TWI877832B - Intelligent packaging machine structure and method - Google Patents
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Abstract
本發明為涉及一種智能包裝機之結構及其方法,主要包括有包裝平台裝置、第一捲帶件、第二捲帶件、攝像裝置、攝像元件、對焦自校模組、包裝裝置、處理裝置、儲存模組、電子零件狀態判斷模組、停止模組、及履歷模組,於啟動包裝平台裝置後,對焦自校模組會自動對攝像元件進行對焦校正,並再經攝像元件對料帶內的電子零件進行拍攝,電子零件狀態判斷模組再將截圖與儲存模組內之資料進行比對,若沒問題則繼續運行,若有問題則通知停止模組緊急停止運行,又若使用者欲觀察電子零件之履歷狀態時,可使用讀取器讀取電子零件上之讀取單元,即可進行觀看,如此達到自動辨識放置於料帶上之電子零件狀態、以及攝像元件可自動進行對焦校正等優勢。 The present invention relates to a structure and method of an intelligent packaging machine, which mainly includes a packaging platform device, a first winding member, a second winding member, a camera device, a camera element, a focus self-calibration module, a packaging device, a processing device, a storage module, an electronic component state judgment module, a stop module, and a history module. After the packaging platform device is started, the focus self-calibration module will automatically calibrate the camera element, and then the camera element will calibrate the electronic components in the material belt. After taking a photo, the electronic component status judgment module will compare the screenshot with the data in the storage module. If there is no problem, it will continue to run. If there is a problem, it will notify the stop module to stop running urgently. If the user wants to observe the status of the electronic component, he can use the reader to read the reading unit on the electronic component and then view it. In this way, the status of the electronic component placed on the tape can be automatically identified, and the camera element can automatically perform focus correction and other advantages.
Description
本發明係涉及一種可自動辨識放置於料帶上之電子零件狀態、以及攝像元件可自動進行對焦校正的智能包裝機之結構及其方法。 The present invention relates to a structure and method of an intelligent packaging machine that can automatically identify the status of electronic parts placed on a material belt and automatically perform focus correction on a camera element.
電子產品的製造鏈通常係將零件與組裝分離,生產零件之廠商乃將微小之電子零件大量製造後進行包裝,再出貨供應給予組裝廠進行組裝。而包裝過程當中,以工作盤(Tray盤)為例,將電子零件運用包裝機將其包裝於工作盤(Tray盤)中,可有效達到包裝收容目的,並也便於運載給其他廠商,然,此種工作盤(Tray盤)方式雖可達運載目的,但整體體積較大,當所包裝之電子零件數量較為龐大時,將會造成存放空間不足之狀況。 The manufacturing chain of electronic products usually separates parts from assembly. Parts manufacturers produce a large number of tiny electronic parts, package them, and then ship them to assembly plants for assembly. In the packaging process, taking the work tray as an example, the electronic parts are packaged in the work tray using a packaging machine, which can effectively achieve the purpose of packaging and storage, and is also convenient for transportation to other manufacturers. However, although this work tray method can achieve the purpose of transportation, the overall volume is relatively large. When the number of electronic parts packaged is relatively large, it will cause insufficient storage space.
又電子零件之包裝過程,常會運用到條碼,利用條碼可得知電子零件的型號或廠商等資訊,然,就現階段一般之條碼讀取,並無法得知電子零件於料帶中的方向是否為正確,抑或是無法得知字體是否有髒污、差異、未放置電子零件、或字體印刷之角度是否正常等。 Barcodes are often used in the packaging process of electronic components. Barcodes can be used to obtain information such as the model or manufacturer of the electronic components. However, with the current general barcode reading, it is impossible to know whether the direction of the electronic components in the material strip is correct, or whether the font is dirty, different, the electronic components are not placed, or whether the angle of the font printing is normal.
