TWI879067B - Sheet positioning device, positioning method, and method for forming a mask layer for electronic components - Google Patents

Abstract

Regarding the positioning device of the sheet of the present invention, the sheet has a substrate and a functional material arranged on the substrate; the positioning device has: a supporting mechanism that supports the aforementioned sheet; a sheet stage that fixes the aforementioned sheet; and a detecting unit that detects the position of the aforementioned functional material in the surface direction of the aforementioned sheet supported by the aforementioned supporting mechanism; the device is configured to arrange the aforementioned functional material at a specified position with respect to the aforementioned sheet stage based on the position of the aforementioned functional material detected by the aforementioned detecting unit, and after the aforementioned sheet is positioned so that the aforementioned sheet is relatively moved with respect to the aforementioned sheet stage, the aforementioned sheet is fixed to the aforementioned sheet stage.

Description

Sheet positioning device, positioning method, and method for forming a mask layer for electronic components

The present invention relates to a sheet positioning device, a positioning method, and a method for forming a mask layer for electronic components.

Patent document 1 discloses a conveying mechanism that fixes a release film cut into a specified length on a sheet stage and then conveys it to a resin forming device. In more detail, the release film is cut after being rolled out from a roll to a specified length and fixed to a sheet stage. Thereafter, the release film of the specified length is conveyed to the resin forming device by the conveying mechanism.

[Prior technical literature] (Patent literature) Patent literature 1: Japanese Patent No. 6423399

[Problem to be solved by the invention] However, the release film is not positioned with high precision on the sheet stage, but is merely arranged on the sheet stage. Therefore, this mechanism is not suitable for equipment that requires high precision in the position of the release film in subsequent steps. In addition, this problem is not limited to the release film, but is a problem that may arise in general sheets that require high precision positioning on the sheet stage. In addition, the above-mentioned post-conveying procedure is not limited to the resin molding device, but can also be applied to various procedures.

The present invention is made to solve this problem, and its purpose is to provide a sheet positioning device, a positioning method, and a method for forming a mask layer for electronic components, which can perform high-precision positioning whenever a sheet is arranged on a sheet stage.

[Technical means for solving the problem] The sheet positioning device of the present invention comprises a substrate and a functional material arranged on the substrate; the positioning device comprises: a support mechanism that supports the sheet; a sheet stage that fixes the sheet; and a detection unit that detects the position of the functional material in the sheet supported by the support mechanism in the surface direction; the device is configured to arrange the functional material at a predetermined position with respect to the sheet stage based on the position of the functional material detected by the detection unit, and after the sheet is positioned so as to move relative to the sheet stage, the sheet is fixed to the sheet stage.

Regarding the positioning method of a sheet material of the present invention, the sheet material has a substrate and a functional material arranged on the substrate; the positioning method comprises: a step of arranging the aforementioned sheet material above a sheet material table; a step of detecting the position of the aforementioned functional material in the surface direction of the aforementioned sheet material; a step of positioning the aforementioned sheet material relative to the aforementioned sheet material table in such a manner that the aforementioned functional material is arranged at a specified position with respect to the aforementioned sheet material table based on the detected position of the aforementioned functional material; and a step of fixing the aforementioned sheet material to the aforementioned sheet material table after the aforementioned positioning is completed.

Regarding the method for forming a mask layer for electronic components of the present invention, the functional material is a mask material for electromagnetic waves; the forming method comprises: a step of preparing a first mold and a second mold facing each other; after the above positioning method, the sheet is conveyed from the sheet stage by a conveying mechanism, and the sheet is arranged on the setting surface of the first mold with the functional material facing the second mold; a step of arranging a plurality of electronic components on a carrier at specified intervals; a step of arranging the carrier on the setting surface of the second mold with the electronic components facing the first mold; and a step of bringing the first mold and the second mold close to pressurize and bond the functional material to the surface of the electronic component, thereby forming a mask layer on the surface of the electronic component.

[Effect of the invention] According to the present invention, it is possible to perform high-precision positioning whenever a sheet is placed on a sheet stage.

Below, a diagram is used to describe in detail an embodiment of a system for forming a mask layer for electronic components, including a positioning device for a sheet of the present invention. In addition, for ease of understanding, appropriate objects may be omitted or exaggerated in each diagram and depicted schematically.

