TWI909860B - Damping structure and electronic device - Google Patents

Abstract

An electronic device includes a casing, a hard disk, at least one fan and at least one damping structure. The hard disk is disposed in the casing. The at least one fan is disposed in the casing. The at least one shock absorbing structure is located between the hard disk and the at least one fan, and includes an elastic component and a mass block. The elastic component includes a mounting portion, a supporting portion and a swinging portion. The mounting portion is disposed on the casing. Opposite ends of the support portion are respectively connected to the mounting portion and the swing portion. The mounting portion and the swinging portion are located on the same side of the supporting portion. The swinging portion can swing relative to the supporting portion and the mounting portion. The mass block is disposed on the swing portion.

Description

Vibration damping structure and electronic device

This invention relates to a vibration damping structure and an electronic device, particularly a vibration damping structure and an electronic device having an elastic element and a mass block.

With the rapid development of technology, the computing power of processors has increased significantly, but it has also generated a lot of heat. In order to ensure that the processor is not damaged by high heat, fans need to be installed on electronic products to dissipate the excessive heat of the processor and enable the processor to operate within a certain operating temperature range.

The high-speed operation of a fan generates vibrations. When these vibrations are transmitted to the hard drive inside an electronic product, they cause a position error signal (PES), affecting the accuracy of data retrieval, reducing IOPS (Input/Output Per Second), and consequently decreasing the overall performance of the server. This can even lead to data loss. Therefore, vibration suppression is crucial in the server field. Manufacturers typically install vibration damping components inside the casing to absorb the vibrations generated by the fan. However, these components are currently expensive. Furthermore, the numerous components and limited space within electronic products make them difficult to integrate. Furthermore, current vibration damping components are not compatible with different housing specifications. This means manufacturers must select different sized vibration dampers to match different housing specifications, increasing assembly costs. Therefore, finding a vibration damping component that balances low assembly costs with effective damping is one of the problems researchers need to solve.

The present invention provides a vibration damping structure and electronic device, thereby enabling the vibration damping component to achieve both low assembly cost and vibration damping effect.

One embodiment of the present invention discloses a vibration damping structure disposed within a housing and comprising an elastic element and a mass block. The elastic element comprises a mounting portion, a support portion, and a swinging portion. The mounting portion is disposed within the housing. Opposite ends of the support portion are respectively connected to the mounting portion and the swinging portion. The mounting portion and the swinging portion are located on the same side of the support portion. The swinging portion is swayable relative to the support portion and the mounting portion. The mass block is disposed within the swinging portion.

Another embodiment of the present invention discloses an electronic device comprising a casing, a hard drive, at least one fan, and at least one vibration damping structure. The hard drive is disposed within the casing. At least one fan is disposed within the casing. At least one vibration damping structure is located between the hard drive and the at least one fan, and includes an elastic member and a mass block. The elastic member includes a mounting portion, a supporting portion, and a oscillating portion. The mounting portion is disposed within the casing. Opposite ends of the supporting portion are respectively connected to the mounting portion and the oscillating portion. The mounting portion and the oscillating portion are located on the same side of the supporting portion. The oscillating portion is oscillating relative to the supporting portion and the mounting portion. The mass block is disposed within the oscillating portion.

According to the vibration damping structure and electronic device of the above embodiments, the two opposite ends of the support portion of the elastic member are respectively connected to the mounting portion and the swing portion, and the mounting portion and the swing portion are on the same side of the support portion, that is, the elastic member is, for example, in the shape of a "7". The swing portion can swing relative to the support portion and the mounting portion. In conjunction with the mass adjustment of the mass block and the position of the mass block in the assembly slot, the natural frequency of the vibration damping structure can be adjusted accordingly, thus ensuring that the electronic device can still effectively dampen vibration under different operating conditions. When the vibration frequency generated by these fans matches the natural frequency of these vibration damping structures, a resonance phenomenon occurs, resulting in a significant increase in amplitude. The vibrational energy generated by these fans interacts with the elastic components of these vibration-damping structures along their transmission path. Specifically, the vibrational energy generated by the fans during operation is transmitted along these vibration-damping structures. By incorporating elastic components, the oscillating element can effectively absorb vibrational energy and convert it into kinetic energy, thereby limiting the vibration generated by the fans to these vibration-damping structures to dissipate, for example, 71% of the total vibrational energy and, for example, 53% of the peak vibrational energy. Furthermore, through magnetic attraction, these vibration-damping structures can be easily installed in the narrow space between the hard drive and the fans, avoiding obstructions, and are suitable for various case sizes. In this way, the vibration damping structure can achieve both low assembly costs and vibration damping effect.