此外,當前述之包裝機所屬攝像元件對焦失焦時,使用者不一定可立即發現,此時將導致包裝中的電子零件可能會有置放方向錯誤、字體不對等因攝像元件失焦而檢漏之狀況。 In addition, when the camera element of the aforementioned packaging machine loses focus, the user may not be able to find it immediately, which may cause the electronic parts in the package to be placed in the wrong direction, the fonts to be misaligned, etc., which may lead to the situation of missing due to the camera element losing focus.
是以,要如何解決上述習用之問題與缺失,即為本發明之申請人與從事此行業之相關廠商所亟欲研究改善之方向所在者。 Therefore, how to solve the above-mentioned problems and deficiencies in usage is the direction that the applicant of this invention and related manufacturers engaged in this industry are eager to study and improve.
本發明之課題主要目的在於提供一種透過攝像裝置的攝像元件搭配處理裝置內的儲存模組與電子零件狀態判斷模組,即可達到自動辨識放置於料帶上之電子零件狀態的優勢。 The main purpose of the subject of this invention is to provide a method for automatically identifying the status of electronic components placed on a tape by using the imaging element of the imaging device in combination with the storage module and the electronic component status judgment module in the processing device.
本發明之另一課題主要目的在於提供一種透過對焦自校模組得以使攝像元件可具有自動進行對焦校正之優勢。 Another main purpose of the present invention is to provide a method that enables the imaging element to have the advantage of automatically performing focus correction through a focus self-calibration module.
本發明能夠達成上述各個主要目的之結構包括有一包裝平台裝置,所述包裝平台裝置上之一端處設有一供設置一料帶之第一捲帶件,另一端處則設有一供收容該料帶之第二捲帶件,再該包裝平台裝置上設有一攝像裝置,攝像裝置乃包括一攝像元件,該攝像元件乃拍攝由該第一捲帶件所提供之料帶,又該攝像元件內具有一可自動調整該攝像元件之對焦的對焦自校模組,而攝像裝置與第二捲帶件之間設有一包裝裝置,此外,攝像裝置一側設有一處理裝置,所述處理裝置包括有一供儲存該電子零件之狀態資訊的儲存模組、一與該儲存模組資訊連結之電子零件狀態判斷模組、及一與該電子零件狀態判斷模組資訊連結之停止模組,另,電子零件上設有一讀取單元,此讀取單元乃資訊連結一履歷模組,以供儲存該電子零件之生產資訊。 The structure of the present invention capable of achieving the above-mentioned main purposes includes a packaging platform device, wherein a first reel for placing a material tape is provided at one end of the packaging platform device, and a second reel for accommodating the material tape is provided at the other end. A camera device is provided on the packaging platform device, and the camera device includes a camera element, and the camera element is used to shoot the material tape provided by the first reel, and the camera element has a focus self-calibration module that can automatically adjust the focus of the camera element. , and a packaging device is provided between the camera device and the second reel. In addition, a processing device is provided on one side of the camera device. The processing device includes a storage module for storing the status information of the electronic component, an electronic component status judgment module information-linked to the storage module, and a stop module information-linked to the electronic component status judgment module. In addition, a reading unit is provided on the electronic component. The reading unit is information-linked to a history module for storing the production information of the electronic component.
當欲對電子零件進行包裝時,可依照下述步驟進行: When you want to package electronic parts, you can follow the steps below:
(a)、將一料帶放置於一第一捲帶件上; (a) Place a material tape on a first reel;
(b)、啟動一包裝平台裝置並由一對焦自校模組對設於該包裝平台裝置上之攝像裝置的攝像元件進行對焦校正; (b) Activate a packaging platform device and use a self-focus calibration module to perform focus calibration on the imaging element of the imaging device installed on the packaging platform device;
(c)、該料帶通過該包裝平台裝置上時,將至少一電子零件放入該料帶內; (c) When the material belt passes through the packaging platform device, at least one electronic component is placed into the material belt;
(d)、該料帶移動至該攝像元件下方時,由該攝像元件進行拍照擷取; (d) When the material belt moves to the bottom of the imaging element, the imaging element takes pictures;
(e)、將該攝像元件所拍照擷取出之照片,透過一設於一處理裝置內之電子零件狀態判斷模組進行判斷,該電子零件狀態判斷模組係與一設於一儲存模組內之狀態資訊進行比對,若比對符合則繼續運行並執行步驟(f),若不符合,則傳遞一停止資訊給予一停止模組進行停止運行動作; (e) The photos captured by the imaging element are judged by an electronic component status judgment module in a processing device. The electronic component status judgment module is compared with status information in a storage module. If the comparison is consistent, the operation continues and step (f) is executed. If it is inconsistent, a stop message is transmitted to a stop module to stop the operation;
(f)、透過一包裝裝置對收容有該電子零件之料帶進行封膜包裝動作,並由一設於該包裝平台裝置一端處之第二捲帶件進行收納。 (f) The material tape containing the electronic components is sealed and packaged by a packaging device, and then received by a second tape reel disposed at one end of the packaging platform device.
