TWI726098B - 金屬/樹脂積層體之製造方法及電氣電子機器 - Google Patents

金屬/樹脂積層體之製造方法及電氣電子機器 Download PDF

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Publication number
TWI726098B
TWI726098B TW106115286A TW106115286A TWI726098B TW I726098 B TWI726098 B TW I726098B TW 106115286 A TW106115286 A TW 106115286A TW 106115286 A TW106115286 A TW 106115286A TW I726098 B TWI726098 B TW I726098B
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TW
Taiwan
Prior art keywords
film
resin
release film
manufacturing
polyamide
Prior art date
Application number
TW106115286A
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English (en)
Chinese (zh)
Other versions
TW201811528A (zh
Inventor
清水勝
志摩健二
Original Assignee
日商三井化學東賽璐股份有限公司
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Publication of TW201811528A publication Critical patent/TW201811528A/zh
Application granted granted Critical
Publication of TWI726098B publication Critical patent/TWI726098B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
TW106115286A 2016-05-16 2017-05-09 金屬/樹脂積層體之製造方法及電氣電子機器 TWI726098B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-098229 2016-05-16
JP2016098229A JP2017205902A (ja) 2016-05-16 2016-05-16 多層プリント配線板の製造に好適な離型フィルム

Publications (2)

Publication Number Publication Date
TW201811528A TW201811528A (zh) 2018-04-01
TWI726098B true TWI726098B (zh) 2021-05-01

Family

ID=60325078

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106115286A TWI726098B (zh) 2016-05-16 2017-05-09 金屬/樹脂積層體之製造方法及電氣電子機器

Country Status (5)

Country Link
JP (1) JP2017205902A (ja)
KR (1) KR20180126013A (ja)
CN (1) CN109070399B (ja)
TW (1) TWI726098B (ja)
WO (1) WO2017199764A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7408286B2 (ja) * 2019-03-11 2024-01-05 三井化学東セロ株式会社 離型フィルムおよび電子装置の製造方法
CN113557136B (zh) * 2019-03-28 2024-02-02 三井化学东赛璐株式会社 印刷线路基板制程用离型膜、印刷基板的制造方法、印刷基板制造装置及印刷基板
CN110591591B (zh) * 2019-09-05 2020-12-01 深圳市柳鑫实业股份有限公司 一种绝缘介质胶膜及其制备方法、多层印刷线路板
WO2021079746A1 (ja) * 2019-10-24 2021-04-29 昭和電工マテリアルズ株式会社 離型フィルム及び半導体パッケージの製造方法
WO2021172257A1 (ja) * 2020-02-28 2021-09-02 三井化学東セロ株式会社 多層離型フィルム
KR102909749B1 (ko) * 2022-07-22 2026-01-09 피아이첨단소재 주식회사 폴리이미드 필름 및 이의 제조방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1533888A (zh) * 2003-03-31 2004-10-06 ������������ʽ���� 阻透性层积膜及其制造方法
TW201431661A (zh) * 2012-10-19 2014-08-16 Mitsui Chemicals Tohcello Inc 離型薄膜

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1160633A (zh) * 1996-03-21 1997-10-01 日立化成工业株式会社 覆铜箔层压板、多层覆铜箔层压板及其制备工艺
WO2004087401A1 (ja) * 2003-03-28 2004-10-14 Mitsui Chemicals, Inc. 延伸フィルムおよびその製造方法
DE102005051126A1 (de) * 2005-10-26 2007-05-03 Degussa Gmbh Folie mit Deckschicht aus einer Polyamidzusammensetzung
JP5111508B2 (ja) * 2007-08-22 2013-01-09 ユニチカ株式会社 離型用シート
JP4992626B2 (ja) * 2007-09-14 2012-08-08 三菱エンジニアリングプラスチックス株式会社 熱プレス成形用離型フィルム
JP2012209322A (ja) * 2011-03-29 2012-10-25 Toppan Printing Co Ltd 配線基板の製造方法
JP6127514B2 (ja) * 2011-08-11 2017-05-17 東レ株式会社 離型用ポリアリーレンスルフィドフィルムおよびこれを用いた熱硬化性樹脂成形体の製造方法
JP6126446B2 (ja) * 2013-04-24 2017-05-10 三井化学東セロ株式会社 離型フィルムおよびｌｅｄ素子封止体の製造方法
JP2015227437A (ja) * 2014-05-09 2015-12-17 三菱レイヨン株式会社 活性エネルギー線硬化性樹脂組成物、その硬化膜を用いた積層体及び成形体

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1533888A (zh) * 2003-03-31 2004-10-06 ������������ʽ���� 阻透性层积膜及其制造方法
TW201431661A (zh) * 2012-10-19 2014-08-16 Mitsui Chemicals Tohcello Inc 離型薄膜

Also Published As

Publication number Publication date
JP2017205902A (ja) 2017-11-24
KR20180126013A (ko) 2018-11-26
WO2017199764A1 (ja) 2017-11-23
CN109070399B (zh) 2021-01-26
CN109070399A (zh) 2018-12-21
TW201811528A (zh) 2018-04-01

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