TWI731428B - 晶圓的製造方法、線鋸用再利用漿料的品質評估方法、及線鋸用已使用之漿料的品質評估方法 - Google Patents

晶圓的製造方法、線鋸用再利用漿料的品質評估方法、及線鋸用已使用之漿料的品質評估方法 Download PDF

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Publication number: TWI731428B
Authority: TW; Taiwan
Prior art keywords: slurry; particles; tank; particle size; small
Prior art date: 2018-11-16

Application number

TW108135845A

Other languages

English (en)

Chinese (zh)

Other versions

TW202037775A (zh

Inventor

利根俊輔

鈴木一彦

南畑祐司

舟山誠

Original Assignee

日商Ｓｕｍｃｏ股份有限公司

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2018-11-16

Filing date

2019-10-03

Publication date

2021-06-21

2019-10-03 Application filed by 日商Ｓｕｍｃｏ股份有限公司 filed Critical 日商Ｓｕｍｃｏ股份有限公司

2020-10-16 Publication of TW202037775A publication Critical patent/TW202037775A/zh

2021-06-21 Application granted granted Critical

2021-06-21 Publication of TWI731428B publication Critical patent/TWI731428B/zh

Links

239000002002 slurry Substances 0.000 title claims abstract description 263
238000004519 manufacturing process Methods 0.000 title claims abstract description 20
238000000034 method Methods 0.000 title claims description 84
238000013441 quality evaluation Methods 0.000 title description 14
239000002245 particle Substances 0.000 claims abstract description 259
239000002826 coolant Substances 0.000 claims abstract description 70
239000006061 abrasive grain Substances 0.000 claims abstract description 61
238000012545 processing Methods 0.000 claims abstract description 29
238000009826 distribution Methods 0.000 claims abstract description 17
235000012431 wafers Nutrition 0.000 claims description 46
238000004064 recycling Methods 0.000 claims description 38
238000002360 preparation method Methods 0.000 claims description 13
238000002156 mixing Methods 0.000 claims description 11
238000012958 reprocessing Methods 0.000 claims description 10
230000005484 gravity Effects 0.000 claims description 9
238000005259 measurement Methods 0.000 claims description 7
238000000227 grinding Methods 0.000 claims description 3
238000011867 re-evaluation Methods 0.000 claims 1
230000006866 deterioration Effects 0.000 abstract description 5
230000000087 stabilizing effect Effects 0.000 abstract 1
238000000926 separation method Methods 0.000 description 37
239000007788 liquid Substances 0.000 description 32
238000011084 recovery Methods 0.000 description 13
XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 11
238000005520 cutting process Methods 0.000 description 9
229910052710 silicon Inorganic materials 0.000 description 7
239000010703 silicon Substances 0.000 description 7
DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
238000005498 polishing Methods 0.000 description 5
LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
238000010586 diagram Methods 0.000 description 4
238000011156 evaluation Methods 0.000 description 4
239000013078 crystal Substances 0.000 description 3
MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
239000000463 material Substances 0.000 description 3
HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
229910010271 silicon carbide Inorganic materials 0.000 description 3
238000004364 calculation method Methods 0.000 description 2
WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
239000000203 mixture Substances 0.000 description 2
239000004065 semiconductor Substances 0.000 description 2
229910052580 B4C Inorganic materials 0.000 description 1
229910052582 BN Inorganic materials 0.000 description 1
PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
229910052581 Si3N4 Inorganic materials 0.000 description 1
238000005299 abrasion Methods 0.000 description 1
238000004458 analytical method Methods 0.000 description 1
INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
238000004140 cleaning Methods 0.000 description 1
150000001875 compounds Chemical class 0.000 description 1
230000001186 cumulative effect Effects 0.000 description 1
229910003460 diamond Inorganic materials 0.000 description 1
239000010432 diamond Substances 0.000 description 1
239000006185 dispersion Substances 0.000 description 1
238000005530 etching Methods 0.000 description 1
239000011521 glass Substances 0.000 description 1
230000001771 impaired effect Effects 0.000 description 1
239000012535 impurity Substances 0.000 description 1
239000003960 organic solvent Substances 0.000 description 1
TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
239000003507 refrigerant Substances 0.000 description 1
230000008929 regeneration Effects 0.000 description 1
238000011069 regeneration method Methods 0.000 description 1
238000011160 research Methods 0.000 description 1
HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
238000007613 slurry method Methods 0.000 description 1
239000000758 substrate Substances 0.000 description 1
230000001629 suppression Effects 0.000 description 1
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1