<1. Configuration of a system for forming a mask layer for electronic components>

FIG. 1 is a schematic plan view of a system 100 for forming a mask layer for electronic components according to the present embodiment. This system is a system for forming a mask layer for electromagnetic waves on the surface of electronic components. As shown in FIG. 1 , this system 100 has a module A, a module B, and a module C arranged from the left to the right of FIG. 1 .

FIG2 is a cross-sectional view of an electronic component formed with a mask layer. As shown in FIG2, the electronic component 1 has a substrate 11 and a chip portion 12 such as an IC chip disposed on the substrate 11. The substrate 11 can be in various forms, such as a substrate that electrically relays the motherboard carrying the electronic component 1 and the chip portion 12, and can be set as an intermediate layer. Specifically, it can be set as an electronic component formed by laminating a conductive pattern, a ground layer, and an insulating layer that are omitted from the figure. Furthermore, as described later, a mask layer 13 is pressure-bonded to the top and side surfaces of the chip portion 12 in the electronic component 1 and the side surface of the substrate 11. The following describes each module constituting the present system 100.

<2. Module A>

Module A is a handler module that places multiple electronic components on a carrier. As shown in Figure 3, in this module A, a carrier 2 is prepared that has multiple electronic components 1 placed on it.

The carrier 2 is made of a film, sheet or substrate that can carry the electronic component 1. Any carrier that can withstand the depressurization step and heating described below can be used. For example, it can be formed of metal, glass, etc. An adhesive layer or adhesive layer is formed on the surface of the carrier 2 to adhere the electronic component 1. Furthermore, the substrate 11 of the electronic component 1 is fixed to this adhesive layer or adhesive layer.

The number of electronic components 1 arranged on the carrier 2 is not particularly limited, and may be one or more. In the present embodiment, they are arranged in a matrix of N×M (N and M are integers of 2 or more).

As shown in FIG. 4 , the carrier 2 is supported by a plate-shaped support member 3 and transported to the module B. A plurality of suction ports 31 opened on the bottom of the support member 3 are configured to suck the surface of the carrier 2 opposite to the surface on which the electronic component 1 is arranged. The support member 3 with the carrier 2 sucked in this way is transported to the module B by a transport device (not shown).

<3. Module C> Module C will be explained before module B. Module C is a module for preparing a masking material (functional material) for electromagnetic waves to be pressurized and bonded to the surface of the electronic component 1. First, the sheet on which the masking material is mounted will be explained.

<3-1. Sheet> Figure 5 is a plan view of a rolled sheet. Figure 6 is a side view of Figure 5. As shown in Figures 5 and 6, the sheet 4 is rolled up and held by a reel 40, and has a sheet-like base material 41 and a plurality of mask materials 42 arranged on the base material 41. Furthermore, as described later, the reel 40 on which the sheet has been rolled up is rotatably held by the reel holding portion 511.

The substrate 41 may be formed of a resin film or the like as long as it has mold release properties so that the mask material 42 can be peeled off later. The substrate 41 preferably includes a stretchable substrate. The stretchability allows the substrate 41 to exert its stretchability and stretch in a manner suitable for the shape of the electronic component 1 when the upper module 61 and the lower module 62 are brought close to each other in the module B described later. The substrate 41 may also be formed of a thermoplastic resin having a cushioning property.

The thickness of the substrate 41 is not particularly limited, and is, for example, 50 to 550 μm, preferably 50 to 400 μm, and more preferably 100 to 350 μm. The material constituting the substrate 41 is preferably thermoplastic polystyrene, polymethylpentene, polybutylene terephthalate, polypropylene, cyclic olefin polymer, more preferably cyclic olefin polymer, and particularly preferably polymethylpentene.

The mask material 42 is formed into a rectangular shape having a width narrower than that of the base material 41. Furthermore, a plurality of mask materials 42 are arranged on the base material 41 at predetermined intervals in the unwinding direction of the reel 40. The mask material is a mask-like member for forming a mask layer on the surface of the electronic component 1 to shield the electronic component 1 from electromagnetic waves. The mask material 42 can be set to include, for example, a resin adhesive, a bridging agent, and a conductive filler, and can also further include other additives according to needs.

The resin adhesive is preferably a thermosetting resin selected from, for example, epoxy resins, phenolic resins, alkyd resins, melamine-formaldehyde resins, acrylic resins, silicone resins, or a mixture thereof.