The above description of the contents of this invention and the following description of the embodiments are used to demonstrate and explain the principles of this invention, and to provide a further explanation of the scope of the patent application of this invention.

Please refer to Figure 1. Figure 1 is a schematic plan view of the electronic device according to an embodiment of the present invention. The electronic device 10 of this embodiment includes a casing 20, a hard drive 30, multiple fans 40, and multiple vibration damping structures 50. The hard drive 30 and the fans 40 are disposed within the casing 20. The vibration damping structures 50 are disposed between the hard drive 30 and the fans 40 using the concept of local resonators, so that the vibrations generated by the fans 40 interact with the vibration damping structures 50 in their transmission path, thereby mitigating the vibrations generated when the fans 40 are operating. In this way, the problem of reduced hard drive read efficiency (IOPS) can be avoided.

These vibration damping structures 50 induce resonance in local resonators when external vibration frequencies approach their resonant frequencies, forming a vibration bandgap. In other words, the local resonance is caused by the interaction between the local resonant mass unit and the elastic waves of the elastic element, thereby enhancing the vibration suppression effect. For example, these vibration damping structures 50 can absorb vibration frequencies of, for example, 300 Hz to 400 Hz and 1200 Hz to 1500 Hz. Among them, the fundamental frequency and its overtones in the range of 300 Hz to 400 Hz are, for example, the fundamental frequency that causes the fans 40 to vibrate when they are running, and the range of 1200 Hz to 1500 Hz is, for example, a sensitive frequency band in which the hard drive 30 is easily affected by vibration.

Please refer to Figures 2 through 4. Figure 2 is a three-dimensional schematic diagram of the vibration damping structure of the electronic device in Figure 1. Figure 3 is a plan view of the vibration damping structure in Figure 2. Figure 4 is an exploded view of the vibration damping structure in Figure 2.

Each of these damping structures 50 includes an elastic element 51 and a mass block 52. That is, the elastic element 51 and the mass block 52 together form a resonator, and the natural frequency of the resonator follows the formula: f = Where f is the natural frequency of the resonator (unit: Hertz, Hz), k is the stiffness of the elastic element 51 (unit: Newton/meter, N/m), and m is the mass of the mass block 52 (unit: kilogram, kg).

The elastic member 51 includes a mounting portion 511, a support portion 512, and a swing portion 513. The mounting portion 511 is disposed on the housing 20. Specifically, the mounting portion 511 is fixed to the housing 20, for example, by a magnetic element 60. The opposite ends of the support portion 512 are respectively connected to the mounting portion 511 and the swing portion 513, and the mounting portion 511 and the swing portion 513 are located on the same side of the support portion 512. The swing portion 513 can swing relative to the support portion 512 and the mounting portion 511.

The elastic element 51 is made of materials such as metal, acrylic, resin, or plastic. Please also refer to Figure 6 for now. Figure 6 is a side view of the elastic element of the damping structure in Figure 2. The length L2 of the oscillating part 513 is, for example, greater than the length L1 of the mounting part 511, making the elastic element 51, for example, shaped like a "7".

A mass block 52 is disposed in the oscillating part 513. Specifically, the oscillating part 513 has an assembly groove 5131. The mass block 52 has a surface 521 and an assembly post 522. The surface 521 is, for example, a plane. The assembly post 522 is, for example, a bolt, and protrudes from the surface 521. Furthermore, when the thickness of the oscillating part 513 is small enough that the assembly post 522 passes through the oscillating part 513, the mass block 52 can be additionally fixed by a nut (not shown) at the point where the assembly post 522 passes through the oscillating part 513, that is, by fixing the mass block 52 by a nut to one side of the oscillating part 513 away from the mass block 52. Furthermore, when the mass of mass block 52 is small, the mass of the nut and the mass of mass block 52 can be included together to adjust the natural frequency.

