TWI809111B - Exposure device and height adjustment method - Google Patents

Exposure device and height adjustment method Download PDF

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Publication number
TWI809111B
TWI809111B TW108118015A TW108118015A TWI809111B TW I809111 B TWI809111 B TW I809111B TW 108118015 A TW108118015 A TW 108118015A TW 108118015 A TW108118015 A TW 108118015A TW I809111 B TWI809111 B TW I809111B
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Taiwan
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mentioned
sliding surface
support
unit
column
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TW108118015A
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TW202001323A (en
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米澤良
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日商V科技股份有限公司
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Microwave Amplifiers (AREA)
  • Exposure Control For Cameras (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

本發明可正確地進行光照射部之高度調整。將旋轉驅動部驅動而使小齒輪旋轉,使設置有與小齒輪咬合之齒條的支持部於高度方向上移動。又,於包括永久磁鐵及電磁鐵之永電磁鐵所具有之電磁鐵之線圈中流通電流,藉由永電磁鐵吸附支持部而使支持部側滑動面與柱側滑動面密接,且藉由支持部側滑動面與柱側滑動面之間之摩擦力來固定支持部。The present invention can accurately adjust the height of the light irradiation part. The pinion is rotated by driving the rotary driving part, and the supporting part provided with the rack meshed with the pinion is moved in the height direction. In addition, a current flows through the coil of the electromagnet included in the permanent magnet and the electromagnet, and the permanent electromagnet attracts the supporting part so that the sliding surface on the side of the supporting part is in close contact with the sliding surface on the side of the column, and by supporting The friction force between the sliding surface on the side of the head and the sliding surface on the column side is used to fix the supporting part.

Description

曝光裝置及高度調整方法Exposure device and height adjustment method

本發明係關於一種曝光裝置及高度調整方法。 The invention relates to an exposure device and a height adjustment method.

專利文獻1中揭示有一種描繪裝置,其於保持板之一端卡合有滾珠螺桿,藉由與該滾珠螺桿連結之伺服馬達,描繪頭於上下方向且於既定之範圍內移動。 Patent Document 1 discloses a drawing device in which a ball screw is engaged with one end of a holding plate, and a drawing head is moved up and down within a predetermined range by a servo motor connected to the ball screw.

[先前技術文獻] [Prior Art Literature]

[專利文獻] [Patent Document]

[專利文獻1]日本專利特開平9-320943號公報 [Patent Document 1] Japanese Patent Laid-Open No. 9-320943

然而,專利文獻1所記載之發明中,由於將滾珠螺桿用於描繪頭之移動,故而產生隨機漫步誤差(雌螺桿構件相對於導螺桿1旋轉之前進速度之不均),存在無法使描繪頭正確地移動之問題。 However, in the invention described in Patent Document 1, since the ball screw is used for the movement of the drawing head, a random walk error (unevenness of the advancing speed of the female screw member relative to the lead screw 1 before rotation) occurs, and there is a problem that the drawing head cannot be moved. The problem of moving correctly.

本發明係鑒於如上所述之情況而形成,目的在於提供一種可正確地進行照射光之光學裝置之高度調整的曝光裝置及高度調整方法。 The present invention was made in view of the above circumstances, and an object of the present invention is to provide an exposure device and a height adjustment method that can accurately adjust the height of an optical device that irradiates light.

為解決上述課題,本發明之曝光裝置例如具備:基板保持部,其 載置基板;框體,其包括由磁性材料所形成之大致棒狀之支持部且以長邊方向成為大致水平方向之方式設置之支持部、以及分別以長邊方向成為大致鉛直方向之方式設置於上述支持部之兩端的棒狀之柱,且於上述支持部形成有支持部側滑動面,於上述柱,柱側滑動面形成於與上述支持部側滑動面對向之位置;移動機構,其使上述支持部於鉛直方向上移動,其包括設置於上述支持部之齒條、以可旋轉之方式設置於上述柱且與上述齒條咬合之小齒輪、以及使上述小齒輪旋轉之旋轉驅動部;光學裝置,其設置於上述支持部且對上述基板照射光;永電磁鐵,其設置於上述柱且包括永久磁鐵及電磁鐵;以及控制部,其驅動上述旋轉驅動部而使上述支持部移動,且於上述電磁鐵之線圈中流通電流而於上述永久磁鐵吸附上述支持部;並且上述永電磁鐵吸附上述支持部而使上述支持部側滑動面與上述柱側滑動面密接,藉由上述支持部側滑動面與上述柱側滑動面之間之摩擦力而將上述支持部固定於上述柱。 In order to solve the above-mentioned problems, the exposure apparatus of the present invention includes, for example, a substrate holding unit that The mounting substrate; the frame body, which includes a substantially rod-shaped support part formed of a magnetic material, and the support part is arranged so that the long side direction becomes a substantially horizontal direction, and the long side direction is substantially vertically arranged Rod-shaped columns at both ends of the above-mentioned supporting part, and a supporting part-side sliding surface is formed on the above-mentioned supporting part, and on the above-mentioned column, the column-side sliding surface is formed at a position facing the above-mentioned supporting part-side sliding surface; the moving mechanism, It moves the support part in the vertical direction, and includes a rack provided on the support part, a pinion gear rotatably provided on the column and engaged with the rack, and a rotary drive that rotates the pinion gear. an optical device, which is provided on the above-mentioned supporting part and irradiates light to the above-mentioned substrate; a permanent electromagnet, which is provided on the above-mentioned post and includes a permanent magnet and an electromagnet; and a control part, which drives the above-mentioned rotary driving part so that the above-mentioned supporting part move, and a current flows through the coil of the electromagnet to attract the above-mentioned support part to the above-mentioned permanent magnet; The frictional force between the sliding surface on the side of the supporting part and the sliding surface on the side of the column fixes the supporting part to the column.

依據本發明之曝光裝置,將旋轉驅動部驅動而使小齒輪旋轉,使設置有與小齒輪咬合之齒條的支持部於高度方向上移動。又,藉由於包括永久磁鐵及電磁鐵之永電磁鐵所具有之電磁鐵之線圈中流通電流,永電磁鐵吸附支持部,而使支持部側滑動面與柱側滑動面密接,藉由支持部側滑動面與柱側滑動面之間之摩擦力而將支持部固定。藉此,可正確地進行光學裝置之高度調整。又,由於將永電磁鐵用於支持部之吸附,故而通電時間短,不產生由熱引起之支持部之變形、膨脹等,因此可正確地進行光學裝置之高度調整。 According to the exposure apparatus of the present invention, the rotation drive unit is driven to rotate the pinion, and the support unit provided with the rack meshing with the pinion is moved in the height direction. Also, by passing current through the coil of the electromagnet of the permanent electromagnet including the permanent magnet and the electromagnet, the permanent electromagnet attracts the supporting part, so that the sliding surface on the side of the supporting part is in close contact with the sliding surface on the side of the column. The friction force between the side sliding surface and the column side sliding surface fixes the supporting part. Thereby, the height adjustment of the optical device can be accurately performed. In addition, since the permanent electromagnet is used for the adsorption of the support part, the energization time is short, and the deformation and expansion of the support part due to heat do not occur, so the height adjustment of the optical device can be accurately performed.

此處,亦可具備測量部,其設置於上述支持部,且包括大致沿著鉛直方向而設置之標尺、以及讀取上述標尺之值而輸出位置資訊之頭;並且於上述支持部之移動時,上述永電磁鐵係以較上述移動機構不使上述支持部移動時之吸附力即第1吸附力更弱之第2吸附力吸附上述支持部,上述測量部連續測量上述支持部之高度,且上述支持部側滑動面沿著上述柱側滑動面而滑動。藉 此,於使支持部側滑動面與柱側滑動面密接時支持部不傾斜,因此可消除由支持部之傾斜所引起之測量部之測量誤差。 Here, a measurement unit may be provided, which is provided on the above-mentioned support part, and includes a scale arranged substantially along the vertical direction, and a head which reads the value of the above-mentioned scale and outputs position information; and when the above-mentioned support part moves , the above-mentioned permanent electromagnet absorbs the above-mentioned support part with the second adsorption force which is weaker than the first adsorption force when the above-mentioned moving mechanism does not move the above-mentioned support part, and the above-mentioned measuring part continuously measures the height of the above-mentioned support part, and The support portion-side sliding surface slides along the column-side sliding surface. borrow Here, the support portion does not incline when the support portion-side sliding surface and the column-side sliding surface are brought into close contact, so measurement errors in the measurement portion caused by the inclination of the support portion can be eliminated.

此處,上述第2吸附力亦可為上述第1吸附力之約20%至約30%。藉此,以第2吸附力來吸附支持部時之測量部之測量結果、與以第1吸附力來吸附支持部時之測量部之測量結果之差變得最小。 Here, the second adsorption force may be about 20% to about 30% of the first adsorption force. Thereby, the difference between the measurement result of the measurement part when the support part is adsorbed by the second adsorption force and the measurement result of the measurement part when the support part is adsorbed by the first adsorption force is minimized.

此處,亦可具備設置於上述支持部與上述光學裝置之間的大致薄板狀之引導構件、以及設置於上述框體且使上述光學裝置於鉛直方向上移動之驅動部;上述支持部具有大致水平地配置之板狀部,且於上述板狀部形成有於大致鉛直方向上貫通之圓孔,上述引導構件為俯視大致圓板形狀,以覆蓋上述圓孔之方式設置於上述板狀部,於上述引導構件,於大致中央形成有安裝孔,上述安裝孔係與上述圓孔配置為大致同心圓狀,上述光學裝置係以光軸與上述安裝孔之中心大致一致之方式插入上述安裝孔中而固定於上述引導構件。藉此,可使驅動部使光學裝置於高度方向上移動時之光軸之振動小至數nm以下。 Here, a substantially thin-plate-shaped guide member provided between the above-mentioned supporting part and the above-mentioned optical device, and a driving part provided on the above-mentioned frame and moving the above-mentioned optical device in the vertical direction may be provided; the above-mentioned supporting part has a substantially a horizontally arranged plate-shaped portion, and a circular hole penetrating in a substantially vertical direction is formed in the plate-shaped portion, and the above-mentioned guide member is generally in the shape of a circular plate in plan view, and is provided on the above-mentioned plate-shaped portion so as to cover the circular hole, A mounting hole is formed approximately in the center of the guide member, the mounting hole is arranged in a substantially concentric circle with the circular hole, and the optical device is inserted into the mounting hole so that the optical axis coincides with the center of the mounting hole And it is fixed to the above-mentioned guide member. Thereby, the vibration of the optical axis when the drive unit moves the optical device in the height direction can be reduced to a few nm or less.

此處,亦可具備:使上述基板保持部於掃描方向上移動之移動部、以及設置於上述支持部且測定至上述基板為止之距離之測定部,上述控制部一面經由上述移動部而使上述基板保持部於上述掃描方向上移動,一面經由上述測定部而測定至上述基板為止之距離,根據至該基板為止之距離之最大值與最小值來求出中值,且基於該中值而求出上述驅動部之驅動量。藉此,即便基板之高度變化,亦可使光學裝置之焦點一直聚焦於基板上。 Here, a moving part that moves the substrate holding part in the scanning direction, and a measuring part that is provided on the supporting part and measures a distance to the substrate may be provided, and the control part moves the moving part via the moving part. The substrate holding part moves in the above-mentioned scanning direction, and measures the distance to the above-mentioned substrate through the above-mentioned measuring part while passing through the above-mentioned measuring part, obtains a median value from the maximum value and minimum value of the distance to the substrate, and calculates based on the median value. Show the driving amount of the above-mentioned driving part. Thereby, even if the height of the substrate changes, the focal point of the optical device can always be focused on the substrate.

此處,上述光學裝置亦可包括AF處理部,其具有照射向下之光之AF用光源、以及反射光所射入之AF感測器,上述控制部一面使上述AF處理部工作一面使上述支持部移動,若上述光學裝置位於判斷為聚焦之位置,則使上述支持部側滑動面與上述柱側滑動面密接。藉此,即便基板之高度變化,亦可使光學裝置之焦點一直聚焦於基板上。 Here, the optical device may include an AF processing unit having an AF light source for irradiating downward light and an AF sensor into which reflected light enters, and the control unit operates the AF processing unit while operating the AF processing unit. The supporting part is moved, and when the optical device is located at a position determined to be in focus, the sliding surface on the supporting part side is brought into close contact with the sliding surface on the column side. Thereby, even if the height of the substrate changes, the focal point of the optical device can always be focused on the substrate.

為解決上述課題,本發明之高度調整方法係使用如下裝置來調整上述支持部之高度者,上述裝置例如包括:基板保持部,其載置基板;框體,其包括由磁性材料所形成之大致棒狀之支持部且以長邊方向成為大致水平方向之方式設置之支持部、以及分別以長邊方向成為大致鉛直方向之方式設置於上述支持部之兩端的棒狀之柱,且於上述支持部形成支持部側滑動面,於上述柱,柱側滑動面形成於與上述支持部側滑動面對向之位置;移動機構,其使上述支持部於鉛直方向上移動,且包括大致沿著鉛直方向而設置於上述支持部之齒條、以可旋轉之方式設置於上述柱且與上述齒條咬合之小齒輪、以及使上述小齒輪旋轉之旋轉驅動部;測量部,其設置於上述支持部;光學裝置,其設置於上述支持部且對上述基板照射光;以及永電磁鐵,其設置於上述柱且包括永久磁鐵及電磁鐵;上述高度調整方法之特徵在於包括:於上述電磁鐵之線圈中流通電流而使上述支持部以第2吸附力來吸附於上述永電磁鐵,使上述支持部側滑動面與上述柱側滑動面抵接之步驟;一面利用上述測量部來測量上述支持部之高度,一面驅動上述旋轉驅動部而使上述小齒輪旋轉,使上述支持部於高度方向上移動之步驟;以及於上述線圈中流通電流,使上述支持部以較上述第2吸附力更強之第1吸附力吸附於上述永電磁鐵,使上述支持部側滑動面與上述柱側滑動面密接而將上述支持部固定於上述柱之步驟。藉此,於以第2吸附力來吸附支持部時與以第1吸附力來吸附支持部時,支持部不傾斜,因此可消除由支持部之傾斜所引起之測量部之測量誤差。 In order to solve the above-mentioned problems, the height adjustment method of the present invention uses the following device to adjust the height of the above-mentioned supporting part. The above-mentioned device includes, for example: a substrate holding part, which places the substrate; A rod-shaped support part and a support part provided in such a manner that the longitudinal direction becomes a substantially horizontal direction, and rod-shaped columns respectively provided at both ends of the above-mentioned support part in such a manner that the long-side direction becomes a substantially vertical direction, and on the above-mentioned support The supporting portion side sliding surface is formed in the above-mentioned column, and the column-side sliding surface is formed at a position facing the above-mentioned supporting portion-side sliding surface; The rack provided on the above-mentioned support part in the direction, the pinion gear rotatably provided on the above-mentioned column and meshed with the above-mentioned rack, and the rotation drive part that rotates the above-mentioned pinion gear; the measuring part, which is provided on the above-mentioned support part ; an optical device, which is installed on the above-mentioned supporting part and irradiates light to the above-mentioned substrate; and a permanent electromagnet, which is installed on the above-mentioned column and includes a permanent magnet and an electromagnet; the above-mentioned height adjustment method is characterized in that it includes: a coil on the above-mentioned electromagnet A step in which the above-mentioned supporting part is attracted to the above-mentioned permanent electromagnet with the second adsorption force by passing a medium current, and the above-mentioned supporting part-side sliding surface is brought into contact with the above-mentioned post-side sliding surface; while using the above-mentioned measuring part to measure the Height, while driving the above-mentioned rotary driving part to rotate the above-mentioned pinion, the step of moving the above-mentioned support part in the height direction; 1. A step of adhering to the permanent electromagnet by the suction force, bringing the sliding surface on the side of the supporting part into close contact with the sliding surface on the side of the column, and fixing the supporting part to the column. Thereby, when the support part is adsorbed by the second adsorption force and when the support part is adsorbed by the first adsorption force, the support part does not incline, so the measurement error of the measurement part caused by the inclination of the support part can be eliminated.

依據本發明,可正確地進行光照射部之高度調整。 According to the present invention, the height adjustment of the light irradiation part can be accurately performed.

1:曝光裝置 1: Exposure device

11:定盤 11:Fixed

11a:上表面 11a: upper surface

12:板狀部 12: plate-shaped part

12a:上表面 12a: upper surface

13、14:軌道 13, 14: track

15:框體 15: frame

15a:支持部 15a: Support Department

15c:柱 15c: column

20:遮罩保持部 20: Mask holding part

20a:上表面 20a: upper surface

21、22、23:條狀鏡 21, 22, 23: strip mirror

30(30a~30g):光照射部 30(30a~30g): Light irradiation part

31(31a~31g):DMD 31(31a~31g):DMD

32(32a~32g):物鏡 32(32a~32g): objective lens

33(33a~33g):光源部 33(33a~33g): light source part

34(34a~34g):AF處理部 34(34a~34g): AF processing part

35(35a~35g):筒狀部 35 (35a~35g): cylindrical part

36(36a~36g):凸緣 36(36a~36g): Flange

37(37a~37g)、38(38a~38g):安裝部 37(37a~37g), 38(38a~38g): Installation part

39(39a~39g):驅動部 39(39a~39g): drive unit

40:測定部 40: Determination Department

41、42:位置測定部 41, 42: Position measurement unit

41a、42a:標尺 41a, 42a: ruler

41b、42b:檢測頭 41b, 42b: detection head

50、51(51a、51b、51c)、52(52a、52g):雷射干涉儀 50, 51 (51a, 51b, 51c), 52 (52a, 52g): laser interferometer

55a、55b、55c、56a、56g:鏡 55a, 55b, 55c, 56a, 56g: mirror

60:讀取部 60: Reading Department

61(61a、61d、61g):測定部 61 (61a, 61d, 61g): measurement department

70、70A:引導構件 70, 70A: guide member

74、74A:安裝孔 74, 74A: mounting holes

75、76、77、78:孔 75, 76, 77, 78: holes

79A、79B、79C、79D:剪切孔 79A, 79B, 79C, 79D: shear holes

79Aa、79Ba、79Ca、79Da:端部區域 79Aa, 79Ba, 79Ca, 79Da: end regions

81、82:驅動部 81, 82: drive unit

85、86:螺桿 85, 86: screw

151:底板 151: Bottom plate

152、154:側板 152, 154: side panels

152a~152i、154a~154i:孔 152a~152i, 154a~154i: hole

153:支持板 153: Support board

155a~155g、156a~156g:圓孔 155a~155g, 156a~156g: round hole

156h:螺桿孔 156h: screw hole

157a~157g:圓孔 157a~157g: round hole

158:凸部 158: convex part

159:隔離壁 159: Partition wall

160:彈性構件 160: Elastic member

161:移動機構 161: Mobile Mechanism

161a:齒條 161a: Rack

161b:小齒輪 161b: Pinion

161c:凸部 161c: convex part

161d、161e:滑動面 161d, 161e: sliding surface

161f:旋轉驅動部 161f: Rotary drive unit

162:定位構件 162: Positioning component

162a:凹部 162a: concave part

163:永電磁鐵 163: permanent electromagnet

163a:永久磁鐵 163a: permanent magnet

163b:電磁鐵 163b: Electromagnet

163c:調整撥號盤 163c: Adjustment dial

164:測量部 164: Measurement Department

164a:標尺 164a: Ruler

164b:檢測頭 164b: detection head

201:CPU 201:CPU

201a:控制部 201a: Control Department

202:RAM 202: RAM

203:ROM 203:ROM

204:輸入輸出介面 204: input and output interface

205:通訊介面 205: communication interface

206:媒體介面 206: Media interface

211:輸入輸出裝置 211: Input and output device

212:網路 212: Network

213:存儲介質 213: storage medium

331:光源 331: light source

332:透鏡 332: lens

333:複眼透鏡 333: fly eye lens

334、335:透鏡 334, 335: lens

336:鏡 336: Mirror

341:AF用光源 341: Light source for AF

342:準直透鏡 342: Collimating lens

343:AF用柱面透鏡 343: Cylindrical lens for AF

344、345:五稜鏡 344, 345: five 稜鏡

346:透鏡 346: lens

347、348:感測器 347, 348: sensor

371:螺桿孔 371: screw hole

372:中空部 372: hollow part

381:螺桿孔 381: screw hole

391:壓電元件 391:Piezoelectric element

392:連結部 392: link

393:凸部 393: convex part

394:槽 394: slot

395:安裝部 395: Installation department

圖1係表示第1實施形態之曝光裝置1之概略的立體圖。 FIG. 1 is a perspective view schematically showing an exposure apparatus 1 according to a first embodiment.