A bridge agent is used to bridge the resin adhesive. Specifically, examples include bridge agents containing one or more of hydroxyl, phenol, carboxylic acid, amine, epoxy, isocyanate and aziridine. From the perspective of product life and reactivity, bridge agents containing epoxy, phenol, hydroxyl and carboxylic acid are preferred.

Examples of conductive fillers include (1) metal powders of conductive metals such as gold, copper, silver, and nickel; (2) alloy powders of conductive metal alloys; and (3) core-shell particles of silver-plated copper powder, gold-plated copper powder, silver-plated nickel powder, and gold-plated nickel powder. The conductive filler may be in the shape of a sphere, an ellipse, a scale, a dendrite, a grape, and/or a needle.

<3-2. Sheet positioning device>

Next, the sheet positioning device provided in module C will be described. FIG. 7 is a side view of the positioning device. FIG. 8 is a plan view of FIG. 7 . This positioning device is a device that cuts a sheet 4 of a specified length from a reel 40 and arranges it on a sheet table 52. As shown in FIG. 7 and FIG. 8 , this positioning device has: a support mechanism 51 that supports the sheet 4, a sheet table 52 that fixes the sheet 4, a sensor unit 53 that detects the position of the mask material 42 of the sheet 4, and a cutting mechanism (cutting part) 54 that cuts the sheet 4. Furthermore, these components are controlled by a control unit (not shown) composed of a computer such as a PLC (programmable logic controller). These components are described in detail below. In addition, for the sake of convenience, the following description will be made in accordance with the directions shown in Figures 7 and 8, but the positioning device of the present invention is not limited to this direction.

<3-2-1. Supporting organizations>

The support mechanism 51 comprises: a roll holding portion 511 for holding the roll 40 on which the sheet 4 has been rolled up so as to be rotatable, and a feed portion 512 for holding the end of the sheet 4 and moving closer to and farther from the roll 40 in the left-right direction (first direction). The roll holding portion 511 comprises: a bearing (not shown in the figure) for supporting the roll 40 so as to be rotatable, and a driving portion (not shown in the figure) for driving the bearing. The feed portion 512 is configured to be movable left-right. Specifically, it is configured to move to the right while holding the end of the sheet 4 rolled up from the roll 40 by a chuck, thereby rolling the sheet 4 out from the roll 40. As shown in FIG. 8 , when the sheet 4 is rolled out in this manner, a mask material 42 is exposed in the rolled out sheet 4.

<3-2-2. Sheet stage> The sheet stage 52 is rectangular in shape when viewed from above and is disposed below the sheet 4 rolled out from the reel 40. A plurality of suction ports (not shown) are formed on the top of the sheet stage 52, and air is sucked from the suction ports to adsorb the sheet 4 onto the top of the sheet stage 52. The sheet stage 52 is movable in the horizontal direction (the direction of the paper surface of FIG. 8 ) while holding the sheet 4, and is transported to the module B.

<3-2-3. Sensor unit> The sensor unit 53 is arranged above the sheet 4 that has been unrolled from the reel 40. The sensor unit 53 has a base 531 that is formed in a plate shape and supported to be movable up and down, and a first sensor 532 and a second sensor 533 that are arranged on the base 531. In addition, a first pressing portion 534 extending in the front-rear direction is provided at the end on the left side (the reel 40 side) below the base 531. The first pressing portion 534 is configured to contact the vicinity of the left end of the upper surface of the sheet platform 52 as the base 531 descends. In this way, the unrolled sheet 4 can be clamped by the sheet platform 52 and the first pressing portion 534.

The sensing unit 53 is configured to be close to the upper surface of the sheet 4 rolled off the reel 40 to detect the horizontal position of the mask material 42. Specifically, the first sensor 532 is used to detect the rear edge of the mask material 42 extending in the left-right direction, and the second sensor 533 is used to detect the left edge of the mask material 42 extending in the front-rear direction. Furthermore, the control unit determines whether the detected edge is arranged within a specified range.

