TWI853486B - Appearance inspection apparatus and processing machine - Google Patents
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Abstract
Description
本發明提供一種可提高電子元件出廠品質及生產效能之外觀檢知裝置。The present invention provides an external inspection device which can improve the quality and production efficiency of electronic components.
在現今,電子元件歷經多道加工製程,例如植錫球製程,以於電子元件之底面植入複數個為錫球之接點;例如測試製程,以對電子元件執行電性測試作業;例如打印製程,以於電子元件之頂面印製型號、廠商資訊等;因此,電子元件於出廠前需執行測試作業、錫球檢知作業及外觀檢知作業等,以淘汰出不良品。Nowadays, electronic components go through multiple processing steps, such as solder ball implantation to implant multiple solder ball contacts on the bottom surface of electronic components; testing process to perform electrical testing on electronic components; printing process to print model numbers, manufacturer information, etc. on the top surface of electronic components; therefore, electronic components need to undergo testing operations, solder ball inspection operations, and appearance inspection operations before leaving the factory to eliminate defective products.
電子元件作業機以移料器吸附電子元件之頂面,令電子元件之錫球朝向下方,並將電子元件移入測試座,使電子元件之錫球電性接觸測試座之探針而執行測試作業,於測試完畢,移料器將電子元件移載至一取像器之上方 ,由於電子元件之錫球朝向下方,使得電子元件行經取像器時,取像器可直接由下向上對電子元件底面之錫球執行錫球檢知作業,以檢知錫球是否脫落。 The electronic component processing machine uses a material transfer device to absorb the top surface of the electronic component, so that the solder ball of the electronic component faces downward, and moves the electronic component into the test socket so that the solder ball of the electronic component electrically contacts the probe of the test socket to perform the test operation. After the test is completed, the material transfer device transfers the electronic component to the top of an image finder. Since the solder ball of the electronic component faces downward, when the electronic component passes through the image finder, the image finder can directly perform a solder ball detection operation on the solder ball on the bottom surface of the electronic component from bottom to top to detect whether the solder ball has fallen off.
惟,移料器吸附於電子元件之頂面,亦即移料器及其上方之驅動機構遮蔽電子元件之頂面的資訊,導致無法檢知電子元件之頂面的打印資訊是否正確或受損,以致無法確保電子元件之出廠品質。However, the material transfer device is adsorbed on the top surface of the electronic component, that is, the material transfer device and the driving mechanism above it shield the information on the top surface of the electronic component, resulting in an inability to detect whether the printed information on the top surface of the electronic component is correct or damaged, and thus the factory quality of the electronic component cannot be ensured.
若將電子元件旋轉翻面,而以移料器吸附電子元件之底面,雖可供取像器取像電子元件之頂面而執行外觀檢知作業,但於出料作業,電子元件的錫球必需朝向下方擺置,導致電子元件取像完畢後,又必需繁瑣將錫球朝上之電子元件再次旋轉翻面,使電子元件之錫球朝向下方,再以移料器吸附電子元件之頂面方可出料,造成增加作業時間及出料不便之問題。If the electronic component is rotated and turned over, and the bottom surface of the electronic component is sucked by the material transfer device, although the imager can take the image of the top surface of the electronic component to perform the appearance inspection operation, the solder ball of the electronic component must be placed facing downward during the unloading operation. As a result, after the electronic component is imaged, the electronic component with the solder ball facing upward must be tediously rotated and turned over again so that the solder ball of the electronic component faces downward, and then the top surface of the electronic component can be sucked by the material transfer device before unloading, resulting in increased operation time and inconvenience in unloading.