圖2係表示測定部40及雷射干涉儀50測定遮罩保持部20之位置之情況的概略圖。 FIG. 2 is a schematic diagram showing how the measuring unit 40 and the laser interferometer 50 measure the position of the mask holding unit 20 .

圖3係表示框體15之支持部15a之概略的立體圖,係從背面側(+x側)看之圖。 FIG. 3 is a perspective view schematically showing the support portion 15a of the frame body 15, viewed from the back side (+x side).

圖4係表示框體15之支持部15a之概略的立體圖,係從正面側(-x側)看之圖。 FIG. 4 is a perspective view schematically showing the support portion 15a of the frame body 15, viewed from the front side (-x side).

圖5係表示以圖3之面C將框體15切斷時之概略的圖。 FIG. 5 is a schematic view showing the frame body 15 cut along the plane C of FIG. 3 .

圖6係表示光照射部30a之概略的主要部分透視圖。 FIG. 6 is a perspective view of main parts schematically showing the light irradiation unit 30a.

圖7係表示驅動部39a之概略的側視圖。 FIG. 7 is a schematic side view showing the drive unit 39a.

圖8的(A)係表示引導構件70之概略的圖,(B)係表示引導構件70A之概略的圖。 (A) of FIG. 8 is a figure which shows the outline of the guide member 70, (B) is a figure which shows the outline of 70 A of guide members.

圖9的(A)表示當於底板151上安裝引導構件70時之底板151與引導構件70之位置關係,(B)表示當於支持板153上安裝引導構件70A時之支持板153與引導構件70A之位置關係。 (A) of FIG. 9 shows the positional relationship between the base plate 151 and the guide member 70 when the guide member 70 is installed on the base plate 151, and (B) shows the support plate 153 and the guide member when the guide member 70A is installed on the support plate 153. The positional relationship of 70A.

圖10係將光照射部30a安裝於支持板153上之安裝構造之分解立體圖。 FIG. 10 is an exploded perspective view of an installation structure in which the light irradiation unit 30 a is installed on the support plate 153 .

圖11係表示於框體15上安裝有光照射部30a之狀態的圖。 FIG. 11 is a diagram showing a state in which the light irradiation unit 30 a is attached to the frame body 15 .

圖12的(A)表示光照射部30a不移動之狀態(衝程中央),(B)表示光照射部30a移動至下側之狀態(衝程下端),(C)表示光照射部30a移動至上側之狀態(衝程上端)。 (A) of FIG. 12 shows the state where the light irradiation part 30a does not move (stroke center), (B) shows the state where the light irradiation part 30a moves to the lower side (stroke lower end), and (C) shows the light irradiation part 30a moves to the upper side. The state (stroke upper end).

圖13係表示曝光裝置1之電性構成的方塊圖。 FIG. 13 is a block diagram showing the electrical configuration of the exposure apparatus 1 .

圖14係表示曝光裝置1之高度調整處理之流程的流程圖。 FIG. 14 is a flowchart showing the flow of the height adjustment process of the exposure apparatus 1 .

圖15係步驟S20中之測定結果之一例。 Fig. 15 is an example of the measurement results in step S20.

圖16係示意性表示使支持部15a上下移動時之情況的圖,(A)為吸附支持部15a之情形(本實施形態),(B)、(C)為不吸附支持部15a之情形。 Fig. 16 is a diagram schematically showing the situation when the supporting part 15a is moved up and down, (A) is the situation of the suction supporting part 15a (this embodiment), (B) and (C) are the situations of not suctioning the supporting part 15a.

以下,以一面使保持為大致水平方向之感光性基板(例如玻璃基板)於掃描方向上移動,一面照射雷射等光而生成光罩之曝光裝置中所應用之實施形態為例,參照圖式,對本發明進行詳細說明。各圖式中,對同一要素標註同一符號,對重複之部分省略說明。 Hereinafter, an embodiment applied to an exposure device for forming a photomask by irradiating light such as a laser while moving a photosensitive substrate (such as a glass substrate) held in a substantially horizontal direction in a scanning direction is taken as an example, referring to the drawings. , the present invention will be described in detail. In each figure, the same symbol is attached|subjected to the same element, and the description of the overlapping part is abbreviate|omitted.

作為感光性基板,例如使用熱膨脹率非常小(例如約5.5×10-7/K左右)之石英玻璃。由曝光裝置生成之光罩係用於製造例如液晶顯示裝置用之基板的曝光用遮罩。光罩係於一邊超過例如1m之(例如1400mm×1220mm)大型之大致矩形形狀之基板上,形成有1個或複數個成像器件用轉印圖案者。以下,作為包括加工前、加工中及加工後之感光性基板的概念,使用稱為遮罩M之用語。 As the photosensitive substrate, for example, quartz glass having a very small coefficient of thermal expansion (for example, about 5.5×10 -7 /K) is used. The photomask produced by the exposure apparatus is used for manufacturing the exposure mask of the board|substrate for liquid crystal display devices, for example. A photomask is one or a plurality of transfer patterns for an imaging device formed on a large substantially rectangular-shaped substrate (for example, 1400mm×1220mm) with one side exceeding, for example, 1m. Hereinafter, the term "mask M" is used as a concept including the photosensitive substrate before processing, during processing, and after processing.

但,本發明之曝光裝置並不限定於遮罩製造裝置。本發明之曝光裝置係包含一面使保持為大致水平方向之基板於掃描方向上移動,一面照射光(包含雷射、UV、偏振光等)各式各樣之裝置的概念。又,本發明之光學裝置亦不限定於對感光性基板照射光之光照射部。 However, the exposure apparatus of this invention is not limited to a mask manufacturing apparatus. The exposure device of the present invention includes the concept of a device that irradiates various types of light (including laser, UV, polarized light, etc.) while moving the substrate held in a substantially horizontal direction in the scanning direction. Also, the optical device of the present invention is not limited to the light irradiation section that irradiates light to the photosensitive substrate.

圖1係表示第1實施形態之曝光裝置1之概略的立體圖。曝光裝置1主要包括:定盤11、板狀部12、軌道13、14、框體15、遮罩保持部20、光照射部30、測定部40(參照圖2)、雷射干涉儀50(參照圖2)、及測定部61(61a、61d、61g)。此外,圖1中,對一部分構成省略圖示。又,曝光裝置1藉由覆蓋裝置整體之未圖示之溫度調整部而保持為一定溫度。 FIG. 1 is a perspective view schematically showing an exposure apparatus 1 according to a first embodiment. The exposure device 1 mainly includes: a fixed plate 11, a plate-shaped part 12, rails 13, 14, a frame body 15, a mask holding part 20, a light irradiation part 30, a measuring part 40 (see FIG. 2), a laser interferometer 50 ( Refer to FIG. 2 ), and the measurement unit 61 (61a, 61d, 61g). In addition, in FIG. 1, illustration of a part of a structure is abbreviate|omitted. In addition, the exposure apparatus 1 is maintained at a constant temperature by a temperature adjustment unit (not shown) covering the entire apparatus.

定盤11為大致長方體形狀(厚板狀)之構件,例如由岩石(例如花崗岩)或低膨脹率之鑄件(例如鎳系之合金)所形成。定盤11具有與上側(+z側)大致水平(與xy面大致平行)之上表面11a。 The fixed plate 11 is a substantially rectangular parallelepiped (slab-shaped) member, for example, formed of rock (such as granite) or a casting with low expansion rate (such as a nickel-based alloy). The fixed plate 11 has an upper surface 11 a substantially horizontal to the upper side (+z side) (substantially parallel to the xy plane).

定盤11載置於設置面(例如,地板)上所載置之複數個除振台(未圖示)上。藉此,定盤11經由除振台而載置於設置面上。除振台由於已經公知,故而省略詳細之說明。此外,除振台並非必需。於定盤11之+x側設置有將遮罩M設置於遮罩保持部20上之載入器(未圖示)。 The fixed plate 11 is placed on a plurality of vibration-isolating tables (not shown) placed on an installation surface (for example, a floor). Thereby, the fixed plate 11 is placed on the installation surface via the vibration-isolating table. Since the devibration table is already known, a detailed description is omitted. Also, a devibration table is not required. A loader (not shown) for setting the mask M on the mask holding portion 20 is provided on the +x side of the surface plate 11 .

軌道13係陶瓷製之細長之板狀之構件,以長邊方向沿著掃描方向(x方向)之方式固定於定盤11之上表面11a。3根軌道13之高度(z方向之位置)大致相同,上表面係以高精度及高平坦度形成。 The rail 13 is an elongated plate-shaped member made of ceramics, and is fixed to the upper surface 11 a of the fixed plate 11 so that the longitudinal direction is along the scanning direction (x direction). The heights (positions in the z direction) of the three rails 13 are approximately the same, and the upper surfaces are formed with high precision and high flatness.

載入器側(+x側)之軌道13之端配置於上表面11a之端部,反載入器側(-x側)之軌道13之端較上表面11a之端部而言配置於內側。 The end of the rail 13 on the loader side (+x side) is arranged at the end of the upper surface 11a, and the end of the rail 13 on the anti-loader side (-x side) is arranged on the inner side than the end of the upper surface 11a .

板狀部12載置於軌道13上。板狀部12為陶瓷製之大致板狀之構件,整體為大致矩形形狀。於板狀部12之下表面(-z側之面),以長邊方向沿著x方向之方式設置引導部(未圖示)。藉此,為使板狀部12不移動至x方向以外而調節板狀部12之移動方向。 The plate portion 12 is placed on the rail 13 . The plate-shaped part 12 is a substantially plate-shaped member made of ceramics, and has a generally rectangular shape as a whole. On the lower surface (the surface on the −z side) of the plate-shaped portion 12, a guide portion (not shown) is provided such that the longitudinal direction is along the x direction. Thereby, the moving direction of the plate-shaped part 12 is adjusted so that the plate-shaped part 12 may not move beyond the x direction.

於板狀部12之上表面12a設置軌道14。軌道14係以長邊方向沿著y方向之方式固定。軌道14之高度大致相同,上表面係以高精度及高平坦度來形成。 A track 14 is disposed on the upper surface 12 a of the plate portion 12 . The rail 14 is fixed such that the longitudinal direction is along the y direction. The rails 14 have approximately the same height, and the upper surface is formed with high precision and high flatness.

遮罩保持部20為俯視大致矩形形狀之大致板狀,使用熱膨脹係數為約0.5~1×10-7/K之低膨脹性陶瓷來形成。藉此,可防止遮罩保持部20之變形。此外,遮罩保持部20亦可使用熱膨脹係數為約5×10-8/K之超低膨脹性玻璃陶瓷來形成。於該情形時,即便發生無法控制之溫度變化,亦可確實地防止遮罩保持部20之變形。此外,亦可利用與遮罩M同樣地伸縮之材料來形成遮罩保持部20。 The mask holding portion 20 has a substantially rectangular planar shape and is formed of low-expansion ceramics having a coefficient of thermal expansion of about 0.5 to 1×10 −7 /K. Thereby, deformation of the mask holding part 20 can be prevented. In addition, the mask holding portion 20 may also be formed using ultra-low expansion glass ceramics having a thermal expansion coefficient of about 5×10 −8 /K. In this case, even if an uncontrollable temperature change occurs, deformation of the mask holding portion 20 can be reliably prevented. In addition, the mask holding part 20 can also be formed with the material which expands and contracts similarly to the mask M.

遮罩保持部20載置於軌道14上。換言之,遮罩保持部20經由板狀部12及軌道13、14而設置於上表面11a。 The mask holder 20 is placed on the rail 14 . In other words, the mask holding part 20 is provided on the upper surface 11 a via the plate-shaped part 12 and the rails 13 and 14 .

於遮罩保持部20之下表面,以長邊方向沿著y方向之方式設置引 導部(未圖示)。藉此,為使遮罩保持部20、即板狀部12不移動至y方向以外而限制遮罩保持部20之移動方向。 On the lower surface of the mask holding part 20, guides are set in such a way that the long side direction is along the y direction. guide (not shown). Thereby, the moving direction of the mask holding part 20 is restricted so that the mask holding part 20, that is, the plate-shaped part 12 does not move beyond the y direction.

如此,遮罩保持部20(板狀部12)以可移動之方式沿著軌道13而設置於x方向,遮罩保持部20係以可移動之方式沿著軌道14而設置於y方向。 Thus, the mask holding part 20 (plate part 12) is provided movably along the rail 13 in the x direction, and the mask holding part 20 is movably provided along the rail 14 in the y direction.

遮罩保持部20具有大致水平之上表面20a。於上表面20a載置遮罩M(圖示省略)。又,於上表面20a設置條狀鏡21、22、23(參照圖2)。 The mask holder 20 has a substantially horizontal upper surface 20a. A mask M (not shown) is placed on the upper surface 20a. Moreover, the strip mirrors 21, 22, 23 are provided in the upper surface 20a (refer FIG. 2).

曝光裝置1具有未圖示之驅動部81、82(參照圖13)。驅動部81、82例如為線性馬達。驅動部81使遮罩保持部20(板狀部12)沿著軌道13而於x方向上移動,驅動部82使遮罩保持部20沿著軌道14而於y方向上移動。驅動部81、82使板狀部12或遮罩保持部20移動之方法可使用已公知之各種方法。 The exposure apparatus 1 has drive parts 81 and 82 (refer FIG. 13) which are not shown in figure. The drive units 81 and 82 are, for example, linear motors. The driving unit 81 moves the mask holding unit 20 (plate-shaped part 12 ) in the x direction along the rail 13 , and the driving unit 82 moves the mask holding unit 20 in the y direction along the rail 14 . Various well-known methods can be used as a method for the drive units 81 and 82 to move the plate-shaped portion 12 or the mask holding portion 20 .

於定盤11上設置框體15。框體15係由磁性材料、例如低膨脹率之鑄件(例如鎳系之合金)所形成。框體15包括支持部15a、以及將支持部15a以兩端支持之2根柱15c。框體15於遮罩保持部20之上方(+z方向)保持光照射部30。於支持部15a上安裝光照射部30。後文對框體15進行詳細說明。 A frame body 15 is set on the fixing plate 11 . The frame body 15 is formed of a magnetic material, such as a low-expansion casting (such as a nickel-based alloy). The frame body 15 includes a support portion 15a and two columns 15c supporting the support portion 15a at both ends. The frame body 15 holds the light irradiation section 30 above the mask holding section 20 (in the +z direction). The light irradiation part 30 is attached to the support part 15a. The frame body 15 will be described in detail later.

光照射部30對遮罩M照射光(本實施形態中為雷射光)。光照射部30沿著y方向且以一定間隔(例如每隔約200mm)來設置。本實施形態中,包括:7個光照射部30a、光、光照射部30b、光照射部30c、光照射部30d、光照射部30e、光照射部30f、光照射部30g。移動機構161(後文詳述)係以光照射部30a~30g之焦點位置聚焦於遮罩M之上表面之方式,使光照射部30a~30g整體於10mm左右之範圍內於鉛直方向(z方向)上移動。又,驅動部39(39a(參照圖6)~30g,後文詳述)為了進行光照射部30a~30g之焦點位置之微調整,而使光照射部30a~30g於30μm(微米)左右之範圍內於z方向上微動。對於光照射部30,後文詳述。 The light irradiation unit 30 irradiates the mask M with light (laser light in this embodiment). The light irradiation parts 30 are provided along the y direction at regular intervals (for example, every about 200 mm). In this embodiment, seven light irradiation parts 30a, light, light irradiation part 30b, light irradiation part 30c, light irradiation part 30d, light irradiation part 30e, light irradiation part 30f, and light irradiation part 30g are included. The moving mechanism 161 (described later in detail) is such that the focal positions of the light-irradiating parts 30a-30g are focused on the upper surface of the mask M, so that the light-irradiating parts 30a-30g are in the vertical direction (z direction) to move up. In addition, the driving unit 39 (39a (see FIG. 6) to 30g, which will be described in detail later) makes the light irradiation units 30a to 30g at a distance of about 30 μm (micrometers) in order to perform fine adjustment of the focus position of the light irradiation units 30a to 30g. Move slightly in the z direction within the range. The light irradiation unit 30 will be described in detail later.

於光照射部30a~30g,分別設置未圖示之讀取部。讀取部係讀取 形成於遮罩M上之圖案者。 In the light irradiation parts 30a-30g, the reading part which is not shown in figure is respectively provided. read department read The pattern formed on the mask M.

測定部40(參照圖2)例如為線性編碼器,測定遮罩保持部20之位置之雷射干涉儀50包括雷射干涉儀51、52(圖1中省略圖示,參照圖2)。於設置於框體15之-y側之柱上設置雷射干涉儀51。又,於定盤11之+x側之側面設置雷射干涉儀52(圖1中省略圖示)。 The measurement unit 40 (see FIG. 2 ) is, for example, a linear encoder, and the laser interferometer 50 for measuring the position of the mask holding unit 20 includes laser interferometers 51 and 52 (not shown in FIG. 1 , see FIG. 2 ). A laser interferometer 51 is installed on a column provided on the -y side of the frame body 15 . Also, a laser interferometer 52 (not shown in FIG. 1 ) is provided on the +x side of the fixed plate 11 .