The assembly column 522 moves relative to the oscillating part 513 in the assembly slot 5131. The assembly position of the mass block 52 in the assembly slot 5131 can be adjusted according to the target vibration frequency to be absorbed, so as to ensure that the natural frequency of these vibration damping structures 50 matches the target vibration frequency. Therefore, when the vibration generated by these fans 40 is transmitted to these vibration damping structures 50, if the natural frequency of these vibration damping structures 50 matches the fan vibration frequency, a resonance phenomenon will occur, causing these vibration damping structures 50 to produce a strong amplitude enhancement effect. In this regard, by increasing the length L2 of the oscillating part 513, the stiffness of the equivalent elastic member 51 can be reduced, thereby reducing the natural frequency of the vibration damping structure 50. In addition, the mass block 52 with a corresponding mass can be selected according to the actual vibration frequency.

In this embodiment, for example, for the target vibration frequency of the fan 40, which is 300 Hz to 400 Hz, the mass of the mass block 52 can be set to 42 grams, and the distance L4 between the assembly column 522 of the mass block 52 and the end point of the assembly slot 5131 near the support 512 is 18 mm, so that the natural frequency of the vibration damping structure 50 matches the target vibration frequency, thereby the vibration damping structure 50 can effectively absorb the vibration energy generated by the fan 40. For example, for frequencies that are more sensitive to hard drives, such as 1450 Hz to 1550 Hz, the mass of the mass block 52 can be set to 48 grams, and the distance between the assembly post 522 of the mass block 52 and the end of the assembly slot 5131 near the support part 512 can be 6 mm. This makes the natural frequency of the vibration damping structure 50 match the sensitive frequency, so that the vibration damping structure 50 can effectively absorb the vibration energy of the sensitive frequency and reduce the impact on the hard drive. In other words, by adjusting the distance between the assembly column 522 of the mass block 52 and the end of the assembly groove 5131 near the support 512, the natural frequency of the resonator can be adjusted accordingly. The greater this distance, the smaller the stiffness of the elastic element 51, and the lower the natural frequency of the resonator. On the other hand, the greater the mass of the mass block 52, the lower the natural frequency of the resonator.

In this embodiment, since the two opposite ends of the support portion 512 of the elastic member 51 are respectively connected to the mounting portion 511 and the swing portion 513, and the mounting portion 511 and the swing portion 513 are located on the same side of the support portion 512, that is, the elastic member 51 is, for example, in the shape of a 7, and the swing portion 513 can swing relative to the support portion 512 and the mounting portion 511, and in conjunction with the mass adjustment of the mass block 52 and the position of the mass block 52 in the assembly slot 5131, the natural frequency of these vibration damping structures 50 can be adjusted accordingly, so that the electronic device 10 can still effectively dampen vibration under different operating conditions. When the vibration frequency generated by the fans 40 matches the natural frequency of the damping structures 50, resonance occurs, resulting in a significant increase in amplitude. The vibrational energy generated by the fans 40 interacts with the elastic elements 51 of the damping structures 50 along its transmission path. Specifically, the vibrational energy of the fans 40 during operation is transmitted along the damping structures 50. By incorporating the elastic element 51, the oscillating part 513 can effectively absorb vibrational energy and convert it into kinetic energy, thereby limiting the vibration generated by the fans 40 during operation to the damping structure 50, dissipating, for example, 71% of the total vibrational energy and, for example, 53% of the peak vibrational energy. Furthermore, through the attraction of the magnetic element 60, the damping structure 50 can be easily installed in the narrow space between the hard drive 30 and the fans 40, avoiding obstacles, and is applicable to different specifications of the chassis 20. In this way, the damping structure 50 can achieve both low assembly cost and effective vibration reduction.

