd	電子部品実装方法
US20020044432A1 (en) *	2000-06-12	2002-04-18	Matsushita Electric Industrial Co., Ltd.	Component mounting method and component mounting apparatus
EP1437933A2 (de) *	2003-01-09	2004-07-14	Siemens Aktiengesellschaft	Vorrichtung zum Bestücken von Substraten mit Bauelementen und Verfahren zum Kalibrieren einer solchen Vorrichtung
US20040245319A1 (en) *	2003-06-03	2004-12-09	Asm Assembly Automation Ltd.	Substrate alignment method and apparatus
JP2004260223A (ja) *	2004-06-17	2004-09-16	Fujitsu Ltd	半導体ベアチップ実装装置
TW200715436A (en) *	2005-08-24	2007-04-16	Shibaura Mechatronics Corp	Electronic component mounting device and method
TW201337483A (zh) *	2012-03-14	2013-09-16	Giga Byte Tech Co Ltd	電路板定位校正系統及方法

Also Published As

Publication number	Publication date
DE102015106224B4 (de)	2022-09-01
AT517157A3 (de)	2017-09-15
DE102015106224A1 (de)	2016-10-27
CN106068073B (zh)	2020-05-01
TW201642730A (zh)	2016-12-01
CN106068073A (zh)	2016-11-02
AT517157B1 (de)	2019-10-15
AT517157A2 (de)	2016-11-15

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TWI665752B (zh)	2019-07-11	重複地測量位於自動裝配機區域中的元件載體
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JPH0829458B2 (ja)	1996-03-27	部品の自動マウント方法
JP5884273B2 (ja)	2016-03-15	露光ユニット及び基板のプリアライメント方法