TWI852052B - Sound transmitter - Google Patents

Abstract

The present disclosure discloses a sound transmitter. The sound transmitter may include: a housing structure; a vibration pickup part generating vibration in response to vibration of the housing structure; a vibration transmission part configured to transmit the vibration generated by the vibration pickup part; and an acoustical-electrical transduction element configured to receive the vibration transmitted by the vibration transmission part to generate an electrical signal. The vibration pickup part and the vibration transmission part may form a vacuum cavity, and the acoustical-electrical transduction element may be located in the vacuum cavity. In the present disclosure, the acoustical-electrical transduction element of the sound transmitter may be arranged in the vacuum cavity formed by the vibration pickup part and the vibration transmission part, so as to prevent the acoustical-electrical transduction element from contacting with air in an acoustic cavity, which can effectively reduce background noise of the sound transmitter, and at the same time prevent the acoustical-electrical transduction element from rubbing against gas during a vibration process, reducing air damping inside the vacuum cavity of the sound transmitter, and improving a Q value of the sound transmitter.

Description

Microphone

This application relates to the field of microphone technology, and in particular to a microphone.

Cross-references to related applications

This application claims priority to the Chinese patent application No. 202110917780.6 filed on August 11, 2021, the entire contents of which are incorporated herein by reference.

A microphone is a transducer that converts sound signals into electrical signals. Taking an air conduction microphone as an example, the external sound signal enters the acoustic cavity of the air conduction microphone through the hole in the shell structure and is transmitted to the acoustic-to-electric conversion component. The acoustic-to-electric conversion component generates vibrations based on the sound signal and converts the vibration signal into an electrical signal for output. The acoustic cavity of the microphone has a gas (e.g., air) with a certain air pressure inside, which will cause the sound signal to generate greater noise in the process of being transmitted from the acoustic cavity of the microphone to the acoustic-to-electric conversion component, thereby reducing the sound quality output by the microphone. In addition, when the microphone's acoustic-to-electric conversion component vibrates after receiving a sound signal, it will rub against the gas in the acoustic cavity, increasing the air damping of the microphone's acoustic cavity, thereby reducing the microphone's Q value.

Therefore, it is desirable to provide a microphone with low noise floor and high Q value.

The present application provides a microphone, which includes: a housing structure; a vibration pickup part, which generates vibration in response to the vibration of the housing structure; a vibration transmission part, which is configured to transmit the vibration generated by the vibration pickup part; and an acoustic-to-electric conversion component, which is configured to receive the vibration transmitted by the vibration transmission part and generate an electrical signal; wherein the vibration pickup part and the vibration transmission part form a vacuum cavity, and the acoustic-to-electric conversion component is located in the vacuum cavity.

Compared with the prior art, the beneficial effect of the microphone provided in the embodiment of the present disclosure is that the acoustic-to-electric conversion component in the microphone is located in a vacuum cavity formed by a vibration pickup portion and a vibration transmission portion, and the external sound signal enters the acoustic cavity of the shell structure through the hole, causing the air in the acoustic cavity to vibrate, and the vibration pickup portion and the vibration transmission portion transmit the vibration to the acoustic-to-electric conversion component in the vacuum cavity, thereby avoiding contact between the acoustic-to-electric conversion component and the air in the acoustic cavity, thereby solving the influence of the acoustic-to-electric conversion component on the air vibration of the acoustic cavity during the acoustic-to-electric conversion process, that is, solving the problem of large background noise of the microphone. In addition, the acoustic-to-electric conversion component is located in the vacuum cavity, which can prevent the acoustic-to-electric conversion component from rubbing against the gas during the vibration process, thereby reducing the air damping inside the vacuum cavity of the microphone and improving the Q value of the microphone.

100: Microphone

110: Shell structure

111: Hole

120: Sound-to-electric conversion components

130: Processor

140:Acoustic cavity

150: Conductor wire

200: Microphone

210: Shell structure

211: Hole

220: Sound-to-electric conversion components

230: Processor

240: First acoustic cavity

250: Second acoustic cavity

260: Vibration pickup unit

270: Conductor

500: Microphone

510: Shell structure

511: Hole

520: Sound-to-electric conversion components

522: Vibration pickup unit

523: Vibration transmission unit

530: First acoustic cavity

540: Second acoustic cavity

550: Vacuum chamber

1000: Microphone

1010: Shell structure

1011: Hole

1020: Sound-to-electric conversion components

1022: Vibration pickup unit

1023: Vibration transmission unit

1030: The first acoustic cavity

1040: Second acoustic cavity

1050: Vacuum chamber

1110:Frequency response curve

1120:Frequency response curve

1130:Frequency response curve

1200: Microphone

1210: Shell structure

1211: Hole Department

1220: Sound-to-electric conversion components

1222: Vibration pickup unit

1223: Vibration transmission unit

1230: The first acoustic cavity

1240: Second acoustic cavity

1250: Vacuum chamber

1260:Membrane structure

1300: Microphone

1310: Shell structure

1311: Hole

1320: Sound-to-electric conversion components

1322: Vibration pickup unit

1323: Vibration transmission unit

1330: The first acoustic cavity

1340: Second acoustic cavity

1350: Vacuum chamber

1360:Membrane structure

1500: Microphone

1510: Shell structure

1511: Hole Department

1520: Sound-to-electric conversion components

1522: Vibration pickup unit

1523: Vibration transmission unit

1530: The first acoustic cavity

1540: Second acoustic cavity

1550: Vacuum chamber

1600: Microphone

1610: Shell structure

1611: Hole Department

1620: Sound-to-electric conversion components

1622: Vibration pickup unit

1623: Vibration transmission unit

1630: The first acoustic cavity

1640: Second acoustic cavity

1650: Vacuum chamber

1700: Microphone

1710: Shell structure

1711: Hole Department

1720: Sound-to-electric conversion components

1722: Vibration pickup unit

1723: Vibration Transmission Department

1730: The first acoustic cavity

1740: Second acoustic cavity

1750: Vacuum chamber

1760:Supporting structure

2000: Microphone

2010: Shell structure

2011: Kong Department

2020: Sound-to-Electricity Conversion Components

2022: Vibration pickup unit

2023: Vibration Transmission Department

2030: The first acoustic cavity

2040: Second acoustic cavity

2050: Vacuum chamber

2060:Supporting structure

2100: Microphone

2110: Shell structure

2120: Sound-to-electric conversion components

2122: Vibration pickup unit

2123: Vibration transmission unit

2130: The first acoustic cavity

2140: Second acoustic cavity

2150: Vacuum chamber

2160:Support structure

2200: Microphone

2210: Shell structure

2220: Sound-to-electric conversion components

2222: Vibration pickup unit

2223: Vibration transmission unit

2230: The first acoustic cavity

2240: Second acoustic cavity

2250: Vacuum chamber

2260:Support structure

5221: First vibration pickup unit

5222: Second vibration pickup unit

10211: First cantilever beam structure

10212: Second cantilever beam structure

10221: First vibration pickup unit

10222: Second vibration pickup unit

12221: First vibration pickup unit

12222: Second vibration pickup unit

13211: First cantilever beam structure

13212: Second cantilever beam structure

13221: First vibration pickup unit

13222: Second vibration pickup unit

15221: First vibration pickup unit

15222: Second vibration pickup unit

15223: The third vibration pickup unit

16211: First cantilever beam structure

16212: Second cantilever beam structure

16221: First vibration pickup unit

16222: Second vibration pickup unit

16223: The third vibration pickup unit

17221: First vibration pickup unit

17222: Second vibration pickup unit

17223: The third vibration pickup unit

20211: First cantilever beam structure

20212: Second cantilever beam structure

20221: First vibration pickup unit

20222: Second vibration pickup unit

20223: The third vibration pickup unit

21221: First vibration pickup unit

21222: Second vibration pickup unit

21223: The third vibration pickup unit

22211: First cantilever beam structure

22212: Second cantilever beam structure

22221: First vibration pickup unit

22222: Second vibration pickup unit

22223: The third vibration pickup unit

52211: First elastic part

52212: First fixed part

52221: Second elastic part

52222: Second fixed part

102211: First elastic part

102212: First fixed part

102221: Second elastic part

102222: Second fixing part

122211: First elastic part

122212: First fixed part

122221: Second elastic part

122222: Second fixing part

132211: First elastic part

132212: First fixed part

132221: Second elastic part

132222: Second fixing part

This application will be further explained in the form of exemplary embodiments, which will be described in detail through drawings. These embodiments are not restrictive, and in these embodiments, the same number represents the same structure, wherein; [Figure 1] is a schematic diagram of the structure of a microphone shown in some embodiments of this application; [Figure 2] is a schematic diagram of the structure of another microphone shown in some embodiments of this application; [Figure 3] is a schematic diagram of the spring-mass-damper system of the acoustic-to-electric conversion component shown in some embodiments of this application; [Figure 4] is an exemplary normalized schematic diagram of the displacement resonance curve of the spring-mass-damper system shown in some embodiments of this application; [Figure 5] is a schematic diagram of the structure of the microphone shown in some embodiments of this application Schematic diagram; [Fig. 6] is a schematic diagram of the structure of the microphone shown in some embodiments of the present application; [Fig. 7] is a schematic diagram of the structure of the microphone shown in some embodiments of the present application; [Fig. 8A] is a schematic diagram of the cross-section of the microphone in Fig. 5 along the A to A direction; [Fig. 8B] is a schematic diagram of the cross-section of the microphone in Fig. 5 along the direction perpendicular to the A to A direction; [Fig. 9A] is a schematic diagram of the cantilever beam structure distribution shown in some embodiments of the present application; [Fig. 9B] is a schematic diagram of the cantilever beam structure distribution shown in some embodiments of the present application; [Fig. 10] is a schematic diagram of the structure of the microphone shown in some embodiments of the present application; [Fig. 11] is a schematic diagram of the structure of the microphone shown in some embodiments of the present application FIG12 is a schematic diagram of a frequency response curve of a microphone according to some embodiments of the present application; FIG13 is a schematic diagram of a structure of a microphone according to some embodiments of the present application; FIG14 is a schematic diagram of a structure of a microphone according to some embodiments of the present application; FIG15 is a schematic diagram of a structure of a microphone according to some embodiments of the present application; FIG16 is a schematic diagram of a structure of a microphone according to some embodiments of the present application; FIG17 is a schematic diagram of a structure of a microphone according to some embodiments of the present application; FIG18A is a schematic diagram of a structure of a microphone according to some embodiments of the present application; [Figure 18B] is a schematic cross-sectional view of a microphone according to some embodiments of the present application; [Figure 19A] is a schematic cross-sectional view of a microphone according to some embodiments of the present application; [Figure 19B] is a schematic cross-sectional view of a microphone according to some embodiments of the present application; [Figure 20] is a schematic structural view of a microphone according to some embodiments of the present application; [Figure 21] is a schematic structural view of a microphone according to some embodiments of the present application; [Figure 22] is a schematic structural view of a microphone according to some embodiments of the present application.

In order to more clearly explain the technical solution of the embodiment of this application, the following will briefly introduce the figures required for the description of the embodiment. Obviously, the figures described below are only some examples or embodiments of this application. For those with ordinary knowledge in this field, this application can also be applied to other similar scenarios based on these figures without making any progressive efforts. Unless it is obvious from the language context or otherwise explained, the same number in the figure represents the same structure or operation.