Furthermore, since the assembly column 522 is adjustablely assembled in the assembly slot 5131 through its relative movement to the swinging part 513, the assembly position of the mass block 52 in the assembly slot 5131 can be adjusted according to the actual vibration frequency. In this way, the flexibility of these vibration damping structures 50 in vibration damping function can be further improved.

In this embodiment, the mass block 52 has a mounting groove 523 on one side away from the assembly column 522. The mounting groove 523 is, for example, threaded (not shown) and is used for mounting other mass blocks 52 to adjust the overall mass.

In this embodiment, there are multiple fans 40 and multiple vibration damping structures 50, but this is not a limitation. In other embodiments, there may be only one fan and one vibration damping structure. In other embodiments, the vibration damping structure may consist of multiple vibration damping structures with different natural frequencies spaced apart in the housing.

In this embodiment, the mounting part 511 is fixed to the housing 20 by magnetic component 60, but this is not the only embodiment. In other embodiments, the mounting part may not be fixed by magnetic component, but may be provided with a notch so that the mounting part can be locked to the housing by a locking accessory provided in the notch.

Please refer to Figures 5 and 6. Figure 5 is a top view of the elastic element of the vibration damping structure in Figure 2. In this embodiment, when the natural frequency of these vibration damping structures 50 is 300 Hz to 400 Hz, the ratio of the length L2 of the oscillating part 513 to the length L1 of the mounting part 511 of the elastic element 51 can be between 3 and 6, and the ratio of the length L2 of the oscillating part 513 of the elastic element 51 to the length L3 of the assembly groove 5131 can be between 1.5 and 1.8. The ratio of the length L1 of the mounting part 511 to the width W2 of the elastic member 51 can be between 1.7 and 2.3; the ratio of the length L1 of the mounting part 511 to the height H of the elastic member 51 can be between 1.1 and 1.7; the ratio of the length L2 of the mounting part 513 to the height H of the elastic member 51 can be between 4 and 4.6; and the ratio of the length L3 of the assembly groove 5131 to the width W3 of the assembly groove 5131 can be between 6 and 6.6. In the preferred embodiment of this invention, the height H of the elastic member 51 is, for example, between 6 mm and 8 mm, but the invention is not limited to this. Specifically, the natural frequency and oscillation mode of these vibration damping structures 50 can be changed by adjusting the length L2 of the oscillating part 513, the position of the mass block 52 in the assembly slot 5131, and the mass of the mass block 52.

According to the vibration damping structure and electronic device of the above embodiment, the two opposite ends of the support portion of the elastic member are respectively connected to the mounting portion and the swing portion, and the mounting portion and the swing portion are on the same side of the support portion, that is, the elastic member is, for example, in the shape of a "7", and the swing portion can swing relative to the support portion and the mounting portion. In conjunction with the mass adjustment of the mass block and the position of the mass block in the assembly slot, the natural frequency of these vibration damping structures can be adjusted accordingly, thus ensuring that the electronic device can still effectively dampen vibrations under different operating conditions. When the vibration frequency generated by these fans matches the natural frequency of these vibration damping structures, a resonance phenomenon occurs, resulting in a significant increase in amplitude. The vibrational energy generated by these fans interacts with the elastic components of the damping structure along its transmission path. Specifically, the vibrational energy generated by the fans during operation is transmitted along these damping structures. By incorporating elastic components, the oscillating element can effectively absorb vibrational energy and convert it into kinetic energy, thereby limiting the vibration generated by the fans to these damping structures to dissipate, for example, 71% of the total vibrational energy and, for example, 53% of the peak vibrational energy. Furthermore, through magnetic attraction, these damping structures can be easily installed in the narrow space between the hard drive and the fans, avoiding obstructions, and are suitable for various case sizes. In this way, the vibration damping structure can achieve both low assembly costs and vibration damping effect.

Furthermore, since the assembly column can be adjusted and assembled in the assembly slot through the relative swinging part, the assembly position of the mass block in the assembly slot can be adjusted according to the actual vibration frequency. In this way, the flexibility of these vibration damping structures in vibration damping function can be further improved.

In one embodiment of the present invention, the vibration damping structure of the present invention can be used as a server, which can be used for artificial intelligence (AI) computing, edge computing, or as a 5G server, cloud server, or vehicle network server.

