TWI868507B - Processing system - Google Patents

Abstract

Provide a processing system that can process multiple workpieces with high precision and efficiency.

The processing system 1 for sequentially performing pre-grinding and fine grinding on the workpieces W1 and W2 comprises: a dividing table 2, which is provided with a chuck 3 for holding the workpieces W1 and W2 in a rotatable manner, so that the workpieces W1 and W2 move in the order of a rough grinding table ST2, a medium grinding table ST3, a fine grinding table ST4 and a calibration table; a tilting mechanism 33, which can adjust the tilt of the chuck 3; a swing sensor 72, which measures the workpiece before fine grinding. The shape of the workpieces W1 and W2; the fixed sensor 8 measures the shape of the workpiece W1 after fine grinding while the workpiece W1 after fine grinding is being transported to the correction table; and the control device 9 controls the inclination, i.e. the inclination angle, of the chuck 3 during fine grinding according to the shapes of the workpieces W1 and W2 before fine grinding, and compensates the inclination angle during fine grinding of the workpiece W2 according to the shape of the workpiece W1 after fine grinding.

Description

Processing system

The present invention relates to a processing system for continuously grinding multiple workpieces.

In the field of semiconductor manufacturing, in terms of grinding a semiconductor wafer such as a silicon wafer (hereinafter referred to as a "workpiece") to be thin and flat, a grinding device is known that grinds the workpiece by pushing the grinding surface of a rotating grinding wheel against the workpiece.

Patent document 1 discloses a grinding device for processing a workpiece in the order of rough grinding, fine grinding and grinding. The device discloses that a swinging thickness sensor in the grinding table measures the shape of the workpiece after grinding, and when the shape of the workpiece after grinding is not the desired shape, the tilt amount of the tilt mechanism is adjusted when the workpiece to be processed is finely ground.

[Prior Art Literature]

[Patent Literature]

[Patent Document 1] Japanese Patent Publication No. 2015-79457

In the grinding processing device described in Patent Document 1, when measuring the shape of the workpiece after processing, the thickness sensor needs to scan the workpiece after processing after the grinding pad retreats, so there is a problem of deterioration in throughput when processing multiple workpieces continuously.

Therefore, in order to process multiple workpieces with high precision and efficiency, a technical problem that needs to be solved has arisen, and the purpose of this invention is to solve this problem.

To achieve the above-mentioned purpose, the processing system of the present invention sequentially performs pre-grinding and fine grinding on the workpiece. The processing system comprises: a dividing table having a chuck that can hold the workpiece and rotate, so that the workpiece moves at least in the order of a pre-grinding table, a fine grinding table and a correction table; a tilting mechanism that can adjust the tilt of the chuck; a first sensor that measures the shape of the workpiece before fine grinding; ; a second sensor, which measures the shape of the workpiece after fine grinding while the workpiece after fine grinding is being transported to the correction table; and a control device, which controls the tilt, i.e., the tilt angle, of the chuck during fine grinding according to the shape of the workpiece before fine grinding, and compensates for the tilt angle when fine grinding the next workpiece according to the shape of the workpiece after fine grinding.

The present invention can process multiple workpieces with high precision and efficiency.

1: Processing system

1a: Rack

2: Indexing table

2a: Rotation axis

3: Clamp

3a: Rotation axis

31: Rotating table

32: Adsorbent

33: Tilt mechanism

34: Tilt platform

35: Fixed support part

36: 1st movable support part

37: Second movable support unit

41: Arm 1

42: 1st rack

43: Second Arm

44: 2nd rack

5: Rough grinding device

51: Rough grinding wheel

52: 1st main axis

53: 1st spindle feed mechanism

6: Middle grinding device

61: Second main axis

62: Second spindle feed mechanism

7: Fine grinding device

71: Fine grinding wheel

72: Oscillating sensor

73: Arm

74:Sensor head

75: Drive shaft

8: Fixed sensor

9: Control device

D: Rotation direction

O: Center

P1: Peripheral position

R: Rotating track

ST1: Calibration table

ST2: Rough grinding table

ST3: Middle grinding table

ST4: Fine grinding table

W: Workpiece

W1: Workpiece

W2: Workpiece

[Figure 1] is a plan view showing a processing system of an embodiment of the present invention.