此外,當使用者欲觀看電子零件之履歷時,可取用一讀取器對電子零件上的讀取單元進行掃描,即可顯示出該電子零件之履歷資訊。 In addition, when the user wants to view the history of an electronic component, he can use a reader to scan the reading unit on the electronic component to display the history information of the electronic component.
藉由上述技術,可針對習用包裝機所存在之無法得知電子零件於料帶中的方向是否為正確,抑或是無法得知字體是否有髒污、差異、或字體印之 角度及未放置電子零件等狀況是否正常等、以及無法立即得知攝像元件對焦失焦的問題點加以突破,達到本發明如上述優點之實用進步性。 By using the above technology, the problems existing in conventional packaging machines, such as the inability to know whether the direction of the electronic components in the material belt is correct, the inability to know whether the font is dirty, different, or whether the angle of the font printing and the situation where the electronic components are not placed are normal, and the inability to immediately know whether the camera element is out of focus, can be overcome to achieve the practical progress of the above advantages of the present invention.
1:包裝平台裝置 1: Packaging platform device
2:第一捲帶件 2: First reel
3:第二捲帶件 3: Second reel
31:驅動件 31:Driver
4:攝像裝置 4: Camera equipment
41:攝像元件 41: Imaging components
411:對焦自校模組 411: Focus self-calibration module
42:縱向支架組 42: Longitudinal bracket set
421:縱向支架驅動件 421: Longitudinal bracket drive
43:前後支架組 43: Front and rear bracket assembly
431:前後支架驅動件 431: Front and rear bracket drive parts
44:橫向支架組 44: Horizontal bracket assembly
441:橫向支架驅動件 441: Transverse bracket drive
5:包裝裝置 5: Packaging equipment
51:膠膜捲元件 51: Rubber film roll element
52:封裝元件 52:Packaging components
6:處理裝置 6: Processing device
61:儲存模組 61: Storage module
62:電子零件狀態判斷模組 62: Electronic component status judgment module
63:停止模組 63: Stop module
7:履歷模組 7: Resume module
8:警示裝置 8: Warning device
9:螢幕 9: Screen
A:料帶 A: Material strip
A1:槽位 A1: Slot
B:電子零件 B: Electronic parts
B1:讀取單元 B1: Reading unit
C:封膜 C: Sealing film
D:讀取器 D: Reader
E:第一機械手臂 E: The first robotic arm
F:第二機械手臂 F: Second robotic arm
第一圖 為本發明較佳實施例之立體透視圖。 The first figure is a three-dimensional perspective view of a preferred embodiment of the present invention.
第一A圖 為本發明較佳實施例之局部示意圖。 Figure 1 A is a partial schematic diagram of a preferred embodiment of the present invention.
第二圖 為本發明較佳實施例之結構方塊圖。 The second figure is a structural block diagram of a preferred embodiment of the present invention.
第三圖 為本發明較佳實施例之步驟流程圖。 The third figure is a step flow chart of a preferred embodiment of the present invention.
第四圖 為本發明較佳實施例之動作示意圖一。 Figure 4 is a schematic diagram of the first preferred embodiment of the present invention.