Although the present invention has been disclosed above with reference to the aforementioned embodiments, it is not intended to limit the present invention. Anyone skilled in similar art may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the scope of the patent application attached to this specification.

10: Electronic Device 20: Case 30: Hard Drive 40: Fan 50: Vibration Damping Structure 51: Elastic Component 511: Mounting Section 512: Support Section 513: Swinging Section 5131: Assembly Slot 52: Mass Block 521: Surface 522: Assembly Post 523: Mounting Slot 60: Magnetic Component H: Height L1~L3: Length L4: Distance W2,W3: Width

Figure 1 is a plan view of the electronic device according to an embodiment of the present invention. Figure 2 is a perspective view of the vibration damping structure of the electronic device of Figure 1. Figure 3 is a plan view of the vibration damping structure of Figure 2. Figure 4 is an exploded view of the vibration damping structure of Figure 2. Figure 5 is a top view of the elastic member of the vibration damping structure of Figure 2. Figure 6 is a side view of the elastic member of the vibration damping structure of Figure 2.

50: Vibration damping structure

51: Elastic component

511: Installation Department

512: Support Unit

513: Pendulum Department

5131: Assembly slot

52: Mass Block

522: Assembly Column

Claims (9)

A vibration damping structure is disposed within a housing. The vibration damping structure comprises: an elastic member including a mounting portion, a support portion, and a swing portion; the mounting portion is disposed on the housing; opposite ends of the support portion are respectively connected to the mounting portion and the swing portion; the mounting portion and the swing portion are located on the same side of the support portion; the swing portion is oscillating relative to the support portion and the mounting portion; and a mass block disposed on the swing portion. The ratio of the length of the oscillating part to the length of the mounting part is between 3 and 6, the ratio of the length of the oscillating part to the width of the oscillating part is between 1.7 and 2.3, the ratio of the length of the mounting part to the height of the elastic member is between 1.1 and 1.7, and the ratio of the length of the oscillating part to the height of the elastic member is between 4 and 4.6. The vibration damping structure as described in claim 1, wherein the oscillating part has an assembly groove, and the mass block has an assembly column that is adjustablely assembled in the assembly groove by moving relative to the oscillating part in the assembly groove. The vibration damping structure as described in claim 2, wherein the ratio of the length of the oscillating part to the length of the assembly groove is between 1.5 and 1.8, and the ratio of the length of the assembly groove to the width of the assembly groove is between 6 and 6.6. The vibration damping structure as described in claim 1, wherein the length of the oscillating part is greater than the length of the mounting part. An electronic device includes: a housing; a hard disk disposed within the housing; at least one fan disposed within the housing; and at least one vibration damping structure located between the hard disk and the at least one fan, the at least one vibration damping structure comprising: an elastic member including a mounting portion, a support portion, and a oscillating portion, the mounting portion being disposed within the housing, the opposite ends of the support portion being respectively connected to the mounting portion and the oscillating portion, the mounting portion and the oscillating portion being located on the same side of the support portion, the oscillating portion being oscillating relative to the support portion and the mounting portion; and a mass block disposed within the oscillating portion. The electronic device as claimed in claim 5, wherein the oscillating part has an assembly slot and the mass block has an assembly post that is adjustablely assembled in the assembly slot by moving relative to the oscillating part in the assembly slot. The electronic device as described in claim 6, wherein the ratio of the length of the oscillating part to the length of the assembly slot is between 1.5 and 1.8, and the ratio of the length of the assembly slot to the width of the assembly slot is between 6 and 6.6. The electronic device as described in claim 5, wherein the length of the oscillating part is greater than the length of the mounting part. The electronic device as described in claim 5, wherein the ratio of the length of the oscillating part to the length of the mounting part is between 3 and 6, the ratio of the length of the oscillating part to the width of the oscillating part is between 1.7 and 2.3, the ratio of the length of the mounting part to the height of the elastic member is between 1.1 and 1.7, and the ratio of the length of the oscillating part to the height of the elastic member is between 4 and 4.6.