[Figure 2] is a plan view showing the positional relationship between the chuck, swing-type thickness sensor, and tilt mechanism.

[Figure 3] is a schematic diagram showing the installation location of the fixed thickness sensor.

[Figure 4] is a schematic diagram showing the positional relationship of the measuring points of the fixed thickness sensor on the workpiece.

[Figure 5] is a schematic diagram showing the processing sequence for the first workpiece.

[Figure 6] is a graph showing the shape of the outer periphery of the first workpiece before and after fine grinding.

[Figure 7] is a table showing the lifting amount of each movable support part during the fine grinding of each workpiece.

[Figure 8] is a schematic diagram showing the processing sequence for the second workpiece.

[Figure 9] is a graph showing the shape of the outer periphery of the second workpiece before and after fine grinding.

An embodiment of the present invention is described based on the drawings. In addition, in the following, when referring to the number, value, amount, range, etc. of the constituent elements, unless otherwise specifically stated or clearly limited to a specific number in principle, it is not limited to the specific number and can be greater than or less than the specific number.

Furthermore, when referring to the shape or positional relationship of constituent elements, unless otherwise specifically stated or it is considered to be obviously not the case in principle, the term substantially includes those that are similar or similar to the shape, etc.

In addition, in order to make the features easier to understand, the drawings may exaggerate the features by enlarging them, and the size ratios of the components may not be the same as the actual ones. In addition, in order to make the cross-sectional structure of the components easier to understand, the cross-sectional drawings may omit the hatching of some components.

FIG1 is a plan view showing the basic structure of the processing system 1. The processing system 1 continuously performs multiple grinding processes on the workpiece W. In addition, the processing system 1 can also perform only grinding or polishing, or can perform polishing after grinding.

In the processing system 1, there are four stations, namely, the correction station ST1, the rough grinding station ST2, the intermediate grinding station ST3 and the fine grinding station ST4. In addition, the number of stations (front grinding stations) that sequentially process the workpiece W on the upstream side of the fine grinding station ST4 is not limited to two stations, namely, the rough grinding station ST2 and the intermediate grinding station ST3, but may be one or more than three.

The processing system 1 has a dividing table 2 that can rotate around a rotating axis 2a, and four chucks 3 that are arranged at equal intervals on a concentric circle with the rotating axis 2a of the dividing table 2 as the center. Through the rotation of the dividing table 2, the chuck 3 can move in the order of the correction table ST1, the rough grinding table ST2, the intermediate grinding table ST3, and the fine grinding table ST4.

The chuck 3 is an adsorbent 32 made of a porous material such as alumina buried on the top of the rotating table 31. The surface (adsorption surface) of each adsorbent 32 of the four chucks 3 is formed the same by self-grinding before processing. The chuck 3 has an unillustrated pipeline extending on the surface through the interior. The pipeline is connected to a vacuum source, a compressed air source or a water supply source through an unillustrated rotating joint. When the vacuum source is started, the workpiece W placed on the chuck 3 is adsorbed and held on the chuck 3. In addition, when the compressed air source or the water supply source is started, the adsorption of the workpiece W and the chuck 3 is released.

The turntable 31 is connected to a chuck spindle (not shown). The chuck spindle is configured to be rotatably driven around a rotation axis perpendicular to the turntable 31.

As shown in FIG. 2 , the chuck 3 is supported by a tilting mechanism 33 that can tilt the rotation axis 3a (vertical axis passing through the center O of the workpiece W) of the chuck 3. The tilting mechanism 33 includes a tilting table 34, a fixed support portion 35, a first movable support portion 36, and a second movable support portion 37.