第五圖 為本發明較佳實施例之動作示意圖二。 Figure 5 is the second action diagram of the preferred embodiment of the present invention.
第六圖 為本發明較佳實施例之動作示意圖三。 Figure 6 is the third action diagram of the preferred embodiment of the present invention.
第七圖 為本發明較佳實施例之動作示意圖四。 Figure 7 is a fourth schematic diagram of the operation of a preferred embodiment of the present invention.
第八圖 為本發明較佳實施例之動作示意圖五。 Figure 8 is a schematic diagram of the fifth operation of the preferred embodiment of the present invention.
第九圖 為本發明較佳實施例之履歷示意圖。 Figure 9 is a schematic diagram of the resume of a preferred embodiment of the present invention.
第十圖 為本發明再一較佳實施例之機械手臂示意圖。 Figure 10 is a schematic diagram of a robotic arm in another preferred embodiment of the present invention.
第十一圖 為本發明又一較佳實施例之實施示意圖。 Figure 11 is a schematic diagram of another preferred embodiment of the present invention.
請參閱第一圖至第二圖所示,為本發明較佳實施例之立體透視圖至結構方塊圖,由圖中可清楚看出本發明係包括: Please refer to the first and second figures, which are the three-dimensional perspective diagrams and structural block diagrams of the preferred embodiments of the present invention. It can be clearly seen from the figures that the present invention includes:
一包裝平台裝置1;
A
一設於該包裝平台裝置1一端處並供設置一料帶A之第一捲帶件2,該包裝平台裝置1另一端處則設有一供收容該料帶A之第二捲帶件3;
A
一設於該包裝平台裝置1上之攝像裝置4,該攝像裝置4乃包括一攝像元件41,該攝像元件41乃拍攝由該第一捲帶件2所提供之料帶A,且該料帶A內供收容至少一具有一讀取單元B1之電子零件B,又該攝像元件41內具有一可自動調整該攝像元件41之對焦動作的對焦自校模組411,並本實施例之攝像元件41係以攝像鏡頭為例;
A
一設於該攝像裝置4與該第二捲帶件3之間的包裝裝置5,以對收容有該電子零件B之料帶A進行包裝;
A
一設於該攝像裝置4一側並與攝像元件41資訊連結之處理裝置6,該處理裝置6包括一供儲存該電子零件B之狀態資訊的儲存模組61、一與該儲存模組61資訊連結之電子零件狀態判斷模組62、及一與該電子零件狀態判斷模組62資訊連結之停止模組63;及
A
一與該讀取單元B1資訊連結之履歷模組7,以供儲存該電子零件B之生產資訊,且本實施例之處理裝置6係以工業電腦為例。
A
其中,所述狀態資訊乃為電子零件B方向性資訊、字體髒污資訊、字體差異資訊、字體角度資訊、或未放置電子零件其中之一者。 The state information is one of the directional information of the electronic component B, the font contamination information, the font difference information, the font angle information, or the electronic component is not placed.
其中,所述包裝平台裝置1上設有一與該處理裝置6資訊連結之警示裝置8。
Among them, the
其中,所述包裝裝置5具有一供放置有一封膜C之膠膜捲元件51、及一設於該膠膜捲元件51一側並可將該封膜C與該料帶A結合之封裝元件52。
The
其中,所述料帶A包含有供放置電子零件B的多個槽位A1。 The material strip A includes multiple slots A1 for placing electronic components B.
其中,所述讀取單元B1乃以條碼為例,亦可為QR碼或其他辨識碼。 The reading unit B1 is a barcode as an example, but it can also be a QR code or other identification code.
其中,所述電子零件B乃以晶片(IC)為例。 The electronic component B is a chip (IC) as an example.