圖2係表示測定部40及雷射干涉儀50測定遮罩保持部20之位置之情況的概略圖。此外,圖2中,僅圖示出軌道13、14之一部分。又,圖2中,僅圖示出光照射部30a、30g,對於光、光照射部30b~30f,省略圖示。 FIG. 2 is a schematic diagram showing how the measurement unit 40 and the laser interferometer 50 measure the position of the mask holding unit 20 . In addition, in FIG. 2, only a part of rails 13 and 14 are shown in figure. In addition, in FIG. 2, only the light irradiation parts 30a and 30g are shown in figure, and illustration of light and light irradiation parts 30b-30f is abbreviate|omitted.

測定部40包括位置測定部41、42。位置測定部41、42分別包括標尺41a、42a及檢測頭41b、42b。 The measurement unit 40 includes position measurement units 41 and 42 . The position measurement units 41, 42 include scales 41a, 42a and detection heads 41b, 42b, respectively.

標尺41a設置於+y側之軌道13之+y側之端面以及-y側之軌道13之-y側之端面。檢測頭41b設置於板狀部12(圖2中省略圖示)之+y側及-y側之端面。圖2中,省略關於+y側之標尺41a及檢測頭41b之圖示。 The scale 41a is provided on the +y-side end surface of the +y-side rail 13 and the -y-side end surface of the -y-side rail 13 . The detection head 41b is provided on the +y-side and -y-side end surfaces of the plate-like portion 12 (not shown in FIG. 2 ). In FIG. 2 , illustration of the scale 41 a and the detection head 41 b on the +y side is omitted.

標尺42a設置於+x側之軌道14之+x側之端面以及-x側之軌道13之-x側之端面。檢測頭42b設置於遮罩保持部20之+x側以及-x側之端面。圖2中,省略關於-x側之標尺42a及檢測頭42b之圖示。 The scale 42a is provided on the +x side end surface of the +x side rail 14 and the -x side end surface of the -x side rail 13 . The detection head 42b is provided on the +x side and -x side end surfaces of the mask holding part 20 . In FIG. 2 , illustration of the scale 42 a and the detection head 42 b on the -x side is omitted.

標尺41a、42a例如為雷射全息標尺,以0.512μm(微米)間距形成有記憶體。檢測頭41b、42b照射光(例如雷射光),取得由標尺41a、42a所反射之光,將藉此產生之訊號進行512等分而獲得1nm,將藉此產生之訊號進行1024等分而獲得0.5nm。位置測定部41、42已經公知,故而省略詳細之說明。 The scales 41a and 42a are, for example, laser holographic scales, and memories are formed at a pitch of 0.512 μm (micrometer). The detection heads 41b, 42b irradiate light (such as laser light) to obtain the light reflected by the scales 41a, 42a. The signal generated by this is divided into 512 equal parts to obtain 1nm, and the signal generated thereby is divided into 1024 equal parts to obtain 0.5nm. The position measuring units 41 and 42 are already known, and therefore detailed description thereof will be omitted.

於光照射部30a,設置具有與xz平面大致平行之反射面之鏡55a。於光照射部30g,設置具有與xz平面大致平行之反射面之鏡55b、55c。鏡55a、55b、55c係以x方向之位置不重疊之方式設置。 In the light irradiation part 30a, the mirror 55a which has the reflection surface substantially parallel to the xz plane is provided. Mirrors 55b and 55c having reflective surfaces substantially parallel to the xz plane are provided in the light irradiation portion 30g. The mirrors 55a, 55b, and 55c are installed so that the positions in the x direction do not overlap.

於光照射部30a,設置具有與yz平面大致平行之反射面之鏡56a。 於光照射部30g,設置具有與yz平面大致平行之反射面之鏡56g。 In the light irradiation part 30a, the mirror 56a which has the reflection surface substantially parallel to the yz plane is provided. In the light irradiation part 30g, the mirror 56g which has the reflection surface substantially parallel to the yz plane is provided.

雷射干涉儀51、52照射4根雷射光。雷射干涉儀51包括雷射干涉儀51a、51b、51c。雷射干涉儀52包括雷射干涉儀52a、52g。 The laser interferometers 51 and 52 irradiate four laser beams. The laser interferometer 51 includes laser interferometers 51a, 51b, and 51c. The laser interferometer 52 includes laser interferometers 52a, 52g.

圖2中,將雷射光之路徑以兩點鏈線表示。由雷射干涉儀51a、51b、51c照射之光中之2根係由條狀鏡23反射,其反射光由雷射干涉儀51a、51b、51c接收。 In FIG. 2, the path of the laser light is represented by a chain line of two dots. Two of the lights irradiated by the laser interferometers 51a, 51b, and 51c are reflected by the strip mirror 23, and the reflected light is received by the laser interferometers 51a, 51b, and 51c.

由雷射干涉儀51a照射之光中之其餘2根係由鏡55a反射,其反射光由雷射干涉儀51a接收。由雷射干涉儀51b照射之光中之其餘2根係由鏡55b反射,其反射光由雷射干涉儀51b接收。由雷射干涉儀51c照射之光中之其餘2根係由鏡55c反射,其反射光由雷射干涉儀51c接收。 The remaining two of the lights irradiated by the laser interferometer 51a are reflected by the mirror 55a, and the reflected light is received by the laser interferometer 51a. The other two of the light irradiated by the laser interferometer 51b are reflected by the mirror 55b, and the reflected light is received by the laser interferometer 51b. The other two of the light irradiated by the laser interferometer 51c are reflected by the mirror 55c, and the reflected light is received by the laser interferometer 51c.

雷射干涉儀51a~51c分別藉由以鏡55a~55c之位置為基準來測定條狀鏡23之位置,而測定光照射部30a、30g與遮罩保持部20之y方向之位置關係。 The laser interferometers 51a to 51c measure the position of the strip mirror 23 based on the positions of the mirrors 55a to 55c respectively to measure the positional relationship in the y direction between the light irradiation parts 30a and 30g and the mask holding part 20 .

由雷射干涉儀52a照射之光中之2根係由條狀鏡22反射,其反射光由雷射干涉儀52a接收。由雷射干涉儀52g照射之光中之2根係由條狀鏡21反射,其反射光由雷射干涉儀52g接收。 Two of the lights irradiated by the laser interferometer 52a are reflected by the strip mirror 22, and the reflected light is received by the laser interferometer 52a. Two of the lights irradiated by the laser interferometer 52g are reflected by the strip mirror 21, and the reflected light is received by the laser interferometer 52g.

由雷射干涉儀52a照射之光中之其餘2根係由鏡56a反射,其反射光由雷射干涉儀52a接收。由雷射干涉儀52g照射之光中之其餘2根係由鏡56g反射,其反射光由雷射干涉儀52g接收。 The remaining two of the lights irradiated by the laser interferometer 52a are reflected by the mirror 56a, and the reflected light is received by the laser interferometer 52a. The remaining two of the lights irradiated by the laser interferometer 52g are reflected by the mirror 56g, and the reflected light is received by the laser interferometer 52g.

雷射干涉儀52a、52g分別藉由以鏡56a、56g之位置為基準來測定條狀鏡21、22之位置,而測定光照射部30a~30g與遮罩保持部20之x方向之位置關係。 The laser interferometers 52a, 52g respectively measure the positions of the strip mirrors 21, 22 based on the positions of the mirrors 56a, 56g, and measure the positional relationship between the light irradiation parts 30a~30g and the mask holding part 20 in the x direction .

本實施形態中,於光照射部30b~30f上不設置鏡,亦不設置測定該鏡之位置之雷射干涉儀。其原因在於,使光照射部30a~30g於30μm左右之範 圍內於z方向上移動時之光軸之振動小至數nm以下(後文詳述),基於光照射部30a、30g之位置,藉由內插而求出光照射部30b~30f之位置。藉此,可使裝置小型化,且可降低成本。 In this embodiment, no mirror is provided on the light irradiation parts 30b to 30f, and a laser interferometer for measuring the position of the mirror is not provided. The reason for this is to make the light irradiation portions 30a to 30g within the range of about 30 μm. The vibration of the optical axis when moving in the z direction within the range is as small as several nanometers or less (details will be described later), based on the positions of the light irradiation parts 30a and 30g, the positions of the light irradiation parts 30b~30f are obtained by interpolation . Thereby, the size of the device can be reduced, and the cost can be reduced.

其次,對框體15進行說明。圖3、4係表示框體15之支持部15a之概略的立體圖。圖3為從背面側(-x側)看之圖,圖4為從正面側(+x側)看之圖。圖3、4為了說明,而將支持部15a與柱15c稍微分離而圖示,但實際上,支持部15a與柱15c鄰接。 Next, the housing 15 will be described. 3 and 4 are perspective views schematically showing the support portion 15 a of the frame body 15 . FIG. 3 is a view seen from the back side (-x side), and FIG. 4 is a view seen from the front side (+x side). 3 and 4 illustrate the supporting portion 15a and the post 15c with a slight separation for the sake of explanation, but actually, the supporting portion 15a and the post 15c are adjacent to each other.

支持部15a係剖面形狀為大致矩形形狀之大致棒狀,內部成為空洞。支持部15a係以長邊方向成為大致水平方向(此處為y方向)之方式配置。柱15c分別設置於支持部15a之兩端。 The support portion 15a is substantially rod-shaped with a substantially rectangular cross-sectional shape, and has a hollow inside. The support part 15a is arrange|positioned so that a longitudinal direction may become a substantially horizontal direction (here, y direction). The pillars 15c are respectively provided at both ends of the supporting part 15a.

支持部15a主要包括:底板151、支持板153、設置於底板151及支持板153之兩側的側板152、154、以及隔離壁159。底板151及支持板153大致水平地配置,側板152、154大致鉛直地配置。 The supporting portion 15 a mainly includes: a bottom plate 151 , a supporting plate 153 , side plates 152 , 154 disposed on both sides of the bottom plate 151 and the supporting plate 153 , and a partition wall 159 . The bottom plate 151 and the support plate 153 are arranged approximately horizontally, and the side plates 152 and 154 are arranged approximately vertically.

本實施形態中,底板151、支持板153及側板152、154之板厚為約15mm~20mm,底板151、支持板153及側板152、154之y方向之長度(圖9中之W1)為約2.2m。 In this embodiment, the plate thickness of base plate 151, support plate 153 and side plates 152, 154 is about 15 mm ~ 20 mm, and the length (W1 among Fig. 9) of the y direction of base plate 151, support plate 153 and side plates 152, 154 is about 2.2m.

於底板151及支持板153上,分別沿著y方向而形成圓孔155a~155g、156a~156g。圓孔155a~155g、156a~156g係分別於大致鉛直方向上貫通底板151及支持板153之孔,為俯視大致圓形。俯視時,圓孔155a~155g之中心之位置、與圓孔156a~156g之中心之位置大致一致。 Circular holes 155 a to 155 g and 156 a to 156 g are respectively formed on the bottom plate 151 and the support plate 153 along the y direction. The round holes 155a~155g, 156a~156g are holes which penetrate the bottom plate 151 and the support plate 153 in the substantially vertical direction respectively, and are substantially circular in plan view. When viewed from above, the positions of the centers of the circular holes 155a-155g are approximately the same as the positions of the centers of the circular holes 156a-156g.

於圓孔155a~155g、156a~156g上,分別以覆蓋圓孔155a~155g、156a~156g之方式設置引導構件70、70A(後文詳述),且於引導構件70、70A上設置光照射部30a~30g。換言之,光照射部30a~30g經由引導構件70、70A而設置於框體15上。關於將光照射部30a~30g安裝於框體15上之安裝構造,後 文詳述。 On the round holes 155a~155g, 156a~156g, guide members 70, 70A (described in detail later) are provided to cover the round holes 155a~155g, 156a~156g, respectively, and light irradiation is arranged on the guide members 70, 70A. Parts 30a~30g. In other words, the light irradiation sections 30 a to 30 g are provided on the housing 15 via the guide members 70 and 70A. Regarding the mounting structure for mounting the light irradiation parts 30a to 30g on the frame body 15, the following The article details.

又,於底板151上,與圓孔155a~155g鄰接而形成圓孔157a~157g。於圓孔157a~157g中插入讀取部(未圖示)之鏡筒。 In addition, circular holes 157 a to 157 g are formed adjacent to circular holes 155 a to 155 g on bottom plate 151 . The lens barrel of the reading unit (not shown) is inserted into the circular holes 157a~157g.

於側板152、154上,分別形成孔152a~152i、154a~154i。孔152a~152g、154a~154g分別以y方向之位置與圓孔155a~155g、156a~156g重疊之方式設置。孔152a~152g、154a~154g用於將讀取部60安裝於圓孔157a~157g中。孔152h、152i分別設置於孔152a~152g之兩側,孔154h、154i分別設置於孔154a~154g之兩側。框體15為鑄件,孔152a~152i、154a~154i係作為於鑄造時用以將鑄砂排出而形成內部空間之鑄造孔來使用。 Holes 152 a - 152 i , 154 a - 154 i are respectively formed on the side plates 152 , 154 . The holes 152a-152g, 154a-154g are provided so that the positions in the y direction overlap with the circular holes 155a-155g, 156a-156g, respectively. The holes 152a to 152g and 154a to 154g are used to attach the reading unit 60 to the circular holes 157a to 157g. The holes 152h and 152i are respectively arranged on both sides of the holes 152a-152g, and the holes 154h and 154i are respectively arranged on both sides of the holes 154a-154g. The frame body 15 is a casting, and the holes 152a to 152i and 154a to 154i are used as casting holes for discharging casting sand to form an internal space during casting.

支持部15a之內部為空洞,作為增強而於支持部15a之內部設置有隔離壁159。隔離壁159為板狀之構件,端面與底板151、支持板153及側板152、154抵接。藉此,於設置有隔離壁159之位置,支持部15a之內部之空洞消失,防止支持部15a之振動或變形(撓曲、扭轉等)。 The inside of the support portion 15a is hollow, and a partition wall 159 is provided inside the support portion 15a as reinforcement. The partition wall 159 is a plate-shaped member, and its end faces are in contact with the bottom plate 151 , the support plate 153 , and the side plates 152 and 154 . Thereby, at the position where the partition wall 159 is provided, the cavity inside the support portion 15a disappears, and vibration or deformation (bending, torsion, etc.) of the support portion 15a is prevented.

框體15包括使支持部15a沿著柱15c而於z方向上移動之移動機構161。移動機構161使支持部15a於z方向上在10mm左右之範圍內移動。本實施形態之移動機構161包括:沿著z方向而設置於與支持部15a之長邊方向大致正交之端面的齒條161a、以可旋轉之方式設置於柱15c上之小齒輪161b、以及使小齒輪161b旋轉之旋轉驅動部161f(參照圖13)。齒條161a設置於與支持部15a之長邊方向大致正交之端面之大致中央,使用螺桿等(圖示省略)而固定於從支持部15a之側面向外側突出之凸部158上。小齒輪161b以可旋轉之方式設置於柱15c上,且與齒條161a咬合。 The housing 15 includes a movement mechanism 161 that moves the support portion 15a in the z direction along the column 15c. The moving mechanism 161 moves the supporting part 15a within a range of about 10 mm in the z direction. The moving mechanism 161 of this embodiment includes: a rack 161a provided along the z direction on an end surface substantially perpendicular to the longitudinal direction of the supporting portion 15a; a pinion 161b rotatably provided on the column 15c; and 161f of rotation drive parts which rotate the pinion gear 161b (refer FIG. 13). The rack 161a is provided substantially at the center of the end surface substantially perpendicular to the longitudinal direction of the support portion 15a, and is fixed to the convex portion 158 protruding outward from the side of the support portion 15a by using a screw or the like (not shown). The pinion 161b is rotatably provided on the post 15c, and engages with the rack 161a.

於柱15c上設置2個永電磁鐵163。2個永電磁鐵163設置於柱15c上,且配置於支持部15a之長邊方向之兩端近旁。永電磁鐵163係沿著與設置有齒條161a之端面鄰接之側板154而設置。 Two permanent electromagnets 163 are installed on the column 15c. The two permanent electromagnets 163 are installed on the column 15c, and are arranged near both ends in the longitudinal direction of the support part 15a. The permanent electromagnet 163 is arranged along the side plate 154 adjacent to the end surface provided with the rack 161a.

永電磁鐵163係包括永久磁鐵163a(參照圖13)及電磁鐵163b(參照圖13)之永電磁鐵,僅於磁化及去磁時,於電磁鐵163b之線圈中流通電流,進行內藏之永久磁鐵163a之開閉。框體15中使用之低膨脹合金由於為磁性材料,故而可藉由永電磁鐵163而移動。永電磁鐵163於開閉時僅短時間(例如0.2秒左右)通電即可,因此基本上不發熱。又,永電磁鐵163之永久磁鐵打開後之磁力不變化。 The permanent electromagnet 163 is a permanent electromagnet comprising a permanent magnet 163a (referring to FIG. 13 ) and an electromagnet 163b (referring to FIG. 13 ). Only when magnetizing and demagnetizing, current flows through the coil of the electromagnet 163b to carry out built-in Opening and closing of the permanent magnet 163a. The low-expansion alloy used in the frame body 15 can be moved by the permanent electromagnet 163 because it is a magnetic material. The permanent electromagnet 163 only needs to be energized for a short time (for example, about 0.2 seconds) when it is switched on and off, so it basically does not generate heat. Also, the magnetic force of the permanent magnet of the permanent electromagnet 163 does not change after it is turned on.

又,永電磁鐵163具有調整撥號盤163c(參照圖13)。調整撥號盤163c係調整電磁鐵163b之線圈中所流通之電流者,例如構成為可以1~10之10個階段來調整電流。本實施形態中,於調整撥號盤163c之值為「10」時,永電磁鐵163吸附支持部15a之吸附力成為第1吸附力(後文詳述),於調整撥號盤163c之值為「2」或「3」時(調整撥號盤163c之值為「10」時之電流值之約20%至約30%),永電磁鐵163吸附支持部15a之吸附力成為第2吸附力(後文詳述)。由於電流值與磁通密度及吸附力成比例,故而藉由對調整撥號盤163c進行調整,則永電磁鐵163之磁通密度及吸附力變化。 Moreover, the permanent electromagnet 163 has the adjustment dial 163c (refer FIG. 13). The adjustment dial 163c is for adjusting the current flowing in the coil of the electromagnet 163b, and is configured to adjust the current in 10 steps of 1 to 10, for example. In this embodiment, when the value of the adjustment dial 163c is "10", the adsorption force of the permanent electromagnet 163 to adsorb the support part 15a becomes the first adsorption force (described in detail later), and the value of the adjustment dial 163c is "10". 2" or "3" (about 20% to about 30% of the current value when the value of the adjustment dial 163c is "10"), the adsorption force of the permanent electromagnet 163 adsorption support part 15a becomes the second adsorption force (rear detailed in the text). Since the current value is proportional to the magnetic flux density and the attraction force, the magnetic flux density and the attraction force of the permanent electromagnet 163 are changed by adjusting the adjustment dial 163c.