<3-2-4. Cutting mechanism> The cutting mechanism 54 is configured to cut the left side of the sheet 4 rolled out from the reel 40. More specifically, it is configured to cut the portion of the rolled out sheet 4 that is only a specified distance away from the left edge of the exposed mask material 42 in the front-rear direction (second direction). That is, it is configured to cut the base material 41 between adjacent mask materials 42. Therefore, the cutting mechanism 54 has: a cutter 541 that cuts the sheet 4, a second pressing portion 542 that presses the sheet 4 from above, and a supporting portion 543 that supports the sheet 4 from below. The second pressing portion 542 and the supporting portion 543 are formed between the sheet table 52 and the reel 40 and extend in the front-rear direction.

Furthermore, if the sheet 4 is rolled out, the left side of the rolled out sheet 4 is pushed by the second pushing portion 542 and the support portion 543. Moreover, on the right side of these second pushing portion 542 and the support portion 543, the sheet 4 is pushed by the first pushing portion 534 and the sheet stage 52. In this state, the cutter 541 is moved in the front-back direction, thereby cutting the substrate 41 between the second pushing portion 542 and the first pushing portion 534. In addition, the means for cutting the sheet can be set to a means for cutting by heat such as laser, etc., in addition to the cutter 541.

<3-2-5. Positioning device>

Next, the operation of the positioning device constructed as described above will be described with reference to FIGS. 9 to 14. First, as shown in FIG. 9, the end of the sheet 4 that has been rolled up from the reel 40 is held by the feed portion 512. Then, as shown in FIG. 10, the feed portion 512 is moved to the right to roll out the sheet 4 from the reel 40. Thus, one mask material 42 in the rolled-up sheet 4 is arranged above the sheet table 52.

Next, as shown in FIG11, the sensor unit 53 is lowered to detect the position of the mask material 42 by the first sensor 532 and the second sensor 533. That is, as shown in FIG8, the first sensor 532 and the second sensor 533 are respectively arranged above the rear edge and the left edge of the mask material 42 to detect the positions of these edges. At this time, if the detected left edge does not enter the specified range, the roll holding part 511 and the feeding part 512 are driven to adjust the unwinding distance of the sheet 4, thereby adjusting the left-right direction position of the mask material 42. In this way, the mask material 42 is arranged at a specified position in the left-right direction with respect to the sheet stage 52.

On the other hand, if the detected rear edge does not enter the specified range, the front-to-back position of the sheet stage 52 is adjusted. In this way, the mask material 42 is arranged at a specified position in the front-to-back direction with respect to the sheet stage 52.

If the mask material 42 is arranged at a predetermined position in this way, the sensor unit 53 is further lowered as shown in FIG12 to push the sheet 4 by the first pushing portion 534. Thereby, the base material 41 on the left side of the mask material 42 is clamped in the sheet 4 by the first pushing portion 534 and the sheet stage 52. At the same time, air is sucked from the top of the sheet stage 52 to adsorb the sheet 4. Furthermore, the second pushing portion 542 is lowered relative to the support portion 543, and the sheet 4 is pushed to the left side of the first pushing portion 534 by these. Subsequently, as shown in FIG13, the portion between the first pushing portion 534 and the second pushing portion 542 in the sheet 4 is cut by the cutter 541.

14, the sensor unit 53 is raised, and the second pressing portion 542 is separated from the supporting portion 543. In this way, the sheet 4 is formed so that the mask material 42 is correctly positioned on the sheet stage 52.

Next, the sheet 4 on the sheet stage 52 is transferred to the conveying mechanism. This point is explained with reference to Figures 15 to 18. After the sheet 4 on the sheet stage 52 is positioned as described above, as shown in Figure 15, the conveying body 8 of the conveying mechanism is arranged above the sheet 4. The conveying body 8 is configured to be movable between module B and module C, and has a main body 81 having a plurality of suction ports 811 formed at the bottom, and the suction ports 811 are used to hold the sheet 4. In addition, on the side of the main body 81, there is provided a first holding portion 82 that clamps the main body 81 from the side, and at the lower part of the first holding portion 82, there is provided a second holding portion 83 that can be raised and lowered.

As shown in FIG16 , the conveying body 8 is positioned above the sheet stage 52 and then lowered. Thereby, the bottom of the main body 81 is brought into contact with the sheet 4 on the sheet stage 52. In this state, as shown in FIG17 , the sheet 4 is held by the air sucked from the suction port 811, and the second holding portion 83 is raised and the periphery of the sheet 4 is clamped by the first holding portion 82 and the second holding portion 83. Thereafter, the suction of the air in the sheet stage 52 is stopped, and as shown in FIG18 , the conveying body 8 is raised. In this way, the sheet 4 is transferred from the sheet stage 52 to the conveying body 8. In this state, the conveying body 8 is moved to convey the sheet 4 to module B.

