TWI917112B - Method of diffusion bonding workpiece - Google Patents

Method of diffusion bonding workpiece

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Publication number
TWI917112B
TWI917112B TW113148421A TW113148421A TWI917112B TW I917112 B TWI917112 B TW I917112B TW 113148421 A TW113148421 A TW 113148421A TW 113148421 A TW113148421 A TW 113148421A TW I917112 B TWI917112 B TW I917112B
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Taiwan
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area
workpieces
joined
hot pressing
pressure
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TW113148421A
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Chinese (zh)
Inventor
吳毓珣
李名言
管琪芸
陳怡君
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中國鋼鐵股份有限公司
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Publication of TWI917112B publication Critical patent/TWI917112B/en

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Abstract

A method of diffusion bonding workpiece is provided. The method includes disposing a workpiece to be joined in a hot-pressing equipment, in which the workpiece to be joined includes two substances to be joined; and performing a hot-pressing operation to the workpiece to be joined, in which the hot-pressing operation includes a first-stage hot-pressing step and a second-stage hot-pressing step. Various stages of hot-pressing steps are performed to bond the workpiece to be joined with different briquettes. Therefore, a bonding strength and a bonding rate of the workpiece can be increased.

Description

擴散接合工件的方法Methods for diffusion bonding of workpieces

本發明是關於一種擴散接合工件的方法,特別是關於一種利用多階段熱壓之擴散接合工件的方法。This invention relates to a method for diffusion bonding of workpieces, and more particularly to a method for diffusion bonding of workpieces using multi-stage hot pressing.

擴散接合是一種固態接合技術,其一般是在真空環境中施加高溫和高壓,以使兩待接合工件(例如金屬工件)的接觸面距離縮短至原子間距,以使原子間相互嵌入而擴散接合,藉以接合金屬及陶瓷等材料。相較於傳統的接合技術,擴散接合可提供更堅固的接合面並減少工件的變形。舉例而言,真空擴散焊接係在特定的溫度和壓力下,使兩個物體或多個物體的接觸表面發生塑性變形,並在保溫/保壓或保溫/加壓一段時間後,使待焊表面的原子互相擴散,而實現表面的冶金結合。Diffusion bonding is a solid-state bonding technique that typically involves applying high temperature and pressure in a vacuum environment to reduce the distance between the contact surfaces of two workpieces (e.g., metal workpieces) to the interatomic distance, allowing atoms to intercalate and diffuse, thus bonding materials such as metals and ceramics. Compared to traditional bonding techniques, diffusion bonding provides a stronger joint surface and reduces workpiece deformation. For example, vacuum diffusion welding involves plastic deformation of the contact surfaces of two or more objects under specific temperature and pressure conditions. After holding at temperature/pressure or temperature/pressure for a period of time, the atoms on the surfaces to be welded diffuse, achieving metallurgical bonding of the surfaces.

擴散接合技術的優勢係不需使用焊劑,且接合面無應力效應,且物料強度跟耐腐蝕性能都跟原材料無異。擴散接合技術的應用領域包含模具鑲件、熱交換器、汽車零部件、航空零部件、醫療設備及植入器具和貴金屬手飾等。工件是否成功接合的關鍵在於溫度和壓力的條件。The advantages of diffusion bonding technology are that it does not require flux, there is no stress effect on the joint surface, and the material strength and corrosion resistance are identical to the original material. Applications of diffusion bonding technology include mold inserts, heat exchangers, automotive parts, aerospace components, medical equipment and implants, and precious metal jewelry. The key to successful bonding lies in the temperature and pressure conditions.

熱壓技術(hot pressing)是一種利用高溫和高壓來壓製材料的製程,其通常應用於高密度及高性能的材料,例如陶瓷、金屬和複合材料的製造。熱壓機是習知可做擴散接合製程的加壓設備,其壓力上限取決於液壓系統的設計和結構強度,常見熱壓機的施力上限為250噸。以高純度銅板進行接合為例,其擴散接合的接合溫度係不低於420°C,接合應力係大於10 MPa,且接合強度須大於或等於60 MPa(或背板破斷)。補充說明的是,接合應力係將熱壓機施加的力除以待接合工件的接觸面積;而接合強度指的是兩材料在接合介面上的黏接強度,即衡量接合介面在應力作用下抵抗分斷或斷裂的能力。所謂成功接合一般係要求接合率超過99%。補充說明的是,接合率係以成功接合面積占整體待接合面積的比率來計算,而成功接合的標準可藉由介面的超音波掃描(ultrasonic testing,UT)來判定。然而,習知的擴散接合技術仍存在許多不便和缺點,故製程仍難以穩定地實現上述條件。Hot pressing is a manufacturing process that uses high temperature and high pressure to press materials. It is commonly used in the manufacture of high-density and high-performance materials, such as ceramics, metals, and composites. Hot presses are known pressure equipment for diffusion bonding processes. Their upper pressure limit depends on the design and structural strength of the hydraulic system; a common upper pressure limit for hot presses is 250 tons. For example, when bonding high-purity copper plates, the diffusion bonding temperature must be no less than 420°C, the bonding stress greater than 10 MPa, and the bonding strength greater than or equal to 60 MPa (or the backplate must break). To clarify, the bonding stress is calculated by dividing the force applied by the hot press by the contact area of the workpieces to be bonded; while the bonding strength refers to the adhesive strength between the two materials at the bonding interface, that is, the ability of the bonding interface to resist separation or fracture under stress. A successful bond generally requires a bonding rate exceeding 99%. It should be noted that the bonding rate is calculated as the ratio of the successfully bonded area to the total area to be bonded, and the standard for a successful bond can be determined by ultrasonic testing (UT) of the interface. However, conventional diffusion bonding techniques still have many inconveniences and drawbacks, making it difficult to reliably achieve the above conditions in the process.