於支持部15a上設置測量部164。測量部164包括:大致沿著鉛直方向而設置之標尺164a(參照圖5)、以及讀取標尺164a之值而輸出位置資訊之檢測頭164b(參照圖5)。標尺164a係與標尺41a、42a同樣,例如為雷射全息標尺。檢測頭164b係與檢測頭41b、42b同樣,照射光(例如雷射光),取得由標尺164a反射之光,基於藉此產生之訊號而獲得位置資訊。標尺164a設置在與側板154相反之側之側板152。 The measuring part 164 is provided on the support part 15a. The measurement part 164 includes: a scale 164a (see FIG. 5 ) provided substantially along the vertical direction, and a detection head 164b (see FIG. 5 ) that reads the value of the scale 164a and outputs position information. The scale 164a is the same as the scales 41a and 42a, and is, for example, a laser holographic scale. Like the detection heads 41b and 42b, the detection head 164b irradiates light (for example, laser light), obtains the light reflected by the scale 164a, and obtains positional information based on the signal generated by this. The scale 164a is disposed on the side plate 152 opposite to the side plate 154 .

又,於側板152上,設置測定至遮罩M為止之距離的測定部61(61a、61d、61g)。測定部61a、61d、61g係基於例如由感測器發光之雷射光而檢測對象物(此處為遮罩M)之高度的位移感測器。測定部61a係與光照射部30a鄰接而設置,測定部61d係與光照射部30d鄰接而設置,測定部61g係與光照射部 30g鄰接而設置。 Moreover, on the side plate 152, the measuring part 61 (61a, 61d, 61g) which measures the distance to the mask M is provided. The measurement units 61a, 61d, and 61g are displacement sensors that detect the height of an object (mask M here) based on, for example, laser light emitted by the sensor. The measurement unit 61a is provided adjacent to the light irradiation unit 30a, the measurement unit 61d is provided adjacent to the light irradiation unit 30d, and the measurement unit 61g is adjacent to the light irradiation unit 30a. 30g adjacent to the installation.

圖5係表示以圖3之面C將框體15切斷時之概略的圖。於柱15c上形成有凸部161c。凸部161c之+x側之面為滑動面161d,實施減少摩擦阻力之研磨加工即削刮加工。 FIG. 5 is a schematic diagram showing a case where the frame body 15 is cut along the plane C of FIG. 3 . A convex portion 161c is formed on the post 15c. The surface on the +x side of the convex portion 161c is a sliding surface 161d, which is subjected to grinding processing, that is, scraping processing to reduce frictional resistance.

支持部15a之-x側之面為滑動面161e。滑動面161e設置於與滑動面161d對向之位置。對滑動面161e,與滑動面161d同樣地實施削刮加工。於滑動面161e與滑動面161d之間,藉由滯留於滑動面161d、161e之微小凹凸中之潤滑油而具有數μm左右之油膜。本實施形態中,作為潤滑油,使用於常溫下液體之黏度低之礦物油。 The surface on the -x side of the support portion 15a is the sliding surface 161e. The sliding surface 161e is provided at a position facing the sliding surface 161d. The sliding surface 161e is subjected to scraping in the same manner as the sliding surface 161d. Between the sliding surface 161e and the sliding surface 161d, there is an oil film of about several μm by lubricating oil stagnant in the micro unevenness of the sliding surfaces 161d, 161e. In this embodiment, as the lubricating oil, mineral oil having a low liquid viscosity at room temperature is used.

藉由使設置於柱15c上之小齒輪161b旋轉,則固定有齒條161a之支持部15a上下移動。於移動機構161使支持部15a上下移動時,藉由形成於滑動面161d與滑動面161e之間之油膜,則滑動面161d與滑動面161e光滑地滑動。 By rotating the pinion gear 161b provided on the column 15c, the support part 15a to which the rack 161a is fixed moves up and down. When the moving mechanism 161 moves the supporting portion 15a up and down, the sliding surface 161d and the sliding surface 161e slide smoothly due to the oil film formed between the sliding surface 161d and the sliding surface 161e.

齒條161a於沿著y方向看時,齒條161a之齒位於支持部15a之x方向之中心線c上。換言之,齒條161a之齒位於通過支持部15a之重心且與z方向大致平行之線上。因此,小齒輪161b旋轉而使齒條161a(支持部15a)上下移動時不產生力矩。 When the rack 161a is viewed along the y direction, the teeth of the rack 161a are located on the centerline c of the support portion 15a in the x direction. In other words, the teeth of the rack 161a are located on a line passing through the center of gravity of the support portion 15a and substantially parallel to the z direction. Therefore, no moment is generated when the pinion gear 161b rotates and moves the rack 161a (support portion 15a) up and down.

如圖3、4所示,於未設置齒條161a及小齒輪161b之側之柱15c上,亦形成實施削刮加工之滑動面161d。而且,以與該滑動面抵接之方式,於支持部15a上形成實施削刮加工之滑動面161e(參照圖5)。 As shown in FIGS. 3 and 4, a sliding surface 161d for scraping is also formed on the column 15c on the side where the rack 161a and the pinion 161b are not provided. Then, a sliding surface 161e (see FIG. 5 ) subjected to scraping processing is formed on the support portion 15a so as to be in contact with the sliding surface.

於支持部15a之端,沿著柱15c而設置有彈性構件160。圖3、4中,僅對設置於-y側之端之彈性構件160加以表示,且對設置於+y側之端之彈性構件160省略圖示。如圖5所示,彈性構件160設置於支持部15a之下側。於彈性構件160與支持部15a之間設置定位構件162。藉由在形成於定位構件162之底面之凹部162a中插入彈性構件160,而決定彈性構件160之xy方向之位置,隨著支持部 15a之上下移動,彈性構件160成為可伸縮。如此,設置於支持部15a之兩端之彈性構件160支撐支持部15a之重量。支持部15a為約660kg~700kg,彈性構件160可支持約600kg之重量。 At the end of the supporting portion 15a, an elastic member 160 is provided along the post 15c. In FIGS. 3 and 4, only the elastic member 160 provided at the end on the -y side is shown, and the illustration of the elastic member 160 provided at the end on the +y side is omitted. As shown in FIG. 5 , the elastic member 160 is disposed on the lower side of the supporting portion 15a. A positioning member 162 is provided between the elastic member 160 and the support portion 15a. By inserting the elastic member 160 into the concave portion 162a formed on the bottom surface of the positioning member 162, the position in the xy direction of the elastic member 160 is determined, and along with the supporting portion 15a moves up and down, and the elastic member 160 becomes stretchable. In this way, the elastic members 160 disposed at both ends of the supporting portion 15a support the weight of the supporting portion 15a. The supporting part 15a is about 660kg~700kg, and the elastic member 160 can support about 600kg.

彈性構件160無法支撐之支持部15a之重量係藉由滑動面161d與滑動面161e之間之摩擦力而支撐。永電磁鐵163設置於柱15c上,藉由於電磁鐵163b(參照圖13)之線圈中流通電流而吸附支持部15a。 The weight of the supporting portion 15a that cannot be supported by the elastic member 160 is supported by the frictional force between the sliding surface 161d and the sliding surface 161e. The permanent electromagnet 163 is installed on the post 15c, and attracts the supporting part 15a by passing a current through the coil of the electromagnet 163b (see FIG. 13).

於移動機構161不沿著柱15c而使支持部15a上下移動時,藉由永電磁鐵163以第1吸附力來吸附支持部15a,則支持部15a、即齒條161a及滑動面161e向圖5左方向(參照圖5之箭頭)移動,滑動面161d與滑動面161e密接。第1吸附力為約12000N,永電磁鐵163以第1吸附力來吸附支持部15a時之永電磁鐵163之磁通密度為約0.3T(特斯拉)。又,永電磁鐵163以第1吸附力來吸附支持部15a時之滑動面161d與滑動面161e之間所產生之表面壓為約0.8MPa。 When the moving mechanism 161 does not move the supporting portion 15a up and down along the post 15c, the supporting portion 15a is attracted by the permanent electromagnet 163 with the first adsorption force, and the supporting portion 15a, that is, the rack 161a and the sliding surface 161e are directed toward the figure. 5. Moving in the left direction (see the arrow in FIG. 5 ), the sliding surface 161d is in close contact with the sliding surface 161e. The first adsorption force is about 12000N, and the magnetic flux density of the permanent electromagnet 163 when the permanent electromagnet 163 adsorbs the support portion 15a with the first adsorption force is about 0.3T (Tesla). In addition, when the permanent electromagnet 163 adsorbs the supporting portion 15a with the first adsorption force, the surface pressure generated between the sliding surface 161d and the sliding surface 161e is about 0.8 MPa.

藉由提高如上所述於滑動面161d與滑動面161e之間產生之表面壓,使滑動面161d與滑動面161e密接(強力壓縮),而排除形成於滑動面161d與滑動面161e之間的油膜。其結果為,於滑動面161d與滑動面161e之間產生摩擦。 By increasing the surface pressure generated between the sliding surface 161d and the sliding surface 161e as described above, the sliding surface 161d and the sliding surface 161e are brought into close contact (strong compression), and the oil film formed between the sliding surface 161d and the sliding surface 161e is eliminated. . As a result, friction occurs between the sliding surface 161d and the sliding surface 161e.

若排除油膜時之滑動面161d與滑動面161e之摩擦係數為0.1~0.2,永電磁鐵163之吸附力設為1500kg,則藉由滑動面161d與滑動面161e之間之摩擦而支撐150kg之重量。滑動面於支持部15a之兩側存在2處,因此彈性構件160無法支撐之支持部15a之重量ta(約60kg~100kg)可藉由摩擦力而支持。如上所述,於移動機構161不使支持部15a上下移動時,以支持部15a之高度方向(z方向)之位置不改變之方式支撐支持部15a。 If the coefficient of friction between the sliding surface 161d and the sliding surface 161e when the oil film is removed is 0.1~0.2, and the adsorption force of the permanent electromagnet 163 is set to 1500kg, a weight of 150kg can be supported by the friction between the sliding surface 161d and the sliding surface 161e . There are two sliding surfaces on both sides of the supporting part 15a, so the weight ta (approximately 60kg~100kg) of the supporting part 15a that cannot be supported by the elastic member 160 can be supported by frictional force. As mentioned above, when the moving mechanism 161 does not move the support part 15a up and down, the support part 15a is supported so that the position of the height direction (z direction) of the support part 15a does not change.

於移動機構161沿著柱15c而使支持部15a上下移動時,永電磁鐵163以弱之力(第2吸附力)來吸附支持部15a。使支持部15a上下移動時之吸附力(第2吸附力)較不使支持部15a上下移動時之吸附力(第1吸附力)弱。本實施 形態中,第2吸附力為第1吸附力之約20%至約30%。第2吸附力為約2400~約3600N,永電磁鐵163以第1吸附力來吸附支持部15a時之永電磁鐵163之磁通密度為約0.06~約0.09T。又,永電磁鐵163以第2吸附力來吸附支持部15a時之滑動面161d與滑動面161e之間所產生之表面壓為約0.16~0.24MPa。 When the moving mechanism 161 moves the support part 15a up and down along the column 15c, the permanent electromagnet 163 attracts the support part 15a with a weak force (second attraction force). The suction force (second suction force) when the support part 15a is moved up and down is weaker than the suction force (first suction force) when the support part 15a is not moved up and down. This implementation In the form, the second adsorption force is about 20% to about 30% of the first adsorption force. The second adsorption force is about 2400 to about 3600N, and the magnetic flux density of the permanent electromagnet 163 when the permanent electromagnet 163 adsorbs the supporting part 15a with the first adsorption force is about 0.06 to about 0.09T. In addition, when the permanent electromagnet 163 adsorbs the supporting portion 15a with the second adsorption force, the surface pressure generated between the sliding surface 161d and the sliding surface 161e is about 0.16~0.24MPa.

藉由永電磁鐵163以第2吸附力來吸附支持部15a,則滑動面161d與滑動面161e抵接。此時,滑動面161d與滑動面161e不密接,形成於滑動面161d與滑動面161e之間的油膜未經排除。 When the permanent electromagnet 163 adsorbs the support portion 15a with the second adsorption force, the sliding surface 161d comes into contact with the sliding surface 161e. At this time, the sliding surface 161d is not in close contact with the sliding surface 161e, and the oil film formed between the sliding surface 161d and the sliding surface 161e is not removed.

由於滑動面161d與滑動面161e抵接,故而於支持部15a上下移動時,相對於柱15c,支持部15a不傾斜。配置位置之限制上,永電磁鐵163與測量部164夾持移動機構161而配置於相反側,但本實施形態中,支持部15a不傾斜,因此即便測量部164位於遠離永電磁鐵163之位置,測量部164之測量結果亦穩定,可使支持部15a正確地上下移動。 Since the sliding surface 161d is in contact with the sliding surface 161e, when the supporting part 15a moves up and down, the supporting part 15a does not incline with respect to the column 15c. In terms of the restriction on the arrangement position, the permanent electromagnet 163 and the measuring part 164 are arranged on the opposite side with the moving mechanism 161 sandwiched between them. Therefore, the measurement result of the measuring part 164 is also stable, and the supporting part 15a can be moved up and down correctly.

此處,對第2吸附力理想為第1吸附力之約20%至約30%之原因加以說明。表1、2係表示改變永電磁鐵163之磁化力時之旋轉驅動部161f(此處為馬達)之扭矩的表。表1、2係表示使用不同馬達來進行實驗之結果者。表1、2係藉由驅動旋轉驅動部161f,使小齒輪161b旋轉而使支持部15a於高度方向上移動,測定此時之旋轉驅動部161f之扭矩而獲得者,各單元之值為扭矩(N‧m)。 Here, the reason why the second adsorption force is desirably about 20% to about 30% of the first adsorption force will be described. Tables 1 and 2 are tables showing the torque of the rotation drive unit 161f (here, the motor) when the magnetizing force of the permanent electromagnet 163 is changed. Tables 1 and 2 show the results of experiments using different motors. Tables 1 and 2 are obtained by driving the rotary drive part 161f to rotate the pinion gear 161b to move the support part 15a in the height direction, and measuring the torque of the rotary drive part 161f at this time. The values of each unit are torque ( N‧m).

吸附力係與永電磁鐵163之磁通密度、即對永電磁鐵163施加之電壓成比例。表1、2中之吸附力係基於對永電磁鐵163施加之電壓、以及於永電磁鐵163之磁通密度達到最大時對永電磁鐵163施加之電壓之比來求出。此外,吸附力0%表示去磁狀態。 The attraction force is proportional to the magnetic flux density of the permanent electromagnet 163 , that is, the voltage applied to the permanent electromagnet 163 . The attraction forces in Tables 1 and 2 are obtained based on the ratio of the voltage applied to the permanent electromagnet 163 and the voltage applied to the permanent electromagnet 163 when the magnetic flux density of the permanent electromagnet 163 reaches the maximum. In addition, 0% of the adsorption force indicates a demagnetized state.

Figure 108118015-A0305-02-0019-1
Figure 108118015-A0305-02-0019-1

Figure 108118015-A0305-02-0019-2
Figure 108118015-A0305-02-0019-2

如表1、2所示,吸附力為18.5%及24%時之旋轉驅動部161f之扭矩與去磁狀態時之旋轉驅動部161f之扭矩基本上未改變。即,若第2吸附力為第1吸附力之約24%以下,則形成於滑動面161d與滑動面161e之間的油膜未經排除,於滑動面161d與滑動面161e之間不產生摩擦。 As shown in Tables 1 and 2, the torque of the rotary drive part 161f when the adsorption force is 18.5% and 24% and the torque of the rotary drive part 161f in the demagnetized state are basically unchanged. That is, if the second adsorption force is about 24% or less of the first adsorption force, the oil film formed between the sliding surface 161d and the sliding surface 161e is not removed, and no friction occurs between the sliding surface 161d and the sliding surface 161e.

與此相對,吸附力為39%時之旋轉驅動部161f之扭矩為去磁狀態時之旋轉驅動部161f之扭矩之數倍左右,相對於去磁狀態時之旋轉驅動部161f之扭矩而言大為不同。藉此可知,吸附力為39%時,形成於滑動面161d與滑動面161e之間的油膜經排除,於滑動面161d與滑動面161e之間產生摩擦。 On the other hand, the torque of the rotary drive part 161f when the adsorption force is 39% is about several times the torque of the rotary drive part 161f in the demagnetized state, and is larger than the torque of the rotary drive part 161f in the demagnetized state. for different. It can be seen that when the adsorption force is 39%, the oil film formed between the sliding surface 161d and the sliding surface 161e is removed, and friction occurs between the sliding surface 161d and the sliding surface 161e.

根據以上,就於滑動面161d與滑動面161e之間不產生摩擦之觀點而言,將第2吸附力設為第1吸附力之約39%並不適當,理想為將第2吸附力設為第1吸附力之約30%以下。 Based on the above, from the point of view of not generating friction between the sliding surface 161d and the sliding surface 161e, it is not appropriate to set the second adsorption force at about 39% of the first adsorption force, and it is desirable to set the second adsorption force at About 30% or less of the first adsorption force.

但,於第2吸附力小於第1吸附力之約20%之情形時,從以第2吸 附力來吸附支持部15a之狀態變化為以第1吸附力來吸附支持部15a之狀態時,測量部164之測量結果變化。藉此可知,於第2吸附力小於第1吸附力之約20%之情形時,滑動面161d與滑動面161e不抵接,於支持部15a上下移動時,相對於柱15c,支持部15a傾斜。根據以上,理想為將第2吸附力設為第1吸附力之約20%至約30%。 However, when the second adsorption force is less than about 20% of the first adsorption force, the second adsorption force When the state in which the support portion 15a is attracted by the force changes to the state in which the support portion 15a is attracted by the first force of attraction, the measurement result of the measurement unit 164 changes. It can be seen from this that when the second suction force is less than about 20% of the first suction force, the sliding surface 161d does not contact the sliding surface 161e, and when the support portion 15a moves up and down, the support portion 15a is inclined relative to the column 15c. . From the above, it is desirable to set the second adsorption force to approximately 20% to approximately 30% of the first adsorption force.