The tilting table 34 is roughly triangular in shape when viewed from above. The tilting table 34 is disposed between the indexing table 2 and the chuck 3 to support the rotary table 31.

The fixed support part 35, the first movable support part 36 and the second movable support part 37 are arranged on the tilting table 34 at equal intervals and separately on a concentric circle centered on the rotation axis 3a of the chuck 3. The fixed support part 35 is a bolt that connects the indexing table 2 and the tilting table 34.

The first movable support part 36 is arranged on the upstream side of the rotation direction D of the chuck 3 relative to the fixed support part 35. In addition, the second movable support part 37 is arranged on the downstream side of the rotation direction D of the chuck 3 relative to the fixed support part 35. The first movable support part 36 and the second movable support part 37 are respectively configured to rotate the ball screw arranged along the lead vertical direction between the indexing table 2 and the tilting table 34 by a motor, so that the tilting table 34 can independently raise and lower the indexing table 2.

Returning to Figure 1, on the calibration table ST1, the first arm 41 takes out the workpiece W from the first rack 42 that holds the workpiece W before processing, and transports it to the chuck 3 located in the calibration table ST1. The workpiece W is set out in advance so that its orientation is consistent with a predetermined direction. In addition, the second arm 43 takes the processed workpiece W from the chuck 3 located in the calibration table ST1, and transports it to the second rack 44 for accommodating the processed workpiece W.

A rough grinding device 5 is provided on the rough grinding station ST2. The rough grinding device 5 has a rough grinding wheel 51 described later, a first spindle 52 on which the rough grinding wheel 51 is mounted at the lower end and supports the rough grinding wheel 51 rotatably, and a first spindle feed mechanism 53 that raises and lowers the first spindle 52 in the vertical direction. For example, a #8000 cup-shaped grinding wheel is used for the rough grinding wheel 51. In addition, a thickness sensor (not shown) is provided in the rough grinding device 5 for measuring the thickness of the workpiece W during the rough grinding process.

The middle grinding table ST3 is provided with a middle grinding device 6. The middle grinding device 6 has a middle grinding wheel (not shown), a second spindle 61 on which the middle grinding wheel is mounted at the lower end and supports the middle grinding wheel so as to be rotatable, and a second spindle feed mechanism 62 that raises and lowers the second spindle 61 in the vertical direction. For example, a #8000 cup-shaped grinding wheel is used as the middle grinding wheel. In addition, the middle grinding device 6 is provided with a thickness sensor (not shown) for measuring the thickness of the workpiece W during the middle grinding process.

A finishing grinding device 7 is provided on the finishing grinding table ST4. The finishing grinding device 7 has a finishing grinding wheel 71, a third spindle (not shown) on which the finishing grinding wheel 71 is mounted at the lower end and supports the finishing grinding wheel 71 so as to be rotatable around a rotation axis set along the lead straight direction, and a third spindle feed mechanism (not shown) that raises and lowers the third spindle along the lead straight direction. The finishing grinding wheel 71 is, for example, a #8000 cup-shaped grinding wheel. In addition, a thickness sensor (not shown) is provided in the finishing grinding device 7 for measuring the thickness of the workpiece W during the finishing grinding process.

A swinging thickness sensor 72 is provided on the finishing grinding table ST4. The swinging sensor 72 measures the thickness (film thickness) of the workpiece W before finishing grinding and measures its shape. The swinging sensor 72 is an optical sensor that can detect film thickness in a non-contact manner. As shown in FIG2 , a sensing head 74 is installed at the tip of an arm 73, and the base end of the arm 73 is connected to a drive shaft 75 outside the indexing table 2. The arm 73 can swing along the horizontal plane with the drive shaft 75 as a fulcrum, and the sensing head 74 is configured to be movable from the peripheral position P1 of the workpiece W to a position overlapping with the center O of the workpiece W.