Images

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0633—Grinders for cutting-off using a cutting wire
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0683—Accessories therefor
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material

Landscapes

Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Mechanical Treatment Of Semiconductor (AREA)
Processing Of Stones Or Stones Resemblance Materials (AREA)
Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Grinding-Machine Dressing And Accessory Apparatuses (AREA)

TW108135845A 2018-11-16 2019-10-03 晶圓的製造方法、線鋸用再利用漿料的品質評估方法、及線鋸用已使用之漿料的品質評估方法 TWI731428B (zh)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2018215822A JP7003897B2 (ja)	2018-11-16	2018-11-16	ウェーハの製造方法、ワイヤーソー用再利用スラリーの品質評価方法、及びワイヤーソー用使用済みスラリーの品質評価方法
JP2018-215822		2018-11-16

Publications (2)

Publication Number	Publication Date
TW202037775A TW202037775A (zh)	2020-10-16
TWI731428B true TWI731428B (zh)	2021-06-21

Family

ID=70741641

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW108135845A TWI731428B (zh)	2018-11-16	2019-10-03	晶圓的製造方法、線鋸用再利用漿料的品質評估方法、及線鋸用已使用之漿料的品質評估方法

Country Status (3)

Country	Link
JP (1)	JP7003897B2 (ja)
CN (1)	CN111195991A (ja)
TW (1)	TWI731428B (ja)

Citations (3)

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TW363914B (en) *	1996-02-21	1999-07-11	Shinetsu Handotai Kk	Recycling system for water soluble sludge waste
JP2011005561A (ja) *	2009-06-23	2011-01-13	Shin Etsu Handotai Co Ltd	シリコンインゴットの切断方法および切断システム
TW201630810A (zh) *	2015-01-19	2016-09-01	福吉米股份有限公司	改質膠態矽及製造方法以及使用其之研磨劑

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JPH10100141A (ja) *	1996-10-02	1998-04-21	Mitsubishi Materials Shilicon Corp	ワイヤソ−のスラリ−供給装置およびインゴットの切断方法
JP2000263452A (ja) *	1999-03-12	2000-09-26	Osaka Diamond Ind Co Ltd	超砥粒ワイヤソー
JP4248895B2 (ja)	2003-02-27	2009-04-02	ＳｕｍｃｏＴｅｃｈｘｉｖ株式会社	スラリ再生方法及びワイヤソーシステム
EP2075106B1 (en) *	2006-10-20	2013-05-01	Mitsubishi Electric Corporation	Slurry for silicon ingot cutting and method of cutting silicon ingot therewith
JP2011083845A (ja) *	2009-10-14	2011-04-28	Kemitoron:Kk	研磨用固液回収分離装置
JP5624449B2 (ja) *	2010-12-16	2014-11-12	株式会社Ｉｈｉ回転機械	ワイヤソーのスラリ管理装置
JP5375895B2 (ja) *	2011-08-17	2013-12-25	旭硝子株式会社	研磨システム
CN106378876B (zh) *	2016-09-23	2019-02-05	镇江环太硅科技有限公司	一种蓝宝石和硅片用金刚线切片冷却液集成式处理方法
JP6604313B2 (ja) *	2016-11-10	2019-11-13	株式会社Ｓｕｍｃｏ	砥粒の評価方法並びにウェーハの製造方法
CN108099035B (zh) *	2017-12-21	2019-12-10	重庆超硅半导体有限公司	一种集成电路用单晶硅多线切割稳定性控制方法

2018
- 2018-11-16 JP JP2018215822A patent/JP7003897B2/ja active Active
2019
- 2019-10-03 TW TW108135845A patent/TWI731428B/zh active
- 2019-11-15 CN CN201911119131.0A patent/CN111195991A/zh active Pending

Patent Citations (3)

* Cited by examiner, † Cited by third party
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TW363914B (en) *	1996-02-21	1999-07-11	Shinetsu Handotai Kk	Recycling system for water soluble sludge waste
JP2011005561A (ja) *	2009-06-23	2011-01-13	Shin Etsu Handotai Co Ltd	シリコンインゴットの切断方法および切断システム
TW201630810A (zh) *	2015-01-19	2016-09-01	福吉米股份有限公司	改質膠態矽及製造方法以及使用其之研磨劑

Also Published As

Publication number	Publication date
CN111195991A (zh)	2020-05-26
JP7003897B2 (ja)	2022-02-04
TW202037775A (zh)	2020-10-16
JP2020082224A (ja)	2020-06-04

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