TWI732921B - 半導體裝置的製造方法 - Google Patents

半導體裝置的製造方法 Download PDF

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Publication number
TWI732921B
TWI732921B TW106127072A TW106127072A TWI732921B TW I732921 B TWI732921 B TW I732921B TW 106127072 A TW106127072 A TW 106127072A TW 106127072 A TW106127072 A TW 106127072A TW I732921 B TWI732921 B TW I732921B
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TW
Taiwan
Prior art keywords
sealing body
protective film
semiconductor
manufacturing
layer
Prior art date
Application number
TW106127072A
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English (en)
Chinese (zh)
Other versions
TW201826405A (zh
Inventor
篠田智則
根本拓
中西勇人
Original Assignee
日商琳得科股份有限公司
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Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司
Publication of TW201826405A publication Critical patent/TW201826405A/zh
Application granted granted Critical
Publication of TWI732921B publication Critical patent/TWI732921B/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Dicing (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Bipolar Transistors (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
TW106127072A 2016-08-31 2017-08-10 半導體裝置的製造方法 TWI732921B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-169152 2016-08-31
JP2016169152 2016-08-31

Publications (2)

Publication Number Publication Date
TW201826405A TW201826405A (zh) 2018-07-16
TWI732921B true TWI732921B (zh) 2021-07-11

Family

ID=61301917

Family Applications (2)

Application Number Title Priority Date Filing Date
TW106127072A TWI732921B (zh) 2016-08-31 2017-08-10 半導體裝置的製造方法
TW110119011A TWI773341B (zh) 2016-08-31 2017-08-10 半導體裝置的製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW110119011A TWI773341B (zh) 2016-08-31 2017-08-10 半導體裝置的製造方法

Country Status (5)

Country Link
JP (2) JP7096766B2 (fr)
KR (2) KR102385965B1 (fr)
CN (1) CN109463007B (fr)
TW (2) TWI732921B (fr)
WO (1) WO2018043008A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7238301B2 (ja) * 2018-09-05 2023-03-14 株式会社レゾナック 材料の選定方法及びパネルの製造方法
JP7704674B2 (ja) * 2019-04-26 2025-07-08 リンテック株式会社 第三積層体の製造方法
JP7395898B2 (ja) * 2019-09-18 2023-12-12 大日本印刷株式会社 半導体多面付け基板用部材、半導体多面付け基板、および半導体部材
WO2022185489A1 (fr) * 2021-03-04 2022-09-09 昭和電工マテリアルズ株式会社 Procédé de fabrication de dispositif à semi-conducteur

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006222164A (ja) * 2005-02-08 2006-08-24 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
US20130078770A1 (en) * 2011-09-28 2013-03-28 Nitto Denko Corporation Method for producing semiconductor device
US20130157419A1 (en) * 2011-12-19 2013-06-20 Nitto Denko Corporation Method of manufacturing semiconductor device
US20140191406A1 (en) * 2011-10-19 2014-07-10 Panasonic Corporation Manufacturing method for semiconductor package, semiconductor package, and semiconductor device

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3456462B2 (ja) * 2000-02-28 2003-10-14 日本電気株式会社 半導体装置及びその製造方法
JP3455948B2 (ja) * 2000-05-19 2003-10-14 カシオ計算機株式会社 半導体装置およびその製造方法
JP4719042B2 (ja) * 2006-03-16 2011-07-06 株式会社東芝 半導体装置の製造方法
JP2009032929A (ja) * 2007-07-27 2009-02-12 Sanyo Electric Co Ltd 半導体装置及びその製造方法
JP5456440B2 (ja) * 2009-01-30 2014-03-26 日東電工株式会社 ダイシングテープ一体型ウエハ裏面保護フィルム
JP5718005B2 (ja) 2010-09-14 2015-05-13 日東電工株式会社 半導体装置製造用耐熱性粘着テープ及びそのテープを用いた半導体装置の製造方法。
JP2014197568A (ja) * 2011-10-19 2014-10-16 パナソニック株式会社 半導体パッケージの製造方法、半導体パッケージ、及び半導体装置
US9385102B2 (en) * 2012-09-28 2016-07-05 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming supporting layer over semiconductor die in thin fan-out wafer level chip scale package
CN103887251B (zh) * 2014-04-02 2016-08-24 华进半导体封装先导技术研发中心有限公司 扇出型晶圆级封装结构及制造工艺
CN104103528A (zh) * 2014-07-22 2014-10-15 华进半导体封装先导技术研发中心有限公司 一种扇出型方片级半导体芯片封装工艺
JP6417142B2 (ja) * 2014-07-23 2018-10-31 株式会社ジェイデバイス 半導体装置及びその製造方法
CN204497228U (zh) * 2015-03-16 2015-07-22 苏州晶方半导体科技股份有限公司 芯片封装结构

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006222164A (ja) * 2005-02-08 2006-08-24 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
US20130078770A1 (en) * 2011-09-28 2013-03-28 Nitto Denko Corporation Method for producing semiconductor device
US20140191406A1 (en) * 2011-10-19 2014-07-10 Panasonic Corporation Manufacturing method for semiconductor package, semiconductor package, and semiconductor device
US20130157419A1 (en) * 2011-12-19 2013-06-20 Nitto Denko Corporation Method of manufacturing semiconductor device

Also Published As

Publication number Publication date
JP7317187B2 (ja) 2023-07-28
CN109463007A (zh) 2019-03-12
JPWO2018043008A1 (ja) 2019-06-24
KR20190045091A (ko) 2019-05-02
WO2018043008A1 (fr) 2018-03-08
TWI773341B (zh) 2022-08-01
JP7096766B2 (ja) 2022-07-06
KR20220045255A (ko) 2022-04-12
TW201826405A (zh) 2018-07-16
CN109463007B (zh) 2022-11-08
JP2022123045A (ja) 2022-08-23
KR102487681B1 (ko) 2023-01-11
KR102385965B1 (ko) 2022-04-12
TW202137340A (zh) 2021-10-01

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