其中,所述對焦自校模組411乃以設於上述攝像元件41內的相位檢測自動對焦為例,而相位檢測自動對焦(又稱相位差偵測自動對焦)是相機拍攝時所用的自動對焦系統,主要特點是快捷的自動對焦速度。
The self-focusing
其中,該攝像裝置4乃包括一供承載該攝像元件41的縱向支架組42、一設於該縱向支架組42一側並供該縱向支架組42前後活動之前後支架組43、及一設於該前後支架組43一側並供該前後支架組43橫向活動之橫向支架組44,且該縱向支架組42連結一縱向支架驅動件421,該前後支架組43連結一前後支架驅動件431,該橫向支架組44連結一橫向支架驅動件441。
The
其中,所述縱向支架驅動件421、前後支架驅動件431、及橫向支架驅動件441乃以氣壓缸為例,並分別與縱向支架組42、前後支架組43、及橫向支架組44共同形成一種導桿氣壓缸。
The
其中,所述封裝元件52之封裝方式可為熱壓封裝或自黏封裝其中
之一者。
The packaging method of the
其中,所述儲存模組61乃為儲存晶片或伺服器其中之一者。
The
其中,所述電子零件狀態判斷模組62與停止模組63乃以處理器為例。
The electronic component
其中,所述履歷模組7乃為儲存晶片或伺服器其中之一者。
The
其中,所述履歷模組7內乃儲存有電子零件B之生產時間、型號、產地、生產工廠、或批號等。
The
其中,所述警示裝置8乃以燈光為例,然亦可為聲音警示。
The
請同時配合參閱第一圖至第八圖所示,為本發明較佳實施例之立體透視圖至動作示意圖五,由圖中可清楚看出,主要步驟包括: Please refer to Figures 1 to 8 at the same time, which are the three-dimensional perspective diagrams to the action schematic diagram 5 of the preferred embodiment of the present invention. It can be clearly seen from the diagrams that the main steps include:
(a)、安裝料帶:將一料帶A放置於一第一捲帶件2上;
(a) Installing the tape: placing a tape A on a
(b)、自動對焦:啟動一包裝平台裝置1並由一對焦自校模組411對設於該包裝平台裝置1上之攝像元件41進行對焦校正;
(b) Autofocus: Start a
(c)、放置電子零件:該料帶A通過該包裝平台裝置1上時,將至少一電子零件B放入該料帶A內;
(c) Placing electronic components: When the material belt A passes through the
(d)、拍攝擷取:該料帶A移動至該攝像元件41下方時,由該攝像元件41進行拍照擷取;
(d) Photographing and capturing: When the material belt A moves below the
(e)、比對判斷:將該攝像元件41所拍照擷取出之照片,透過一設於一處理裝置6內之電子零件狀態判斷模組62進行判斷,該電子零件狀態判斷模組62係與一設於一儲存模組61內之狀態資訊進行比對,若比對符合則繼續運行並執行步驟(f),若不符合,則傳遞一停止資訊給予一停止模組63進行停止運行動作;
(e) Comparison and judgment: The photo captured by the
(f)、包裝封膜:透過一包裝裝置5對收容有該電子零件B之料帶A進行封膜包裝動作,並由一設於該包裝平台裝置1一端處之第二捲帶件3進行收納。
(f) Packaging film: The material tape A containing the electronic component B is packaged with a film by a
針對上述步驟詳言而論如下: The above steps are described in detail as follows:
針對步驟(a),當使用者欲對電子零件B進行封裝時,可先將料帶A與包裝平台裝置1進行結合,使料帶A可經由包裝平台裝置1的導引進行移動。
Regarding step (a), when the user wants to package the electronic component B, the material belt A can be combined with the
針對步驟(b),當安裝完畢後,啟動包裝平台裝置1,使料帶A移
動運行(此包裝平台裝置1帶動料帶A移動之系統為一般習用捲帶包裝機構造,故不再贅述),且攝像元件41透過對焦自校模組411可進行自動對焦,舉例而言,當攝像元件41之對焦自校模組411因故障發生失焦狀態,而無法自動對焦時,可利用縱向支架驅動件421,以氣壓缸的帶動方式,帶動縱向支架組42進行縱向高度的移動調整,而前後支架驅動件431可驅動前後支架組43進行前後位置之移動調整,而橫向支架驅動件441可驅動橫向支架組44進行橫向位置之移動調整,如此可使攝像元件41達到多軸移動調整之優勢,意謂,縱使對焦自校模組411故障時,使用者也可利用手動調整方式來進行攝像元件41的對焦,達到多元化之優勢,若當對焦自校模組411無故障時,則可達到全自動化設計,使用者無需另外手動調整,直接透過對焦自校模組411即可完成自動對焦目的,方便、快速、又精準。(可參第二、五圖)