This specification describes a microphone. A microphone is a converter that converts a sound signal into an electrical signal. In some embodiments, the microphone may be a dynamic microphone, a ribbon microphone, a capacitor microphone, a piezoelectric microphone, a stationary-pole microphone, an electromagnetic microphone, a carbon-particle microphone, or the like or any combination thereof. In some embodiments, the microphone may include a bone conduction microphone and an air conduction microphone, based on the way the sound is collected. The microphone described in the embodiments of the present disclosure may include a housing structure, a vibration pickup portion, a vibration transmission portion, and an acoustic-to-electric conversion assembly. Among them, the housing structure may be configured to carry the vibration pickup portion, the vibration transmission portion, and the acoustic-to-electric conversion assembly. In some embodiments, the housing structure may be a hollow structure, the housing structure may independently form an acoustic cavity, and the vibration pickup portion, the vibration transmission portion, and the acoustic-electric conversion assembly may be located in the acoustic cavity of the housing structure. In some embodiments, the vibration pickup portion may be connected to the side wall of the housing structure, and the vibration pickup portion may generate vibration in response to an external sound signal transmitted to the housing structure. In some embodiments, the vibration transmission portion may be connected to the vibration pickup portion, the vibration transmission portion may receive the vibration of the vibration pickup portion, and transmit the vibration signal to the acoustic-electric conversion assembly, and the acoustic-electric conversion assembly converts the vibration signal into an electrical signal. In some embodiments, a vacuum cavity can be formed between the vibration transmission part and the partial structure of the vibration pickup part (for example, the fixing part), and the acoustic-to-electric conversion component is located in the vacuum cavity. In the microphone provided by the embodiments of the present disclosure, the acoustic-to-electric conversion component is located in the vacuum cavity formed by the vibration pickup part and the vibration transmission part, and the external sound signal enters the acoustic cavity of the shell structure through the hole, causing the air in the acoustic cavity to vibrate. The vibration pickup part and the vibration transmission part transmit the vibration to the acoustic-to-electric conversion component in the vacuum cavity, thereby avoiding the acoustic-to-electric conversion component from contacting the air in the acoustic cavity, thereby solving the influence of the acoustic-to-electric conversion component on the air vibration of the acoustic cavity in the acoustic-to-electric conversion process, that is, solving the problem of the large background noise of the microphone. In addition, the acoustic-to-electric conversion component is located in the vacuum cavity, which can prevent the acoustic-to-electric conversion component from rubbing against the gas during the vibration process, thereby reducing the air damping inside the vacuum cavity of the microphone and improving the Q value of the microphone.

FIG1 is a schematic diagram of the structure of a microphone according to some embodiments of the present application. As shown in FIG1 , the microphone 100 may include a housing structure 110, an acoustic-to-electric conversion component 120, and a processor 130. The microphone 100 may generate deformation and/or displacement based on an external signal, such as an acoustic signal (such as a sound wave), a mechanical vibration signal, etc. The deformation and/or displacement may be further converted into an electrical signal by the acoustic-to-electric conversion component 120 of the microphone 100. In some embodiments, the microphone 100 may be an air conduction microphone or a bone conduction microphone. An air conduction microphone refers to a microphone in which sound waves are conducted through air. A bone conduction microphone refers to a microphone in which sound waves are conducted in a solid (e.g., bone) in the form of mechanical vibration.

The shell structure 110 may be a hollow structure, and the shell structure 110 may independently form an acoustic cavity 140, and the acoustic-to-electric conversion component 120 and the processor 130 are located in the acoustic cavity 140. In some embodiments, the material of the shell structure 110 may include but is not limited to one or more of metal, alloy material, polymer material (e.g., acrylonitrile-butadiene-styrene copolymer, polyvinyl chloride, polycarbonate, polypropylene, etc.). In some embodiments, one or more holes 111 may be opened on the side wall of the shell structure 110, and the one or more holes 111 may guide external sound signals into the acoustic cavity 140. In some embodiments, an external sound signal can enter the acoustic cavity 140 of the microphone 100 from the hole 111 and cause the air in the acoustic cavity 140 to vibrate. The acoustic-to-electric conversion component 120 can receive the vibration signal and convert the vibration signal into an electrical signal for output.

The acoustic-to-electric conversion assembly 120 is used to convert an external signal into a target signal. In some embodiments, the acoustic-to-electric conversion assembly 120 may be a laminated structure. In some embodiments, at least a portion of the laminated structure is physically connected to the shell structure. The "connection" described in this application may be understood as a connection between different parts of the same structure, or after preparing different components or structures separately, each independent component or structure is fixedly connected by welding, riveting, clamping, bolting, adhesive bonding, etc., or in the preparation process, a first component or structure is deposited on a second component or structure by physical deposition (e.g., physical vapor deposition) or chemical deposition (e.g., chemical vapor deposition). In some embodiments, at least part of the stacked structure can be fixed to the side wall of the shell structure. For example, the stacked structure can be a cantilever beam, which can be a plate-like structure, one end of which is connected to the side wall where the cavity of the shell structure is located, and the other end of which is not connected to or in contact with the base structure, so that the other end of the cantilever beam is suspended in the cavity of the shell structure. For another example, the microphone can include a diaphragm layer (also called a vibration pickup portion), the vibration pickup portion is fixedly connected to the shell structure, and the stacked structure is arranged on the upper surface or lower surface of the vibration pickup portion structure. It should be noted that the phrase "located in the cavity" or "suspended in the cavity" in this application may mean suspended in the interior, below or above the cavity. In some embodiments, the acoustic-electric conversion assembly 120 may also be connected to the housing structure 110 via other components (e.g., a vibration pickup unit, a vibration transmission unit).

In some embodiments, the laminated structure may include a vibration unit and an acoustic transducer unit. The vibration unit refers to the portion of the laminated structure that is easily deformed by external force, and the vibration unit can be used to transfer the deformation caused by external force to the acoustic transducer unit. The acoustic transducer unit refers to the portion of the laminated structure that converts the deformation of the vibration unit into an electrical signal. Specifically, the external sound signal enters the acoustic cavity 140 through the sound inlet 111, causing the air in the acoustic cavity 140 to vibrate, and the vibration unit deforms in response to the vibration of the air inside the acoustic cavity 140; the acoustic transducer unit generates an electrical signal based on the deformation of the vibration unit. It is important to know that the description of the vibration unit and the acoustic transducer unit here is only for the purpose of conveniently introducing the working principle of the laminated structure, and does not limit the actual composition and structure of the laminated structure. In fact, the vibration unit may not be necessary, and its function can be fully realized by the acoustic transducer unit. For example, after making certain changes to the structure of the acoustic transducer unit, the acoustic transducer unit can directly respond to the vibration of the base structure and generate an electrical signal.

In some embodiments, the vibration unit and the acoustic transducer unit overlap to form a stacked structure. The acoustic transducer unit can be located on the upper layer of the vibration unit, and the acoustic transducer unit can also be located on the lower layer of the vibration unit.

In some embodiments, the acoustic transducer unit may include two electrode layers (e.g., a first electrode layer and a second electrode layer) and a piezoelectric layer, and the piezoelectric layer may be located between the first electrode layer and the second electrode layer. The piezoelectric layer refers to a structure that can generate voltage on its two end surfaces when subjected to external force. In some embodiments, the piezoelectric layer can generate voltage under the deformation stress of the vibration unit, and the first electrode layer and the second electrode layer can collect the voltage (electrical signal).

The processor 130 can obtain an electrical signal from the acoustic-to-electric conversion component 120 and perform signal processing. In some embodiments, the processor 130 can be directly connected to the acoustic-to-electric conversion component 120 through a wire 150 (e.g., a gold wire, a copper wire, an aluminum wire, etc.). In some embodiments, the signal processing can include frequency modulation processing, amplitude modulation processing, filtering processing, noise reduction processing, etc. In some embodiments, the processor 130 may include but is not limited to a microcontroller, a microprocessor, an application specific integrated circuit (ASIC), an application specific instruction set processor (ASIP), a central processing unit (CPU), a physical processing unit (PPU), a digital signal processor (DSP), a field programmable gate array (FPGA), an advanced reduced instruction set computer (ARM), a programmable logic device (PLD), etc., or other types of processing circuits or processors.

In some embodiments, when the microphone 100 is used as an air conduction microphone (e.g., an air conduction microphone), the acoustic cavity 140 can be acoustically connected to the outside of the microphone 100 through the hole 111, so that there is a gas (e.g., air) with a certain air pressure in the acoustic cavity 140. The gas inside the acoustic cavity 140 will cause the air inside the acoustic cavity 140 to vibrate during the process of the sound signal being transmitted from the hole 111 through the acoustic cavity 140 to the acoustic-to-electric conversion component 120. The vibration acts on the acoustic-to-electric conversion component 120 to generate vibration, and at the same time, it will bring a larger background noise to the microphone 100. On the other hand, when the acoustic-to-electric conversion component 120 receives a sound signal and generates vibration, the acoustic-to-electric conversion component 120 will rub against the gas inside the acoustic cavity 140, increasing the air damping inside the acoustic cavity 140, thereby reducing the Q value of the microphone 100. In order to solve the above problem, a microphone is provided in the embodiment of the specification of this application. The specific content of the microphone can be found in the following content.

FIG2 is a schematic diagram of the structure of a microphone according to some embodiments of the present application. As shown in FIG2, the microphone 200 may include a housing structure 210, an acoustic-to-electric conversion component 220, and a processor 230. The microphone 200 shown in FIG2 may be the same as or similar to the microphone 100 shown in FIG1. For example, the housing structure 210 of the microphone 200 is the same as or similar to the housing structure 110 of the microphone 100. For another example, the acoustic-to-electric conversion component 220 of the microphone 200 is the same as or similar to the acoustic-to-electric conversion component 120 of the microphone 100. For more structures of the microphone 200 (e.g., the processor 230, the wire 270, etc.), please refer to FIG1 and its related description.

In some embodiments, the microphone 200 is different from the microphone 100 in that the microphone 200 may further include a vibration pickup portion 260. The vibration pickup portion 260 is located in the acoustic cavity of the housing structure 210, and the periphery of the vibration pickup portion 260 may be connected to the side wall of the housing structure 210, thereby dividing the acoustic cavity into a first acoustic cavity 240 and a second acoustic cavity 250. In some embodiments, the microphone 200 may include one or more holes 211, and the holes 211 may be located at the side wall of the housing structure 210 corresponding to the first acoustic cavity 240, and the holes 211 may connect the first acoustic cavity 240 with the outside of the microphone 200. The external sound signal can enter the first acoustic cavity 240 through the hole 211 and cause the air in the first acoustic cavity 240 to vibrate. The vibration pickup portion 260 can pick up the air vibration in the first acoustic cavity 240 and transmit the vibration signal to the acoustic-to-electric conversion component 220. The acoustic-to-electric conversion component 220 receives the vibration signal from the vibration pickup portion 260 and converts the vibration signal into an electrical signal.

In some embodiments, the material of the vibration pickup portion 260 may include but is not limited to one or more of semiconductor materials, metal materials, metal alloys, organic materials, etc. In some embodiments, semiconductor materials may include but are not limited to silicon, silicon dioxide, silicon nitride, silicon carbide, etc. In some embodiments, metal materials may include but are not limited to copper, aluminum, chromium, titanium, gold, etc. In some embodiments, metal alloys may include but are not limited to copper-aluminum alloys, copper-gold alloys, titanium alloys, aluminum alloys, etc. In some embodiments, organic materials may include but are not limited to polyimide, polyparaxylene, polydimethylsiloxane, silicone gel, silicone, etc. In some embodiments, the structure of the vibration pickup portion 260 may be a plate structure, a columnar structure, etc.

In some embodiments, the acoustic-to-electric conversion component 220 and the processor 230 may be located in the second acoustic cavity 250. The second acoustic cavity 250 is a vacuum cavity. In some embodiments, the acoustic-to-electric conversion component 220 is located in the second acoustic cavity 250, which avoids the acoustic-to-electric conversion component 220 from contacting the air in the second acoustic cavity 250, thereby solving the influence of the acoustic-to-electric conversion component 220 on the vibration of the air inside the second acoustic cavity 250 during the acoustic-to-electric conversion process, that is, solving the problem of the large background noise of the microphone 200. On the other hand, the acoustic-to-electric conversion component 220 is located in the second acoustic cavity 250, which can prevent the acoustic-to-electric conversion component 220 from rubbing against the air inside the second acoustic cavity 250 during the vibration process, thereby reducing the air damping inside the second acoustic cavity 250 and improving the Q value of the microphone 200. In some embodiments, the vacuum degree inside the second acoustic cavity 250 can be less than 100Pa. In some embodiments, the vacuum degree inside the second acoustic cavity 250 can be ^10-6Pa to 100Pa. In some embodiments, the vacuum degree inside the second acoustic cavity 250 can be ^10-7Pa to 100Pa.