其次,對光照射部30進行說明。圖6係表示光照射部30a之概略的主要部分透視圖。光照射部30a主要包括:DMD 31a、物鏡32a、光源部33a、AF處理部34a、筒狀部35a、凸緣36a、安裝部37a、38a、以及驅動部39a。光照射部30b~光照射部30g分別包括:DMD 31b~31g、物鏡32b~32g、光源部33b~33g、AF處理部34b~34g、筒狀部35b~35g、凸緣36b~36g、安裝部37b~37g、38b~38g、以及驅動部39b~39g。光照射部30b~光照射部30g由於為與光照射部30a相同之構成,故而省略說明。 Next, the light irradiation unit 30 will be described. FIG. 6 is a perspective view of main parts schematically showing the light irradiation unit 30a. The light irradiation part 30a mainly includes a DMD 31a, an objective lens 32a, a light source part 33a, an AF processing part 34a, a cylindrical part 35a, a flange 36a, mounting parts 37a, 38a, and a driving part 39a. Light irradiation part 30b~light irradiation part 30g respectively includes: DMD 31b~31g, objective lens 32b~32g, light source part 33b~33g, AF processing part 34b~34g, cylindrical part 35b~35g, flange 36b~36g, mounting part 37b~37g, 38b~38g, and drive parts 39b~39g. Since the light irradiation part 30b - the light irradiation part 30g have the same structure as the light irradiation part 30a, description is abbreviate|omitted.

DMD 31a為數位鏡器件(Digital Mirror Device,DMD),可照射面狀之雷射光。DMD 31a具有多數個可動式之微鏡(圖示省略),從1片微鏡來照射1畫素之光。微鏡之大小約為10μm,配置為二維狀。對於DMD 31a,由光源部33a(後文詳述)來照射光,光由各微鏡反射。微鏡可以與其對角線大致平行之軸為中心而旋轉,可進行打開(使光朝向遮罩M反射)與關閉(不使光朝向遮罩M反射)之切換。DMD 31a已經公知,因此省略詳細說明。 DMD 31a is a digital mirror device (Digital Mirror Device, DMD), which can irradiate planar laser light. The DMD 31a has a plurality of movable micromirrors (not shown), and irradiates light of one pixel from one micromirror. The size of the micromirrors is about 10 μm, and they are arranged two-dimensionally. The DMD 31a is irradiated with light from a light source unit 33a (details will be described later), and the light is reflected by each micromirror. The micromirror can rotate around an axis approximately parallel to its diagonal, and can be switched on (reflecting light toward the mask M) and off (not reflecting light toward the mask M). The DMD 31a is already known, and thus detailed description thereof will be omitted.

物鏡32a使由DMD 31a之各微鏡所反射之雷射光成像於遮罩M之表面。描繪時,由光照射部30a~光照射部30g分別照射光,該光於遮罩M上成像,藉此於遮罩M上描繪圖案。 The objective lens 32a makes the laser light reflected by each micromirror of the DMD 31a form an image on the surface of the mask M. When drawing, light is irradiated from the light irradiation part 30a - the light irradiation part 30g respectively, and this light forms an image on the mask M, and a pattern is drawn on the mask M by this light.

光源部33a主要包括:光源331、透鏡332、複眼透鏡333、透鏡334、335、以及鏡336。光源331例如為雷射二極體,由光源331射出之光經由光纖等而導入透鏡332中。 The light source unit 33 a mainly includes a light source 331 , a lens 332 , a fly-eye lens 333 , lenses 334 , 335 , and a mirror 336 . The light source 331 is, for example, a laser diode, and the light emitted from the light source 331 is introduced into the lens 332 through an optical fiber or the like.

光係從透鏡332導入複眼透鏡333中。複眼透鏡333係將複數片透鏡(未圖示)配置為二維狀者,於複眼透鏡333中製作多數個點光源。通過複眼透鏡333之光通過透鏡334、335(例如聚光透鏡)而成為平行光,由鏡336而朝向DMD 31a反射。 The light system is introduced from the lens 332 into the fly-eye lens 333 . The fly-eye lens 333 is a two-dimensional arrangement of a plurality of lenses (not shown), and a plurality of point light sources are produced in the fly-eye lens 333 . The light passing through the fly-eye lens 333 becomes parallel light through lenses 334 and 335 (for example, condenser lenses), and is reflected toward the DMD 31 a by the mirror 336 .

AF處理部34a係使對遮罩M照射之光之焦點聚焦於遮罩M上者,主要包括:AF用光源341、準直透鏡342、AF用柱面透鏡343、五稜鏡344、345、透鏡346、以及AF感測器347、348。由AF用光源341照射之光藉由準直透鏡342而成為平行光,藉由AF用柱面透鏡343而成為線狀之光,由五稜鏡344反射而成像於遮罩M之表面。由遮罩M反射之光係由五稜鏡345反射,由透鏡346聚光而射入AF感測器347、348。五稜鏡344、345以約97度之彎曲角度使光彎曲。此外,雖亦可使用鏡代替五稜鏡344、345,但由於鏡之角度偏移會引起焦點模糊,故而理想為使用五稜鏡。AF處理部34a進行自動對焦處理,即,基於由AF感測器347、348所受光之結果,而求出聚焦位置。此外,如上所述之利用光槓桿式之自動對焦處理已經公知,因此省略詳細說明。 The AF processing part 34a focuses the focus of the light irradiated on the mask M on the mask M, and mainly includes: AF light source 341, collimator lens 342, AF cylindrical lens 343, five beams 344, 345, lens 346, and AF sensors 347, 348. The light irradiated by the AF light source 341 becomes parallel light by the collimator lens 342 , and becomes linear light by the AF cylindrical lens 343 , and is reflected by the light beam 344 to be imaged on the surface of the mask M. The light reflected by the mask M is reflected by the lens 345 , condensed by the lens 346 and enters the AF sensors 347 and 348 . The pentacles 344, 345 bend light at a bend angle of about 97 degrees. In addition, although mirrors can also be used instead of the five-colored mirrors 344 and 345, since the angular deviation of the mirrors will cause focus blur, it is ideal to use five-starred mirrors. The AF processing unit 34a performs autofocus processing, that is, obtains a focus position based on the results of light received by the AF sensors 347 and 348 . In addition, since the above-mentioned autofocus processing using the optical lever type is already known, detailed description thereof will be omitted.

光照射部30a具有於內部設置有光學系統(包含物鏡32a)之大致圓筒形狀之筒狀部35a。於筒狀部35a之上側之端設置凸緣36a。凸緣36a於上側保持透鏡332、複眼透鏡333及透鏡334、335。因此,光照射部30a之重心較光軸ax而言向圖6中之左方向偏移。 The light irradiation part 30a has the substantially cylindrical-shaped cylindrical part 35a in which the optical system (including the objective lens 32a) was provided. A flange 36a is provided at the upper end of the cylindrical portion 35a. The flange 36a holds the lens 332, the fly-eye lens 333, and the lenses 334, 335 on the upper side. Therefore, the center of gravity of the light irradiation part 30a deviates to the left direction in FIG. 6 with respect to the optical axis ax.

又,於筒狀部35a上設置安裝部37a、38a。安裝部37a、38a用於對框體15之安裝。安裝部37a設置於凸緣36a之近旁,安裝部38a設置於筒狀部35a之下端近旁。於安裝部37a上形成具有較安裝部38a之外徑更大之直徑的中空部372。藉此,筒狀部35a可向上方拔出。此外,圖6中,省略形成於安裝部37a、38a中之螺桿孔371、381(後文詳述)之圖示。 Moreover, attachment parts 37a, 38a are provided in the cylindrical part 35a. The mounting parts 37 a and 38 a are used for mounting the frame body 15 . The mounting part 37a is provided near the flange 36a, and the mounting part 38a is provided near the lower end of the cylindrical part 35a. A hollow portion 372 having a larger diameter than the outer diameter of the mounting portion 38a is formed on the mounting portion 37a. Thereby, the cylindrical part 35a can be pulled out upwards. In addition, in FIG. 6 , the illustration of the screw holes 371 and 381 (described later in detail) formed in the mounting portions 37 a and 38 a is omitted.

安裝部37a(即,光照射部30a)藉由驅動部39a而於鉛直方向(z 方向)上移動。圖7係表示驅動部39a之概略的側視圖。驅動部39a主要包括壓電元件391、及連結部392。 The mounting part 37a (that is, the light irradiation part 30a) is moved in the vertical direction (z) by the driving part 39a. direction) to move up. FIG. 7 is a schematic side view showing the drive unit 39a. The drive unit 39 a mainly includes a piezoelectric element 391 and a connection unit 392 .

壓電元件391係藉由施加電壓而產生位移之固體致動器(piezoelectric element)。壓電元件391之不位移之部分(例如下端)經由安裝部395而設置於框體15之支持部15a(參照圖11)。若對壓電元件391印加電壓,則壓電元件391伸長,壓電元件391之上側之端向上方移動。圖7之虛線表示壓電元件391縮短之狀態,圖7之實線表示壓電元件391延長之狀態。 The piezoelectric element 391 is a solid actuator (piezoelectric element) that generates displacement by applying a voltage. A non-displaced portion (for example, the lower end) of the piezoelectric element 391 is provided on the supporting portion 15 a of the frame body 15 via the mounting portion 395 (see FIG. 11 ). When a voltage is applied to the piezoelectric element 391, the piezoelectric element 391 expands, and the upper end of the piezoelectric element 391 moves upward. The dotted line in FIG. 7 shows the state where the piezoelectric element 391 is shortened, and the solid line in FIG. 7 shows the state where the piezoelectric element 391 is extended.

連結部392係下端螺合於壓電元件391中之大致圓柱形狀之構件。連結部392隨著壓電元件391之伸縮而上下移動。 The connecting portion 392 is a substantially cylindrical member whose lower end is screwed into the piezoelectric element 391 . The connecting portion 392 moves up and down as the piezoelectric element 391 expands and contracts.

於連結部392之上端,設置前端為圓弧形狀之凸部393。凸部393之前端抵接於安裝部37a(參照圖6)之下側。因此,若壓電元件391伸長,則光照射部30a向+z方向移動,若壓電元件391縮短,則光照射部30a向-z方向移動。 On the upper end of the connecting portion 392, a convex portion 393 with a circular arc-shaped front end is provided. The front end of the convex portion 393 abuts against the lower side of the mounting portion 37a (see FIG. 6 ). Therefore, when the piezoelectric element 391 expands, the light irradiation part 30a moves in the +z direction, and when the piezoelectric element 391 shortens, the light irradiation part 30a moves in the -z direction.

於連結部392之側面形成有複數個槽394。槽394係以隨著接近中心軸而向斜下方向切入之方式來形成。因此,即便壓電元件391彎曲伸長(參照圖7兩點鏈線),連結部392亦於槽394之部分變形,可使凸部393不於水平方向上移動,而僅於鉛直方向上移動。 A plurality of grooves 394 are formed on the side of the connecting portion 392 . The groove 394 is formed to cut obliquely downward as it approaches the central axis. Therefore, even if the piezoelectric element 391 is bent and elongated (refer to the chain line of two dots in FIG. 7 ), the connecting portion 392 is also partially deformed in the groove 394, so that the convex portion 393 does not move in the horizontal direction, but only moves in the vertical direction.

其次,對將光照射部30a~30g安裝於框體15上之安裝構造進行說明。本實施形態之安裝構造中,於底板151上安裝引導構件70,於支持板153上安裝引導構件70A,於引導構件70、70A上安裝光照射部30a~30g,藉此將光照射部30a~30g安裝於框體15上。即,引導構件70、70A設置於光照射部30a與框體15(此處為支持板153)之間。 Next, the attachment structure which attaches the light irradiation part 30a-30g to the frame body 15 is demonstrated. In the installation structure of the present embodiment, the guide member 70 is installed on the bottom plate 151, the guide member 70A is installed on the support plate 153, and the light irradiation parts 30a~30g are installed on the guide members 70, 70A, whereby the light irradiation parts 30a~30g 30g is installed on the frame body 15 . That is, the guide members 70 and 70A are provided between the light irradiation part 30a and the frame body 15 (here, the support plate 153).

首先,對引導構件70、70A進行說明。引導構件70、70A係設置於支持部15a(底板151、支持板153)與光照射部30之間的大致薄板狀之構件。 First, the guide members 70 and 70A will be described. The guide members 70 and 70A are substantially thin plate-shaped members provided between the support portion 15 a (base plate 151 , support plate 153 ) and the light irradiation portion 30 .

圖8的(A)係表示引導構件70之概略的圖,圖8的(B)係表示 引導構件70A之概略的圖。引導構件70與引導構件70A之直徑不同。 (A) of FIG. 8 is a diagram showing the outline of the guide member 70, and (B) of FIG. 8 shows A schematic diagram of the guide member 70A. The diameter of the guide member 70 is different from that of the guide member 70A.

引導構件70、70A為大致薄板狀,且為俯視大致圓板形狀。引導構件70、70A係由厚度為約0.5~1mm左右之金屬所形成。本實施形態中,引導構件70為約0.5mm,引導構件70A為約1mm。金屬可使用不鏽鋼、磷青銅等,但理想為更均質之磷青銅。此外,本發明中之所謂約0.5~1mm左右,係指相對於約0.5~1mm而包含約0.5mm以下之誤差。 The guide members 70 and 70A are substantially thin plate-shaped, and have a substantially circular plate shape in plan view. The guide members 70 and 70A are formed of metal with a thickness of about 0.5 to 1 mm. In this embodiment, the guide member 70 is about 0.5 mm, and the guide member 70A is about 1 mm. Metals such as stainless steel and phosphor bronze can be used, but more homogeneous phosphor bronze is ideal. In addition, about 0.5 to 1 mm in the present invention means that an error of about 0.5 mm or less is included with respect to about 0.5 to 1 mm.

於引導構件70、70A中,於大致中央形成安裝孔74、74A。又,於引導構件70、70A中,沿著外周而形成複數個孔77,且沿著安裝孔74、74A而形成複數個孔78。 Attachment holes 74, 74A are formed substantially in the center of the guide members 70, 70A. In addition, in the guide members 70 and 70A, a plurality of holes 77 are formed along the outer periphery, and a plurality of holes 78 are formed along the attachment holes 74 and 74A.

於引導構件70中,為使引導構件70容易變形之方式,大致圓弧形狀之剪切孔79A、79B分別形成複數個。剪切孔79A、79B分別沿著周方向而配置為等間隔。剪切孔79A之半徑小於剪切孔79B之半徑,剪切孔79B配置於剪切孔79A之外側。又,包含剪切孔79A之端的端部區域79Aa、與包含剪切孔79B之端的端部區域79Ba的周方向之位置大致一致。此外,端部區域79Aa、79Ba分別存在於剪切孔79A、79B之兩端。 In the guide member 70 , in order to facilitate the deformation of the guide member 70 , a plurality of substantially arc-shaped shear holes 79A and 79B are respectively formed. The shear holes 79A and 79B are arranged at equal intervals along the circumferential direction. The radius of the shear hole 79A is smaller than the radius of the shear hole 79B, and the shear hole 79B is disposed outside the shear hole 79A. In addition, the positions in the circumferential direction of the end region 79Aa including the end of the shear hole 79A substantially coincide with that of the end region 79Ba including the end of the shear hole 79B. In addition, end regions 79Aa, 79Ba exist at both ends of the shear holes 79A, 79B, respectively.

於引導構件70A中,為使引導構件70A容易變形,大致圓弧形狀之剪切孔79C、79D分別形成複數個。剪切孔79C、79D分別沿著周方向而配置為等間隔。剪切孔79C之半徑小於剪切孔79D之半徑,剪切孔79D配置於剪切孔79C之外側。又,包含剪切孔79C之端的端部區域79Ca、與包含剪切孔79D之端的端部區域79Da的周方向之位置大致一致。此外,端部區域79Ca、79Da分別存在於剪切孔79C、79D之兩端。 In the guide member 70A, in order to make the guide member 70A easy to deform, a plurality of substantially arc-shaped shear holes 79C and 79D are respectively formed. The shear holes 79C and 79D are arranged at equal intervals along the circumferential direction. The radius of the shear hole 79C is smaller than the radius of the shear hole 79D, and the shear hole 79D is disposed outside the shear hole 79C. In addition, the positions in the circumferential direction of the end region 79Ca including the end of the shear hole 79C substantially coincide with that of the end region 79Da including the end of the shear hole 79D. In addition, end regions 79Ca, 79Da exist at both ends of the shear holes 79C, 79D, respectively.

本實施形態中,剪切孔79A、79B、79C、79D各為4個,但剪切孔79A、79B、79C、79D之位置及數量並不限定於此。 In this embodiment, the number of each of the shear holes 79A, 79B, 79C, and 79D is four, but the positions and numbers of the shear holes 79A, 79B, 79C, and 79D are not limited thereto.

端部區域79Aa與端部區域79Ba之周方向之位置大致一致,該重 疊之位置均等地(例如每隔約45度)配置於周方向。又,端部區域79Ca與端部區域79Da之周方向之位置大致一致,該重疊之位置均等地(例如每隔約45度)配置於周方向。因此,從引導構件70、70A之中心點拉出於直徑方向上放射狀地延伸之線,則該線必定通過剪切孔79A~79D中之至少1個。因此,引導構件70、70A之變形量不論周方向之部位如何,均為大致一定。又,藉由如上所述配置剪切孔79A~79D,則即便將厚度為1mm左右之厚度之薄板用於引導構件70、70A,引導構件70、70A亦隨著約30μm之筒狀部35a之上下移動而伸縮。 The positions in the circumferential direction of the end region 79Aa and the end region 79Ba are approximately the same, and the weight The positions of the stacks are evenly arranged (for example, every about 45 degrees) in the circumferential direction. In addition, the positions of the end region 79Ca and the end region 79Da in the circumferential direction substantially match each other, and the overlapping positions are arranged equally (for example, every about 45 degrees) in the circumferential direction. Therefore, if a line extending radially in the radial direction is drawn from the center point of the guide members 70 and 70A, the line must pass through at least one of the cutting holes 79A to 79D. Therefore, the amount of deformation of the guide members 70 and 70A is substantially constant regardless of the location in the circumferential direction. Also, by arranging the shear holes 79A to 79D as described above, even if a thin plate having a thickness of about 1 mm is used for the guide members 70 and 70A, the guide members 70 and 70A follow the diameter of the cylindrical portion 35a of about 30 μm. Move up and down to expand and contract.

圖9的(A)表示於底板151上安裝引導構件70時之底板151與引導構件70之位置關係,圖9的(B)表示於支持板153上安裝引導構件70A時之支持板153與引導構件70A之位置關係。 (A) of Figure 9 shows the positional relationship between the base plate 151 and the guide member 70 when the guide member 70 is installed on the base plate 151, and (B) of Figure 9 shows the support plate 153 and the guide when the guide member 70A is installed on the support plate 153. The positional relationship of the member 70A.

引導構件70係以覆蓋圓孔155a~155g之方式,於底板151上設置7個。引導構件70A係以覆蓋圓孔156a~156g之方式,於支持板153上設置7個。安裝孔74、74A係與圓孔155a~155g、156a~156g配置為大致同心圓狀。 Seven guide members 70 are provided on the bottom plate 151 so as to cover the circular holes 155a to 155g. Seven guide members 70A are provided on the support plate 153 so as to cover the circular holes 156a to 156g. The attachment holes 74 and 74A are arranged substantially concentrically with the round holes 155a to 155g and 156a to 156g.