After that, after the sheet stage 52 is returned to the initial position of FIG. 8, the feed part 512 is moved to the vicinity of the second pressing part 542 to hold the end of the sheet 4, and the actions of FIG. 9 to FIG. 18 are repeated. In this way, the sheet 4 positioned at the predetermined position on the sheet stage 52 is sequentially conveyed to the module B.

<4. Module B> Next, module B is described. Module B is a module that presses and bonds the mask material 42 conveyed from module C to the surface of the electronic component 1 conveyed from module A. As shown in FIG19 , module B has: an upper module (second module) 61 configured with a carrier 2, and a lower module (first module) 62 configured with a sheet 4, and these are configured in a chamber that can reduce pressure. The upper module 61 and the lower module 62 are described below.

<4-1. Overview of the upper and lower molds> As shown in FIG. 19, the lower surface of the upper mold 61 is formed flat to arrange the carrier 2, and a plurality of suction ports 611 are formed on the lower surface. Furthermore, the carrier 2 transported from the module A by the transport device is arranged on the lower surface of the upper mold 61 and adsorbed.

The lower module 62 includes a base 621 having a rectangular upper surface and a rectangular support plate 622 disposed on the upper surface of the base 621. The support plate 622 is formed to be smaller than the upper surface of the base 621, and a suction port 623 is formed in a region of the upper surface of the base 621 that is outside the support plate 622. The suction port 623 is configured to suck air to adsorb the sheet 4 conveyed from the module C.

A plurality of rectangular recesses 624 are formed on the upper surface of the support plate 622. These recesses 624 are formed at positions opposite to the electronic components 1 fixed to the upper mold 61 via the carrier 2. That is, each recess 624 is formed in a rectangular shape slightly larger than the planar shape of the electronic component 1, and is configured so that each electronic component 1 enters the recess 624 when the upper mold 61 and the lower mold 62 are brought close to each other.

<4-2. Pressurized bonding step of mask material by upper and lower modules> Next, the pressurized bonding step of mask material is described with reference to FIGS. 20 to 22. First, as shown in FIG. 20, the carrier 2 is arranged in the upper module 61, and the sheet 4 is arranged in the lower module 62. The sheet 4 is positioned in the module C and then conveyed to the module B by the conveyor 8. By positioning the sheet 4, when the sheet 4 is transferred from the conveyor 8 to the lower module 62, the mask material 42 of the sheet 4 is arranged to cover all the recesses 624.

Next, the pressure in the chamber is reduced. At this time, the vacuum degree in the chamber is 4000 Pa or less, preferably 2000 Pa or less, more preferably 1000 Pa or less, and further preferably 100 Pa or less. By reducing the pressure in this way, the electronic component 1 and the mask material 42 can be firmly attached.

Next, as shown in FIG. 21 , the upper mold 61 and the lower mold 62 are brought close together, and each electronic component 1 is placed in the recess 624. This allows the mask material 42 to be closely attached to the surface (bottom and side) of each electronic component 1. Next, if the upper mold 61 and the lower mold 62 are heated, the mask material 42 closely attached to the electronic component 1 is hardened to form a mask layer 13 on the bottom and side of the electronic component 1. Alternatively, the upper mold 61 and the lower mold 62 may be heated in advance and then brought close together.

Furthermore, it is also possible to apply pressure during heating. For example, the electronic component 1 and the mask material 42 can be pressurized by the upper mold 61 and the lower mold 62. The pressure at this time can be set to, for example, 1 to 10 MPa. In this way, the mask layer 13 can be formed on the electronic component 1 more firmly and reliably.

The heating temperature and curing time can be appropriately set according to the conditions of the selected resin adhesive, for example, 90 to 180 seconds at 100 to 180°C. Here, the curing time can be the time from the completion of mold tightening to the following peeling. Instead of the above, mold tightening can also be performed by pressing only at normal temperature or room temperature without heating.