其中M表示彈簧-質量-阻尼系統的質量、x表示彈簧-質量-阻尼系統的位移、R表示彈簧-質量-阻尼系統的阻尼、K表示彈簧-質量-阻尼的彈性係數、F表示驅動力的振幅、ω表示外力的圓形頻率。 To facilitate understanding of the acoustic-to-electric conversion assembly, in some embodiments, the acoustic-to-electric conversion assembly of the microphone can be approximately equivalent to a spring-mass-damper system. When the microphone is working, the spring-mass-damper system may vibrate under the action of an excitation source (e.g., the vibration of the vibration pickup). FIG. 3 is a schematic diagram of a spring-mass-damper system of an acoustic-to-electric conversion assembly according to some embodiments of the present application. As shown in FIG. 3 , the spring-mass-damper system can move according to differential equation (1);

Where M represents the mass of the spring-mass-damper system, x represents the displacement of the spring-mass-damper system, R represents the damping of the spring-mass-damper system, K represents the elastic coefficient of the spring-mass-damper, F represents the amplitude of the driving force, and ω represents the circular frequency of the external force.

中x _a 表示輸出位移、Z表示機械阻抗、θ表示振蕩相位。 The differential equation (1) can be solved to obtain the displacement in the steady state (2); x = x _a cos( ωt - θ ), (2) where x represents the deformation of the spring-mass-damper system when the microphone is working, which is equal to the value of the output electrical signal, and x _a =

Here, xa represents output displacement, Z represents mechanical impedance, _and θ represents oscillation phase.

The normalized displacement amplitude ratio A can be described as equation (3);

中x _a0表示穩態下的位移幅度(或當ω=0時的位移 幅度)、

中

表示外力頻率與固有頻率之比、ω₀=K/M中ω₀表示振動的圓 周頻率、

中Q _m 表示機械質量因數。 in,

where x _{a 0} represents the displacement amplitude in the steady state (or the displacement amplitude when ω=0),

middle

Represents the ratio of the external force frequency to the natural frequency. In ω ₀ = K/M , ω ₀ represents the circular frequency of vibration.

Qm _represents the mechanical quality factor.

FIG4 is a schematic diagram of an exemplary normalized displacement resonance curve of a spring-mass-damper system according to some embodiments of the present application. The horizontal axis may represent the ratio of the actual vibration frequency of the spring-mass-damper system to its natural frequency, and the vertical axis may represent the normalized displacement of the spring-mass-damper system. It is understood that each curve in FIG4 may represent a displacement resonance curve of a spring-mass-damper system with different parameters. In some embodiments, a microphone may generate an electrical signal through a relative displacement between an acoustic-electric conversion assembly and a housing structure. For example, a stationary microphone may generate an electrical signal according to a change in the distance between a deformed diaphragm and a substrate. As another example, a cantilever beam conduction microphone can generate an electrical signal based on the reverse piezoelectric effect caused by the deformed cantilever beam structure. In some embodiments, the greater the displacement of the cantilever beam structure deformation, the greater the electrical signal output by the microphone. As shown in FIG4 , when the actual vibration frequency of the spring-mass-damper system is the same as or approximately the same as its natural frequency (i.e., the ratio ω / ω ₀ of the actual vibration frequency of the spring-mass-damper system to its natural frequency is equal to or approximately equal to 1), the greater the normalized displacement of the spring-mass-damper system, and the narrower the 3dB bandwidth (here can be understood as the harmonic frequency range) of the resonant peak in the displacement resonance curve. Combining the above equation (3), it can be seen that the larger the normalized displacement of the spring-mass-damper system, the larger the Q value of the microphone.

FIG5 is a schematic diagram of the structure of a microphone according to some embodiments of the present application. As shown in FIG5 , the microphone 500 may include a housing structure 510, an acoustic-to-electric conversion assembly 520, a vibration pickup portion 522, and a vibration transmission portion 523. The housing structure 510 may be configured to carry the vibration pickup portion 522, the vibration transmission portion 523, and the acoustic-to-electric conversion assembly 520. In some embodiments, the housing structure 510 may be a regular structure such as a cuboid, a cylinder, a frustum, or other irregular structures. In some embodiments, the housing structure 510 is a structure with a hollow interior, and the housing structure 510 may independently form an acoustic cavity, and the vibration pickup portion 522, the vibration transmission portion 523, and the acoustic-to-electric conversion assembly 520 may be located in the acoustic cavity. In some embodiments, the material of the housing structure 510 may include but is not limited to one or more of metal, alloy material, polymer material (e.g., acrylonitrile-butadiene-styrene copolymer, polyvinyl chloride, polycarbonate, polypropylene, etc.). In some embodiments, the periphery of the vibration pickup portion 522 may be connected to the side wall of the housing structure 510, thereby separating the acoustic cavity formed by the housing structure 510 into multiple cavities, including a first acoustic cavity 530 and a second acoustic cavity 540.

In some embodiments, one or more holes 511 may be provided on the side wall of the housing structure 510 corresponding to the first acoustic cavity 530. The one or more holes 511 may be located at the first acoustic cavity 530 and guide the external sound signal into the first acoustic cavity 530. In some embodiments, the external sound signal may enter the first acoustic cavity 530 of the microphone 500 from the hole 511 and cause the air in the first acoustic cavity 530 to vibrate. The vibration pickup portion 522 may pick up the air vibration signal and transmit the vibration signal to the acoustic-electric conversion component 520. The acoustic-electric conversion component 520 receives the vibration signal and converts the vibration signal into an electrical signal for output.

In some embodiments, the vibration pickup portion 522 may include a first vibration pickup portion 5221 and a second vibration pickup portion 5222 arranged sequentially from top to bottom. The first vibration pickup portion 5221 and the second vibration pickup portion 5222 may be connected to the housing structure 510 through their peripheries, and a portion of the first vibration pickup portion 5221 and the second vibration pickup portion 5222 may vibrate in response to a sound signal entering the microphone 500 through the hole portion 511. In some embodiments, the material of the vibration pickup portion 522 may include but is not limited to one or more of semiconductor materials, metal materials, metal alloys, organic materials, etc. In some embodiments, the semiconductor material may include but is not limited to silicon, silicon dioxide, silicon nitride, silicon carbide, etc. In some embodiments, the metal material may include but is not limited to copper, aluminum, chromium, titanium, gold, etc. In some embodiments, the metal alloy may include but is not limited to copper-aluminum alloy, copper-gold alloy, titanium alloy, aluminum alloy, etc. In some embodiments, the organic material may include but is not limited to polyimide, polyparaxylene, polydimethylsiloxane, silicone gel, silicone, etc. In some embodiments, the structure of the vibration pickup portion 522 may be a plate structure, a columnar structure, etc.

In some embodiments, the vibration pickup portion 522 may include an elastic portion and a fixed portion. As an example only, FIG. 6 is a schematic diagram of the structure of a microphone shown in some embodiments of the present application. As shown in FIG. 6, the first vibration pickup portion 5221 may include a first elastic portion 52211 and a first fixed portion 52212. One end of the first elastic portion 52211 is connected to the side wall of the shell structure 510, and the other end of the first elastic portion 52211 is connected to the first fixed portion 52212, so that the first elastic portion 52211 is connected between the first fixed portion 52212 and the inner wall of the shell structure 510. The second vibration pickup portion 5222 may include a second elastic portion 52221 and a second fixed portion 52222. One end of the second elastic part 52221 is connected to the side wall of the shell structure 510, and the other end of the second elastic part 52221 is connected to the second fixed part 52222, so that the second elastic part 52221 is connected between the second fixed part 52222 and the inner wall of the shell structure 510.

In some embodiments, the vibration transmission part 523 may be located between the first vibration pickup part 5221 and the second vibration pickup part 5222. The upper surface of the vibration transmission part 523 is connected to the lower surface of the first vibration pickup part 5221, and the lower surface of the vibration transmission part 523 is connected to the upper surface of the second vibration pickup part 5222. Specifically, a vacuum cavity 550 may be formed between the vibration transmission part 523, the first fixing part 52212 of the first vibration pickup part 5221, and the second fixing part 52222 of the second vibration pickup part 5222, and the acoustic-electric conversion assembly 520 may be located in the vacuum cavity 550. Specifically, one end of the acoustic-to-electric conversion assembly 520 may be connected to the inner wall of the vibration transmission part 523, and the other end of the acoustic-to-electric conversion assembly 520 may be suspended in the vacuum chamber 550. In some embodiments, the vibration picked up by the vibration pickup part 522 (e.g., the first elastic part 52211 of the first vibration pickup part 5221, the second elastic part 52221 of the second vibration pickup part 5222) may be transmitted to the acoustic-to-electric conversion assembly 520 through the vibration transmission part 523. In some embodiments, the material of the vibration transmission part 523 may include but is not limited to one or more of semiconductor materials, metal materials, metal alloys, organic materials, etc. In some embodiments, the material of the vibration transmission part 523 may be the same as or different from the material of the vibration pickup part 522. In some embodiments, the vibration transmission part 523 and the vibration pickup part 522 may be an integrally formed structure. In some embodiments, the vibration transmission part 523 and the vibration pickup part 522 may also be relatively independent structures. In some embodiments, the vibration transmission part 523 may be a tubular structure, an annular structure, a quadrilateral, a pentagon, or other regular and/or irregular polygonal structure.

The acoustic-to-electric conversion component 520 is disposed in the vacuum cavity 550, which can prevent the acoustic-to-electric conversion component 520 from contacting the air in the vacuum cavity 550, solve the influence of the acoustic-to-electric conversion component 520 on the vibration process of the air in the vacuum cavity 550, and further solve the problem of the large background noise of the microphone 500. On the other hand, the acoustic-to-electric conversion component 520 is located in the vacuum cavity 550, which can prevent the acoustic-to-electric conversion component 520 from rubbing against the air in the vacuum cavity 550, thereby reducing the air damping in the vacuum cavity 550 and improving the Q value of the microphone 500. In order to improve the output effect of the microphone 500, in some embodiments, the vacuum degree in the vacuum cavity 550 can be less than 100Pa. In some embodiments, the vacuum degree inside the vacuum chamber 550 may be 10 ⁻⁶ Pa to 100 Pa. In some embodiments, the vacuum degree inside the vacuum chamber 550 may be 10 ⁻⁷ Pa to 100 Pa.

In some embodiments, the materials of the first fixing portion 52212 and the second fixing portion 52222 may be different from the materials of the first elastic portion 52211 and the second elastic portion 52221. For example, in some embodiments, the rigidity of the fixing portion of the vibration pickup portion 522 may be greater than the rigidity of the elastic portion, that is, the rigidity of the first fixing portion 52212 may be greater than the rigidity of the first elastic portion 52211 and/or the rigidity of the second fixing portion 52222 may be greater than the rigidity of the second elastic portion 52221. The first elastic portion 52211 and/or the second elastic portion 52221 may generate vibrations in response to external sound signals and transmit the vibration signals to the acoustic-to-electric conversion assembly 520. The first fixing part 52212 and the second fixing part 52222 have a relatively large rigidity to ensure that the vacuum cavity 550 formed by the first fixing part 52212, the second fixing part 52222 and the vibration transmission part 523 is not affected by the external air pressure. In some embodiments, in order to ensure that the vacuum cavity 550 is not affected by the external air pressure, the Young's modulus of the fixing part of the vibration pickup part 522 (for example, the first fixing part 52212, the second fixing part 52222) can be greater than 60GPa. In some embodiments, the Young's modulus of the fixing part of the vibration pickup part 522 (for example, the first fixing part 52212, the second fixing part 52222) can be greater than 50GPa. In some embodiments, the Young's modulus of the fixed portion (e.g., the first fixed portion 52212, the second fixed portion 52222) of the vibration pickup portion 522 may be greater than 40 GPa.