本發明之目的一,提供一種外觀檢知裝置,包含承料機構、取像機構及轉載機構,承料機構設置承裝單元及至少一承料叉具,承裝單元以供裝配承料叉具,承料叉具能夠水平承置至少一頂面朝上之電子元件,取像機構設有架置單元及至少一取像器,架置單元以供裝配取像器,取像器能夠取像電子元件之頂面,轉載機構設置轉載驅動單元及至少一轉載叉具,轉載驅動單元驅動該轉載叉具作線性位移及旋轉位移,使轉載叉具於承料叉具取出待檢知之電子元件,並轉載至取像機構之取像器下方,以供取像器對電子元件之頂面執行外觀檢知作業,於取像完畢,轉載叉具將已檢知且頂面朝上之電子元件移載至承料叉具而便利迅速出料,進而提高電子元件出廠品質及生產效能。The first object of the present invention is to provide an appearance detection device, comprising a material receiving mechanism, an imaging mechanism and a transfer mechanism, wherein the material receiving mechanism is provided with a receiving unit and at least one material receiving fork, the receiving unit is used to assemble the material receiving fork, the material receiving fork can horizontally support at least one electronic component with the top surface facing upward, the imaging mechanism is provided with a mounting unit and at least one imager, the mounting unit is used to assemble the imager, the imager can image the top surface of the electronic component, and the transfer mechanism is provided with a transfer drive unit. and at least one transfer fork, the transfer drive unit drives the transfer fork to perform linear displacement and rotational displacement, so that the transfer fork takes out the electronic component to be inspected from the receiving fork and transfers it to the bottom of the imager of the imaging mechanism, so that the imager can perform appearance inspection on the top surface of the electronic component. After the imaging is completed, the transfer fork transfers the inspected electronic component with the top surface facing upward to the receiving fork for convenient and rapid material removal, thereby improving the factory quality and production efficiency of the electronic components.
本發明之目的二,提供一種外觀檢知裝置,其承料機構於承料叉具上配置至少一承盤,承盤以供承置電子元件,轉載叉具可取出且轉載一具電子元件之承盤,進而提高轉載電子元件行程中之平穩性。The second object of the present invention is to provide an appearance detection device, wherein the material receiving mechanism is equipped with at least one tray on the material receiving fork, and the tray is used to receive electronic components. The transfer fork can take out and transfer a tray with electronic components, thereby improving the stability of the transfer process of electronic components.
本發明之目的三,提供一種外觀檢知裝置,其承料機構設有承料驅動器,以供驅動承料叉具作Z方向位移,於轉載叉具位移至承料叉具之上方或下方,承料叉具作Z方向位移而便利將待檢知電子元件置放於轉載叉具,或者於轉載叉具取出已檢知電子元件,進而提高作業便利性。The third object of the present invention is to provide an appearance detection device, wherein the material receiving mechanism is provided with a material receiving driver for driving the material receiving fork to move in the Z direction. When the transfer fork moves to the top or bottom of the material receiving fork, the material receiving fork moves in the Z direction to facilitate placing the electronic components to be detected on the transfer fork, or taking out the detected electronic components from the transfer fork, thereby improving the convenience of operation.
本發明之目的四,提供一種外觀檢知裝置,其取像機構之架置單元設有取像驅動器,以供驅動該取像器作Z方向位移而調整取像高度位置,進而提高外觀檢知作業之品質。The fourth object of the present invention is to provide an appearance inspection device, wherein the mounting unit of the imaging mechanism is provided with an imaging driver for driving the imaging device to move in the Z direction to adjust the imaging height position, thereby improving the quality of the appearance inspection operation.
本發明之目的五,提供一種作業機,包含機台、供料裝置、收料裝置、測試裝置、輸送裝置、本發明外觀檢知裝置及中央控制裝置,供料裝置配置於機台,並設有至少一供料器,以供容置至少一待測電子元件;收料裝置配置於機台,並設有至少一收料器,以供容置至少一已測電子元件;測試裝置配置於機台,並設有至少一測試器,以供測試電子元件;輸送裝置配置於機台 ,並設有至少一輸送器,以供輸送電子元件;本發明外觀檢知裝置配置於機台 ,並設有承料機構、取像機構及轉載機構,以供對電子元件執行外觀檢知作業 ;中央控制裝置以控制及整合各裝置作動而執行自動化作業。 The fifth object of the present invention is to provide a kind of operating machine, including a machine, a feeding device, a receiving device, a testing device, a conveying device, the appearance inspection device of the present invention and a central control device, wherein the feeding device is arranged on the machine and is provided with at least one feeder for accommodating at least one electronic component to be tested; the receiving device is arranged on the machine and is provided with at least one receiving device for accommodating at least one electronic component that has been tested; the testing device is arranged on the machine and is provided with at least one tester for testing electronic components; the conveying device is arranged on the machine , and is provided with at least one conveyor for conveying electronic components; the appearance inspection device of the present invention is arranged on the machine , and is provided with a receiving mechanism, an imaging mechanism and a transfer mechanism for performing appearance inspection operations on electronic components ; the central control device controls and integrates the actions of each device to perform automated operations.