引導構件70及圓孔155a~155g均等地配置於底板151之中央部分,引導構件70A及圓孔156a~156g均等地配置於支持板153之中央部分。鄰接之圓孔155a~155g(即引導構件70)之間隔以及鄰接之圓孔156a~156g(即引導構件70A)之間隔W2係與光照射部30a~30g之間隔大致相同。 The guide member 70 and the circular holes 155 a to 155 g are equally arranged at the central portion of the bottom plate 151 , and the guide member 70A and the circular holes 156 a to 156 g are equally arranged at the central portion of the support plate 153 . The intervals between the adjacent round holes 155a~155g (ie, the guide member 70) and the interval W2 between the adjacent round holes 156a~156g (ie, the guide member 70A) are substantially the same as the intervals between the light irradiation parts 30a~30g.

於設置於圓孔155a、156a中之引導構件70、70A上,設置光照射部30a之筒狀部35。於設置於圓孔155b、156b中之引導構件70、70A上,設置光、光照射部30b。同樣,於設置於圓孔155c~155g、156c~156g中之引導構件70、70A上,分別設置光照射部30c~30g。 On the guide members 70, 70A provided in the circular holes 155a, 156a, the cylindrical portion 35 of the light irradiation portion 30a is provided. On the guide members 70, 70A provided in the circular holes 155b, 156b, the light, the light irradiation part 30b is provided. Similarly, on the guide members 70, 70A provided in the circular holes 155c-155g, 156c-156g, the light irradiation parts 30c-30g are respectively provided.

圓孔155a與圓孔156a係以俯視時之位置重疊之方式形成。同樣,圓孔155b~155g與圓孔156b~156g分別以俯視時之位置重疊之方式形成。 The round hole 155a and the round hole 156a are formed so that their positions overlap in plan view. Similarly, the circular holes 155b to 155g and the circular holes 156b to 156g are formed so that their respective positions overlap when viewed from above.

其次,對光照射部30a之安裝進行說明。圖10係將光照射部30a 安裝於支持板153上之安裝構造之分解立體圖。此外,將光照射部30b~30g安裝於底板151上之安裝構造以及將光、光照射部30b~30g安裝於支持板153上之安裝構造係與將光照射部30a安裝於底板151上之安裝構造相同,故而省略說明。 Next, the attachment of the light irradiation part 30a is demonstrated. Figure 10 is the light irradiation part 30a An exploded perspective view of the installation structure installed on the support plate 153. In addition, the installation structure of installing the light irradiation parts 30b~30g on the base plate 151 and the installation structure of the light and the light irradiation parts 30b~30g on the support plate 153 are similar to the installation of the light irradiation part 30a on the base plate 151. Since the structures are the same, explanations are omitted.

引導構件70A係以覆蓋圓孔156a之方式設置於支持板153上。藉由將螺桿85插入孔77中,使螺桿85螺合於形成於支持板153上之螺桿孔156h中,則引導構件70A固定於支持板153上。 The guide member 70A is provided on the support plate 153 so as to cover the circular hole 156a. By inserting the screw 85 into the hole 77 and screwing the screw 85 into the screw hole 156 h formed on the support plate 153 , the guide member 70A is fixed on the support plate 153 .

光照射部30a(即筒狀部35a)係經由安裝部37a而設置於引導構件70A上。藉由將螺桿86插入孔78中,使螺桿86螺合於螺桿孔371中,則引導構件70A固定於安裝部37a上。藉此,光照射部30a係以光軸與安裝孔74A之中心大致一致之方式,插入安裝孔74A中而固定於引導構件70A上。 The light irradiation part 30a (that is, the cylindrical part 35a) is provided in the guide member 70A via the attachment part 37a. By inserting the screw 86 into the hole 78 and screwing the screw 86 into the screw hole 371, the guide member 70A is fixed to the mounting portion 37a. Thereby, the light irradiation part 30a is inserted into the attachment hole 74A, and is fixed to the guide member 70A so that the optical axis may substantially coincide with the center of the attachment hole 74A.

圖11係示意性表示於框體15(此處為支持部15a)上安裝有光照射部30a之狀態的圖。圖11中,表示以通過安裝孔74及孔75、76之中心之面來切斷之狀態。圖11中,表示一部分構成要件之剖面。又,圖11中,省略螺桿85、86等緊固構件以及設置有該等之孔之圖示。 Fig. 11 is a diagram schematically showing a state in which the light irradiation unit 30a is attached to the frame body 15 (here, the support unit 15a). In FIG. 11, it shows the state which cut with the plane which passes the center of the mounting hole 74 and the holes 75,76. In Fig. 11, a cross section of a part of constituent elements is shown. In addition, in FIG. 11, illustration of fastening members, such as the screw rod 85,86, and the hole provided with these is abbreviate|omitted.

筒狀部35a插入引導構件70、70A之安裝孔74、74A中。於安裝部38a位於引導構件70之上側,較筒狀部35a之安裝部38a更下側之部分位於較引導構件70更下側之狀態下,固定有引導構件70與安裝部38a。又,於安裝部37a位於引導構件70A之上側,較筒狀部35a之安裝部37a更下側之部分位於較引導構件70A更下側之狀態下,固定有引導構件70A及安裝部37a。 The cylindrical portion 35a is inserted into the mounting holes 74, 74A of the guide members 70, 70A. The guide member 70 and the attachment portion 38a are fixed in a state where the attachment portion 38a is located above the guide member 70 and the portion of the tubular portion 35a that is lower than the attachment portion 38a is located below the guide member 70 . In addition, the guide member 70A and the attachment portion 37a are fixed in a state where the attachment portion 37a is located above the guide member 70A, and the portion below the attachment portion 37a of the cylindrical portion 35a is located below the guide member 70A.

此外,於將引導構件70、70A安裝於框體15及光照射部30上時亦可使用擠壓環。藉由使用擠壓環,可防止引導構件70、70A之變形。 In addition, when attaching the guide member 70,70A to the frame body 15 and the light irradiation part 30, you may use a squeeze ring. By using a squeeze ring, deformation of the guide members 70, 70A can be prevented.

俯視時,圓孔155a之中心與圓孔156a之中心大致一致,因此,以光軸ax成為大致鉛直方向之方式,光照射部30a安裝於支持部15a。 Since the center of the circular hole 155a and the center of the circular hole 156a are substantially coincident in a plan view, the light irradiation part 30a is attached to the support part 15a so that the optical axis ax becomes a substantially vertical direction.

剪切孔79A係為了使從AF用光源341向下照射之光以及遮罩M上 之反射光可通過,而分別與AF用光源341以及AF感測器347、348之水平方向之位置一致。換言之,剪切孔79A之位置於俯視時與AF用光源341以及AF感測器347、348之位置重疊。 The cutout hole 79A is for the light irradiated downward from the light source 341 for AF and the upper surface of the mask M. The reflected light can pass through and coincide with the positions of the AF light source 341 and the AF sensors 347 and 348 in the horizontal direction, respectively. In other words, the position of the cutout hole 79A overlaps with the positions of the AF light source 341 and the AF sensors 347 and 348 in plan view.

驅動部39a經由安裝部395而設置於支持部15a上,將安裝部37a上推而使其於鉛直方向上移動。光照射部30a之重心G位於驅動部39a上推安裝部37a之位置之近旁。因此,驅動部39a於重心G之附近上推光照射部30a。藉此,光照射部30a之上下移動穩定。 The driving part 39a is provided on the support part 15a via the mounting part 395, and pushes up the mounting part 37a to move in the vertical direction. The center of gravity G of the light irradiation part 30a is located near the position where the driving part 39a pushes up the mounting part 37a. Therefore, the drive part 39a pushes up the light irradiation part 30a in the vicinity of the center of gravity G. As shown in FIG. Thereby, the vertical movement of the light irradiation part 30a is stabilized.

圖12之(A)表示光照射部30a不移動之狀態(衝程中央),(B)表示光照射部30a向下側移動之狀態(衝程下端),(C)表示光照射部30a向上側移動之狀態(衝程上端)。 (A) of FIG. 12 shows the state where the light irradiation part 30a does not move (center of the stroke), (B) shows the state where the light irradiation part 30a moves downward (lower end of the stroke), and (C) shows the state where the light irradiation part 30a moves upward. The state (stroke upper end).

引導構件70、70A經由安裝部37a、38a(圖12中省略圖示)而固定於筒狀部35a上,因此若藉由驅動部39a,筒狀部35a上下移動,則隨之,引導構件70、70A變形。 The guide members 70, 70A are fixed to the cylindrical portion 35a via the mounting portions 37a, 38a (not shown in FIG. 12 ). Therefore, if the cylindrical portion 35a moves up and down by the driving portion 39a, the guide member 70 will follow accordingly. , 70A deformation.

藉由驅動部39a之筒狀部35a之移動量為約40μm(±約20μm)。引導構件70、70A由於為薄的金屬製,故而隨著約40μm之筒狀部35a之上下移動,引導構件70、70A伸縮(彈性變形)。引導構件70、70A為俯視大致圓形狀,因此引導構件70、70A之變形量不論部位如何,均為大致一定,筒狀部35a不於xy方向上移動。 The amount of movement of the cylindrical portion 35a by the driving portion 39a is about 40 μm (±about 20 μm). Since the guide members 70 and 70A are made of thin metal, the guide members 70 and 70A expand and contract (elastically deform) as the cylindrical portion 35a of about 40 μm moves up and down. Since the guide members 70 and 70A are substantially circular in plan view, the amount of deformation of the guide members 70 and 70A is substantially constant regardless of the location, and the cylindrical portion 35a does not move in the xy direction.

圖13係表示曝光裝置1之電性構成之方塊圖。曝光裝置1包括:CPU(Central Processing Unit,中央處理單元)201、RAM(Random Access Memory,隨機存取記憶體)202、ROM(Read Only Memory,唯讀記憶體)203、輸入輸出介面(I/F)204、通訊介面(I/F)205、以及媒體介面(I/F)206,該等係與光照射部30、位置測定部41、42、雷射干涉儀51、52、測定部61、驅動部81、82、旋轉驅動部161f、永電磁鐵163、測量部164、壓電元件391等相互連 接。 FIG. 13 is a block diagram showing the electrical configuration of the exposure apparatus 1 . Exposure device 1 comprises: CPU (Central Processing Unit, central processing unit) 201, RAM (Random Access Memory, random access memory) 202, ROM (Read Only Memory, read-only memory) 203, input-output interface (I/O F) 204, communication interface (I/F) 205, and media interface (I/F) 206, these systems are connected with light irradiation part 30, position measuring part 41, 42, laser interferometer 51, 52, measuring part 61 , driving parts 81, 82, rotating driving part 161f, permanent electromagnet 163, measuring part 164, piezoelectric element 391, etc. are interconnected catch.

CPU 201係基於RAM 202、ROM 203中所存儲之程式而工作,進行各部之控制。於CPU 201中,從位置測定部41、42、雷射干涉儀51、52、測定部61、測量部164等輸入訊號。從CPU 201中輸出之訊號輸出至光照射部30、驅動部81、82、旋轉驅動部161f、永電磁鐵163、壓電元件391等。 The CPU 201 operates based on the programs stored in the RAM 202 and the ROM 203, and controls each part. In the CPU 201, signals are input from the position measuring units 41, 42, the laser interferometers 51, 52, the measuring unit 61, the measuring unit 164, and the like. Signals output from the CPU 201 are output to the light irradiation unit 30, the drive units 81, 82, the rotation drive unit 161f, the permanent electromagnet 163, the piezoelectric element 391, and the like.

RAM 202為揮發性記憶體。ROM 203係存儲有各種控制程式等之非揮發性記憶體。CPU 201係基於RAM 202、ROM 203中所存儲之程式而工作,進行各部之控制。又,ROM 203存儲有:於曝光裝置1之起動時CPU 201所進行之啟動程式、依存於曝光裝置1之硬體之程式、對遮罩M之描繪資料等。又,RAM 202收納CPU 201所實行之程式以及CPU 201所使用之資料等。 RAM 202 is a volatile memory. The ROM 203 is a non-volatile memory storing various control programs and the like. The CPU 201 operates based on the programs stored in the RAM 202 and the ROM 203, and controls each part. Also, the ROM 203 stores an activation program executed by the CPU 201 when the exposure apparatus 1 is activated, a program dependent on the hardware of the exposure apparatus 1 , drawing data for the mask M, and the like. Also, the RAM 202 stores programs executed by the CPU 201, data used by the CPU 201, and the like.

CPU 201經由輸入輸出介面204而控制鍵盤或滑鼠等輸入輸出裝置211。通訊介面205經由網路212而從其他機器中接收資料,且發送至CPU 201,並且將CPU 201所生成之資料經由網路212而發送至其他機器。 The CPU 201 controls an input/output device 211 such as a keyboard or a mouse through the input/output interface 204 . The communication interface 205 receives data from other machines via the network 212 and sends it to the CPU 201 , and sends the data generated by the CPU 201 to other machines via the network 212 .

媒體介面206讀取存儲介質213中所存儲之程式或者資料,存儲於RAM 202中。此外,存儲介質213例如為IC卡、SD卡、DVD等。 The media interface 206 reads the programs or data stored in the storage medium 213 and stores them in the RAM 202 . In addition, the storage medium 213 is IC card, SD card, DVD etc., for example.

此外,實現各功能之程式例如從存儲介質213中讀出,經由RAM202而安裝於曝光裝置1中,由CPU 201來實行。 In addition, the program which realizes each function is read from the storage medium 213, for example, is installed in the exposure apparatus 1 via RAM202, and is executed by CPU201.

CPU 201具有基於輸入訊號而控制曝光裝置1之各部的控制部201a之功能。控制部201a係藉由CPU 201實行所讀入之既定程式而構建。控制部201a將旋轉驅動部161f驅動而使支持部15a於z方向上移動。又,控制部201a於電磁鐵163b之線圈中流通電流,以第1吸附力或第2吸附力來吸附支持部15a。關於控制部201a所進行之處理,後文詳述。 The CPU 201 has a function of a control unit 201a that controls each unit of the exposure apparatus 1 based on an input signal. The control unit 201a is constructed by the CPU 201 executing a predetermined program that has been read. The control part 201a drives the rotation drive part 161f, and moves the support part 15a in z direction. Moreover, the control part 201a flows electric current through the coil of the electromagnet 163b, and attracts the support part 15a by the 1st attraction|suction force or the 2nd attraction|suction force. The processing performed by the control unit 201a will be described in detail later.

圖13所示之曝光裝置1之構成係於對本實施形態之特徵加以說明,對主要構成進行說明,並未排除例如一般之資訊處理裝置所具備之構成。 曝光裝置1之構成要素可根據處理內容而進而分類為多個構成要素,1個構成要素亦可實行複數個構成要素之處理。 The configuration of the exposure apparatus 1 shown in FIG. 13 is to describe the features of this embodiment, and to describe the main configuration, and does not exclude, for example, configurations that are included in general information processing devices. The components of the exposure apparatus 1 can be further classified into a plurality of components according to the processing content, and one component can perform processing of a plurality of components.

對如上所述構成之曝光裝置1之作用進行說明。以下處理主要由主控制部201a來進行。 The operation of the exposure apparatus 1 configured as described above will be described. The following processes are mainly performed by the main control unit 201a.

圖14係表示曝光裝置1之高度調整處理之流程的流程圖。控制部201a係使用載入器(未圖示)而將遮罩M設置於遮罩保持部20(步驟S10)。然後,控制部201a經由驅動部81、82而將遮罩保持部20移動,調整遮罩M之位置(步驟S12)。此外,步驟S10、S12之處理已經公知,因此省略說明。 FIG. 14 is a flowchart showing the flow of the height adjustment process of the exposure apparatus 1 . The control unit 201a sets the mask M on the mask holding unit 20 using a loader (not shown) (step S10). Then, the control part 201a moves the mask holding part 20 via the drive part 81,82, and adjusts the position of the mask M (step S12). In addition, the processing of steps S10 and S12 is already known, so description is omitted.

其次,控制部201a使支持部15a於高度方向上移動,使支持部15a之高度方向之位置向原點位置移動(步驟S14)。所謂原點位置,係根據遮罩保持部20之高度(預先存儲)以及所設置之遮罩M之標準來求出,於該等組件處於標準值之情形時,係光照射部30之焦點位於遮罩M上之位置。此外,步驟S14中之支持部15a之x方向之位置為中心位置(x中心)。 Next, the control part 201a moves the support part 15a in the height direction, and moves the position of the height direction of the support part 15a to the origin position (step S14). The so-called origin position is obtained according to the height of the mask holding part 20 (stored in advance) and the standard of the mask M provided. When these components are at the standard value, the focus of the light irradiation part 30 is located at Mask the position on M. In addition, the position of the support part 15a in the x direction in step S14 is a center position (x center).

此處,對控制部201a使支持部15a向高度方向移動之處理進行說明。首先,控制部201a於電磁鐵163b之線圈中流通電流。由於利用調整撥號盤163c來調整電流,故而永電磁鐵163以第2吸附力來吸附支持部15a。然後,控制部201a藉由將旋轉驅動部161f驅動,使小齒輪161b旋轉,而使齒條161a即支持部15a於高度方向上移動。此時,控制部201a連續取得測量部164之測量結果,驅動旋轉驅動部161f直至測量部164之測量結果成為目標值為止。 Here, the process of moving the support part 15a in the height direction by the control part 201a is demonstrated. First, the control unit 201a passes current through the coil of the electromagnet 163b. Since the electric current is adjusted by the adjustment dial 163c, the permanent electromagnet 163 attracts the supporting part 15a with the second attraction force. Then, the control part 201a drives the rotation drive part 161f, rotates the pinion gear 161b, and moves the rack 161a, ie, the support part 15a, in the height direction. At this time, the control part 201a continuously acquires the measurement result of the measurement part 164, and drives the rotation drive part 161f until the measurement result of the measurement part 164 becomes a target value.

由於永電磁鐵163以第2吸附力來吸附支持部15a,故而滑動面161d與滑動面161e抵接,但形成於滑動面161d與滑動面161e之間的油膜未經排除。因此,支持部15a於z方向上移動時,滑動面161e沿著滑動面161d而滑動。如此,支持部15a於z方向上移動時,相對於柱15c,支持部15a不傾斜,因此測量部164之測量結果穩定。 Since the permanent electromagnet 163 adsorbs the support portion 15a with the second adsorption force, the sliding surface 161d contacts the sliding surface 161e, but the oil film formed between the sliding surface 161d and the sliding surface 161e is not removed. Therefore, when the support portion 15a moves in the z direction, the sliding surface 161e slides along the sliding surface 161d. In this way, when the support part 15a moves in the z direction, the support part 15a does not incline with respect to the column 15c, so the measurement result of the measurement part 164 is stable.