22, when the upper mold 61 and the lower mold 62 are separated, the mask material 42 of the sheet 4 is peeled off from the base material 41 and transferred to the electronic component 1. In this way, the electronic component 1 having the mask layer 13 formed thereon is obtained.

Next, the carrier 2 is removed from the upper mold to separate the carrier 2 carrying the electronic components 1. The separation method is not particularly limited, and for example, each electronic component 1 is grasped by a pickup device to separate the electronic component and the carrier 2. Alternatively, the electronic component 1 and the carrier 2 can be separated by dicing. That is, the carrier 2 can be separated between adjacent electronic components 1 to separate them.

＜5. Characteristics＞

The positioning device constructed as described above has the following effects.

(1) In the above-mentioned pressurized bonding step, the mask material 42 needs to be correctly positioned on the lower module 62 so that the mask material 42 is correctly attached to the surface of each electronic component 1. In this embodiment, in the module C, the mask material 42 is arranged at a predetermined position on the sheet stage 52, so that when the sheet 4 is transferred from the sheet stage 52 to the lower module 62, the mask material 42 is already positioned on the lower module 62. Therefore, in the pressurized bonding step, the mask material 42 does not need to be positioned, and the mask material 42 can be correctly pressurized and bonded to the electronic component 1.

(2) In this embodiment, two sensors 532 and 533 are used to detect the edges of two sides orthogonal to the mask material 42. Therefore, the position of the mask material 42 in the surface direction can be accurately detected. Furthermore, when it is not within the specified range, at least one of the support mechanism 51 and the sheet stage 52 can be driven to configure the mask material 42 at a specified position on the sheet stage 52.

(3) The sensor unit 53 is provided with a first pressing portion 534, so when the sensor unit 53 is lowered, in addition to detecting the position of the mask material 42, the first pressing portion 534 can also be pressed against the sheet stage 52. In this way, the sheet 4 can be clamped by the first pressing portion 534 and the sheet stage 52. Therefore, there is no need to set up a separate mechanism for pressing the sheet 4 when cutting.

<6. Variations>

The above describes an embodiment of the present invention, but the present invention is not limited to the above embodiment, and various changes can be made as long as it does not deviate from its main purpose. For example, the following changes can be made. In addition, the main purpose of the following variation examples can be appropriately combined.

(1) In the above-mentioned embodiment, after the sheet 4 is unwound from the reel 40 and the mask material 42 is positioned on the sheet stage 52, it is cut to form a sheet-like sheet 4. However, it is also possible to prepare a sheet-like sheet 4 provided with a mask material 42 and position the sheet 4.

For example, as shown in FIG. 23, the conveying unit 7 having four rod-shaped adsorption components 71 is moved to the initial position of the stacked sheet material. Furthermore, after the four corners of the sheet material 4 arranged on the top are adsorbed by the adsorption component 71, it is arranged above the sheet stage 52 as shown in FIG. 24. Then, as shown in FIG. 25, the sensor unit 53 is arranged on the sheet material 4 to detect the position of the mask material 42. The detection method can adopt, for example, the method of using two sensors 532, 533 shown in the above-mentioned embodiment. At this time, if the position of the mask material 42 is not within the specified range, the conveying unit 7 is moved in the horizontal direction to position the mask material 42 at the specified position of the sheet stage 52.

Next, after the sensor unit 53 is withdrawn from above the sheet 4, the conveying unit 7 is lowered, and as shown in FIG. 26, after the sheet 4 is adsorbed on the sheet stage 52, the conveying unit 7 is separated from the sheet 4. In this way, the sheet 4 on which the mask material 42 is positioned is arranged on the sheet stage 52. Thereafter, the conveying unit 7 returns to the initial position where the sheet 4 is stacked, and the same process is repeated.

(2) In the above-mentioned embodiment, when the sheet 4 is positioned in the front-rear direction, the sheet table 52 is moved in the front-rear direction, but it is also possible to synchronize the roll holding part 511 and the feed part 512 while simultaneously moving in the front-rear direction to implement the front-rear direction positioning.

(3) In the above embodiment, the position of the mask material 42 is detected by two sensors 532 and 533, but the type, position and number of sensors are not particularly limited and can have various forms as long as they can detect the position of the mask material 42 relative to the sheet stage 52. Therefore, the sensor can be set not only on the base 531, but also on the sheet stage 52 and other components.