為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如後:In order to enable you to have a further understanding of the present invention, a preferred embodiment is given below with accompanying drawings:
請參閱圖1~4,本發明外觀檢知裝置10包含承料機構、取像機構及轉載機構。Please refer to FIGS. 1 to 4 , the
承料機構包含承裝單元及至少一承料叉具,承裝單元以供裝配承料叉具,承料叉具能夠承置至少一電子元件。The material receiving mechanism comprises a receiving unit and at least one material receiving fork. The receiving unit is used to assemble the material receiving fork, and the material receiving fork can receive at least one electronic component.
依作業需求,承料機構之承料叉具及轉載機構之轉載叉具其中一者相對另一者作第三方向(如Z方向)位移。According to the operation requirements, one of the material receiving fork of the material receiving mechanism and the transfer fork of the transfer mechanism is displaced in a third direction (such as Z direction) relative to the other.
依作業需求,承裝單元可固設承料叉具或者驅動承料叉具作至少第三方向(如Z方向)位移;例如承裝單元設有固定座,以供固設至少一呈水平配置之承料叉具;例如承裝單元設有至少一承料驅動器,以供驅動至少一呈水平配置之承料叉具作第三方向位移;更進一步,承料驅動器可為壓缸、線性馬達或包含馬達及至少一傳動結構。According to the working requirements, the supporting unit can be fixed with a material receiving fork or drive the material receiving fork to move in at least a third direction (such as the Z direction); for example, the supporting unit is provided with a fixed seat for fixing at least one horizontally arranged material receiving fork; for example, the supporting unit is provided with at least one material receiving driver for driving at least one horizontally arranged material receiving fork to move in the third direction; further, the material receiving driver can be a cylinder, a linear motor, or a motor and at least one transmission structure.
依作業需求,承料機構之至少一承料叉具能夠承置至少一可分離式之承盤,承盤以供承置至少一電子元件。According to the operation requirements, at least one material receiving fork of the material receiving mechanism can receive at least one detachable receiving plate, and the receiving plate is used to receive at least one electronic component.
於本實施例,承料機構設置複數個承料驅動器及複數個承料叉具
,複數個承料叉具以供承置複數個電子元件,複數個承料驅動器以供驅動複數個承料叉具作第三方向位移;複數個承料驅動器之設計相同,茲舉一承料驅動器作說明,承料驅動器設有第一馬達11、第一傳動結構及第二傳動結構,第一傳動結構設有一呈第一方向(如X方向)配置之第一螺桿螺座組,第一螺桿螺座組之第一螺桿121由第一馬達11驅動,並帶動第一螺座122沿X方向位移,第一螺座122連結帶動一移動座131同步位移,移動座131連結一呈X方向配置之滑軌組的第一滑座132,第一滑座132沿第一滑軌133作X方向位移,第二傳動結構設有連桿組,連桿組之第一連桿141及第二連桿142的中段部位相互樞接,第一連桿141的一端樞接於移動座131,另一端樞接於承料叉具15之呈Z方向配置的第一裝配部151,第二連桿142的一端樞接於一固定座143,另一端設有滑輪144,滑輪144能夠沿承料叉具15之第一裝配部151開設呈X方向的滑槽152位移,承料叉具15之第一裝配部151連接二支呈水平配置之第一承桿153,以供承置電子元件,二支第一承桿153間形成第一讓位部154。
In this embodiment, the material receiving mechanism is provided with a plurality of material receiving drivers and a plurality of material receiving forks
, a plurality of material receiving forks are used to receive a plurality of electronic components, and a plurality of material receiving drivers are used to drive the plurality of material receiving forks to move in a third direction; the design of the plurality of material receiving drivers is the same, and one material receiving driver is used for illustration, the material receiving driver is provided with a
另於承料叉具15之第一承桿153頂面裝配可分離式之承盤16,承盤16設有容置部161以供承置電子元件;承料機構設有第一定位結構,第一定位結構於承料叉具15與承盤16間設有相互配合之第一定位件及第二定位件,以供定位承盤16;於本實施例,第一定位結構於承料叉具15之第一承桿153設有為定位銷之第一定位件155,於承盤16之底面設有為定位孔之第二定位件162,承盤16之第二定位件162可套合或脫離承料叉具15之第一定位件155。In addition, a
取像機構包含架置單元及至少一取像器,架置單元以供裝配取像器,取像器能夠取像電子元件之頂面;依作業需求,架置單元設有至少一取像驅動器,以供驅動該取像器作至少第三方向位移而調整取像高度位置。The imaging mechanism includes a mounting unit and at least one imaging device. The mounting unit is used to assemble the imaging device, and the imaging device can capture the top surface of the electronic component. According to the operation requirements, the mounting unit is provided with at least one imaging driver to drive the imaging device to move in at least a third direction to adjust the imaging height position.