In some embodiments, in order to ensure that the vacuum cavity is not affected by the external air pressure, the microphone may further include a reinforcement member, which may be located on the upper surface or lower surface of the vibration pickup portion corresponding to the vacuum cavity, thereby improving the rigidity of the portion of the vibration pickup portion corresponding to the vacuum cavity. As an example only, FIG. 7 is a schematic diagram of the structure of the microphone shown in some embodiments of the present application. As shown in FIG. 7, the microphone 500 may further include a reinforcement member 560. The reinforcement member 560 may be located on the upper surface or lower surface of the vibration pickup portion 522 corresponding to the vacuum cavity 550. Specifically, the reinforcement member 560 may be located on the lower surface of the first vibration pickup portion 5221 and the upper surface of the second vibration pickup portion 5222, respectively, and the periphery of the reinforcement member 560 is connected to the inner wall of the vibration transmission portion 523. In some embodiments, the structure of the reinforcement 560 may be a plate-like structure, a columnar structure, etc., and the structure of the reinforcement 560 may be adaptively adjusted according to the shape and structure of the vibration transmission part 523. It should be noted that the position of the reinforcement 560 is not limited to the inside of the vacuum cavity 550 shown in FIG. 7, and may also be located at other positions. For example, the reinforcement 560 may also be located outside the vacuum cavity 550. Specifically, the reinforcement 560 may be located on the upper surface of the first vibration pickup part 5221 and the lower surface of the second vibration pickup part 5222. For another example, the reinforcement 560 may also be located inside and outside the vacuum cavity 550 at the same time. Specifically, the reinforcing member 560 may be located on the upper surface of the first vibration pickup portion 5221 and the upper surface of the second vibration pickup portion 5222, or the reinforcing member 560 may be located on the upper surface of the first vibration pickup portion 5221 and the lower surface of the second vibration pickup portion 5222, or the reinforcing member 560 may be located on the lower surface of the first vibration pickup portion 5221 and the lower surface of the second vibration pickup portion 5222, or the reinforcing member 560 may be located on the lower surface of the first vibration pickup portion 5221 and the upper surface of the second vibration pickup portion 5222, or the reinforcing member 560 may be located on the upper and lower surfaces of the first vibration pickup portion 5221 and the upper and lower surfaces of the second vibration pickup portion 5222. The position of the reinforcement 560 is not limited to the above description, and any function that can ensure that the vacuum chamber is not affected by external air pressure is within the scope of protection of this specification.

In some embodiments, to ensure that the vacuum chamber 550 is not affected by the external air pressure, the stiffness of the reinforcement 560 is greater than the stiffness of the vibration pickup portion 522. In some embodiments, the Young's modulus of the reinforcement 560 may be greater than 60 GPa. In some embodiments, the Young's modulus of the reinforcement 560 may be greater than 50 GPa. In some embodiments, the Young's modulus of the reinforcement 560 may be greater than 40 GPa. In some embodiments, the material of the reinforcement 560 may include but is not limited to one or more of semiconductor materials, metal materials, metal alloys, organic materials, etc. In some embodiments, the semiconductor material may include but is not limited to silicon, silicon dioxide, silicon nitride, silicon carbide, etc. In some embodiments, the metal material may include but is not limited to copper, aluminum, chromium, titanium, gold, etc. In some embodiments, the metal alloy may include but is not limited to copper-aluminum alloy, copper-gold alloy, titanium alloy, aluminum alloy, etc. In some embodiments, the organic material may include but is not limited to polyimide, polyparaxylene, polydimethylsiloxane, silicone gel, silicone, etc.

The internal air pressure of the vacuum cavity 550 is much lower than the external air pressure of the vacuum cavity 550. By providing the reinforcing member 560 at the first vibration pickup portion 5221 and/or the second vibration pickup portion 5222 corresponding to the vacuum cavity 550, it can be ensured that the vacuum cavity 550 is not affected by the external air pressure. It can also be understood here that by providing the reinforcing member 560, the rigidity of the first vibration pickup portion 5221 and the second vibration pickup portion 5222 corresponding to the vacuum cavity 550 can be improved to prevent the vibration pickup portion 522 corresponding to the vacuum cavity 550 from being deformed under the effect of the difference between the external air pressure and the air pressure inside the vacuum cavity 550, thereby ensuring that the volume of the vacuum cavity 550 remains basically constant when the microphone 500 is working, thereby ensuring that the sound-to-electric conversion component 520 inside the vacuum cavity 550 works normally. It should be noted that the components of the microphone 500 (e.g., the first vibration pickup part 5221, the second vibration pickup part 5222, the vibration transmission part 523, and the acoustic-electric conversion assembly 520) need the packaging device to provide the required vacuum degree during the production process so that the vacuum degree inside the vacuum chamber 550 is within the required range.

It should be noted that, in an alternative embodiment, the vibration pickup portion 522 may only include a first vibration pickup portion 5221, the first vibration pickup portion 5221 is connected to the housing structure 510 through its periphery, and the acoustic-to-electric conversion component 520 may be directly or indirectly connected to the first vibration pickup portion 5221. For example, the acoustic-to-electric conversion component 520 may be located on the upper surface or the lower surface of the first vibration pickup portion 5221. For another example, the acoustic-to-electric conversion component 520 may be connected to the first vibration pickup portion 5221 through other structures (e.g., the vibration transmission portion 523). The first vibration pickup portion 5221 can generate vibration in response to the sound signal entering the microphone 500 through the hole portion 511, and the sound-to-electric conversion component 520 can convert the vibration of the first vibration pickup portion 5221 or the vibration transmission portion 523 into an electrical signal.

In some embodiments, the acoustic-to-electric conversion assembly 520 may include one or more acoustic-to-electric conversion assemblies. In some embodiments, a plurality of acoustic-to-electric conversion assemblies 520 may be distributed at intervals on the inner wall of the vibration transmission portion 523. It should be noted that the interval distribution here may refer to the horizontal direction (perpendicular to the A to A direction shown in FIG5 ) or the vertical direction (the A to A direction shown in FIG5 ). For example, when the vibration transmission portion 523 is an annular tubular structure, in the vertical direction, a plurality of acoustic-to-electric conversion assemblies 520 may be distributed at intervals in sequence from top to bottom. FIG8A is a schematic cross-sectional view of the microphone in FIG5 along the A to A direction. As shown in Fig. 8A, a plurality of acoustic-to-electric conversion components 520 can be sequentially spaced and distributed on the inner wall of the vibration transmission part 523, and in the horizontal direction, the plurality of acoustic-to-electric conversion components 520 spaced and distributed are on the same plane or approximately parallel. Fig. 8B is a schematic cross-sectional view of the microphone of Fig. 5 along the direction perpendicular to A to A. As shown in FIG8B , in the horizontal direction, the fixed ends of each acoustic-to-electric conversion assembly 520 and the vibration transmission part 523 can be distributed at intervals on the annular inner wall of the vibration transmission part 523, and the fixed ends of the acoustic-to-electric conversion assembly 520 and the vibration transmission part 523 can be approximately perpendicular, and the other end of the acoustic-to-electric conversion assembly 520 (also referred to as the free end) extends toward the center direction of the vibration transmission part 523 and is suspended in the vacuum cavity 550, so that the acoustic-to-electric conversion assembly 520 is distributed in an annular shape in the horizontal direction. In some embodiments, when the vibration transmission part 523 is a polygonal tubular structure (e.g., a triangle, a pentagon, a hexagon, etc.), in the horizontal direction, the fixed ends of multiple acoustic-to-electric conversion assemblies 520 can also be distributed at intervals along the side walls of the vibration transmission part 523. FIG9A is a schematic diagram of the horizontal distribution of the acoustic-to-electric conversion components shown in some embodiments of the present application. As shown in FIG9A , the vibration transmission part 523 is a quadrilateral structure, and a plurality of acoustic-to-electric conversion components 520 can be alternately distributed on the four side walls of the vibration transmission part 523. FIG9B is a schematic diagram of the distribution of the acoustic-to-electric conversion components shown in some embodiments of the present application. As shown in FIG9B , the vibration transmission part 523 is a hexagonal structure, and a plurality of acoustic-to-electric conversion components 520 can be alternately distributed on the six side walls of the vibration transmission part 523. In some embodiments, multiple acoustic-to-electric conversion components 520 are spaced and distributed on the inner wall of the vibration transmission part 523 to improve the space utilization of the vacuum cavity 550, thereby reducing the overall volume of the microphone 500.

It should be noted that in the horizontal direction or vertical direction, the multiple acoustic-electric conversion components 520 are not limited to being distributed at intervals on all inner walls of the vibration transmission part 523. The multiple acoustic-electric conversion components 520 can also be arranged on a side wall or part of the side wall of the vibration transmission part 523, or the multiple acoustic-electric conversion components 520 are on the same horizontal plane. For example, the vibration transmission part 523 is a rectangular parallelepiped structure, and the multiple acoustic-electric conversion components 520 can be simultaneously arranged on a side wall of the rectangular parallelepiped structure, on two opposite or adjacent side walls, or on any three side walls. The distribution method of the multiple acoustic-electric conversion components 520 can be adaptively adjusted according to their number or the size of the vacuum cavity 550, and is not further limited here.

In some embodiments, the acoustic-electric conversion assembly 520 may include a cantilever beam structure, one end of which may be connected to the inner wall of the vibration transmission portion 523, and the other end of which may be suspended in the vacuum chamber 550.

In some embodiments, the cantilever beam structure may include a first electrode layer, a piezoelectric layer, a second electrode layer, an elastic layer, and a base layer. The first electrode layer, the piezoelectric layer, and the second electrode layer may be arranged in sequence from top to bottom, the elastic layer may be located on the upper surface of the first electrode layer or the lower surface of the second electrode layer, and the base layer may be located on the upper surface or the lower surface of the elastic layer. In some embodiments, an external sound signal enters the first acoustic cavity 530 of the microphone 500 through the hole 511 and causes the air in the first acoustic cavity 530 to vibrate. The vibration pickup portion 522 (e.g., the first elastic portion 52211) can pick up air vibration signals and transmit the vibration signals to the acoustic-electric conversion component 520 (e.g., the cantilever beam structure) through the vibration transmission portion 523, so that the elastic layer in the cantilever beam structure is deformed under the action of the vibration signal. In some embodiments, the piezoelectric layer can generate an electrical signal based on the deformation of the elastic layer, and the first electrode layer and the second electrode layer can collect the electrical signal. In some embodiments, the piezoelectric layer can generate a voltage (potential difference) under the deformation stress of the elastic layer based on the piezoelectric effect, and the first electrode layer and the second electrode layer can export the voltage (electrical signal).

In some embodiments, the cantilever beam structure may also include one or more elastic layers, electrode layers and piezoelectric layers, wherein the elastic layer may be located on the surface of the electrode layer, and the electrode layer may be located on the upper surface or the lower surface of the piezoelectric layer. In some embodiments, the electrode layer may include a first electrode and a second electrode. The first electrode and the second electrode may be bent into a first comb-shaped structure, and the first comb-shaped structure and the second comb-shaped structure may include a plurality of comb structures, and adjacent comb structures of the first comb-shaped structure and adjacent comb structures of the first comb-shaped structure both have a certain spacing, and the spacing may be the same or different. The first comb-shaped structure cooperates with the second comb-shaped structure to form an electrode layer. Furthermore, the comb-shaped structure of the first comb-shaped structure can extend into the spacing of the second comb-shaped structure, and the comb-shaped structure of the second comb-shaped structure can extend into the spacing of the first comb-shaped structure, thereby cooperating with each other to form an electrode layer. The first comb-shaped structure and the second comb-shaped structure cooperate with each other so that the first electrode and the second electrode are arranged compactly but do not intersect. In some embodiments, the first comb-shaped structure and the second comb-shaped structure extend along the length direction of the cantilever beam (for example, from the fixed end to the free end).