Returning to FIG. 1 , a fixed thickness sensor 8 is provided in the processing system 1. The fixed sensor 8 measures the thickness (film thickness) of the workpiece W after fine grinding in a non-contact manner and measures its shape. The fixed sensor 8 is, for example, a spectroscopic interferometer film thickness measuring device. The fixed sensor 8 is provided one each on the upstream and downstream sides of the correction table ST1 in the rotation direction of the indexing table 2. This is because when the processed workpiece W is transported from the fine grinding table ST4 to the correction table ST1, in relation to the rotation mechanism of the indexing table 2, there are situations where the indexing table 2 rotates clockwise and counterclockwise on the paper of FIG. 1. In order to correspond to each rotation direction of the indexing table 2, one fixed sensor 8 is provided on the upstream and downstream sides of the correction table ST1.

As shown in FIG3 , the fixed sensor 8 is fixed to the frame 1a installed in the processing system 1 and is set above the indexing table 2. The measuring point of the fixed sensor 8 for measuring the thickness of the workpiece W is set on the rotating track R of the center O of the workpiece W when viewed from above. In addition, FIG3 only illustrates the fixed sensor 8 set between the calibration table ST1 and the fine grinding table ST4, and omits the fixed sensor 8 set between the calibration table ST1 and the rough grinding table ST2.

FIG4 is a schematic diagram showing the positional relationship of the measuring point of the fixed sensor 8 on the workpiece W. In addition, FIG4 shows the positional relationship of the measuring point of the fixed sensor 8 when the rotation speed of the indexing table 2 is set to 20 deg/sec, the rotation speed of the chuck 3 is set to 400 rpm, and the sampling period of the fixed sensor 8 is set to 4 milliseconds. Because the workpiece W passes while rotating directly under the fixed sensor 8, the trajectory of the measuring point of the fixed sensor 8 is the entire surface of the workpiece W including the center O of the workpiece W. In addition, the trajectory of the measuring point of the fixed sensor 8 can be appropriately changed according to the rotation speed of the indexing table 2, the rotation speed of the chuck 3, and the sampling period of the fixed sensor 8.

In addition, if the fixed sensor 8 can measure the thickness of the workpiece W while the processed workpiece W is being transported from the fine grinding table ST4 to the correction table ST1, it is not limited to being arranged on the upstream side and downstream side of the correction table ST1. For example, it can also be arranged on the upstream side and downstream side of the fine grinding table ST4, respectively.

The operation of the processing system 1 is controlled by the control device 9. The control device 9 controls the components of the processing device 1 respectively. The control device 9 is composed of, for example, a CPU, a memory, etc. In addition, the function of the control device 9 can be realized by using software for control, or by using hardware and actuation.

The control device 9 drives the tilt mechanism 33 to tilt the rotating shaft 3a of the chuck 3 relative to the rotating shaft of the finishing grinding wheel 71 in accordance with the thickness of the workpiece W before finishing grinding measured by the swing sensor 72 so that the workpiece W after finishing grinding is approximately consistent with the desired shape. Hereinafter, the angle of the rotating shaft 3a of the chuck 3 relative to the rotating shaft of the finishing grinding wheel 71 is referred to as the "tilt angle".

Next, the procedure for processing two pieces of workpieces W into a roughly flat state is described. In the following, the two pieces of workpieces W are distinguished by the symbols W1 and W2. In addition, the target shape of the workpiece W is not limited to a roughly flat one.

<1st piece of workpiece>

On the correction table ST1, the first arm 41 takes the workpiece W1 out of the first rack 42 and transfers it to the chuck 3. Then, when the vacuum source is started, negative pressure is supplied between the workpiece W1 and the chuck 3, and the workpiece W1 is adsorbed and held on the chuck 3.

Next, the indexing table 2 rotates and the chuck 3 moves toward the rough grinding table ST2.

The chuck 3 moves to the rough grinding station ST2 to perform rough grinding on the workpiece W1. During the rough grinding, as shown in FIG5(a), the grinding surface of the rough grinding wheel 51 is pushed against the workpiece W1 while the rough grinding wheel 51 and the chuck 3 are rotated respectively to perform rough grinding of the workpiece W1. When the workpiece W1 reaches the desired thickness, as shown in FIG5(b), the rough grinding device 5 stops the rotation of the rough grinding wheel 51 and the chuck 3, and makes the rough grinding wheel 51 retreat upward to end the rough grinding.