於本實施例,架置單元設有支撐架17以供裝配取像驅動器18,取像驅動器18可為壓缸、線性馬達或包含馬達及至少一傳動組,取像驅動器18連結且能夠驅動取像器19作Z方向位移而調整取像高度位置,取像器19為CCD,以供由上方朝向下方取像電子元件,並將取像資料傳輸至一處理器(圖未示出),以供分析判別電子元件之頂面外觀是否受損或打印資訊是否正確等。In this embodiment, the mounting unit is provided with a
轉載機構包含轉載驅動單元及至少一轉載叉具,轉載叉具能夠承置電子元件,轉載驅動單元以供驅動轉載叉具於承料叉具15與取像器19之間轉載電子元件,並供取像器19對轉載叉具上之電子元件的頂面執行外觀檢知作業
。更進一步,轉載叉具可承置且轉載至少一具電子元件之承盤16。
The transfer mechanism includes a transfer drive unit and at least one transfer fork. The transfer fork can carry electronic components. The transfer drive unit is used to drive the transfer fork to transfer electronic components between the
依作業需求,轉載機構設有第二定位結構,第二定位結構於轉載叉具與承盤16間設有相互配合之第二定位件及第三定位件,以供定位承盤16。According to the operation requirements, the transfer mechanism is provided with a second positioning structure. The second positioning structure is provided with a second positioning member and a third positioning member that cooperate with each other between the transfer fork and the
依作業需求,轉載驅動單元設有複數個驅動器,以供驅動轉載叉具作複數個方向之線性位移,或者作至少一方向線性位移及水平旋轉位移;例如複數個驅動器以供驅動該轉載叉具作X-Y方向之線性位移;例如複數個驅動器以供驅動該轉載叉具作X-Y方向線性位移及水平旋轉位移。According to the operation requirements, the transfer drive unit is provided with a plurality of drivers for driving the transfer fork to perform linear displacement in a plurality of directions, or to perform linear displacement in at least one direction and horizontal rotation displacement; for example, a plurality of drivers are provided for driving the transfer fork to perform linear displacement in the X-Y direction; for example, a plurality of drivers are provided for driving the transfer fork to perform linear displacement in the X-Y direction and horizontal rotation displacement.
於本實施例,轉載驅動單元之複數個驅動器包含第一驅動器20、第二驅動器21及第三驅動器22,第一驅動器20呈第一方向(如X方向)配置,並設有馬達驅動一呈X方向配置之螺桿螺座組,螺桿螺座組之螺座供裝配第二驅動器21,以帶動第二驅動器21作X方向位移;第二驅動器21呈第二方向(如Y方向)配置,並設有馬達驅動一呈Y方向配置之螺桿螺座組,螺桿螺座組之螺座供裝配第三驅動器22,以帶動第三驅動器22作Y方向位移;第三驅動器22設有馬達驅動齒輪組,齒輪組以供連結且驅動一轉載叉具23作水平旋轉位移,轉載叉具23以第二裝配部231連結第三驅動器22,並設有複數支呈水平配置之第二承桿232,以供承置一具電子元件之承盤16,複數支第二承桿232之間形成第二讓位部233,轉載叉具23之複數支第二承桿232與承料叉具15之複數支第一承桿153相互錯位,使得承料叉具15之第一承桿153相對於轉載叉具23之第二讓位部233,以及承料叉具15之之第一讓位部154相對轉載叉具23之第二承桿232;第二定位結構於複數支第二承桿232之頂面設有複數個為定位銷之第三定位件234,以供承盤16之第二定位件162套合或脫離轉載叉具23之第三定位件234;因此轉載機構以第一驅動器20、第二驅動器21及第三驅動器22驅動該轉載叉具23作X-Y方向線性位移及水平旋轉位移,使轉載叉具23能夠於承料叉具15與取像器19之間轉載電子元件,並供取像器19對電子元件之頂面執行外觀檢知作業。In this embodiment, the plurality of drivers of the transfer drive unit include a
請參閱圖5~9,本發明電子元件作業機包含機台30、供料裝置40
、收料裝置50、測試裝置60、輸送裝置70、本發明外觀檢知裝置10及中央控制裝置(圖未示出);中央控制裝置以控制及整合各裝置作動而執行自動化作業