至此(步驟S10~S14)為用以進行光照射部30之高度調整的準備階段。其次,控制部201a一面經由驅動部81、82而使遮罩保持部20於x方向上移動,一面藉由測定部61a、61g而測量遮罩M之高度(步驟S20)。而且,控制部201a基於步驟S20中之測定結果,算出光照射部30之高度方向之移動量(驅動部39a之驅動量及支持部15a之移動量)(步驟S22)。以下,對步驟S22之處理進行詳細說明。 So far (steps S10 to S14 ) is a preparation stage for height adjustment of the light irradiation unit 30 . Next, the control unit 201a measures the height of the mask M by the measuring units 61a and 61g while moving the mask holding unit 20 in the x direction via the drive units 81 and 82 (step S20). Then, the control unit 201a calculates the movement amount in the height direction of the light irradiation unit 30 (the driving amount of the driving unit 39a and the moving amount of the support unit 15a) based on the measurement result in step S20 (step S22). Hereinafter, the processing of step S22 will be described in detail.

圖15係步驟S20中之測定結果之一例。此處,例示測定部61a中之測定結果,所求出之值係對光照射部30a之值。控制部201a係使用數學式(1)而求出測定結果之最低值(BOTTOM)與最高值(PEAK)之中心位置(厚度中心)。 Fig. 15 is an example of the measurement results in step S20. Here, the measurement results in the measurement unit 61a are exemplified, and the obtained values are values for the light irradiation unit 30a. The control part 201a obtains the center position (thickness center) of the lowest value (BOTTOM) and the highest value (PEAK) of a measurement result using mathematical formula (1).

[數式1](PEAK+BOTTOM)/2=厚度中心......(1) [Expression 1] (PEAK+BOTTOM)/2=thickness center......(1)

又,控制部201a將x方向之中心位置(x中心)之測定結果、與厚度中心之差異設為PZT-OFS而算出。PZT-OFS係於支持部15a之x方向之位置位於x中心,且壓電元件391位於衝程中心時,以光照射部30之聚焦位置成為厚度中心之方式調整支持部15a之高度時的壓電元件391之驅動量。PZT-OFS於較厚度中心而言,測定結果大時為正值,於較厚度中心而言,測定結果小時為負值。 In addition, the control unit 201a calculates the difference between the measurement result of the center position (x center) in the x direction and the thickness center as PZT-OFS. PZT-OFS is when the position of the support part 15a in the x direction is at the x center, and the piezoelectric element 391 is at the stroke center, and the piezoelectricity of the support part 15a is adjusted so that the focus position of the light irradiation part 30 becomes the thickness center. The driving amount of the element 391. PZT-OFS is a positive value when the measurement result is larger than the thickness center, and a negative value when the measurement result is smaller than the thickness center.

此外,本實施形態中,於步驟S14中以支持部15a為x中心而移動,於步驟S22中基於x中心之測定結果而求出PZT-OFS,但亦可例如於步驟S14中使支持部15a向-x端移動,於步驟S22中基於-x端之測定結果而求出PZT-OFS。亦即,步驟S14、S22中之x中心為一例,x方向之位置並不限定於x中心。 In addition, in this embodiment, in step S14, the support part 15a is moved with the x-center, and the PZT-OFS is obtained based on the measurement result of the x-center in step S22, but it is also possible to make the support part 15a Moving to the -x terminal, PZT-OFS is obtained based on the measurement result of the -x terminal in step S22. That is, the x center in steps S14 and S22 is an example, and the position in the x direction is not limited to the x center.

控制部201a係將於PZT-OFS中加上用以將壓電元件391配置於衝程中心之值(此處為20μm)而得的值,作為光照射部30之鉛直方向之移動量而算出。此外,所謂20μm之值根據壓電元件391之種類而變化。 The control unit 201a calculates a value obtained by adding a value (here, 20 μm) for disposing the piezoelectric element 391 at the stroke center to the PZT-OFS as the vertical movement amount of the light irradiation unit 30 . In addition, the value of 20 μm varies depending on the type of the piezoelectric element 391 .

於步驟S20中,使用測定部61a、61g來測定,因此根據測定結果 來求出光照射部30a、30g之高度方向之移動量。於步驟S22中,控制部201a基於根據測定結果來直接求出之光照射部30a、30g之高度方向之移動量,藉由內插而算出光照射部30b~30f之高度方向之移動量(厚度中心及PZT-OFS)。 In step S20, the measuring units 61a and 61g are used for measurement, so according to the measurement result The amount of movement in the height direction of the light irradiation parts 30a and 30g is obtained. In step S22, the control part 201a calculates the movement amount (thickness) of the light irradiation part 30b-30f by interpolation based on the movement amount of the height direction of the light irradiation part 30a, 30g obtained directly from the measurement result. Center and PZT-OFS).

返回至圖14之說明。控制部201a係對於設置於光照射部30a~30g上之壓電元件391之各個,以步驟S22中算出之值(於PZT-OFS加上20μm之值),使壓電元件391從下端位置驅動(步驟S24)。 Return to the description of FIG. 14 . The control unit 201a drives the piezoelectric element 391 from the lower end position using the value calculated in step S22 (a value of 20 μm added to PZT-OFS) for each of the piezoelectric elements 391 provided on the light irradiation portions 30a to 30g. (step S24).

其次,控制部201a係對於光照射部30a~30g之各個,一面確認經由AF處理部34而向遮罩M照射之光之焦點是否聚焦於遮罩M上,一面驅動旋轉驅動部161f而使支持部15a向高度方向移動(步驟S26)。 Next, the control unit 201a drives the rotation driving unit 161f to support each of the light irradiation units 30a to 30g while confirming whether the focus of the light irradiated to the mask M via the AF processing unit 34 is focused on the mask M. The portion 15a moves in the height direction (step S26).

於步驟S14中,由於以第2吸附力來吸附支持部15a,故而永電磁鐵163繼續以第2吸附力來吸附支持部15a。因此,於步驟S26中,滑動面161d與滑動面161e亦抵接,且滑動面161e沿著滑動面161d而滑動。 In step S14, since the supporting part 15a is attracted by the second attracting force, the permanent electromagnet 163 continues to attract the supporting part 15a by the second attracting force. Therefore, in step S26, the sliding surface 161d also contacts the sliding surface 161e, and the sliding surface 161e slides along the sliding surface 161d.

AF處理部34中,連續求出需要以何種程度移動至聚焦位置,控制部201a連續取得該結果。控制部201a一面連續取得測量部164之測量結果,一面將旋轉驅動部161f驅動,使支持部15a向高度方向移動AF處理部34中所求出之移動距離。 The AF processing unit 34 continuously obtains how much the focus position needs to be moved, and the control unit 201 a continuously obtains the result. The control unit 201a continuously acquires the measurement results of the measurement unit 164, and drives the rotation drive unit 161f to move the support unit 15a in the height direction by the moving distance calculated by the AF processing unit 34.

於步驟S24中,壓電元件391從下端位置起,驅動PZT-OFS加上20μm之值,因此於步驟S26中支持部15a移動之結果為,於壓電元件391位於衝程中心時,由光照射部30照射之光聚焦於厚度中心。藉此,即便遮罩M之高度變化,亦可藉由壓電元件391之移動,而光照射部30之焦點一直聚焦於遮罩M。 In step S24, the piezoelectric element 391 is driven from the lower end position to add a value of 20 μm to the PZT-OFS. Therefore, as a result of the movement of the support part 15a in step S26, when the piezoelectric element 391 is located at the center of the stroke, it is irradiated with light. The light irradiated by the portion 30 is focused on the center of the thickness. Thereby, even if the height of the mask M changes, the focus of the light irradiation part 30 can always be focused on the mask M by the movement of the piezoelectric element 391 .

然後,控制部201a判定經由AF處理部34而由光照射部30照射之光是否聚焦於遮罩M上(步驟S28)。於步驟S24、S26中光照射部30移動,故而於步驟S28中,通常由光照射部30照射之光聚焦於遮罩M上。假設於光照射部30不位於判斷為聚焦之位置之情形(步驟S28中為否)時,控制部201a將處理返回 至步驟S26。 Then, the control unit 201a determines whether or not the light irradiated by the light irradiation unit 30 via the AF processing unit 34 is focused on the mask M (step S28). Since the light irradiation part 30 moves in steps S24 and S26, the light irradiated by the light irradiation part 30 is usually focused on the mask M in step S28. Assuming that the light irradiation unit 30 is not located at the position determined to be in focus (NO in step S28), the control unit 201a returns the process to Go to step S26.

於光照射部30位於判斷為聚焦之位置之情形(步驟S28中為是)時,控制部201a於電磁鐵163b之線圈中流通電流,以第1吸附力而使支持部15a吸附於永電磁鐵163上,使滑動面161d與滑動面161e密接(步驟S30)。其結果為,於滑動面161d與滑動面161e之間產生摩擦,藉由摩擦力,支持部15a固定於柱15c上。 When the light irradiation part 30 is located at the position judged to be focused (YES in step S28), the control part 201a flows a current through the coil of the electromagnet 163b, and the support part 15a is attracted to the permanent electromagnet by the first adsorption force. 163, the sliding surface 161d is brought into close contact with the sliding surface 161e (step S30). As a result, friction occurs between the sliding surface 161d and the sliding surface 161e, and the support portion 15a is fixed to the post 15c by the frictional force.

於步驟S14中,由於永電磁鐵163以第2吸附力吸附於支持部15a上,故而於步驟S30之前,永電磁鐵163以第2吸附力而持續吸附支持部15a。若於該狀態下將調整撥號盤163c之值移動至「10」,則於電磁鐵163b之線圈中流通之電流值上升,永電磁鐵163之吸附力從第2吸附力變化為第1吸附力。於永電磁鐵163之性質上,可使吸附力從第2吸附力上升至第1吸附力(但無法使吸附力從第1吸附力下降至第2吸附力)。 In step S14, since the permanent electromagnet 163 is attracted to the supporting part 15a with the second attraction force, the permanent electromagnet 163 continues to attract the support part 15a with the second attraction force before step S30. If the value of the adjustment dial 163c is moved to "10" in this state, the current value flowing in the coil of the electromagnet 163b increases, and the attraction force of the permanent electromagnet 163 changes from the second attraction force to the first attraction force . In the nature of the permanent electromagnet 163, the adsorption force can be increased from the second adsorption force to the first adsorption force (but the adsorption force cannot be decreased from the first adsorption force to the second adsorption force).

本實施形態中,於支持部15a之移動時,滑動面161d與滑動面161e抵接,滑動面161d沿著滑動面161e而滑動,因此即便藉由永電磁鐵163之吸附力而使滑動面161d與滑動面161e密接,滑動面161d即支持部15a亦不傾斜。因此,不論支持部15a移動或不移動,測量部164

Figure 108118015-A0305-02-0031-3
之測量結果均不改變。 In this embodiment, when the support portion 15a moves, the sliding surface 161d abuts against the sliding surface 161e, and the sliding surface 161d slides along the sliding surface 161e. The sliding surface 161d is in close contact with the sliding surface 161e, and the supporting portion 15a is not inclined. Therefore, regardless of whether the supporting part 15a moves or does not move, the measuring part 164
Figure 108118015-A0305-02-0031-3
The measurement results are not changed.

如例如圖16的(B)、(C)所示,於支持部15a相對於柱15c而傾斜之狀態(滑動面161d相對於滑動面161e而傾斜之狀態)下,使支持部15a於高度方向上移動之情形(參照圖16的(B)、(C)之中空箭頭)時,於使滑動面161d與滑動面161e密接時,支持部15a旋轉(參照圖16的(B)、(C)之粗箭頭),測量部164之測量結果改變。即便此時之滑動面161d之傾斜為1度以下之微小角度,或滑動面161d與滑動面161e之間之間隙小至數μm左右,就支持部15a較大,又,必須將測量部164設置於與設置有永電磁鐵163之面相反之側之面上的限制而言,測量部164之測定結果產生無法忽視之誤差。與此相對,若如圖16的(A) 所示(本實施形態),一面使滑動面161d與滑動面161e抵接,一面使支持部15a於高度方向上移動,則於使滑動面161d與滑動面161e密接時支持部15a不傾斜,因此不論支持部15a移動或不移動,測量部164之測量結果均不改變。如上所述於本實施形態中,可消除由支持部15a之傾斜所引起之誤差。 As shown in, for example, (B) and (C) of FIG. When moving upwards (refer to the hollow arrows in (B) and (C) of FIG. thick arrow), the measurement result of the measurement unit 164 changes. Even if the inclination of the sliding surface 161d at this time is a small angle of less than 1 degree, or the gap between the sliding surface 161d and the sliding surface 161e is as small as about a few μm, the supporting part 15a is large, and the measuring part 164 must be provided In terms of the restriction on the surface opposite to the surface on which the permanent electromagnet 163 is provided, a non-negligible error occurs in the measurement result of the measuring unit 164 . In contrast, if (A) shown in Figure 16 As shown (in this embodiment), the support portion 15a is moved in the height direction while the sliding surface 161d is brought into contact with the sliding surface 161e, and the support portion 15a is not inclined when the sliding surface 161d is brought into close contact with the sliding surface 161e. No matter whether the supporting part 15a moves or not, the measurement result of the measuring part 164 does not change. As described above, in this embodiment, the error caused by the inclination of the support portion 15a can be eliminated.

若將支持部15a之高度固定(步驟S30),則控制部201a製作AF圖,該AF圖表示為了一面經由驅動部81、82而使遮罩保持部20於x方向、y方向上移動,一面使用AF處理部34a~34g之各個,使由光照射部30a~30g照射之光聚焦於遮罩M上,而需要移動何種程度;並且確認壓電元件391之驅動量是否超過±20μm(步驟S32)。AF圖之製作已經公知,因此省略說明。 When the height of the supporting part 15a is fixed (step S30), the control part 201a creates an AF map showing that the mask holding part 20 is moved in the x direction and the y direction via the driving parts 81 and 82, while the Use each of the AF processing parts 34a~34g to focus the light irradiated by the light irradiating parts 30a~30g on the mask M, and how far it needs to move; and confirm whether the driving amount of the piezoelectric element 391 exceeds ±20 μm (step S32). The creation of the AF chart is already known, so the description will be omitted.

假設於壓電元件391之驅動量超過±20μm之情形時,控制部201a使支持部15a向壓電元件391之驅動量超過±20μm之方向移動。 Assuming that the driving amount of the piezoelectric element 391 exceeds ±20 μm, the control unit 201 a moves the supporting portion 15 a in a direction in which the driving amount of the piezoelectric element 391 exceeds ±20 μm.

藉此,結束圖14所示之處理。此外,圖14所示之處理為一例,處理之順序或處理內容並不限定於此。 Thereby, the processing shown in FIG. 14 ends. In addition, the process shown in FIG. 14 is an example, and the order of a process and the content of a process are not limited to this.

然後,進行未圖示之描繪處理。控制部201a係基於位置測定部41、42之測定結果而使遮罩保持部20於x方向及y方向上移動。控制部201a一面使遮罩保持部20移動,一面於遮罩M通過光照射部30之下側時從光照射部30照射光,進行描繪處理。描繪處理係於遮罩保持部20上載置遮罩M後經過數小時後再進行,因此控制部201a進行步驟S32之處理十分充裕。 Then, drawing processing not shown is performed. The control unit 201 a moves the mask holding unit 20 in the x direction and the y direction based on the measurement results of the position measurement units 41 and 42 . The control unit 201 a moves the mask holding unit 20 and irradiates light from the light irradiation unit 30 when the mask M passes under the light irradiation unit 30 to perform drawing processing. The drawing process is performed several hours after the mask M is placed on the mask holding unit 20, so the control unit 201a has enough time to perform the process of step S32.

依據本實施形態,由於使用包含齒條161a及小齒輪161b之移動機構161,使設置有光照射部30之支持部15a上下移動,故而與使用滾珠螺桿之情形不同,不產生隨機漫步誤差。因此,可正確地進行光照射部之高度調整。 According to this embodiment, since the supporting part 15a provided with the light irradiation part 30 is moved up and down by using the moving mechanism 161 including the rack 161a and the pinion 161b, random walk error does not occur unlike the case of using a ball screw. Therefore, the height adjustment of the light irradiation part can be accurately performed.

又,依據本實施形態,使用永電磁鐵163而以第1吸附力來吸附支持部15a,使滑動面161d與滑動面161e密接而排出滑動面161d與滑動面161e之間之油膜,藉此可以滑動面161d與滑動面161e之間所產生之摩擦力來保持支持部 15a。又,使用永電磁鐵163而以第2吸附力(第2吸附力<第1吸附力)來吸附支持部15a,於使滑動面161d與滑動面161e抵接之狀態下使支持部15a上下移動,藉此於支持部15a移動時或不移動時,測量部164之測量結果均不改變,可消除由支持部15a之傾斜所引起之誤差。 Also, according to the present embodiment, the permanent electromagnet 163 is used to adsorb the supporting portion 15a with the first adsorption force, and the sliding surface 161d and the sliding surface 161e are brought into close contact to discharge the oil film between the sliding surface 161d and the sliding surface 161e. The frictional force generated between the sliding surface 161d and the sliding surface 161e keeps the supporting part 15a. Also, the permanent electromagnet 163 is used to adsorb the supporting part 15a with the second suction force (the second suction force<the first suction force), and the supporting part 15a is moved up and down in a state where the sliding surface 161d and the sliding surface 161e are in contact with each other. Therefore, when the supporting part 15a moves or does not move, the measurement result of the measuring part 164 does not change, and the error caused by the inclination of the supporting part 15a can be eliminated.

又,依據本實施形態,由於使用永電磁鐵163,故而通電時間短,不產生由熱引起之支持部15a之變形、膨脹等。因此,可正確地進行支持部15a、即光照射部之高度調整。 Also, according to this embodiment, since the permanent electromagnet 163 is used, the energization time is short, and deformation, expansion, etc. of the supporting portion 15a due to heat do not occur. Therefore, the height adjustment of the support part 15a, that is, the light irradiation part can be accurately performed.

以上,以參照圖式,對本發明之實施形態進行詳細說明,但具體之構成並不限定於本實施形態,亦包含不脫離本發明之要旨之範圍之設計變更等。本發明所屬領域中具有通常知識者可將實施形態之各要素適當進行變更、追加、變換等。 Above, the embodiments of the present invention have been described in detail with reference to the drawings, but the specific configuration is not limited to the embodiments, and design changes and the like within the scope of the present invention are also included. Those having ordinary knowledge in the field to which the present invention pertains can appropriately change, add, convert, etc. each element of the embodiment.