Next, the indexing table 2 rotates, and the chuck 3 moves toward the middle grinding table ST3. The workpiece W1 is subjected to middle grinding at the middle grinding table ST3. During the middle grinding, the grinding surface of the middle grinding wheel is pushed against the workpiece W1 while the middle grinding wheel and the chuck 3 are rotated respectively to perform middle grinding of the workpiece W1. When the workpiece W reaches the desired thickness, the middle grinding device 6 stops the rotation of the middle grinding wheel and the chuck 3, and causes the middle grinding wheel to retreat upward, thereby completing the middle grinding.

Next, the indexing table 2 rotates and the chuck 3 moves toward the finishing grinding table ST4. Then, the arm 73 swings with the drive shaft 75 as a fulcrum, and as shown in Figure 5(c), the sensor head 74 scans from the peripheral position P1 of the workpiece W to the position overlapping with the center O of the workpiece W1. In this way, the shape of the workpiece W1 before finishing grinding is measured. Figure 6 Shows the shape of the first piece of workpiece W before finishing grinding.

Next, as shown in FIG5(d), the rotating shaft 3a of the chuck 3 is tilted according to the shape of the workpiece W1 before fine grinding.

Specifically, the control device 9 invokes the grinding amount of the workpiece W1 during the fine grinding and the tilt angle for achieving the grinding amount, which is consistent with the difference between the shape of the workpiece W1 before fine grinding and the target shape of the workpiece W1 after grinding measured by the swing sensor 72. Then, the control device 9 invokes the lifting amounts of the first movable support part 36 and the second movable support part 37 corresponding to the tilt angle, and lifts the first movable support part 36 and the second movable support part 37 respectively. In this way, the tilting table 34 tilts the rotating axis 3a of the chuck 3 relative to the rotating axis of the fine grinding wheel 71 based on the fixed support part 35.

The control device 9 pre-stores the relationship between the grinding amount and the tilt angle of the workpiece W1 during fine grinding, and the lifting amounts of the first movable support part 36 and the second movable support part 37 to achieve the tilt angle, obtained through experiments, etc. FIG7 (a) shows the lifting amounts of the first movable support part 36 and the second movable support part 37 in the first piece of workpiece W1 before fine grinding. In addition, the lifting amount is positive (+) corresponding to the lifting amount, and negative (-) corresponding to the lowering amount. That is, FIG7 (a) is an example of the case where the first movable support part 36 is lifted by 3μm and the second movable support part 37 is lowered by 1.5μm.

Next, as shown in FIG. 5(e), the workpiece W1 is subjected to fine grinding. Specifically, during the fine grinding, the grinding surface of the fine grinding wheel 71 is pushed against the workpiece W1 while the fine grinding wheel 71 and the chuck 3 are rotated respectively to perform fine grinding of the workpiece W1. When the workpiece W reaches the desired thickness, the fine grinding device 7 stops the rotation of the fine grinding wheel 71 and the chuck 3, and causes the fine grinding wheel 71 to retreat upward, thereby completing the fine grinding.

Next, when the indexing table 2 rotates, the chuck 3 moves toward the correction table ST1, and the adsorption between the workpiece W1 and the chuck 3 is released, the second arm 43 takes the workpiece W1 out of the chuck 3 and transfers it to the second rack 44.