;供料裝置40裝配於機台30,並設有至少一供料器41,以供容納至少一待測之電子元件;收料裝置50裝配於機台30,並設有至少一收料器51,以供容納至少一已測之電子元件;測試裝置60配置於機台30,並設有至少一測試器,以供測試電子元件;於本實施例,測試器設有電性連接之電路板61及具傳輸件(如探針)之測試座62,測試座62以供承置及測試電子元件;輸送裝置70裝配於機台30,並設有至少一輸送器,以輸送電子元件,於本實施例,輸送裝置70設有第一輸送器71,以於供料裝置40之供料器41取出待測之電子元件,並將待測電子元件移載第二輸送器72,第二輸送器72將待測之電子元件載送至測試裝置60之一方;輸送裝置70以第三輸送器73將第二輸送器72內之待測電子元件移載至測試座62而執行測試作業,以及將已測電子元件移載至第四輸送器74,第四輸送器74載出已測之電子元件,輸送裝置70以第五輸送器75於第四輸送器74取出已測之電子元件,並移載至本發明之外觀檢知裝置10而執行電子元件頂面之外觀檢知作業,第五輸送器75依據測試及外觀檢知之結果,將已測之電子元件輸送至收料裝置50之收料器51處而分類收置。
Please refer to Figures 5 to 9. The electronic component processing machine of the present invention includes a
依作業需求,輸送裝置70之第三輸送器73更包含溫控單元(圖未示出),溫控單元於第三輸送器73設置至少一溫控件,以供溫控電子元件;更進一步,溫控件可為加熱件、致冷晶片或具流體之座體。According to the operation requirements, the
然,測試裝置60於執行下一批次電子元件的測試作業時,第五輸送器75將已測電子元件81移入外觀檢知裝置10之承料機構的一承盤16,承料機構以第一馬達11驅動第一螺桿121,第一螺桿121帶動第一螺座122沿X方向位移
,第一螺座122傳動該移動座131同步位移,移動座131推動第一連桿141的一端朝向第二連桿142之一端靠近,由於第一連桿141及第二連桿142相互樞接,而可使第二連桿142另一端之滑輪144沿承料叉具15之滑槽152位移,且朝向第一連桿141之另一端靠近,使第一連桿141及第二連桿142頂撐承料叉具15及具電子元件81之承盤16作Z方向向上位移。
However, when the
承料叉具15的高度位置高於轉載叉具23之高度位置,轉載機構以第一驅動器20及第二驅動器21帶動轉載叉具23作X-Y方向線性位移,使轉載叉具23位於承料叉具15之下方;由於承料叉具15之二支第一承桿153間形成第一讓位部154,以及轉載叉具23之複數支第二承桿232間形成第二讓位部233,承料機構之第一馬達11經第一螺桿121及第一螺座122以驅動移動座131作X方向反向位移,移動座131經由第一連桿141及第二連桿142帶動承料叉具15、承盤16及電子元件81作Z方向向下位移,令承料叉具15之第一承桿153通過轉載叉具23之第二讓位部233,並將一具電子元件81之承盤16置放於轉載叉具23之第二承桿232上
,使轉載叉具23承載一具電子元件81之承盤16。
The height position of the
轉載機構以第一驅動器20及第二驅動器21帶動轉載叉具23作X-Y方向反向位移,使轉載叉具23承載一具電子元件81之承盤16退出承料叉具15之下方,轉載機構再以第三驅動器22驅動轉載叉具23承載該承盤16作水平旋轉位移,將一具電子元件81之承盤16載送至取像機構之取像器19下方,由於承盤16內之電子元件81的頂面朝向上方且未被遮蔽,在取像機構之取像驅動器18已事先調整好取像器19之取像高度位置下,取像器19可直接取像電子元件81之頂面而執行外觀檢知作業,並將取像資訊傳輸至一處理器(圖未示出),處理器作分析判別電子元件81之頂面是否受損及打印資訊是否正確等,進而提高電子元件之出廠品質。The transfer mechanism drives the
於完成電子元件81之頂面的外觀檢知作業,轉載機構以第一驅動器20、第二驅動器21及第三驅動器22驅動轉載叉具23承載一具電子元件81之承盤16作X-Y方向位移及水平旋轉位移,將一具電子元件81之承盤16置放於承料機構之承料叉具15,由於電子元件81之錫球朝向下方,而供第五輸送器75直接將承盤16內之電子元件81移載至收料裝置50收料,進而縮短出料作業時間,以提高生產效能。After completing the appearance inspection of the top surface of the
然,在轉載機構載送一具電子元件81之承盤16執行外觀檢知作業時,承料機構之另一承盤16A已承置下一待檢知之電子元件82,使得轉載叉具23迅速於另一承料叉具15A接續承載下一具電子元件82之承盤16A,進而提高生產效能。However, when the transfer mechanism carries a
10:外觀檢知裝置10: Appearance detection device
11:第一馬達11: First Motor
121:第一螺桿121: First screw
122:第一螺座122: First screw seat
131:移動座131: Mobile seat
132:第一滑座132: First slide
133:第一滑軌133: First track
141:第一連桿141: First Link
142:第二連桿142: Second Link
143:固定座143: Fixed seat
144:滑輪144:Pulley
15、15A:承料叉具15, 15A: Material receiving fork
151:第一裝配部151: First assembly section
152:滑槽152: Chute
153:第一承桿153: First bearing rod
154:第一讓位部154: First yielding position
155:第一定位件155: first positioning member
16、16A:承盤16, 16A: receiving plate
161:容置部161: Accommodation
162:第二定位件162: Second positioning member
