TWI797352B - 裂斷裝置 - Google Patents

裂斷裝置 Download PDF

Info

Publication number
TWI797352B
TWI797352B TW108123529A TW108123529A TWI797352B TW I797352 B TWI797352 B TW I797352B TW 108123529 A TW108123529 A TW 108123529A TW 108123529 A TW108123529 A TW 108123529A TW I797352 B TWI797352 B TW I797352B
Authority
TW
Taiwan
Prior art keywords
breaking
torque
value
motor
mentioned
Prior art date
Application number
TW108123529A
Other languages
English (en)
Chinese (zh)
Other versions
TW202017021A (zh
Inventor
三谷卓朗
Original Assignee
日商三星鑽石工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商三星鑽石工業股份有限公司 filed Critical 日商三星鑽石工業股份有限公司
Publication of TW202017021A publication Critical patent/TW202017021A/zh
Application granted granted Critical
Publication of TWI797352B publication Critical patent/TWI797352B/zh

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B26F3/002—Precutting and tensioning or breaking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Forests & Forestry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Safety Valves (AREA)
  • Dicing (AREA)
  • Surgical Instruments (AREA)
TW108123529A 2018-10-30 2019-07-04 裂斷裝置 TWI797352B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-204163 2018-10-30
JP2018204163 2018-10-30

Publications (2)

Publication Number Publication Date
TW202017021A TW202017021A (zh) 2020-05-01
TWI797352B true TWI797352B (zh) 2023-04-01

Family

ID=70464402

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108123529A TWI797352B (zh) 2018-10-30 2019-07-04 裂斷裝置

Country Status (5)

Country Link
EP (1) EP3875236B1 (de)
JP (2) JPWO2020090179A1 (de)
CN (1) CN112203817B (de)
TW (1) TWI797352B (de)
WO (1) WO2020090179A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12011844B2 (en) 2020-04-06 2024-06-18 A. G. Stacker Inc. Adjustable break bundle breaker
US20230264379A1 (en) * 2022-02-22 2023-08-24 A. G. Stacker Inc. Bundle breaker including a platen having a compressible bottom surface

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000154032A (ja) * 1998-09-16 2000-06-06 Hoya Corp 板状ガラス母材の切断方法、プリフォ―ムの製造方法、および板状ガラス母材切断装置
JP2002160933A (ja) * 2000-11-24 2002-06-04 Nec Kagoshima Ltd 液晶表示パネル切断装置及び液晶表示パネル切断方法
TW200624396A (en) * 2004-10-13 2006-07-16 Mitsuboshi Diamond Ind Co Ltd Method and apparatus for scribing brittle material board and system for breaking brittle material board

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04183571A (ja) * 1990-11-13 1992-06-30 Auto Kiden Kk ダイヤモンドワイヤーソーとその使用方法
JPH07126027A (ja) * 1993-10-28 1995-05-16 Asahi Glass Co Ltd 板硝子の切断方法及び装置
KR100573986B1 (ko) * 2001-07-18 2006-04-25 미쓰보시 다이야몬도 고교 가부시키가이샤 스크라이브 헤드 및 그 스크라이브 헤드를 이용한 스크라이브 장치 및 스크라이브 방법
TWI342302B (en) * 2007-03-30 2011-05-21 Au Optronics Corp A substrate splitting apparatus and a mehtod for splitting a substrate
EP2157059A4 (de) * 2007-04-27 2010-06-16 Asahi Glass Co Ltd Vorrichtung und verfahren zur bildung einer schnittlinie in streifenflachglas und verfahren zur herstellung von streifenflachglas
JP4999666B2 (ja) * 2007-12-11 2012-08-15 三井化学産資株式会社 熱可塑性樹脂管への穿孔方法及び該方法で用いるホールソー
JP5284726B2 (ja) * 2008-08-29 2013-09-11 三星ダイヤモンド工業株式会社 脆性材料ブレーク装置
JP5284725B2 (ja) * 2008-08-29 2013-09-11 三星ダイヤモンド工業株式会社 脆性材料ブレーク装置
JP5824365B2 (ja) * 2012-01-16 2015-11-25 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク方法
CN103028640B (zh) * 2012-12-18 2014-12-17 宁波钜智自动化装备有限公司 一种在弯管机上进行实时检测的方法
JP6387695B2 (ja) * 2014-06-13 2018-09-12 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク装置
JP6520466B2 (ja) 2015-06-29 2019-05-29 三星ダイヤモンド工業株式会社 ブレーク装置
JP6578759B2 (ja) * 2015-06-29 2019-09-25 三星ダイヤモンド工業株式会社 ブレイク装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000154032A (ja) * 1998-09-16 2000-06-06 Hoya Corp 板状ガラス母材の切断方法、プリフォ―ムの製造方法、および板状ガラス母材切断装置
JP2002160933A (ja) * 2000-11-24 2002-06-04 Nec Kagoshima Ltd 液晶表示パネル切断装置及び液晶表示パネル切断方法
TW200624396A (en) * 2004-10-13 2006-07-16 Mitsuboshi Diamond Ind Co Ltd Method and apparatus for scribing brittle material board and system for breaking brittle material board

Also Published As

Publication number Publication date
EP3875236B1 (de) 2023-04-26
CN112203817B (zh) 2026-02-13
JPWO2020090179A1 (ja) 2021-10-07
EP3875236A1 (de) 2021-09-08
EP3875236A4 (de) 2022-07-06
JP2024032796A (ja) 2024-03-12
WO2020090179A1 (ja) 2020-05-07
TW202017021A (zh) 2020-05-01
CN112203817A (zh) 2021-01-08

Similar Documents

Publication Publication Date Title
JP3814798B2 (ja) 脆性材平板加工物の切断方法及び装置
CN1863740B (zh) 划线头和使用该划线头的划线装置以及划线方法
JP2024032796A (ja) ブレーク装置
JP2002137930A (ja) 移動中の脆性材料シートから板を分離する装置および方法
WO2009084489A1 (ja) レーザ加工装置およびレーザ加工方法
JP2003292332A (ja) スクライブ方法及びスクライブ装置
JP4383346B2 (ja) 板ガラス生産時の長尺ガラスシートの切断方法
JP2015209342A (ja) スクライブ用カッターホイール並びにスクライブ装置
CN111093897B (zh) 板状玻璃的制造方法
JP2003267742A (ja) 硬質脆性板のスクライブ方法
TWI619588B (zh) 脆性材料基板之裂斷方法及裂斷裝置
WO1994001256A1 (fr) Perceuse a ultrasons
KR101066140B1 (ko) 스크라이빙 장치 및 방법
JPH08283032A (ja) 板硝子の切断方法及び装置
CN110253775A (zh) 一种切片机张力臂测控装置及切片工艺
JP2014152068A (ja) 強化ガラス基板のスクライブ方法並びにスクライブ装置
TWI774876B (zh) 斷裂裝置
KR20100010575A (ko) 온도센서가 구비된 단조장치
JPS6214369B2 (de)
CN118595984B (zh) 一种线切设备的辅助装置
TWI619589B (zh) 脆性材料基板之裂斷方法及裂斷裝置
JPS6359810B2 (de)
CN117303726A (zh) 划片机玻璃基板负荷控制装置及玻璃基板划片方法
CN113245908A (zh) 一种机床工件装夹检测装置
KR20230159691A (ko) 유리판 제조 방법 및 그 제조 장치