Here, while the indexing table 2 rotates and the chuck 3 moves toward the calibration table ST1, as shown in FIG5(f), the fixed sensor 8 measures the film thickness of the workpiece W1 at multiple measuring points on the entire surface of the workpiece W, and measures the shape of the workpiece W1. The measuring points of the fixed sensor 8 on the workpiece W1 are set to 200 points, for example. When viewed from above, the measuring points of the fixed sensor 8 are set on the rotation track R of the center O of the chuck 3. In this way, the fixed sensor 8 can measure the film thickness and shape of the workpiece W1 without reducing the processing throughput of the grinding process of the workpiece W1 while the workpiece W1 rotates around the rotation axis 3a and the workpiece W1 returns to the calibration table ST1. FIG6 shows the shape of the workpiece W after the first piece is finely ground.

Next, the control device 9 compares the shape of the workpiece W1 after fine grinding measured by the fixed sensor 8 with the desired target shape. When the shape of the workpiece W1 after fine grinding is inconsistent with the desired target shape, the compensation angle to be added to the tilt angle during fine grinding is memorized in a manner consistent with the difference between the shape of the workpiece W1 after fine grinding and the desired target shape. In addition, the control device 9 pre-memorizes the relationship between the difference between the shape of the workpiece W1 after fine grinding and the desired target shape obtained by experiments, etc., and the compensation angle to mitigate the difference, as well as the lifting amounts (compensation lifting amounts) of the first movable support part 36 and the second movable support part 37 that realize the compensation angle of the tilt mechanism 33.

According to FIG6, the shape of the workpiece W1 after fine grinding is concave and partially thinner by about 2μm in the outer periphery (the part surrounded by the dotted ellipse in the figure) compared to the roughly flat target shape. Therefore, the control device 9 calls a compensation angle so that the outer periphery of the workpiece W1 will become thicker by about 2μm, and calls a compensation lift amount corresponding to the compensation angle to lower the first movable support part 36 by 0.3μm and the second movable support part 37 by 0.2μm, as shown in FIG7(b). In addition, when the shape of the workpiece W1 after fine grinding is consistent with the desired target shape, the compensation angle and the compensation lift amount are both zero.

<Workpiece of the second piece>

Next, the first workpiece W1 is subjected to rough grinding, and similarly to the intermediate grinding, the second workpiece W2 is subjected to rough grinding and intermediate grinding. Afterwards, the indexing table 2 rotates, and the chuck 3 moves toward the fine grinding table ST4.

In the fine grinding table ST4, first, the arm 73 swings on the horizontal plane with the drive shaft 75 as a fulcrum, and as shown in Figure 8 (a), the sensor head 74 scans from the peripheral position P1 of the workpiece W2 to the position overlapping with the center O of the workpiece W. In this way, the shape of the workpiece W2 before fine grinding is measured. Figure 9 shows the shape of the second workpiece W before fine grinding. In addition, because the suction surfaces of each chuck 3 are formed the same by self-grinding before processing, it is assumed that the second workpiece W2 shown in Figure 9 is roughly the same shape as the first workpiece W1.

Next, as shown in FIG8(b), the chuck 3 is tilted according to the tilt angle corresponding to the shape of the workpiece W2 before fine grinding and the compensation angle calculated from the processing result of the first workpiece W1.

Specifically, the control device 9 calls the grinding amount of the workpiece W2 during the fine grinding and the tilt angle of the tilt mechanism 33 for achieving the grinding amount, which is consistent with the difference between the shape of the workpiece W2 before fine grinding and the target shape of the workpiece W2 after grinding measured by the swing sensor 72. Then, the control device 9 calculates the lifting amount of the first movable support part 36 and the second movable support part 37 according to the called tilt angle.

Furthermore, the control device 9 calls the compensation lifting amounts of the first movable support portion 36 and the second movable support portion 37 corresponding to the compensation angle obtained by the processing result of the first workpiece W1. Then, the control device 9 adds the compensation lifting amount to the lifting amount of the first movable support portion 36 and the second movable support portion 37 to calculate the lifting amount after compensation. Then, the first movable support portion 36 and the second movable support portion 37 are lifted and lowered in accordance with the lifting amount after compensation. In this way, the tilting table 34 tilts the rotation axis 3a of the chuck 3 relative to the rotation axis of the fine grinding wheel 71 with the fixed support portion 35 as the reference. FIG7(c) shows the compensation lifting amounts of the first movable support part 36 and the second movable support part 37 in the second workpiece W2 before fine grinding. Specifically, the compensation lifting amount of FIG7(c) is the lifting amount of FIG7(a) plus the compensation lifting amount of FIG7(b), which means that the first movable support part 36 is lifted by 2.7μm and the second movable support part 37 is lowered by 1.7μm.