17:支撐架17: Support frame
18:取像驅動器18: Image acquisition drive
19:取像器19: Imager
20:第一驅動器20: First drive
21:第二驅動器21: Second drive
22:第三驅動器22: Third drive
23:轉載叉具23: Transfer fork
231:第二裝配部231: Second assembly section
232:第二承桿232: Second support rod
233:第二讓位部233: Second yielding part
234:第三定位件234: Third positioning member
30:機台30: Machine
40:供料裝置40: Feeding device
41:供料器41: Feeder
50:收料裝置50: Material receiving device
51:收料器51: Receiver
60:測試裝置60:Testing equipment
61:電路板61: Circuit board
62:測試座62: Test seat
70:輸送裝置70: Transport device
71:第一輸送器71: First conveyor
72:第二輸送器72: Second conveyor
73:第三輸送器73: The third conveyor
74:第四輸送器74: The fourth conveyor
75:第五輸送器75: The fifth conveyor
81、82:電子元件81, 82: Electronic components
圖1:本發明外觀檢知裝置之俯視圖。 圖2:本發明外觀檢知裝置之後視圖。 圖3:係圖2之承裝單元之示意圖。 圖4:本發明外觀檢知裝置之側視圖。 圖5:本發明外觀檢知裝置應用於作業機之示意圖。 圖6至圖9:本發明外觀檢知裝置之使用示意圖。 Figure 1: A top view of the appearance detection device of the present invention. Figure 2: A rear view of the appearance detection device of the present invention. Figure 3: A schematic diagram of the housing unit of Figure 2. Figure 4: A side view of the appearance detection device of the present invention. Figure 5: A schematic diagram of the appearance detection device of the present invention applied to a working machine. Figures 6 to 9: Schematic diagrams of the use of the appearance detection device of the present invention.
10:外觀檢知裝置 10: Appearance detection device
11:第一馬達 11: First Motor
15:承料叉具 15: Material receiving fork
153:第一承桿 153: First bearing rod
154:第一讓位部 154: First yielding position
155:第一定位件 155: First positioning member
16:承盤 16: Acceptance
161:容置部 161: Accommodation section
162:第二定位件 162: Second positioning member
17:支撐架 17: Support frame
18:取像驅動器 18: Image acquisition drive
19:取像器 19: Imager
20:第一驅動器 20: First drive
21:第二驅動器 21: Second drive
22:第三驅動器 22: Third drive
23:轉載叉具 23: Transfer fork
231:第二裝配部 231: Second assembly section
232:第二承桿 232: Second support rod
233:第二讓位部 233: Second yielding section
234:第三定位件 234: The third positioning piece
Claims (6)
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| TW112108702A TWI853486B (en) | 2023-03-09 | 2023-03-09 | Appearance inspection apparatus and processing machine |
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| US6515494B1 (en) * | 2000-07-17 | 2003-02-04 | Infrared Laboratories, Inc. | Silicon wafer probe station using back-side imaging |
| US20020130654A1 (en) * | 2001-03-19 | 2002-09-19 | Juki Corporation | Method and apparatus for automatically testing semiconductor device |
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