TWI746448B - 環氧樹脂成形材料、成形物及硬化物 - Google Patents

環氧樹脂成形材料、成形物及硬化物 Download PDF

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Publication number
TWI746448B
TWI746448B TW105121609A TW105121609A TWI746448B TW I746448 B TWI746448 B TW I746448B TW 105121609 A TW105121609 A TW 105121609A TW 105121609 A TW105121609 A TW 105121609A TW I746448 B TWI746448 B TW I746448B
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TW
Taiwan
Prior art keywords
epoxy resin
molding material
resin molding
inorganic filler
material according
Prior art date
Application number
TW105121609A
Other languages
English (en)
Chinese (zh)
Other versions
TW201710368A (zh
Inventor
田中賢治
片木秀行
竹澤由高
Original Assignee
日商昭和電工材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商昭和電工材料股份有限公司 filed Critical 日商昭和電工材料股份有限公司
Publication of TW201710368A publication Critical patent/TW201710368A/zh
Application granted granted Critical
Publication of TWI746448B publication Critical patent/TWI746448B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
TW105121609A 2015-07-10 2016-07-07 環氧樹脂成形材料、成形物及硬化物 TWI746448B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-138447 2015-07-10
JP2015138447 2015-07-10

Publications (2)

Publication Number Publication Date
TW201710368A TW201710368A (zh) 2017-03-16
TWI746448B true TWI746448B (zh) 2021-11-21

Family

ID=57757346

Family Applications (2)

Application Number Title Priority Date Filing Date
TW105121609A TWI746448B (zh) 2015-07-10 2016-07-07 環氧樹脂成形材料、成形物及硬化物
TW110130052A TW202144489A (zh) 2015-07-10 2016-07-07 環氧樹脂成形材料、成形物及硬化物

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW110130052A TW202144489A (zh) 2015-07-10 2016-07-07 環氧樹脂成形材料、成形物及硬化物

Country Status (3)

Country Link
JP (1) JP6512295B2 (fr)
TW (2) TWI746448B (fr)
WO (1) WO2017010403A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117736548A (zh) * 2017-11-30 2024-03-22 株式会社力森诺科 复合物及料片
JP7786090B2 (ja) * 2021-09-15 2025-12-16 住友ベークライト株式会社 熱硬化性樹脂組成物および電子装置
WO2023149521A1 (fr) * 2022-02-03 2023-08-10 味の素株式会社 Composition de résine, produit durci, matériau stratifié de type feuille, feuille de résine, carte de circuit imprimé et dispositif à semi-conducteur

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013227307A (ja) * 2012-03-29 2013-11-07 Kurogane Kasei Co Ltd 新規な化合物及びこれを用いた重合体
CN103917605A (zh) * 2011-11-02 2014-07-09 日立化成株式会社 树脂组合物、以及使用该树脂组合物的树脂片、预浸料坯、层叠板、金属基板和印刷配线板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000273286A (ja) * 1999-03-25 2000-10-03 Hitachi Chem Co Ltd 難燃性エポキシ樹脂組成物及びこの組成物を用いた電気部品
JP2012214743A (ja) * 2011-04-01 2012-11-08 Hitachi Chemical Co Ltd 圧縮成形用固形封止樹脂組成物及び半導体装置
KR101958506B1 (ko) * 2011-11-02 2019-03-14 히타치가세이가부시끼가이샤 수지 조성물, 및 그것을 이용한 수지 시트, 프리프레그, 적층판, 금속 기판, 프린트 배선판 및 파워 반도체 장치
CN103906785A (zh) * 2011-11-02 2014-07-02 日立化成株式会社 环氧树脂组合物、半固化环氧树脂组合物、固化环氧树脂组合物、树脂片、预浸料坯、层叠板、金属基板、配线板、半固化环氧树脂组合物的制造方法以及固化环氧树脂组合物的制造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103917605A (zh) * 2011-11-02 2014-07-09 日立化成株式会社 树脂组合物、以及使用该树脂组合物的树脂片、预浸料坯、层叠板、金属基板和印刷配线板
JP2013227307A (ja) * 2012-03-29 2013-11-07 Kurogane Kasei Co Ltd 新規な化合物及びこれを用いた重合体

Also Published As

Publication number Publication date
TW201710368A (zh) 2017-03-16
JPWO2017010403A1 (ja) 2018-02-15
JP6512295B2 (ja) 2019-05-15
TW202144489A (zh) 2021-12-01
WO2017010403A1 (fr) 2017-01-19

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