In some embodiments, the elastic layer may be a film-like structure or a block-like structure supported by one or more semiconductor materials. In some embodiments, the semiconductor material may include but is not limited to silicon, silicon dioxide, silicon nitride, gallium nitride, zinc oxide, silicon carbide, etc. In some embodiments, the material of the piezoelectric layer may include piezoelectric crystal materials and _{piezoelectric} ceramic materials. Piezoelectric crystal materials refer to piezoelectric single crystals. In some embodiments, the piezoelectric crystal material may include crystal, sphalerite, borate, electric stone, red zinc ore, GaAs, barium titanate and its derivative structure crystals, _{KH2PO4 , NaKC4H4O6.4H2O} (sodium potassium _tartrate ) _, etc. or any combination thereof. Piezoelectric ceramic material refers to a piezoelectric polycrystal formed by irregular aggregation of fine grains obtained by solid phase reaction and sintering between powders of different materials. In some embodiments, the piezoelectric ceramic material may include barium titanate (BT), lead zirconium titanate (PZT), lead barium lithium niobium oxide (PBLN), modified lead titanate (PT), aluminum nitride (AIN), zinc oxide (ZnO), etc. or any combination thereof. In some embodiments, the piezoelectric layer material may also be a piezoelectric polymer material, such as polyvinylidene difluoride (PVDF), etc. In some embodiments, the first electrode layer and the second electrode layer may be a conductive material structure. Exemplary conductive materials may include metals, alloy materials, metal oxide materials, graphene, etc., or any combination thereof. In some embodiments, metal and alloy materials may include nickel, iron, lead, platinum, titanium, copper, molybdenum, zinc, or any combination thereof. In some embodiments, alloy materials may include copper-zinc alloys, copper-tin alloys, copper-nickel-silicon alloys, copper-chromium alloys, copper-silver alloys, etc., or any combination thereof. In some embodiments, metal oxide materials may include RuO ₂ , MnO ₂ , PbO ₂ , NiO, etc., or any combination thereof.

In some embodiments, the cantilever beam structure may further include a bonding electrode layer (PAD layer), which may be located on the first electrode layer and the second electrode layer, and the first electrode layer and the second electrode layer are connected to an external circuit by means of an external bonding wire (e.g., a gold wire, an aluminum wire, etc.), thereby leading the voltage signal between the first electrode layer and the second electrode layer to a back-end processing circuit. In some embodiments, the material of the bonding electrode layer may include copper foil, titanium, copper, etc. In some embodiments, the material of the bonding electrode layer may be the same as that of the first electrode layer (or the second electrode layer). In some embodiments, the material of the binding electrode layer and the first electrode layer (or the second electrode layer) may be different.

In some embodiments, the parameters of the cantilever beam structure (e.g., the length, width, height, material, etc. of the cantilever beam structure) can be set so that different cantilever beam structures have different resonant frequencies, thereby generating different frequency responses to the vibration signal of the vibration transmission part 523. For example, cantilever beam structures of different lengths can be set so that cantilever beam structures of different lengths have different resonant frequencies. The multiple resonant frequencies corresponding to cantilever beam structures of different lengths can be in the range of 100 Hz to 12000 Hz. Since the cantilever beam structure is sensitive to vibrations near its resonant frequency, it can be considered that the cantilever beam structure has a frequency-selective characteristic for the vibration signal, that is, the cantilever beam structure will mainly convert the sub-band vibration signal near its resonant frequency in the vibration signal into an electrical signal. Therefore, in some embodiments, by setting different cantilever beam structures to different lengths, different resonant frequencies can be made, thereby forming sub-bands near each resonant frequency. For example, 11 sub-bands can be set within the human voice frequency range through multiple cantilever beam structures, and the resonant frequencies of the cantilever beam structures corresponding to the 11 sub-bands can be respectively located at 500Hz to 700Hz, 700Hz to 1000Hz, 1000Hz to 1300Hz, 1300Hz to 1700Hz, 1700Hz to 2200Hz, 2200Hz to 3000Hz, 3000Hz to 3800Hz, 3800Hz to 4700Hz, 4700Hz to 5700Hz, 5700Hz to 7000Hz, and 7000Hz to 12000Hz. It should be noted that the number of sub-bands set within the human voice frequency range through the cantilever beam structure can be adjusted according to the application scenario of the microphone 500, and no further limitation is made here.

FIG10 is a schematic diagram of the structure of a microphone according to some embodiments of the present application. As shown in FIG10 , the microphone 1000 may include a housing structure 1010, an acoustic-electric conversion assembly 1020, a vibration pickup portion 1022, and a vibration transmission portion 1023. The microphone 1000 shown in FIG10 may be the same as or similar to the microphone 500 shown in FIG5 and FIG6 . For example, the housing structure 1010 of the microphone 1000 may be the same as or similar to the housing structure 510 of the microphone 500. For another example, the first acoustic cavity 1030, the second acoustic cavity 1040, and the vacuum cavity 1050 of the microphone 1000 may be the same as or similar to the first acoustic cavity 530, the second acoustic cavity 540, and the vacuum cavity 550 of the microphone 500, respectively. For another example, the vibration pickup portion 1022 (e.g., the first vibration pickup portion 10221 (e.g., the first elastic portion 102211, the first fixed portion 102212), the second vibration pickup portion 10222 (e.g., the second elastic portion 102221, the second fixed portion 102222)) of the microphone 1000 may be the same as or similar to the vibration pickup portion 522 (e.g., the first vibration pickup portion 5221 (e.g., the first elastic portion 52211, the first fixed portion 52212), the second vibration pickup portion 5222 (e.g., the second elastic portion 52221, the second fixed portion 52222)) of the microphone 500. For more structures of the microphone 1000 (e.g., the hole portion 1011, the vibration transmission portion 1023, etc.), refer to FIG. 5 and FIG. 6 and their related descriptions.

In some embodiments, the main difference between the microphone 1000 shown in FIG. 10 and the microphone 500 shown in FIG. 5 is that the acoustic-to-electrical conversion assembly 1020 of the microphone 1000 may include a first cantilever beam structure 10211 and a second cantilever beam structure 10212, where the first cantilever beam structure 10211 and the second cantilever beam structure 10212 are relative to two electrode plates. The fixed ends of the first cantilever beam structure 10211 and the second cantilever beam structure 10212 corresponding to the acoustic-electric conversion assembly 1020 can be connected to the inner wall of the vibration transmission part 1023, and the other ends (also called free ends) of the first cantilever beam structure 10211 and the second cantilever beam structure 10212 are suspended in the vacuum chamber 1050. In some embodiments, the first cantilever beam structure 10211 and the second cantilever beam structure 10212 can be arranged opposite to each other, and the first cantilever beam structure 10211 and the second cantilever beam structure 10212 have a facing area. In some embodiments, the first cantilever beam structure 10211 and the second cantilever beam structure 10212 are arranged vertically, and the facing area can be understood as the area where the lower surface of the first cantilever beam structure 10211 and the upper surface of the second cantilever beam structure 10212 are opposite. In some embodiments, the first cantilever beam structure 10211 and the second cantilever beam structure 10212 can have a first spacing d1. After receiving the vibration signal of the vibration transmission part 1023, the first cantilever beam structure 10211 and the second cantilever beam structure 10212 can respectively generate different degrees of deformation in their vibration direction (the extension direction of the first spacing d1), thereby changing the first spacing d1. The first cantilever beam structure 10211 and the second cantilever beam structure 10212 can convert the received vibration signal of the vibration transmission part 1023 into an electrical signal based on the change of the first spacing d1.

In order to make the first cantilever beam structure 10211 and the second cantilever beam structure 10212 produce different degrees of deformation in their vibration directions, in some embodiments, the stiffness of the first cantilever beam structure 10211 may be different from the stiffness of the second cantilever beam structure 10212. Under the action of the vibration signal of the vibration transmission part 1023, the cantilever beam structure with smaller stiffness may produce a certain degree of deformation, and the cantilever beam structure with larger stiffness may be approximately considered to have no deformation or a deformation amount less than that of the cantilever beam structure with smaller stiffness. In some embodiments, when the microphone 1000 is in operation, the cantilever beam structure with smaller rigidity (e.g., the second cantilever beam structure 10212) can deform in response to the vibration of the vibration transmitting portion 1023, and the cantilever beam structure with larger rigidity (e.g., the first cantilever beam structure 10211) can vibrate together with the vibration transmitting portion 1023 without deformation, so that the first spacing d1 changes.

In some embodiments, the resonant frequency of the cantilever beam structure with relatively small stiffness in the acoustic-to-electric conversion assembly 1020 may be located in a frequency range within the hearing range of the human ear (e.g., within 12000 Hz). In some embodiments, the resonant frequency of the cantilever beam structure with relatively large stiffness in the acoustic-to-electric conversion assembly 1020 may be located in a frequency range to which the human ear is insensitive (e.g., greater than 12000 Hz). In some embodiments, the stiffness of the first cantilever beam structure 10211 (or the second cantilever beam structure 10212) in the acoustic-to-electric conversion assembly 1020 can be achieved by adjusting the material, length, width or thickness of the first cantilever beam structure 10211 (or the second cantilever beam structure 10212). In some embodiments, by adjusting the parameters of each group of cantilever beam structures corresponding to the acoustic-to-electric conversion assembly 1020 (for example, the material, thickness, length, width, etc. of the cantilever beam structure), different frequency responses corresponding to different resonant frequencies can be obtained.

FIG11 is a diagram showing a frequency response curve of a microphone according to some embodiments of the present application. As shown in FIG11 , the horizontal axis represents frequency in Hz, and the vertical axis represents the frequency response of the sound signal output by the microphone in dB. The microphone here may refer to microphone 500, microphone 1000, microphone 1200, microphone 1300, microphone 1500, microphone 1600, microphone 1700, microphone 2000, microphone 2100, microphone 2200, etc. The dotted lines in FIG11 may represent the frequency response curves corresponding to the respective acoustic-to-electric conversion components of the microphone. According to the frequency response curves in Figure 11, each acoustic-to-electric conversion component has its own resonant frequency (for example, the resonant frequency of frequency response curve 1120 is approximately 350 Hz, and the resonant frequency of frequency response curve 1130 is approximately 1500 Hz). When the external sound signal is transmitted to the microphone, different acoustic-to-electric conversion components are more sensitive to the vibration signal near their own resonant frequency. Therefore, the electrical signal output by each acoustic-to-electric conversion component mainly includes the sub-band signal corresponding to its resonant frequency. In some embodiments, the output of each acoustic-to-electric conversion component at the resonance peak is much greater than its own flat area output. By selecting the frequency band close to the resonance peak in the frequency response curve of each acoustic-to-electric conversion component, the full-band signal corresponding to the sound signal can be sub-band divided. In some embodiments, after merging the frequency response curves in Figure 11, a frequency response curve 1110 of a microphone with a high signal-to-noise ratio and a flatter signal can be obtained. In addition, by setting different acoustic-to-electric conversion components (cantilever beam structures), resonance peaks of different frequency ranges can be added to the microphone system, which improves the sensitivity of the microphone near multiple resonance peaks, thereby improving the sensitivity of the microphone in the entire broadband.

By setting up multiple acoustic-to-electric conversion components in the microphone and utilizing the characteristics of the acoustic-to-electric conversion components (e.g., cantilever beam structure) with different resonant frequencies, the vibration signal can be filtered and decomposed into frequency bands, thus avoiding the complexity of the filtering circuit in the microphone and the problem that the software algorithm occupies high computing resources, causes signal distortion, and introduces noise, thereby reducing the complexity and production cost of the microphone.

