TWI894206B - 帶有支柱結構之壓電裝置及其製造方法 - Google Patents

帶有支柱結構之壓電裝置及其製造方法

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Publication number
TWI894206B
TWI894206B TW110105539A TW110105539A TWI894206B TW I894206 B TWI894206 B TW I894206B TW 110105539 A TW110105539 A TW 110105539A TW 110105539 A TW110105539 A TW 110105539A TW I894206 B TWI894206 B TW I894206B
Authority
TW
Taiwan
Prior art keywords
pillars
piezoelectric
piezoelectric layer
substrate
layer
Prior art date
Application number
TW110105539A
Other languages
English (en)
Chinese (zh)
Other versions
TW202203478A (zh
Inventor
勞倫斯 Ｃ Ｊ Ｍ 皮特斯
珍 勞倫斯 Ｐ Ｊ 范德史汀
羅伊 Ｇ Ｆ 沃貝克
保羅 Ｌ Ｍ Ｊ 凡涅爾
葛溫 Ｈ 吉林克
Original Assignee
荷蘭商荷蘭Ｔｎｏ自然科學組織公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荷蘭商荷蘭Ｔｎｏ自然科學組織公司 filed Critical 荷蘭商荷蘭Ｔｎｏ自然科學組織公司
Publication of TW202203478A publication Critical patent/TW202203478A/zh
Application granted granted Critical
Publication of TWI894206B publication Critical patent/TWI894206B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • B06B1/0629—Square array
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0688—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction with foil-type piezoelectric elements, e.g. PVDF
    • B06B1/0692—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction with foil-type piezoelectric elements, e.g. PVDF with a continuous electrode on one side and a plurality of electrodes on the other side
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/04—Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning
    • H10N30/045—Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning by polarising
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/084—Shaping or machining of piezoelectric or electrostrictive bodies by moulding or extrusion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/09—Forming piezoelectric or electrostrictive materials
    • H10N30/098—Forming organic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/857—Macromolecular compositions

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Micromachines (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
TW110105539A 2020-02-21 2021-02-18 帶有支柱結構之壓電裝置及其製造方法 TWI894206B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP20158759.9 2020-02-21
EP20158759.9A EP3869575A1 (fr) 2020-02-21 2020-02-21 Dispositif piézoélectrique avec structure de pilier et procédé de fabrication

Publications (2)

Publication Number Publication Date
TW202203478A TW202203478A (zh) 2022-01-16
TWI894206B true TWI894206B (zh) 2025-08-21

Family

ID=69723864

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110105539A TWI894206B (zh) 2020-02-21 2021-02-18 帶有支柱結構之壓電裝置及其製造方法

Country Status (6)

Country Link
US (1) US20230076265A1 (fr)
EP (2) EP3869575A1 (fr)
JP (1) JP7701367B2 (fr)
CN (1) CN115136333B (fr)
TW (1) TWI894206B (fr)
WO (1) WO2021167446A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
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KR102805671B1 (ko) * 2020-03-31 2025-05-09 엘지디스플레이 주식회사 진동발생장치 및 이를 구비한 표시장치
CA3131707A1 (fr) * 2020-09-24 2022-03-24 First Quality Tissue, Llc Systemes et methodes pour l'application de la chimie de surface a une lingette de bain, a un papier-mouchoir et a un essuie-tout
EP4216294A1 (fr) 2022-01-25 2023-07-26 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Procédé de moulage d'une dispositif de pilier piézoélectrique
EP4335558A1 (fr) 2022-09-08 2024-03-13 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Dispositif acoustique et son procédé de fabrication
FR3158013A1 (fr) * 2023-12-31 2025-07-04 Arkema France Procede de transfert de circuit electronique comprenant un transducteur encapsule, dispositif de transfert et procede de fabrication du dispositif,et composite obtenu apres transfert

Citations (3)

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US20150236620A1 (en) * 2014-01-21 2015-08-20 Xi'an Jiaotong University Method for manufacturing energy harvester comprising piezoelectric polymer microstructure array
TWI562412B (en) * 2010-12-10 2016-12-11 Commissariat Energie Atomique Process for fabricating an acoustic wave resonator comprising a suspended membrane
TW201946380A (zh) * 2018-03-29 2019-12-01 法商佛雷克恩股份有限公司 複合基板上的表面聲波裝置

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US5553035A (en) * 1993-06-15 1996-09-03 Hewlett-Packard Company Method of forming integral transducer and impedance matching layers
JP3262076B2 (ja) * 1997-10-03 2002-03-04 株式会社村田製作所 圧電共振子、圧電共振子の周波数調整方法および通信機器
US7486004B2 (en) * 2001-10-30 2009-02-03 1 . . . Limited Piezolelectric devices
US7109642B2 (en) * 2003-11-29 2006-09-19 Walter Guy Scott Composite piezoelectric apparatus and method
WO2005054148A2 (fr) * 2003-11-29 2005-06-16 Cross Match Technologies, Inc. Dispositif piezo-electrique et son procede de fabrication
JP5139672B2 (ja) * 2006-02-07 2013-02-06 富士フイルム株式会社 積層型圧電素子及びその製造方法
JP2008244859A (ja) * 2007-03-27 2008-10-09 Toshiba Corp アレイ式超音波プローブおよび超音波診断装置
US8840559B2 (en) * 2008-03-14 2014-09-23 Konica Minolta Medical & Graphic, Inc. Organic piezoelectric material, ultrasonic oscillator using the material, method for manufacturing the ultrasonic oscillator, ultrasonic probe, and ultrasonic medical diagnostic imaging device
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EP2264802A1 (fr) * 2009-06-19 2010-12-22 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Procédé de fabrication d'élément piézoélectrique en forme de film principal
JP5633200B2 (ja) * 2010-06-08 2014-12-03 株式会社リコー 圧電アクチュエータ、液体吐出ヘッド及び画像形成装置
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TWI562412B (en) * 2010-12-10 2016-12-11 Commissariat Energie Atomique Process for fabricating an acoustic wave resonator comprising a suspended membrane
US20150236620A1 (en) * 2014-01-21 2015-08-20 Xi'an Jiaotong University Method for manufacturing energy harvester comprising piezoelectric polymer microstructure array
TW201946380A (zh) * 2018-03-29 2019-12-01 法商佛雷克恩股份有限公司 複合基板上的表面聲波裝置

Also Published As

Publication number Publication date
EP3869575A1 (fr) 2021-08-25
CN115136333B (zh) 2026-01-02
TW202203478A (zh) 2022-01-16
CN115136333A (zh) 2022-09-30
EP4107798A1 (fr) 2022-12-28
US20230076265A1 (en) 2023-03-09
JP2023515114A (ja) 2023-04-12
WO2021167446A1 (fr) 2021-08-26
JP7701367B2 (ja) 2025-07-01
EP4107798C0 (fr) 2025-05-14
EP4107798B1 (fr) 2025-05-14

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