又,本發明中,所謂「大致」,不僅為嚴格地相同之情形,而且包含不失去同一性之程度之誤差或變形的概念。例如,所謂大致水平,並不限定於嚴格地水平之情形,例如為包含數度左右之誤差之概念。又,例如,於僅表述為平行、正交等之情形時,不僅為嚴格平行、正交等之情形,包含大致平行、大致正交等情形。又,本發明中所謂「近旁」,意指包含位於成為基準之位置之附近的範圍(可任意決定)之區域。例如,於稱為A之近旁之情形時,係位於A之附近之範圍之區域,係表示可包含A亦可不包含A之概念。 In addition, in the present invention, the term "approximately" not only refers to the case of being strictly the same, but also includes the concept of error or deformation to the extent that the identity is not lost. For example, the term "approximately horizontal" is not limited to being strictly horizontal, for example, it is a concept including an error of about several degrees. Also, for example, when only the cases of being parallel and perpendicular are expressed, not only the cases of strictly parallel and perpendicular, but also the cases of substantially parallel and substantially perpendicular are included. In addition, the term "nearby" in the present invention means an area including a range (arbitrarily determined) in the vicinity of the reference position. For example, in the case of being referred to as the vicinity of A, it is an area located in the vicinity of A, which means the concept that A may or may not be included.

15‧‧‧框體 15‧‧‧frame

15a‧‧‧支持部 15a‧‧‧Support Department

15c‧‧‧柱 15c‧‧‧column

158‧‧‧凸部 158‧‧‧convex part

160‧‧‧彈性構件 160‧‧‧Elastic member

161‧‧‧移動機構 161‧‧‧Moving mechanism

161a‧‧‧齒條 161a‧‧‧Rack

161b‧‧‧小齒輪 161b‧‧‧pinion

161c‧‧‧凸部 161c‧‧‧convex part

161d、161e‧‧‧滑動面 161d, 161e‧‧‧Sliding surface

162‧‧‧定位構件 162‧‧‧Positioning components

162a‧‧‧凹部 162a‧‧‧Concave

163‧‧‧永電磁鐵 163‧‧‧Permanent electromagnet

164‧‧‧測量部 164‧‧‧Measurement Department

164a‧‧‧標尺 164a‧‧‧ruler

164b‧‧‧檢測頭 164b‧‧‧Detecting head

c‧‧‧中心線 c‧‧‧central line

Claims (9)

一種曝光裝置,其特徵在於具備: 基板保持部,其載置基板; 框體,其包括由磁性材料所形成之大致棒狀之支持部且以長邊方向成為大致水平方向之方式設置之支持部、以及分別以長邊方向成為大致鉛直方向之方式設置於上述支持部之兩端的棒狀之柱,且於上述支持部形成有支持部側滑動面,於上述柱,柱側滑動面形成於與上述支持部側滑動面對向之位置; 移動機構,其使上述支持部於鉛直方向上移動,且包括:設置於上述支持部之齒條、以可旋轉之方式設置於上述柱且與上述齒條咬合之小齒輪、以及使上述小齒輪旋轉之旋轉驅動部; 光學裝置,其設置於上述支持部且對上述基板照射光; 永電磁鐵,其設置於上述柱且包含永久磁鐵及電磁鐵;以及 控制部,其將上述旋轉驅動部進行驅動而使上述支持部移動,且於上述電磁鐵之線圈中流通電流而於上述永久磁鐵吸附上述支持部; 上述永電磁鐵吸附上述支持部而使上述支持部側滑動面與上述柱側滑動面密接,藉由上述支持部側滑動面與上述柱側滑動面之間之摩擦力而將上述支持部固定於上述柱。An exposure device, characterized in that: a substrate holding part, which places the substrate; The frame includes a substantially rod-shaped support part formed of a magnetic material, the support part is provided so that the longitudinal direction becomes a substantially horizontal direction, and the support part is provided so that the longitudinal direction becomes a substantially vertical direction Rod-shaped columns at both ends, and a support portion-side sliding surface is formed on the above-mentioned support portion, and on the above-mentioned column, the column-side sliding surface is formed at a position facing the above-mentioned support portion-side sliding surface; A movement mechanism that moves the supporting portion in the vertical direction, and includes: a rack provided on the supporting portion, a pinion gear rotatably provided on the column and engaged with the rack, and the pinion gear The rotary drive part of the rotation; an optical device provided on the support portion and irradiating light to the substrate; A permanent electromagnet, which is disposed on the above-mentioned column and includes a permanent magnet and an electromagnet; and a control unit that drives the rotation drive unit to move the support unit, and flows current through the coil of the electromagnet to attract the support unit to the permanent magnet; The permanent electromagnet attracts the supporting part so that the sliding surface on the supporting part side is in close contact with the sliding surface on the column side, and the supporting part is fixed to the sliding surface by the frictional force between the sliding surface on the supporting part side and the sliding surface on the column side. above column. 如請求項1所述之曝光裝置,其具備: 測量部,其設置於上述支持部,且其包括大致沿著鉛直方向而設置之標尺、以及讀取上述標尺之值而輸出位置資訊之頭; 於上述支持部之移動時,上述永電磁鐵係以較上述移動機構不使上述支持部移動時之吸附力即第1吸附力弱之第2吸附力吸附上述支持部,上述測量部連續測量上述支持部之高度,且上述支持部側滑動面沿著上述柱側滑動面而滑動。The exposure device as described in claim 1, which has: The measurement part is installed on the above-mentioned support part, and it includes a scale arranged roughly along the vertical direction, and a head that reads the value of the above-mentioned scale and outputs position information; When the above-mentioned supporting part is moved, the above-mentioned permanent electromagnet absorbs the above-mentioned supporting part with the second adsorption force which is weaker than the first adsorption force when the above-mentioned moving mechanism does not move the above-mentioned supporting part, and the above-mentioned measuring part continuously measures the above-mentioned The height of the supporting part, and the sliding surface on the side of the supporting part slides along the sliding surface on the side of the column. 如請求項2所述之曝光裝置,其中 上述第2吸附力為上述第1吸附力之約20%至約30%。The exposure device as described in claim 2, wherein The second adsorption force is about 20% to about 30% of the first adsorption force. 如請求項1至3中任一項所述之曝光裝置,其具備: 大致薄板狀之引導構件,其設置於上述支持部與上述光學裝置之間;以及 驅動部,其設置於上述框體,且使上述光學裝置於鉛直方向上移動; 上述支持部具有大致水平配置之板狀部, 於上述板狀部形成有於大致鉛直方向上貫通之圓孔, 上述引導構件為俯視大致圓板形狀,以覆蓋上述圓孔之方式設置於上述板狀部, 於上述引導構件,於大致中央形成安裝孔, 上述安裝孔係與上述圓孔配置為大致同心圓狀, 上述光學裝置係以光軸與上述安裝孔之中心大致一致之方式,插入上述安裝孔中而固定於上述引導構件。The exposure device as described in any one of claims 1 to 3, which has: a substantially thin plate-shaped guide member provided between the support portion and the optical device; and a drive unit, which is provided in the frame and moves the optical device in a vertical direction; The above-mentioned supporting part has a plate-shaped part arranged substantially horizontally, A circular hole penetrating in the substantially vertical direction is formed in the above-mentioned plate-like portion, The guide member is generally in the shape of a disc in plan view, and is provided on the plate-shaped portion so as to cover the circular hole. A mounting hole is formed approximately in the center of the guide member, The mounting holes and the circular holes are arranged substantially concentrically, The optical device is inserted into the mounting hole and fixed to the guide member so that the optical axis substantially coincides with the center of the mounting hole. 如請求項4所述之曝光裝置,其具備: 移動部,其使上述基板保持部於掃描方向上移動;以及 測定部,其設置於上述支持部,且測定至上述基板為止之距離; 上述控制部一面經由上述移動部而使上述基板保持部於上述掃描方向上移動,一面經由上述測定部而測定至上述基板為止之距離,根據至該基板為止之距離之最大值及最小值來求出中值,且基於該中值來求出上述驅動部之驅動量。The exposure device as described in claim 4, which has: a moving part that moves the above-mentioned substrate holding part in a scanning direction; and a measurement unit provided on the support unit, and measures the distance to the substrate; The control unit moves the substrate holding unit in the scanning direction via the moving unit and measures the distance to the substrate via the measurement unit, and calculates the distance from the maximum and minimum values of the distance to the substrate. A median value is obtained, and based on the median value, the driving amount of the driving unit is obtained. 如請求項1至3中任一項所述之曝光裝置,其中 上述光學裝置包括AF處理部,其具有照射向下之光之AF用光源、以及反射光所射入之AF感測器; 上述控制部一面使上述AF處理部動作,一面使上述支持部移動,若上述光學裝置位於判斷為聚焦之位置,則使上述支持部側滑動面與上述柱側滑動面密接。The exposure device according to any one of claims 1 to 3, wherein The above-mentioned optical device includes an AF processing unit having an AF light source for irradiating downward light, and an AF sensor into which reflected light enters; The control unit moves the support unit while operating the AF processing unit, and brings the support unit side sliding surface into close contact with the column side sliding surface when the optical device is at a position determined to be in focus. 如請求項4所述之曝光裝置,其中 上述光學裝置包括AF處理部,其具有照射向下之光之AF用光源、以及反射光所射入之AF感測器; 上述控制部一面使上述AF處理部動作一面使上述支持部移動,若上述光學裝置位於判斷為聚焦之位置,則使上述支持部側滑動面與上述柱側滑動面密接。The exposure device as described in Claim 4, wherein The above-mentioned optical device includes an AF processing unit having an AF light source for irradiating downward light, and an AF sensor into which reflected light enters; The control unit moves the support unit while operating the AF processing unit, and brings the support unit side sliding surface into close contact with the column side sliding surface when the optical device is at a position determined to be in focus. 如請求項5所述之曝光裝置,其中 上述光學裝置包含AF處理部,其具有照射向下之光之AF用光源、以及反射光所射入之AF感測器; 上述控制部一面使上述AF處理部動作一面使上述支持部移動,若上述光學裝置位於判斷為聚焦之位置,則使上述支持部側滑動面與上述柱側滑動面密接。The exposure device as described in claim 5, wherein The optical device includes an AF processing unit having an AF light source for irradiating downward light, and an AF sensor into which reflected light enters; The control unit moves the support unit while operating the AF processing unit, and brings the support unit side sliding surface into close contact with the column side sliding surface when the optical device is at a position determined to be in focus. 一種高度調整方法,其係使用如下裝置來調整支持部之高度者,上述裝置包括: 基板保持部,其載置基板; 框體,其包括由磁性材料所形成之大致棒狀之上述支持部且以長邊方向成為大致水平方向之方式設置之支持部、以及分別以長邊方向成為大致鉛直方向之方式設置於上述支持部之兩端的棒狀之柱,且於上述支持部形成支持部側滑動面,於上述柱,柱側滑動面形成於與上述支持部側滑動面對向之位置; 移動機構,其使上述支持部於鉛直方向上移動,且包括:大致沿著鉛直方向而設置於上述支持部之齒條、以可旋轉之方式設置於上述柱且與上述齒條咬合之小齒輪、以及使上述小齒輪旋轉之旋轉驅動部; 測量部,其設置於上述支持部; 光學裝置,其設置於上述支持部且對上述基板照射光;以及 永電磁鐵,其設置於上述柱且包括永久磁鐵及電磁鐵; 上述高度調整方法之特徵在於包括: 於上述電磁鐵之線圈中流通電流,使上述支持部以第2吸附力吸附於上述永電磁鐵,使上述支持部側滑動面與上述柱側滑動面抵接之步驟; 一面利用上述測量部來測量上述支持部之高度,一面驅動上述旋轉驅動部而使上述小齒輪旋轉,使上述支持部於高度方向上移動之步驟;以及 於上述線圈中流通電流,使上述支持部以較上述第2吸附力更強之第1吸附力吸附於上述永電磁鐵,使上述支持部側滑動面與上述柱側滑動面密接而將上述支持部固定於上述柱之步驟。A height adjustment method, which uses the following device to adjust the height of the supporting part, and the above device includes: a substrate holding part, which places the substrate; The frame body includes the above-mentioned substantially rod-shaped support part formed of a magnetic material, and the support part is provided in such a manner that the longitudinal direction becomes a substantially horizontal direction, and the support part is disposed on the above-mentioned support so that the longitudinal direction becomes a substantially vertical direction. rod-shaped columns at both ends of the part, and a support part-side sliding surface is formed on the above-mentioned support part, and on the above-mentioned column, the column-side sliding surface is formed at a position facing the above-mentioned support part-side sliding surface; A movement mechanism that moves the support portion in the vertical direction, and includes: a rack provided on the support portion substantially along the vertical direction, and a pinion gear rotatably provided on the column and engaged with the rack , and a rotary drive unit that rotates the above-mentioned pinion; a measurement unit, which is installed in the above-mentioned support unit; an optical device provided on the support portion and irradiating light to the substrate; and A permanent electromagnet, which is arranged on the above-mentioned column and includes a permanent magnet and an electromagnet; The above-mentioned height adjustment method is characterized in that it includes: A step of passing a current through the coil of the electromagnet, causing the support part to be attracted to the permanent electromagnet by the second adsorption force, and making the sliding surface on the side of the supporting part contact the sliding surface on the side of the column; a step of measuring the height of the supporting part by the measuring part, driving the rotating driving part to rotate the pinion gear, and moving the supporting part in the height direction; and A current is passed through the above-mentioned coil, so that the above-mentioned supporting part is attracted to the above-mentioned permanent electromagnet by the first attractive force stronger than the above-mentioned second attractive force, and the above-mentioned supporting part-side sliding surface is closely contacted with the above-mentioned post-side sliding surface to support the above-mentioned The step of fixing the part to the above-mentioned column.
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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7586731B2 (en) * 2021-02-25 2024-11-19 株式会社Screenホールディングス Drawing device, drawing method, and program
JP7648893B2 (en) * 2021-05-31 2025-03-19 株式会社ジャノメ Route teaching data creation device, method and program
WO2023145085A1 (en) * 2022-01-31 2023-08-03 ファナック株式会社 Support structure
JP2025037489A (en) * 2023-09-06 2025-03-18 株式会社Screenホールディングス Exposure Equipment

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007096094A2 (en) * 2006-02-22 2007-08-30 Kleo Maschinenbau Ag Exposure system
JP2011242563A (en) * 2010-05-18 2011-12-01 Hitachi High-Technologies Corp Exposure apparatus, method for positioning lamp of exposure apparatus, and method of manufacturing display panel substrate
CN103048851A (en) * 2011-10-12 2013-04-17 奥林巴斯映像株式会社 Operation device
TWI587436B (en) * 2009-08-20 2017-06-11 尼康股份有限公司 Object processing device, exposure device and exposure method, and component manufacturing method

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4748335A (en) * 1985-04-19 1988-05-31 Siscan Systems, Inc. Method and aparatus for determining surface profiles
JPH03112123A (en) * 1989-09-27 1991-05-13 Canon Inc Aligner
JPH09320943A (en) 1996-05-31 1997-12-12 Dainippon Screen Mfg Co Ltd Drawing device and automatic focus control method
JP4496711B2 (en) * 2003-03-31 2010-07-07 株式会社ニコン Exposure apparatus and exposure method
JP4688525B2 (en) * 2004-09-27 2011-05-25 株式会社 日立ディスプレイズ Pattern correction device and display device manufacturing method
JP2006286131A (en) * 2005-04-04 2006-10-19 Ricoh Co Ltd Work rotation drive device and optical disc master exposure device
DE102005030304B4 (en) * 2005-06-27 2008-06-26 Xtreme Technologies Gmbh Apparatus and method for generating extreme ultraviolet radiation
JPWO2008139964A1 (en) * 2007-05-11 2010-08-05 株式会社ニコン Optical element driving apparatus, lens barrel, exposure apparatus, and device manufacturing method
US7679849B2 (en) * 2007-06-01 2010-03-16 Stmicroelectronics (Grenoble) Sas Mobile lens unit with detection device
JP5139922B2 (en) * 2008-08-25 2013-02-06 株式会社ディスコ Laser processing equipment
KR101021810B1 (en) * 2009-01-30 2011-03-18 주식회사 다이아벨 Sliding device and mobile device with same
CN102124390B (en) 2009-07-31 2013-03-27 香港应用科技研究院有限公司 Small imaging device and manufacturing method thereof
CN102483581B (en) * 2009-08-25 2015-04-01 Asml荷兰有限公司 Optical apparatus, and method of orienting a reflective element
JP2011119551A (en) * 2009-12-04 2011-06-16 Nikon Corp Optical member deformation apparatus, optical system, aligner, method of manufacturing device
US8988655B2 (en) * 2010-09-07 2015-03-24 Nikon Corporation Exposure apparatus, movable body apparatus, flat-panel display manufacturing method, and device manufacturing method
DE102012201410B4 (en) * 2012-02-01 2013-08-14 Carl Zeiss Smt Gmbh Projection exposure apparatus with a measuring device for measuring an optical element
JP6150043B2 (en) * 2012-03-29 2017-06-21 株式会社ブイ・テクノロジー Exposure equipment
JP5863149B2 (en) * 2012-04-04 2016-02-16 株式会社ニコン Exposure apparatus, flat panel display manufacturing method, and device manufacturing method
NL2010628A (en) * 2012-04-27 2013-10-29 Asml Netherlands Bv Lithographic apparatus comprising an actuator, and method for protecting such actuator.
US9360757B2 (en) * 2013-08-14 2016-06-07 Carbon3D, Inc. Continuous liquid interphase printing
JP2015070014A (en) * 2013-09-27 2015-04-13 株式会社ニコン Substrate holding method and device, and exposure method and device
JP6484853B2 (en) * 2014-04-17 2019-03-20 株式会社ブイ・テクノロジー Reflector unit for exposure apparatus and exposure apparatus
JP6591916B2 (en) * 2016-03-07 2019-10-16 株式会社ブイ・テクノロジー Mask manufacturing equipment
JP6564727B2 (en) * 2016-03-28 2019-08-21 株式会社ブイ・テクノロジー Mask manufacturing apparatus and mask manufacturing apparatus control method
JP2018031824A (en) * 2016-08-22 2018-03-01 株式会社ブイ・テクノロジー Exposure apparatus
JP2019095662A (en) * 2017-11-24 2019-06-20 株式会社ブイ・テクノロジー Attachment structure of optical device and exposure device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007096094A2 (en) * 2006-02-22 2007-08-30 Kleo Maschinenbau Ag Exposure system
TWI587436B (en) * 2009-08-20 2017-06-11 尼康股份有限公司 Object processing device, exposure device and exposure method, and component manufacturing method
JP2011242563A (en) * 2010-05-18 2011-12-01 Hitachi High-Technologies Corp Exposure apparatus, method for positioning lamp of exposure apparatus, and method of manufacturing display panel substrate
CN103048851A (en) * 2011-10-12 2013-04-17 奥林巴斯映像株式会社 Operation device

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