FIG12 is a schematic diagram of the structure of a microphone according to some embodiments of the present application. As shown in FIG12 , the microphone 1200 may include a housing structure 1210, an acoustic-electric conversion assembly 1220, a vibration transmission portion 1223, and a vibration pickup portion 1222. The microphone 1200 shown in FIG12 may be the same as or similar to the microphone 500 shown in FIG5 and FIG6 . For example, the housing structure 1210 of the microphone 1200 may be the same as or similar to the housing structure 510 of the microphone 500. For another example, the first acoustic cavity 1230, the second acoustic cavity 1240, and the vacuum cavity 1250 of the microphone 1200 may be the same as or similar to the first acoustic cavity 530, the second acoustic cavity 540, and the vacuum cavity 550 of the microphone 500, respectively. For another example, the vibration picking-up portion 1222 of the microphone 1200 (e.g., the first vibration picking-up portion 12221 (e.g., the first elastic portion 122211, the first fixed portion 122212), the second vibration picking-up portion 12222 (e.g., the second elastic portion 122221, the second fixed portion 122222)) may be the same as or similar to the vibration picking-up portion 5222 of the microphone 500 (e.g., the first vibration picking-up portion 5221 (e.g., the first elastic portion 52211, the first fixed portion 52212), the second vibration picking-up portion 5222 (e.g., the second elastic portion 52221, the second fixed portion 52222)). For more information about the structure of the microphone 1200 (e.g., the hole 1211, the vibration transmission part 1223, the acoustic-electric conversion component 1220, etc.), please refer to Figures 5 and 6 and their related descriptions.

In some embodiments, the main difference between the microphone 1200 shown in FIG. 12 and the microphone 500 shown in FIG. 5 is that the microphone 1200 may further include one or more membrane structures 1260. In some embodiments, the membrane structure 1260 may be located on the upper surface and/or the lower surface of the acoustic-to-electric conversion component 1220. For example, the membrane structure 1260 may be a single-layer membrane structure, and the membrane structure 1260 may be located on the upper surface or the lower surface of the acoustic-to-electric conversion component 1220. For another example, the membrane structure 1260 may be a double-layer membrane, and the membrane structure 1260 may include a first membrane structure and a second membrane structure, the first membrane structure being located on the upper surface of the acoustic-to-electric conversion component 1220, and the second membrane structure being located on the lower surface of the acoustic-to-electric conversion component 1220. The resonant frequency of the acoustic-to-electric conversion assembly 1220 can be adjusted by arranging the membrane structure 1260 on the surface of the acoustic-to-electric conversion assembly 1220. In some embodiments, the resonant frequency of the acoustic-to-electric conversion assembly 1220 can be affected by adjusting the material, size (such as length, width), thickness, etc. of the membrane structure 1260. On the one hand, the parameter information (such as material, size, thickness, etc.) of the membrane structure 1260 and the acoustic-to-electric conversion assembly 1220 (such as a cantilever beam structure) can be adjusted so that each acoustic-to-electric conversion assembly 1220 generates resonance within a desired frequency range. On the other hand, by providing a membrane structure 1260 on the surface of the acoustic-to-electric conversion component 1220, it is possible to avoid damage to the acoustic-to-electric conversion component 1220 caused by the microphone 1200 when it is overloaded, thereby improving the reliability of the microphone 1200.

In some embodiments, the membrane structure 1260 may fully or partially cover the upper surface and/or lower surface of the acoustic-to-electric conversion assembly 1220. For example, the upper surface or lower surface of each acoustic-to-electric conversion assembly 1220 is covered with a corresponding membrane structure 1260, and the membrane structure 1260 may fully cover the upper surface or lower surface of the corresponding acoustic-to-electric conversion assembly 1220, or the membrane structure 1260 may partially cover the upper surface or lower surface of the corresponding acoustic-to-electric conversion assembly 1220. For another example, viewed in the horizontal direction, when multiple acoustic-to-electric conversion components 1220 are simultaneously located on the same horizontal plane, a membrane structure 1260 can simultaneously cover the upper or lower surfaces of multiple acoustic-to-electric conversion components 1220 on the same horizontal plane. For example, the membrane structure 1260 here is connected to the inner wall of the vibration transmission part 1223 through its periphery, thereby dividing the vacuum cavity 1250 into two independent upper and lower vacuum cavities. For another example, the shape of the membrane structure 1260 can be the same as the cross-sectional shape of the vibration transmission part 1223. The membrane structure 1260 is connected to the inner wall of the vibration transmission part 1223 through its periphery. The middle part of the membrane structure 1260 can include a hole (not shown in FIG. 12). The membrane structure 1260 can partially cover the upper surface or lower surface of multiple acoustic-electric conversion components 1220 on the same horizontal plane at the same time, and the vacuum cavity 1250 can be divided into two upper and lower connected vacuum cavities by the membrane structure 1260.

In some embodiments, the material of the film structure 1260 may include but is not limited to one or more of semiconductor materials, metal materials, metal alloys, organic materials, etc. In some embodiments, semiconductor materials may include but are not limited to silicon, silicon dioxide, silicon nitride, silicon carbide, etc. In some embodiments, metal materials may include but are not limited to copper, aluminum, chromium, titanium, gold, etc. In some embodiments, metal alloys may include but are not limited to copper-aluminum alloys, copper-gold alloys, titanium alloys, aluminum alloys, etc. In some embodiments, Organic materials may include but are not limited to polyimide, polyparaxylene, polydimethylsiloxane, silicone gel, silicone, etc.

FIG13 is a schematic diagram of the structure of a microphone according to some embodiments of the present application. The microphone 1300 shown in FIG13 may be the same as or similar to the microphone 1000 shown in FIG10. For example, the first acoustic cavity 1330, the second acoustic cavity 1340, and the vacuum cavity 1350 of the microphone 1300 may be the same as or similar to the first acoustic cavity 1030, the second acoustic cavity 1040, and the vacuum cavity 1050 of the microphone 1000, respectively. For another example, the vibration picking-up portion 1322 of the microphone 1300 (e.g., the first vibration picking-up portion 13221 (e.g., the first elastic portion 132211, the first fixed portion 132212), the second vibration picking-up portion 13222 (e.g., the second elastic portion 132221, the second fixed portion 132222)) may be the same as or similar to the vibration picking-up portion 10222 of the microphone 1000 (e.g., the first vibration picking-up portion 10221 (e.g., the first elastic portion 102211, the first fixed portion 102212), the second vibration picking-up portion 10222 (e.g., the second elastic portion 102221, the second fixed portion 102222)). For more information about the structure of the microphone 1300 (e.g., the housing structure 1310, the hole 1311, the vibration transmission part 1323, the acoustic-electric conversion component 1320, etc.), please refer to FIG. 10 and its related description.

In some embodiments, the microphone 1300 shown in FIG. 13 is mainly different from the microphone 1200 shown in FIG. 10 in that the microphone 1300 may further include one or more membrane structures 1360. In some embodiments, the membrane structure 1360 may be located on the upper surface and/or lower surface of the cantilever beam structure (e.g., the second cantilever beam structure 13212) with a relatively small rigidity of the acoustic-electric conversion component 1320. For example, the membrane structure 1360 may be a single-layer membrane structure, and the membrane structure 1360 may be located on the upper surface or the lower surface of the second cantilever beam structure 13212. For another example, the membrane structure 1360 may be a double-layer membrane, and the membrane structure 1360 may include a first membrane structure and a second membrane structure, wherein the first membrane structure is located on the upper surface of the second cantilever beam structure 13212, and the second membrane structure is located on the lower surface of the second cantilever beam structure 13212. In some embodiments, the membrane structure 1360 may cover the upper surface and/or the lower surface of the second cantilever beam structure 13212 in whole or in part. For example, the upper surface or lower surface of each second cantilever beam structure 13212 is covered with a corresponding membrane structure 1360, and the membrane structure 1360 may completely cover the upper surface or lower surface of the corresponding second cantilever beam structure 13212, or the membrane structure 1360 may partially cover the upper surface or lower surface of the corresponding second cantilever beam structure 13212. For more information about the membrane structure 1360 completely or partially covering the upper surface and lower surface of the second cantilever beam structure 13212, please refer to Figure 12 and its related description.

In some embodiments, the membrane structure 1360 may also be located on the upper surface and/or lower surface of the cantilever beam structure (e.g., the first cantilever beam structure 13211) of the acoustic-electric conversion assembly 1320 with greater rigidity. The manner in which the membrane structure 1360 is located on the upper surface and/or lower surface of the first cantilever beam structure 13211 is similar to the manner in which the membrane structure 1360 is located on the upper surface and/or lower surface of the second cantilever beam structure 13212, and will not be elaborated here.

In some embodiments, the membrane structure 1360 may also be located simultaneously on the upper surface and/or lower surface of the cantilever beam structure with smaller rigidity (e.g., the second cantilever beam structure 13212) and the upper surface and/or lower surface of the cantilever beam structure with larger rigidity (e.g., the first cantilever beam structure 13211) of the acoustic-electric conversion assembly 1320. For example, FIG14 is a schematic diagram of the structure of a microphone according to some embodiments of the present application. As shown in FIG14, the membrane structure 1360 is located simultaneously on the upper surface of the first cantilever beam structure 13211 and the lower surface of the second cantilever beam structure 13212. In some embodiments, a membrane structure 1360 is provided on the upper surface and/or lower surface of a cantilever beam structure with greater rigidity (e.g., the first cantilever beam structure 13211), so that the cantilever beam structure with greater rigidity does not deform relative to the vibration transmission part 1323, thereby improving the sensitivity of the microphone 1300.

It should be noted that the corresponding vibration pickup parts in the microphone 1000 shown in FIG. 10 , the microphone 1200 shown in FIG. 12 , and the microphone 1300 shown in FIG. 13 and FIG. 14 are not limited to ensuring the stability of the vacuum cavity by setting the fixed part and the elastic part with different rigidity. In some embodiments, the stability of the vacuum cavity can also be ensured by setting a reinforcement at the vibration pickup part corresponding to the vacuum cavity. The description of the fixing part can refer to FIG. 7 and its related contents, which will not be elaborated here.

FIG15 is a schematic diagram of the structure of a microphone according to some embodiments of the present application. As shown in FIG15 , the microphone 1500 may include a housing structure 1510, an acoustic-electric conversion assembly 1520, a vibration pickup portion 1522, and a vibration transmission portion 1523. The microphone 1500 shown in FIG15 may be the same as or similar to the microphone 500 shown in FIG5 . For example, the first acoustic cavity 1530, the second acoustic cavity 1540, and the vacuum cavity 1550 of the microphone 1500 may be the same as or similar to the first acoustic cavity 530, the second acoustic cavity 540, and the vacuum cavity 550 of the microphone 500, respectively. For more information about the structure of the microphone 1500 (e.g., the housing structure 1510, the hole 1511, the vibration transmission part 1523, the acoustic-electric conversion component 1520, etc.), please refer to FIG. 5 and its related description.

In some embodiments, the microphone 1500 shown in FIG. 15 is mainly different from the microphone 500 shown in FIG. 5 in the vibration pickup portion 1522. In some embodiments, the vibration pickup portion 1522 may include a first vibration pickup portion 15221, a second vibration pickup portion 15222, and a third vibration pickup portion 15223. In some embodiments, the first vibration pickup portion 15221 and the second vibration pickup portion 15222 are disposed opposite to each other up and down with respect to the vibration transmission portion 1523, so that the vibration transmission portion 1523 is located between the first vibration pickup portion 15221 and the second vibration pickup portion 15222. Specifically, the lower surface of the first vibration pickup part 15221 is connected to the upper surface of the vibration transmission part 1523, and the upper surface of the second vibration pickup part 15222 is connected to the lower surface of the vibration transmission part 1523. In some embodiments, a vacuum cavity 1550 can be formed between the first vibration pickup part 15221, the second vibration pickup part 15222 and the vibration transmission part 1523, and the acoustic-electric conversion assembly 1520 is located in the vacuum cavity 1550. In some embodiments, the third vibration pickup part 15223 is connected between the vibration transmission part 1523 and the inner wall of the housing structure 1510. When the microphone 1500 is working, the sound signal can enter the first acoustic cavity 1530 through the hole 1511 and act on the vibration pickup part 1522, causing the third vibration pickup part 15223 to vibrate, and the third vibration pickup part 15223 transmits the vibration to the acoustic-electric conversion component 1520 through the vibration transmission part 1523.