Regarding step (b), after the installation is completed, the
針對步驟(c),包裝平台裝置1帶動料帶A移動過程中,可放置電子零件B於料帶A的槽位A1內,並依據廠商定義的方向進行放置(可參第四圖)。
Regarding step (c), while the
針對步驟(d),當包裝平台裝置1帶動料帶A移動至攝像元件41下方時,攝像元件41將會對電子零件B進行拍照擷取,並產生一照片(可參第五圖)。
Regarding step (d), when the
針對步驟(e),前述照片會被傳遞至電子零件狀態判斷模組62進行判斷,電子零件狀態判斷模組62會將該照片與儲存模組61內所儲存的資料進行比對,舉例而言,電子零件B上具有IC型號,而儲存模組61內儲存有該電子零件B之IC型號及正確方向資訊,由攝像元件41拍攝之照片可看出具有IC型號,此時電子零件狀態判斷模組62係將此照片與儲存模組61內的資訊進行對照比對,當對照結果發生IC型號所在位置相反時,即代表電子零件B之擺放角度不正確,此時電子零件狀態判斷模組62隨即發送一錯誤訊息給予停止模組63,停止模組63即驅動包裝平台裝置1以對料帶A進行停止運行動作,此後即可將方向錯誤的電子零件B擺設為正確,再啟動包裝平台裝置1進行後續作業。倘若電子零件狀態判斷模組62比對發生字體髒污、字體外觀不正確、字體印製角度有偏差、未放置電子零件等狀態資訊時,仍同樣會通知停止模組63操控包裝平台裝置1進行暫停動作,且同時會驅動警示裝置8進行發光或發聲,有效提醒使用者現場狀況,便於做即時的更換或轉向等處理(
可參第一、六、七圖)。
In step (e), the aforementioned photo will be transmitted to the electronic component
針對步驟(f),當前述問題皆排除後,裝有電子零件B的料帶A即會與來自膠膜捲元件51的封膜C,共同通過封裝元件52使兩者合二為一,最後再由一供驅動該第二捲帶件3之驅動件31對第二捲帶件3進行旋轉收納(可參第八圖)。
Regarding step (f), when the above problems are eliminated, the material tape A with the electronic components B will be combined with the sealing film C from the
藉此,攝像元件41可將照片檔案儲存於儲存模組61內,可提供使用者利用螢幕9於當下立即觀看或日後回放進行觀看,以做一個完整的畫面紀錄,於日後釐清問題時可更快更方便。
Thus, the
此外,也可做為良率統計之紀錄,舉例而言,當一個完整的料帶A之槽位A1共有500個時,若停止模組63停止的次數落於50次時,儲存模組61即紀錄停止50次,進而可於事後計算出其良率為90%,不良率為10%,並進行紀錄,此統計結果也便於使用者日後的管理。
In addition, it can also be used as a record of yield statistics. For example, when a complete material strip A has 500 slots A1, if the number of stops of the
請參閱第九圖所示,為本發明較佳實施例之履歷示意圖,由圖中可清楚看出,當使用者欲觀看電子零件B之履歷時,可使用讀取器D讀取電子零件B上之讀取單元B1,所述讀取器D可為智慧型手機或條碼機等,而讀取器D掃描到讀取單元B1後,即依據讀取單元B1提供的連結而載入有關電子零件B之履歷資訊(生產時間、型號、產地、生產工廠、或批號等),其載入來源係來自於履歷模組7。
Please refer to the ninth figure, which is a schematic diagram of the resume of the preferred embodiment of the present invention. It can be clearly seen from the figure that when the user wants to view the resume of electronic component B, the reader D can be used to read the reading unit B1 on the electronic component B. The reader D can be a smart phone or a barcode reader, etc. After the reader D scans the reading unit B1, it loads the resume information of the electronic component B (production time, model, origin, production factory, or batch number, etc.) according to the link provided by the reading unit B1. The loading source comes from the