(4) In the above-mentioned embodiment, the first pressing portion 534 is provided on the base 531 of the sensor unit 53, but it can also be provided at other locations instead of being provided on the sensor unit 53.

(5) In the above embodiment, in module B, the electronic component 1 is arranged in the upper module 61, and the sheet 4 is arranged in the lower module 62. The opposite arrangement can also be adopted.

(6) The lower module 62 for arranging the sheet 4 may be in other forms, for example, it may be set as shown in FIG. 27 and FIG. 28. As shown in FIG. 27 and FIG. 28, the lower module 62 is not provided with a support plate, and a recess 625 is directly formed on the upper surface of the lower module 62. In addition to the suction port 623, a plurality of suction ports 626 are formed on the upper surface of the base 627 in order to adsorb the sheet 4. As shown in FIG. 28, these suction ports 626 are formed in a linear shape between the recesses 625 adjacent in one direction (the vertical direction of FIG. 28) so as to connect the recesses 625. The sheet 4 can be firmly fixed by the linear suction ports 626. In addition, the configuration of the lower module 62 may be other than this, and the position, shape and number of the suction ports are not particularly limited, as long as the sheet 4 can be firmly fixed.

(7) In the above embodiment, in module B, the electronic component 1 is arranged in the upper module 61, and the sheet 4 is arranged in the lower module 62. The opposite arrangement can also be adopted.

(8) In the above embodiment, the example of placing the pre-segmented electronic component 1 on the carrier 2 and then pressurizing and bonding the mask material 42 to the electronic component 1 is described, but it is not limited to this. For example, the semiconductor substrate is segmented by half cutting and arranged on the upper mold 61. Furthermore, in addition to arranging the sheet 4 on the lower mold 62 as described above, the upper mold 61 and the lower mold 62 are also brought close to each other, so that the mask material can be closely attached to the groove formed by half cutting and the top surface of the semiconductor substrate. In this way, a mask layer can be formed. Afterwards, by dicing along the groove, an electronic component with a mask layer formed and segmented can be obtained.

(9) In the above embodiment, the positioning device for positioning the mask material 42 in the sheet 4 having the base material 41 and the mask material 42 is described, and the mask material 42 is arranged on the base material 41, but the structure of the sheet 4 is not limited to this. That is, it can be applied to a general sheet in which a sheet-shaped functional material smaller than the base material is arranged on the base material. That is, it can be applied to a general procedure that requires high-precision positioning of a functional material with a specified function on the sheet stage 52. In addition, the procedure after positioning is also applicable to various procedures other than the above-mentioned pressure bonding.

1: Electronic parts

2: Carrier

3: Support components

31: Suction port

4: Sheet

40: Reel

41: Base material

42: Masking material (functional material)

51: Supporting organizations

511: reel holding part

512: Incoming Department

52: Sheet table

53: Sensor unit (detection unit)

531: Base

532: First sensor (sensor)

533: Second sensor (sensor)

534: First pushing part

54: Cutting mechanism (cutting part)

541: Cutter

542: Second pushing part

543: Support Department

61: Upper module (second module)

611: Attraction port

62: Lower module (first module)

621,627: base

622: Support board

623,626: Attraction port

624,625: concave part

7: Transport unit

71: Adsorption components

8: Transport body

81: Headquarters

811: Suction port

82: First holding part

83: Second holding part

11: Substrate

12: Chip Department

13: Mask layer

100: System for forming a mask layer for electronic components (system)