Next, as shown in FIG8(c), the workpiece W2 is subjected to fine grinding. Specifically, during the fine grinding, the grinding surface of the fine grinding wheel 71 is pushed against the workpiece W2 while the fine grinding wheel 71 and the chuck 3 are rotated respectively to perform fine grinding of the workpiece W1. When the workpiece W reaches the desired thickness, the fine grinding device 7 stops the rotation of the fine grinding wheel 71 and the chuck 3, and causes the fine grinding wheel 71 to retreat upward, thereby completing the fine grinding.

Next, when the indexing table 2 rotates, the chuck 3 moves toward the correction table ST1, and the adsorption between the workpiece W2 and the chuck 3 is released, the second arm 43 takes the workpiece W2 out of the chuck 3 and transfers it to the second rack 44.

Here, when the indexing table 2 rotates and the chuck 3 moves toward the correction table ST1, as shown in Figure 8(d), the fixed sensor 8 measures the film thickness of the workpiece W2 at multiple measuring points on the entire surface of the workpiece W2, and measures the shape of the workpiece W2. Figure 9 shows the shape of the second piece of workpiece W2 after fine grinding. According to Figure 9, the shape of the workpiece W1 after fine grinding is roughly consistent with the roughly flat target shape.

In addition, for the workpiece W after the third piece, the compensation angle obtained from the finishing grinding result of the first piece of workpiece W1 can also be applied, and the compensation angle obtained from the finishing grinding result of the previous workpiece W can also be applied. In the latter case, the bevel angle can be appropriately updated by considering the wear of the finishing grinding wheel 71.

Thus, the processing system 1 of the present invention performs pre-grinding and finish grinding on the workpieces W1 and W2 in sequence. The processing system 1 is composed of: a dividing table 2, which has a chuck 3 that holds the workpieces W1 and W2 in a rotatable manner, so that the workpieces W1 and W2 move in the order of the rough grinding table ST2, the intermediate grinding table ST3, the finish grinding table ST4 and the correction table ST1; a tilting mechanism 33 that can adjust the tilt of the chuck 3; a swing sensor 72, The shapes of the workpieces W1 and W2 before fine grinding are measured; the fixed sensor 8 measures the shape of the workpiece W1 after fine grinding while the workpiece W1 after fine grinding is being transported toward the correction table ST1; the control device 9 controls the inclination, i.e. the inclination angle, of the chuck 3 during fine grinding according to the shapes of the workpieces W1 and W2 before fine grinding, and compensates the inclination angle during fine grinding of the workpiece W2 according to the shape of the workpiece W1 after fine grinding.

According to this configuration, the fixed sensor 8 quickly measures the shape of the first workpiece W1 after fine grinding, and the control device 9 calculates the compensation angle during fine grinding in a manner that can process the shape of the workpiece W1 after fine grinding into the desired target shape. The second workpiece W2 is fine ground in a state where the compensation angle corresponding to the fine grinding result of the first workpiece W1 is added to the tilt angle calculated from the shape of the second workpiece W2 before fine grinding, so that the workpiece W2 can be processed efficiently and with high precision.

Furthermore, the processing system 1 of the present invention is configured such that the control device 9 calculates the tilt angle according to the shape of the workpiece W1 before fine grinding so that the shape of the workpiece W1 after fine grinding is approximately consistent with the target shape of the workpiece W1, and calculates the tilt angle according to the shape of the workpiece W2 before fine grinding so that the shape of the workpiece W2 after fine grinding is approximately consistent with the target shape of the workpiece W2.

