TWI901819B - 有機無機混合材料及複合材料 - Google Patents
有機無機混合材料及複合材料Info
- Publication number
- TWI901819B TWI901819B TW110144624A TW110144624A TWI901819B TW I901819 B TWI901819 B TW I901819B TW 110144624 A TW110144624 A TW 110144624A TW 110144624 A TW110144624 A TW 110144624A TW I901819 B TWI901819 B TW I901819B
- Authority
- TW
- Taiwan
- Prior art keywords
- organic
- formula
- inorganic
- inorganic mixture
- materials
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/16—Halogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-000470 | 2021-01-05 | ||
| JP2021000470A JP7625418B2 (ja) | 2021-01-05 | 2021-01-05 | 有機無機ハイブリッド材料及び複合材料 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202229417A TW202229417A (zh) | 2022-08-01 |
| TWI901819B true TWI901819B (zh) | 2025-10-21 |
Family
ID=82357241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110144624A TWI901819B (zh) | 2021-01-05 | 2021-11-30 | 有機無機混合材料及複合材料 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7625418B2 (ja) |
| KR (1) | KR102903822B1 (ja) |
| CN (1) | CN116635482A (ja) |
| TW (1) | TWI901819B (ja) |
| WO (1) | WO2022149391A1 (ja) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201823363A (zh) * | 2016-07-19 | 2018-07-01 | 大賽璐股份有限公司 | 硬化性樹脂組成物、其硬化物、及半導體裝置 |
| TW201938689A (zh) * | 2018-03-12 | 2019-10-01 | 美商陶氏有機矽公司 | 可固化聚矽氧組成物及其經固化產物 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0521500A1 (de) * | 1991-07-05 | 1993-01-07 | Hoechst Schering AgrEvo GmbH | Salze von Pyridylsulfonylharnstoffen als Herbizide und Pflanzenwachstumsregulatoren, Verfahren zu ihrer Herstellung und ihre Verwendung |
| JP2009215344A (ja) * | 2008-03-07 | 2009-09-24 | Central Glass Co Ltd | 熱硬化性有機無機ハイブリッド透明材料 |
| US8809478B2 (en) * | 2010-06-11 | 2014-08-19 | Adeka Corporation | Silicon-containing curable composition, cured product of the silicon-containing curable composition and lead frame substrate formed of the silicon-containing curable composition |
| CN105339418B (zh) * | 2013-04-24 | 2018-08-28 | Dic株式会社 | 无机微粒复合体和其制造方法、组合物及固化物 |
| JP6623505B2 (ja) | 2014-05-20 | 2019-12-25 | 東洋インキScホールディングス株式会社 | 無機微粒子分散体の製造方法、無機微粒子分散体、塗膜、および積層体 |
| JP2017210385A (ja) | 2016-05-24 | 2017-11-30 | 三菱ケミカル株式会社 | 疎水化無機ナノ粒子、及び無機ナノ粒子分散液の製造方法 |
| KR20180032108A (ko) * | 2016-09-21 | 2018-03-29 | 엘지전자 주식회사 | 고신뢰성 유무기 하이브리드 양자점 복합체 및 이의 제조방법 |
| JP6702233B2 (ja) * | 2017-03-09 | 2020-05-27 | 信越化学工業株式会社 | 付加硬化型オルガノポリシロキサン樹脂組成物、該組成物の硬化物及び該硬化物を有する半導体装置 |
-
2021
- 2021-01-05 JP JP2021000470A patent/JP7625418B2/ja active Active
- 2021-11-30 TW TW110144624A patent/TWI901819B/zh active
- 2021-12-07 CN CN202180088311.6A patent/CN116635482A/zh active Pending
- 2021-12-07 WO PCT/JP2021/044916 patent/WO2022149391A1/ja not_active Ceased
- 2021-12-07 KR KR1020237026568A patent/KR102903822B1/ko active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201823363A (zh) * | 2016-07-19 | 2018-07-01 | 大賽璐股份有限公司 | 硬化性樹脂組成物、其硬化物、及半導體裝置 |
| TW201938689A (zh) * | 2018-03-12 | 2019-10-01 | 美商陶氏有機矽公司 | 可固化聚矽氧組成物及其經固化產物 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116635482A (zh) | 2023-08-22 |
| TW202229417A (zh) | 2022-08-01 |
| JP2022105872A (ja) | 2022-07-15 |
| WO2022149391A1 (ja) | 2022-07-14 |
| JP7625418B2 (ja) | 2025-02-03 |
| KR20230127340A (ko) | 2023-08-31 |
| KR102903822B1 (ko) | 2025-12-26 |
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