In some embodiments, the third vibration pickup portion 15223 may include one or more film structures, which are compatible with the vibration transmission portion 1523 and the housing structure 1510. For example, when the housing structure 1510 and the vibration transmission portion 1523 are both cylindrical structures, the third vibration pickup portion 15223 may be an annular film structure, the outer wall of the annular film structure is connected to the housing structure 1510, and the inner wall of the annular film structure is connected to the vibration transmission portion 1523. For another example, when the shell structure 1510 is a cylindrical structure and the vibration transmission part 1523 is a rectangular parallelepiped structure, the third vibration pickup part 15223 can be a circular film structure with a rectangular hole in the center, and the outer wall of the film structure is connected to the shell structure 1510, and the inner wall of the film structure is connected to the vibration transmission part 1523. It should be noted that the shape of the third vibration pickup part 15223 is not limited to the aforementioned ring and rectangle, and can also be a film structure of other shapes, for example, regular and/or irregular shapes such as pentagons and hexagons. The shape and structure of the third vibration pickup part 15223 can be adaptively adjusted according to the shapes of the shell structure 1510 and the vibration transmission part 1523.

In some embodiments, the material of the third vibration pickup portion 15223 may include but is not limited to one or more of semiconductor materials, metal materials, metal alloys, organic materials, etc. In some embodiments, semiconductor materials may include but are not limited to silicon, silicon dioxide, silicon nitride, silicon carbide, etc. In some embodiments, metal materials may include but are not limited to copper, aluminum, chromium, titanium, gold, etc. In some embodiments, metal alloys may include but are not limited to copper-aluminum alloys, copper-gold alloys, titanium alloys, aluminum alloys, etc. In some embodiments, organic materials may include but are not limited to polyimide, polyparaxylene, polydimethylsiloxane, silicone gel, silicone, etc.

In some embodiments, the material of the first vibration pickup portion 15221 and the second vibration pickup portion 15222 is different from the material of the third vibration pickup portion 15223. For example, in some embodiments, the rigidity of the first vibration pickup portion 15221 and the rigidity of the second vibration pickup portion 15222 may be greater than the rigidity of the third vibration pickup portion 15223. In some embodiments, the third vibration pickup portion 15223 may generate vibrations in response to an external sound signal and transmit the vibration signal to the acoustic-to-electric conversion assembly 1520. The first vibration pickup part 15221 and the second vibration pickup part 15222 have a relatively large rigidity to ensure that the vacuum cavity 1550 formed by the first vibration pickup part 15221, the second vibration pickup part 15222 and the vibration transmission part 1523 is not affected by the external air pressure. In some embodiments, in order to ensure that the vacuum cavity 1550 is not affected by the external air pressure, the Young's modulus of the first vibration pickup part 15221 and the second vibration pickup part 15222 may be greater than 60GPa. In some embodiments, the Young's modulus of the first vibration pickup part 15221 and the second vibration pickup part 15222 may be greater than 50GPa. In some embodiments, the Young's modulus of the first vibration pickup portion 15221 and the second vibration pickup portion 15222 may be greater than 40 GPa.

In some embodiments, in order to ensure that the vacuum cavity 1550 is not affected by the external air pressure, the microphone 1500 may further include a reinforcement member (not shown in the figure), which may be located on the upper surface or lower surface of the vibration pickup portion 1522 (e.g., the first vibration pickup portion 15221, the second vibration pickup portion 15222) corresponding to the vacuum cavity 1550. Specifically, the reinforcement member may be located on the lower surface of the first vibration pickup portion 15221 and the upper surface of the second vibration pickup portion 15222, respectively, and the periphery of the reinforcement member is connected to the inner wall of the vibration transmission portion 1523. For the specific contents of the structure, position, material, etc. of the reinforcement member, please refer to FIG. 7 and its related description. In addition, the reinforcement can also be used in other embodiments of the present specification, for example, the microphone 1600 shown in FIG. 16, the microphone 1700 shown in FIG. 17, the microphone 2000 shown in FIG. 20, the microphone 2100 shown in FIG. 21, and the microphone 2200 shown in FIG. 22.

In some embodiments, the microphone 1500 may also include one or more membrane structures (not shown in the figure), and the membrane structure may be located on the upper surface and/or lower surface of the acoustic-electric conversion component 1520. For details about the membrane structure, please refer to Figure 12 and its related description, which will not be elaborated here.

FIG16 is a schematic diagram of the structure of a microphone according to some embodiments of the present application. As shown in FIG16 , the microphone 1600 may include a housing structure 1610, an acoustic-electric conversion assembly 1620, a vibration pickup portion 1622, and a vibration transmission portion 1623. The microphone 1600 shown in FIG16 may be the same as or similar to the microphone 1000 shown in FIG10 . For example, the first acoustic cavity 1630, the second acoustic cavity 1640, and the vacuum cavity 1650 of the microphone 1600 may be the same as or similar to the first acoustic cavity 1030, the second acoustic cavity 1040, and the vacuum cavity 1050 of the microphone 1000, respectively. For more information about the structure of the microphone 1600 (e.g., the housing structure 1610, the hole 1611, the vibration transmission part 1623, the acoustic-electric conversion component 1620, etc.), please refer to FIG. 10 and its related description.

In some embodiments, the microphone 1600 shown in FIG. 16 is mainly different from the microphone 1000 shown in FIG. 10 in the vibration pickup portion 1622. In some embodiments, the vibration pickup portion 1622 may include a first vibration pickup portion 16221, a second vibration pickup portion 16222, and a third vibration pickup portion 16223. In some embodiments, the first vibration pickup portion 16221 and the second vibration pickup portion 16222 may be disposed in an upper and lower relative manner with respect to the vibration transmission portion 1623, so that the vibration transmission portion 1623 is located between the first vibration pickup portion 16221 and the second vibration pickup portion 16222. Specifically, the lower surface of the first vibration pickup part 16221 is connected to the upper surface of the vibration transmission part 1623, and the upper surface of the second vibration pickup part 16222 is connected to the lower surface of the vibration transmission part 1623. In some embodiments, a vacuum cavity 1650 can be formed between the first vibration pickup part 16221, the second vibration pickup part 16222 and the vibration transmission part 1623, and the acoustic-electric conversion component 1620 (for example, the first cantilever beam structure 16211, the second cantilever beam structure 16212) is located in the vacuum cavity 1650.

In some embodiments, the third vibration pickup part 16223 is connected between the vibration transmission part 1623 and the inner wall of the housing structure 1610. When the microphone 1600 is working, the sound signal can enter the first acoustic cavity 1630 through the hole 1611 and act on the third vibration pickup part 16223 to vibrate, and the third vibration pickup part 16223 transmits the vibration to the acoustic-electric conversion component 1620 through the vibration transmission part 1623. The details of the third vibration pickup part 16223 can be referred to Figure 15 and its related description, which will not be elaborated here.

In some embodiments, the microphone 1600 may further include one or more membrane structures (not shown in the figure), and the membrane structure may be located on the upper surface and/or lower surface of the acoustic-electric conversion component 1620. For details about the membrane structure, please refer to Figures 12 ^to 14 and related descriptions, which will not be elaborated here.

FIG17 is a schematic diagram of the structure of a microphone according to some embodiments of the present application. As shown in FIG17 , the microphone 1700 may include a housing structure 1710, an acoustic-electric conversion assembly 1720, a vibration pickup portion 1722, and a vibration transmission portion 1723. The microphone 1700 shown in FIG17 may be the same as or similar to the microphone 1500 shown in FIG15 . For example, the first acoustic cavity 1730, the second acoustic cavity 1740, and the vacuum cavity 1750 of the microphone 1700 may be the same as or similar to the first acoustic cavity 1530, the second acoustic cavity 1540, and the cavity 1550 of the microphone 1500, respectively. For another example, the vibration pickup part 1722 (e.g., the first vibration pickup part 17221, the second vibration pickup part 17222, and the third vibration pickup part 17223) of the microphone 1700 may be the same as or similar to the vibration pickup part 1522 (e.g., the first vibration pickup part 15221, the second vibration pickup part 15222, and the third vibration pickup part 15223) of the microphone 1500. For more structures of the microphone 1700 (e.g., the housing structure 1710, the hole part 1711, the vibration transmission part 1723, the acoustic-electric conversion component 1720, etc.), please refer to FIG. 15 and its related description.

In some embodiments, the microphone 1700 shown in FIG. 17 is mainly different from the microphone 1500 shown in FIG. 15 in that the microphone 1700 may further include one or more supporting structures 1760. In some embodiments, the supporting structure 1760 may be disposed in the vacuum chamber 1750, the upper surface of the supporting structure 1760 may be connected to the lower surface of the first vibration pickup portion 17221, and the lower surface of the supporting structure 1760 may be connected to the upper surface of the second vibration pickup portion 17222. On the one hand, by arranging a supporting structure 1760 in the vacuum cavity 1750, the supporting structure 1760 is respectively connected to the first vibration pickup part 17221 and the second vibration pickup part 17222, thereby further improving the rigidity of the first vibration pickup part 17221 and the second vibration pickup part 17222, so that the first vibration pickup part 17221 and the second vibration pickup part 17222 are not affected by the air vibration in the first acoustic cavity 1730 and are not deformed, thereby reducing the vibration mode of the internal components of the microphone 1700 (such as the first vibration pickup part 17221 and the second vibration pickup part 17222). At the same time, the support structure 1760 improves the rigidity of the first vibration pickup part 17221 and the second vibration pickup part 17222, and can further ensure that the volume of the vacuum cavity 1750 remains basically constant, so that the vacuum degree inside the vacuum cavity 1750 is within the required range (for example, less than 100Pa), thereby reducing the influence of the air damping in the vacuum cavity 1750 on the acoustic-electric conversion component 1720 and improving the Q value of the microphone 1700. On the other hand, the support structure 1760 is connected to the first vibration pickup part 17221 and the second vibration pickup part 17222 respectively, which can also improve the reliability of the microphone 1700 under overload conditions.

In some embodiments, the shape of the support structure 1760 may be a regular and/or irregular structure such as a plate structure, a cylinder, a truncated cone, a cuboid, a pyramid, a hexahedron, etc. In some embodiments, the material of the support structure 1760 may include but is not limited to one or more of semiconductor materials, metal materials, metal alloys, organic materials, etc. In some embodiments, the semiconductor material may include but is not limited to silicon, silicon dioxide, silicon nitride, silicon carbide, etc. In some embodiments, the metal material may include but is not limited to copper, aluminum, chromium, titanium, gold, etc. In some embodiments, the metal alloy may include but is not limited to copper-aluminum alloy, copper-gold alloy, titanium alloy, aluminum alloy, etc. In some embodiments, the organic material may include but is not limited to polyimide, polyparaxylene, polydimethylsiloxane, silicone gel, silicone, etc.

Referring to FIG. 17 , in some embodiments, the second distance d2 between the free end of the acoustic-to-electric conversion component 1720 (i.e., the end suspended in the vacuum chamber 1750) and the support structure 1760 is not less than 2 μm, so as to prevent the acoustic-to-electric conversion component 1720 from colliding with the support structure 1760 during the vibration process. At the same time, when the second distance d2 is smaller (for example, the second distance d2 is not greater than 20 μm), the overall volume of the microphone 1700 can be effectively reduced. In some embodiments, the second distance d2 between the free end and the support structure 1760 in different acoustic-to-electric conversion components 1720 (for example, cantilever beam structures of different lengths) can be different. In some embodiments, by designing support structures 1760 of different shapes and sizes and adjusting the position of the support structures 1760, multiple acoustic-to-electrical conversion components 1720 (e.g., cantilever beam structures) can be densely arranged in the vacuum cavity 1750, thereby making the microphone 1700 have a smaller overall size. FIG. 18A and FIG. 18B are schematic cross-sectional views of microphones in different directions according to some embodiments of the present application. As shown in FIG. 18A and FIG. 18B, when the support structure 1760 is an elliptical cylinder, the support structure 1760, the vibration transmission part 1723 and the vibration pickup part 1722 form a ring-shaped or ring-like cavity in the vacuum cavity 1750, and a plurality of acoustic-electric conversion components 1720 are located in the cavity and are spaced and distributed along the periphery of the support structure 1760.