A,B,C:Module

FIG. 1 is a plan view schematically showing a resin molding device. FIG. 2 is a cross-sectional view of an electronic component. FIG. 3 is a cross-sectional view showing a carrier on which an electronic component is arranged. FIG. 4 is a cross-sectional view showing a support member supporting the carrier. FIG. 5 is a plan view of a sheet that has been wound from a reel. FIG. 6 is a side view of FIG. 5. FIG. 7 is a side view of a positioning device. FIG. 8 is a plan view of FIG. 7. FIG. 9 is a side view showing the movement of the positioning device. FIG. 10 is a side view showing the movement of the positioning device. FIG. 11 is a side view showing the movement of the positioning device. FIG. 12 is a side view showing the movement of the positioning device. FIG. 13 is a plan view showing the movement of the positioning device. FIG. 14 is a side view showing the action of the positioning device. FIG. 15 is a cross-sectional view showing the action of transferring a sheet from a sheet platform to a conveying body. FIG. 16 is a cross-sectional view showing the action of transferring a sheet from a sheet platform to a conveying body. FIG. 17 is a cross-sectional view showing the action of transferring a sheet from a sheet platform to a conveying body. FIG. 18 is a cross-sectional view showing the action of transferring a sheet from a sheet platform to a conveying body. FIG. 19 is a cross-sectional view showing the upper mold and the lower mold of module B. FIG. 20 is a cross-sectional view showing the step of pressurizing and bonding a sheet. FIG. 21 is a cross-sectional view showing the step of pressurizing and bonding a sheet. FIG. 22 is a cross-sectional view showing the step of pressurizing and bonding a sheet. FIG. 23 is a perspective view showing another example of the positioning device in action. FIG. 24 is a perspective view showing another example of the positioning device in action. FIG. 25 is a perspective view showing another example of the positioning device in action. FIG. 26 is a perspective view showing another example of the positioning device in action. FIG. 27 is a cross-sectional view showing another example of the lower mold of module B. FIG. 28 is a plan view showing another example of the lower mold of module B.

4: Sheet

40: Reel

41: Base material

42: Masking material (functional material)

51: Supporting organizations

511: reel holding part

512: Incoming Department

52: Sheet table

53: Sensor unit (detection unit)

531: Base

532: First sensor (sensor)

533: Second sensor (sensor)

534: First pushing part

54: Cutting mechanism

541: Cutter

542: Second pushing part

543: Support Department

Claims (7)

A sheet positioning device, the sheet having a long strip-shaped substrate and a sheet-shaped electromagnetic wave mask material arranged on the substrate at a certain interval; the positioning device comprises: a support mechanism that supports the sheet; a sheet stage that fixes the sheet; and a detection unit that detects the position of the mask material in the surface direction of the sheet supported by the support mechanism; after the sheet is arranged on the sheet stage, the mask material is arranged at a predetermined position with respect to the sheet stage based on the position of the mask material detected by the detection unit, and after the sheet is positioned so that the mask material moves relative to the sheet stage, the sheet is fixed to the sheet stage. The sheet positioning device as described in claim 1, wherein the support mechanism comprises: a roll holding portion for holding the roll on which the sheet has been rolled up so as to be rotatable, and a feeding portion for holding the end of the sheet and rolling out the sheet; a plurality of mask materials are arranged at intervals on the substrate of the sheet in the rolling direction; the support mechanism further comprises a cutting portion for cutting the rolled sheet from the roll after the positioning of the rolled sheet is completed. The sheet positioning device as described in claim 2, wherein the detection unit is configured to detect the position of the edge of the mask material in a first direction of rolling out the sheet and in a second direction orthogonal to the first direction. The sheet positioning device as described in claim 3, wherein the detection section has a pushing section for pushing the rolled sheet; the detection section is configured to move up and down from above the rolled sheet; and after the positioning, the detection section is lowered so that the cutting section cuts the sheet while the pushing section and the sheet table are clamping the sheet. A sheet positioning device as described in any one of claims 1 to 4, wherein the positioning is performed by moving at least one of the support mechanism and the sheet stage. A method for positioning a sheet, the sheet having a long strip substrate and a sheet-shaped electromagnetic wave mask material arranged on the substrate at a certain interval; the method comprises: a step of arranging the sheet above a sheet stage; a step of detecting the position of the mask material in the sheet in the surface direction; a step of positioning the sheet relative to the sheet stage in such a way that the mask material is arranged at a predetermined position with respect to the sheet stage based on the detected position of the mask material; and a step of fixing the sheet to the sheet stage after the positioning is completed. A method for forming a mask layer for an electronic component, comprising the positioning method described in claim 6; the forming method comprises: a step of preparing a first mold and a second mold facing each other; after the positioning method described in claim 6, the sheet is conveyed from the sheet stage by a conveying mechanism, and the sheet is arranged on the setting surface of the first mold with the mask facing the second mold; a step of arranging a plurality of electronic components on a carrier at a predetermined interval; a step of arranging the carrier on the setting surface of the second mold with the electronic components facing the first mold; and a step of bringing the first mold and the second mold close to pressurize and bond the mask to the surface of the electronic component, thereby forming a mask layer on the surface of the electronic component.