According to this structure, the workpieces W1 and W2 after fine grinding can be processed into the desired target shape with high accuracy.

Furthermore, the machining system 1 of the present invention is configured such that the control device 9 calculates the compensation angle according to the shape of the workpiece W1 after fine grinding so that the shape of the workpiece W1 after fine grinding is approximately consistent with the target shape of the workpiece W1.

According to this structure, the compensation angle during the finish grinding of the workpiece W2 is set according to the grinding amount of the finish grinding wheel 71 that matches the difference between the shape of the workpiece W1 after finish grinding and the target shape, so that the shape of the workpiece W2 can be processed more accurately.

Furthermore, the processing system 1 of the present invention is configured such that the fixed sensor 8 is mounted on a frame 1a straddling above the indexing table 2.

According to this structure, when the workpiece W1 passes under the fixed sensor 8, the fixed sensor 8 can measure the shape of the workpiece W1, thereby minimizing the time required for measuring the shape of the workpiece W1.

Furthermore, when viewed from above, the processing system 1 of the present invention is configured such that the fixed sensor 8 is arranged on the rotating track R through which the center O of the workpiece W1 passes.

According to this configuration, by setting the measurement point of the fixed sensor 8 on the rotation track R of the center O of the workpiece W1 when viewed from above, the shape of the workpiece W can be measured without increasing the amount of grinding processing of the workpiece W.

In addition, the present invention can be modified in various ways other than those mentioned above without departing from the spirit of the present invention, and the present invention is of course applicable to such modifications.

For example, in the above-mentioned embodiment, although the tilting mechanism 33 is used as an example to explain the structure in which the chuck 3 is tilted together with the rotating shaft 3a, the tilting mechanism 33 may also be a structure in which only the chuck 3 is tilted without tilting the rotating shaft 3a.

1: Processing system

1a: Rack

2: Indexing table

2a: Rotation axis

3: Clamp

31: Rotating table

32: Adsorbent

41: Arm 1

42: 1st rack

43: Second Arm

44: 2nd rack

5: Rough grinding device

52: 1st main axis

53: 1st spindle feed mechanism

6: Middle grinding device

61: Second main axis

62: Second spindle feed mechanism

7: Fine grinding device

71: Fine grinding wheel

72: Oscillating sensor

74:Sensor head

8: Fixed sensor

9: Control device

R: Rotating track

ST1: Calibration table

ST2: Rough grinding table

ST3: Middle grinding table

ST4: Fine grinding table

W: Workpiece

Claims (5)

A processing system is used to perform pre-grinding and fine grinding on a workpiece in sequence. The processing system is characterized by: a dividing table having a chuck that can hold the workpiece and can rotate, so that the workpiece moves at least in the order of a pre-grinding table, a fine grinding table, and a correction table; a tilting mechanism that can adjust the tilt of the chuck; a first sensor that measures the shape of the workpiece before fine grinding; a second sensor that measures the shape of the workpiece before fine grinding; and a second sensor that measures the shape of the workpiece before fine grinding. 2. A sensor for measuring the shape of the workpiece after fine grinding while the workpiece after fine grinding is being transported toward the correction table; and a control device for controlling the tilt angle of the chuck during fine grinding according to the shape of the workpiece before fine grinding, and compensating the tilt angle during fine grinding of the next workpiece according to the shape of the workpiece after fine grinding. As in the processing system of claim 1, the control device calculates the tilt angle based on the shape of the workpiece before fine grinding so that the shape of the workpiece after fine grinding is approximately consistent with the target shape of the workpiece. As in claim 1, the control device calculates the compensation angle for compensating the tilt angle based on the shape of the workpiece after fine grinding so that the shape of the workpiece after fine grinding is approximately consistent with the target shape of the workpiece. A processing system as claimed in claim 1, wherein the second sensor is mounted on a frame straddling above the indexing table. A processing system as claimed in claim 1, wherein the second sensor is disposed on a rotating track through which the center of the workpiece passes when viewed from a top view.

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