請參閱第十圖所示,為本發明再一較佳實施例之機械手臂示意圖,由圖中可清楚看出,包裝平台裝置1上並位於該第一捲帶件2與該攝像裝置4之間處設有一第一機械手臂E,而該包裝平台裝置1上並位於該攝像裝置4一側處設有一第二機械手臂F,藉此可知,本案可經由全自動方式進行包裝,第一機械手臂E之工作可將待包裝之電子零件抓取運載至料帶的槽位內,而第二機械手臂F之工作則係於電子零件狀態判斷模組通知停止模組停止後,抓取槽位內有問題的電子零件,舉如字體印製不清的電子零件抓去至旁邊進行回收後,再補充一電子零件,並由攝像元件41重新拍攝並透過電子零件狀態判斷模組重新比對判斷,如此達到全自動化之優勢。
Please refer to FIG. 10, which is a schematic diagram of a robot arm of another preferred embodiment of the present invention. It can be clearly seen from the figure that a first robot arm E is provided on the
請參閱第十一圖所示,為本發明又一較佳實施例之實施示意圖,由圖中可清楚看出,本實施例與上述實施例不同處在於,本實施例之處理裝置6係以電路基板為例,且設於攝像元件41上,如此,處理裝置6與攝像元件4
1合二為一,有效縮小本案智能包裝機之整體體積,不會因為處理裝置6而占用太多空間。
Please refer to the eleventh figure, which is a schematic diagram of another preferred embodiment of the present invention. It can be clearly seen from the figure that the present embodiment is different from the above embodiments in that the
是以,本發明之智能包裝機之結構及其方法為可改善習用之技術關鍵在於: Therefore, the structure and method of the intelligent packaging machine of the present invention are the key technologies that can improve usage:
第一,透過攝像裝置4的攝像元件41搭配處理裝置6內的儲存模組61與電子零件狀態判斷模組62,即可達到自動辨識放置於料帶A上之電子零件B狀態的優勢。
First, the advantage of automatically identifying the status of electronic component B placed on the material strip A can be achieved by using the
第二,透過對焦自校模組411得以使攝像元件41具有自動進行對焦校正之優勢。
Second, the self-focusing
第三,本案可對生產過程做一良率之統計,讓使用者可知道這批電子零件B的良率,進而立即改善其狀況。 Third, this case can make a yield statistics for the production process, so that users can know the yield of this batch of electronic components B and then immediately improve its situation.
第四,攝像元件41可將照片檔案儲存於儲存模組61內,可提供使用者利用螢幕9於當下立即觀看或日後回放進行觀看,以做一個完整的畫面紀錄,於日後釐清問題時可更快更方便。
Fourth, the
第五,透過履歷模組7可讓使用者快速得知此批電子零件B的生產時間、型號、產地、生產工廠、或批號,精準掌握來源。
Fifth, through the
第六,透過警示裝置8之發光或發聲設計,可有效提醒使用者現場狀況,便於做即時的更換或轉向等處理。
Sixth, the luminous or audible design of the
第七,透過第一機械手臂E及第二機械手臂F之設計,達到全自動化之優勢。 Seventh, through the design of the first robot arm E and the second robot arm F, the advantage of full automation is achieved.
第八,透過包裝裝置5的膠膜捲元件51與封裝元件52,達到完成自動化封裝優勢。
Eighth, through the
第九,本案透過料帶A之方式進行收納,與工作盤(Tray盤)相較,可具有更佳的收容空間,同一槽位A1數量上,料帶的體積會比工作盤(Tray盤)更小,更易於收納。 Ninth, this case uses material belt A for storage, which can have better storage space compared with the working tray (Tray). For the same number of slots A1, the volume of the material belt will be smaller than that of the working tray (Tray), making it easier to store.