In some embodiments, the support structure 1760 may be located at the center of the vacuum cavity 1750. For example, FIG. 19A is a schematic cross-sectional view of a microphone according to some embodiments of the present application. As shown in FIG. 19A , the support structure 1760 is located at the center of the vacuum cavity 1750. The center here may be the geometric center of the vacuum cavity 1750. In some embodiments, the support structure 1760 may also be disposed in the vacuum cavity 1750 near either end of the vibration transmission portion 1723. For example, FIG. 19B is a schematic cross-sectional view of a microphone according to some embodiments of the present application. As shown in FIG. 19B , the support structure 1760 is located in the vacuum cavity 1750 near the side wall L of the vibration transmission portion 1723. It should be noted that the shape, arrangement, position, material, etc. of the support structure 1760 can be adjusted according to the length, quantity, and distribution of the acoustic-electric conversion component 1720, and no further limitation is made here.

In some embodiments, the microphone 1700 may further include one or more membrane structures (not shown in the figure), and the membrane structure may be disposed on the upper surface and/or lower surface of the acoustic-electric conversion assembly 1720. In some embodiments, a hole portion for the support structure 1760 to pass through may be provided in the middle of the membrane structure, and the hole portion may be the same as or different from the cross-sectional shape of the support structure. In some embodiments, the peripheral sidewalls of the support structure 1760 may be connected to the peripheral portion of the hole portion in the membrane structure, or may not be connected to the peripheral portion of the hole portion in the membrane structure. For more descriptions of the shape, material, structure, etc. of the membrane structure, please refer to Figure 12 and its related descriptions.

It should be noted that the support structure can also be applied to microphones in other embodiments, for example, it can be applied to microphone 500 shown in FIG5, microphone 1000 shown in FIG10, microphone 1200 shown in FIG12, microphone 1300 shown in FIG13, and microphone 1200 shown in FIG14. When the support structure is applied to other microphones, the shape, position, and material of the support structure can be adaptively adjusted according to the specific situation.

FIG20 is a schematic diagram of the structure of a microphone according to some embodiments of the present application. As shown in FIG20 , the microphone 2000 may include a housing structure 2010, an acoustic-electric conversion assembly 2020, a vibration pickup portion 2022, and a vibration transmission portion 2023. The microphone 2000 shown in FIG20 may be the same as or similar to the microphone 1600 shown in FIG16 . For example, the first acoustic cavity 2030, the second acoustic cavity 2040, and the vacuum cavity 2050 of the microphone 2000 may be the same as or similar to the first acoustic cavity 1630, the second acoustic cavity 1640, and the vacuum cavity 1650 of the microphone 1600, respectively. For another example, the vibration pickup part 2022 (e.g., the first vibration pickup part 20221, the second vibration pickup part 20222, and the third vibration pickup part 20223) of the microphone 2000 may be the same as or similar to the vibration pickup part 1622 (e.g., the first vibration pickup part 16221, the second vibration pickup part 16222, and the third vibration pickup part 16223) of the microphone 1600. For more structures of the microphone 2000 (e.g., the housing structure 2010, the hole part 2011, the vibration transmission part 2023, the acoustic-electric conversion component 2020, etc.), please refer to FIG. 16 and its related description.

In some embodiments, the microphone 2000 shown in FIG. 20 is mainly different from the microphone 1600 shown in FIG. 16 in that the microphone 2000 may further include a support structure 2060. In some embodiments, the upper surface of the support structure 2060 may be connected to the lower surface of the first vibration pickup portion 20221, and the lower surface of the support structure 2060 may be connected to the upper surface of the second vibration pickup portion 20222. In some embodiments, the free end (i.e., the end suspended in the vacuum chamber 2050) of the acoustic-to-electric conversion assembly 2020 (e.g., the first cantilever beam structure 20211, the second cantilever beam structure 20212) may have a second distance d2 with the support structure 2060. For more description about the support structure 2060, please refer to Figure 17 and its related description.

In some embodiments, the microphone 2000 may further include one or more membrane structures (not shown in the figure), and a detailed description of the membrane structure of the microphone 2000 including the support structure 2060 may refer to FIG. 13, FIG. 14, FIG. 17 and related descriptions thereof.

FIG21 is a schematic diagram of the structure of a microphone according to some embodiments of the present application. In some embodiments, the microphone may be a bone conduction microphone. As shown in FIG21 , the bone conduction microphone 2100 may include a housing structure 2110, an acoustic-to-electric conversion assembly 2120, a vibration pickup portion 2122, and a vibration transmission portion 2123. The components of the bone conduction microphone 2100 shown in FIG21 may be the same or similar to the components of the microphone 1700 shown in FIG17 , for example, the acoustic-to-electric conversion assembly 2120, the first acoustic cavity 2130, the second acoustic cavity 2140, the vacuum cavity 2150, the vibration pickup portion 2122 (for example, the first vibration pickup portion 21221, the second vibration pickup portion 21222), the vibration transmission portion 2123, the support structure 2160, etc.

In some embodiments, the difference between the bone conduction microphone 2100 and the microphone 1700 shown in FIG. 17 is that the vibration pickup method is different. The vibration pickup portion 1722 (e.g., the third vibration pickup portion 17223) of the microphone 1700 picks up the vibration signal of the air transmitted through the hole 1711 to the first acoustic cavity 1730, while the shell structure 2110 of the bone conduction microphone 2100 does not include a hole. The bone conduction microphone 2100 generates a vibration signal by responding to the vibration of the shell structure 2110 through the vibration pickup portion 2122 (e.g., the third vibration pickup portion 21223). Specifically, the housing structure 2110 can generate vibrations based on external sound signals, and the third vibration pickup portion 21223 can generate a vibration signal in response to the vibration of the housing structure 2110, and transmit the vibration signal to the acoustic-electric conversion component 2120 through the vibration transmission portion 2123, and the acoustic-electric conversion component 2120 converts the vibration signal into an electrical signal and outputs it.

FIG22 is a schematic diagram of the structure of a microphone according to some embodiments of the present application. As shown in FIG22 , a bone conduction microphone 2200 may include a housing structure 2210, an acoustic-to-electric conversion assembly 2220, a vibration pickup portion 2222, and a vibration transmission portion 2223. The components of the bone conduction microphone 2200 shown in FIG22 may be the same as or similar to the components of the microphone 2000 shown in FIG20 , for example, an acoustic-to-electric conversion assembly 2220, a first acoustic cavity 2230, a second acoustic cavity 2240, a vacuum cavity 2250, a vibration pickup portion 2222 (for example, a first vibration pickup portion 22221, a second vibration pickup portion 22222), a vibration transmission portion 2223, a support structure 2260, etc.

In some embodiments, the difference between the bone conduction microphone 2200 and the microphone 2000 shown in FIG. 20 is that the vibration pickup method is different. The vibration pickup portion 2022 (e.g., the third vibration pickup portion 20223) of the microphone 2000 picks up the vibration signal of the air transmitted through the hole 2011 to the first acoustic cavity 2030, while the shell structure 2210 of the bone conduction microphone 2200 does not include a hole. The bone conduction microphone 2200 generates a vibration signal by responding to the vibration of the shell structure 2210 through the vibration pickup portion 2222 (e.g., the third vibration pickup portion 22223). In some embodiments, the housing structure 2210 can generate vibrations based on external sound signals, and the third vibration pickup portion 22223 can generate a vibration signal in response to the vibration of the housing structure 2210, and transmit the vibration signal to the acoustic-to-electric conversion component 2220 (for example, the first cantilever beam structure 22211, the second cantilever beam structure 22212) through the vibration transmission portion 2223, and the acoustic-to-electric conversion component 2220 converts the vibration signal into an electrical signal and outputs it.

It should be noted that the microphone 500 shown in FIG5, the microphone 1000 shown in FIG10, the microphone 1200 shown in FIG12, and the microphone 1300 shown in FIG13 can also be used as a bone conduction microphone. For example, the microphone here may not be provided with a hole, the housing structure may generate vibrations based on an external sound signal, the first vibration pickup portion or the second vibration pickup portion may generate a vibration signal in response to the vibration of the housing structure, and transmit the vibration to the acoustic-electric conversion component through the vibration transmission portion, and the acoustic-electric conversion component converts the vibration signal into an electrical signal and outputs it.

The basic concepts have been described above. Obviously, for those with ordinary knowledge in the field, the above detailed disclosure is only for example and does not constitute a limitation of the present invention. Although it is not explicitly stated here, those with ordinary knowledge in the field may make various modifications, improvements and amendments to the present invention. Such modifications, improvements and amendments are suggested in the present invention, so such modifications, improvements and amendments still belong to the spirit and scope of the exemplary embodiments of the present invention.

500: Microphone

510: Shell structure

511: Hole

520: Sound-to-electric conversion components

522: Vibration pickup unit

523: Vibration transmission unit

530: First acoustic cavity

540: Second acoustic cavity

550: Vacuum chamber

5221: First vibration pickup unit

5222: Second vibration pickup unit

Claims (9)

A microphone comprises: a housing structure; a vibration pickup portion, the vibration pickup portion generating vibration in response to the vibration of the housing structure; a vibration transmission portion configured to transmit the vibration generated by the vibration pickup portion; and an acoustic-to-electric conversion component configured to receive the vibration transmitted by the vibration transmission portion and generate an electrical signal; wherein the vibration pickup portion and the vibration transmission portion form a vacuum cavity, the acoustic-to-electric conversion component is located in the vacuum cavity, wherein the vibration pickup portion comprises a plurality of components from top to bottom. The first vibration pickup part and the second vibration pickup part are arranged in sequence, the first vibration pickup part or the second vibration pickup part includes an elastic part and a fixed part, the fixed part of the first vibration pickup part and the fixed part of the second vibration pickup part and the vibration transmission part form the vacuum cavity, the elastic part is connected between the fixed part and the inner wall of the shell structure, the rigidity of the fixed part is greater than the rigidity of the elastic part, wherein the elastic part generates vibration in response to an external sound signal. A microphone as claimed in claim 1, wherein the vacuum degree inside the vacuum cavity is less than 100 Pa. A microphone as claimed in claim 1, wherein the vacuum degree inside the vacuum cavity is 10 ^-6 Pa to 100 Pa. A microphone as claimed in claim 1, wherein the vibration pickup part and the housing structure form an acoustic cavity, the acoustic cavity includes a first acoustic cavity; the housing structure includes a hole, the hole is located at the side wall of the housing structure corresponding to the first acoustic cavity, and the hole connects the first acoustic cavity with the outside; wherein the vibration pickup part generates vibration in response to the external sound signal transmitted through the hole, and the acoustic-to-electric conversion component receives the vibration of the vibration pickup part and generates an electrical signal. A microphone as claimed in claim 1, wherein the vibration transmission part having a tubular structure is provided between the first vibration pickup part and the second vibration pickup part; the vibration transmission part, the first vibration pickup part and the second vibration pickup part form the vacuum cavity, and the first vibration pickup part and the second vibration pickup part are connected to the housing structure through their peripheries; wherein the first vibration pickup part and the second vibration pickup part generate vibration in response to the external sound signal. A microphone as claimed in claim 1, wherein the Young's modulus of the fixing portion is greater than 50 GPa. A microphone as claimed in claim 5, wherein the microphone further comprises a reinforcement member, wherein the reinforcement member is located on the upper surface or the lower surface of the first vibration pickup portion and the second vibration pickup portion corresponding to the vacuum cavity. The microphone of claim 1, wherein the vibration pickup part includes the first vibration pickup part, the second vibration pickup part and the third vibration pickup part, the first vibration pickup part and the second vibration pickup part are arranged opposite to each other in an upper and lower direction, the vibration transmission part having a tubular structure is arranged between the first vibration pickup part and the second vibration pickup part, the vibration transmission part, the first vibration pickup part and the second vibration pickup part form the vacuum cavity; the third vibration pickup part is connected between the vibration transmission part and the inner wall of the housing structure; wherein the third vibration pickup part generates vibration in response to the external sound signal. A microphone as claimed in claim 8, wherein the rigidity of the first vibration pickup part and the second vibration pickup part is greater than the rigidity of the third vibration pickup part, and the Young's modulus of the first vibration pickup part and the second vibration pickup part is greater than 50 GPa.

Images