惟,雖然本文中已顯示並敘明本發明之各種實施例,但僅以舉例方式提供此等實施例,本文中所提供之任何操作理論或益處既定僅作為敘明本發明之一輔助;此等理論及解釋不束縛或限制關於藉由實踐本發明而達成之組織重塑之申請專利範圍。熟習此項技術者現在可不背離本發明之情形下構想出諸多變化、改變或替代。應瞭解,可在實踐本發明時採用本文中所敘明之發明之 實施例的各種替代方案。本發明之範疇、本發明之範疇內的方法及結構既定包括等效形式。 However, although various embodiments of the present invention have been shown and described herein, such embodiments are provided by way of example only, and any operating theories or benefits provided herein are intended only as an aid to the description of the present invention; such theories and explanations do not restrict or limit the scope of the patent application regarding the organizational remodeling achieved by practicing the present invention. Those skilled in the art can now conceive of many variations, changes or substitutions without departing from the present invention. It should be understood that various alternatives to the embodiments of the invention described herein may be adopted in practicing the present invention. The scope of the present invention, the methods and structures within the scope of the present invention are intended to include equivalent forms.
綜上所述,本發明之智能包裝機之結構及其方法於使用時,為確實能達到其功效及目的,故本發明誠為一實用性優異之發明,為符合發明專利之申請要件,爰依法提出申請,盼 審委早日賜准本發明,以保障申請人之辛苦發明,倘若 鈞局審委有任何稽疑,請不吝來函指示,申請人定當竭力配合,實感公便。 In summary, the structure and method of the intelligent packaging machine of this invention can truly achieve its effect and purpose when used. Therefore, this invention is truly an invention with excellent practicality. In order to meet the application requirements of invention patents, an application is filed in accordance with the law. I hope that the review committee will approve this invention as soon as possible to protect the applicant's hard work. If the review committee of the Jun Bureau has any doubts, please feel free to write to instruct. The applicant will do his best to cooperate and feel that it is public and convenient.
1:包裝平台裝置 1: Packaging platform device
2:第一捲帶件 2: First reel
3:第二捲帶件 3: Second reel
4:攝像裝置 4: Camera equipment
41:攝像元件 41: Imaging components
5:包裝裝置 5: Packaging equipment
51:膠膜捲元件 51: Rubber film roll element
52:封裝元件 52:Packaging components
6:處理裝置 6: Processing device
61:儲存模組 61: Storage module
62:電子零件狀態判斷模組 62: Electronic component status judgment module
63:停止模組 63: Stop module
8:警示裝置 8: Warning device
A:料帶 A: Material strip
C:封膜 C: Sealing film
Claims (10)
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Citations (4)
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| CN211253277U (en) * | 2019-10-31 | 2020-08-14 | 太极半导体(苏州)有限公司 | Automatic information processing mobile recording vehicle for semiconductor finished goods |
| US20200410435A1 (en) * | 2018-03-12 | 2020-12-31 | Robert Bosch Gmbh | Method and camera system for monitoring a picking or packaging process |
| CN112918759A (en) * | 2021-02-05 | 2021-06-08 | 富之光电子科技(韶关)有限公司 | Chip capacitor packaging device |
| TWM651616U (en) * | 2023-10-13 | 2024-02-11 | 京商電子有限公司 | Intelligent packaging machine structure |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20200410435A1 (en) * | 2018-03-12 | 2020-12-31 | Robert Bosch Gmbh | Method and camera system for monitoring a picking or packaging process |
| CN211253277U (en) * | 2019-10-31 | 2020-08-14 | 太极半导体(苏州)有限公司 | Automatic information processing mobile recording vehicle for semiconductor finished goods |
| CN112918759A (en) * | 2021-02-05 | 2021-06-08 | 富之光电子科技(韶关)有限公司 | Chip capacitor packaging device |
| TWM651616U (en) * | 2023-10-13 | 2024-02-11 | 京商電子有限公司 | Intelligent packaging machine structure |
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