中國專利公開號CN 113727801A提出利用沖頭將壓力施加在接合工件,其中沖頭為平板熱壓機的設備設計,其往往設計成特定狀以適應不同的加工需求,故可實現將壓力施加在接合工件上,但無法彈性地調整接合面積及接合功力。在設備沖頭與待接合工件之間,可利用壓塊確保在施加壓力時待接合工件不被移動,習知技術通常使用具有單一尺寸的壓塊,以在最佳溫度和壓力條件下進行接合。然而,當接合大尺寸工件時,由於接合範圍大且接觸面積大,熱壓機會受施力上限的限制,故往往無法滿足接合應力的需求。Chinese patent publication CN 113727801A proposes using a punch to apply pressure to the workpieces to be joined. The punch is designed for flatbed hot presses and is often specifically shaped to adapt to different processing requirements. While it can apply pressure to the workpieces, it cannot flexibly adjust the joining area and joining force. A pressure block can be used between the punch and the workpieces to be joined to ensure that the workpieces are not moved when pressure is applied. The prior art typically uses a pressure block with a single size to perform joining under optimal temperature and pressure conditions. However, when joining large workpieces, the hot press is limited by the upper limit of the applied force due to the large joining range and contact area, often failing to meet the joining stress requirements.

此外,熱壓機的加熱棒位置會限制加熱的均勻性,而導致局部區域無法達到所需的接合溫度或全工件間存在溫度差,而導致接合品質的降低。再者,若工件接合介面不平整、介面存在氧化層或汙染物,都可能導致局部應力不足,進而降低接合率且增加接合失敗的風險。這些問題都導致許多工件在接合過程中失敗,無法補救而報廢,故造成材料和生產成本的浪費。Furthermore, the position of the heating rods in the hot press can limit the uniformity of heating, causing local areas to fail to reach the required bonding temperature or resulting in temperature differences between all workpieces, thus reducing the quality of the bond. Moreover, uneven workpiece bonding interfaces, the presence of oxide layers or contaminants on the interfaces can lead to insufficient local stress, further reducing the bonding rate and increasing the risk of bonding failure. These problems cause many workpieces to fail during the bonding process, becoming irreparable and requiring scrap, thus wasting materials and production costs.

有鑑於此,亟須提供一種擴散接合方法,以提升接合品質及減少接合失敗的風險。In view of this, there is an urgent need to provide a diffusion bonding method to improve bonding quality and reduce the risk of bonding failure.

本發明之一態樣是提供一種擴散接合工件的方法,其係對待接合工件進行包含多階段熱壓步驟的熱壓操作,藉以提升工件的接合品質。One aspect of this invention is to provide a method for diffusion bonding of workpieces, which involves performing a hot pressing operation on the workpieces to be bonded, including a multi-stage hot pressing step, thereby improving the bonding quality of the workpieces.

根據本發明之一態樣,提供一種擴散接合工件的方法,其係包含放置待接合工件於熱壓設備中,其中待接合工件包含上下疊合的兩個待接物;以及對待接合工件進行熱壓操作,其中熱壓操作包含第一階段熱壓步驟及第二階段熱壓步驟。第一階段熱壓步驟包含放置第一壓塊在待接合工件上,其中第一壓塊與待接合工件之表面的接觸面積為第一面積,其中第一面積為待接合工件之表面的面積的20%至100%。第二階段熱壓步驟包含放置第二壓塊在待接合工件上,其中第二壓塊與待接合工件之表面的接觸面積為第二面積,且基於第一面積為100%,第一面積與第二面積的重疊面積為1%至60%。According to one aspect of the present invention, a method for diffusion-joining workpieces is provided, comprising placing the workpieces to be joined in a hot pressing apparatus, wherein the workpieces to be joined comprise two overlapping objects to be joined; and performing a hot pressing operation on the workpieces to be joined, wherein the hot pressing operation includes a first-stage hot pressing step and a second-stage hot pressing step. The first-stage hot pressing step includes placing a first pressing block on the workpieces to be joined, wherein the contact area between the first pressing block and the surface of the workpieces to be joined is a first area, wherein the first area is 20% to 100% of the surface area of the workpieces to be joined. The second-stage hot pressing step includes placing a second pressing block on the workpiece to be joined, wherein the contact area between the second pressing block and the surface of the workpiece to be joined is the second area, and based on the first area being 100%, the overlap area between the first area and the second area is 1% to 60%.

根據本發明之一實施例,上述熱壓操作更包含至少一次第三階段熱壓步驟,其係包含放置第三壓塊在待接合工件上,其中第三壓塊與待接合工件之表面的接觸面積為第三面積,且基於第一面積為100%,第一面積與第三面積的重疊面積為1%至60%。According to one embodiment of the present invention, the hot pressing operation further includes at least one third-stage hot pressing step, which includes placing a third pressing block on the workpiece to be joined, wherein the contact area between the third pressing block and the surface of the workpiece to be joined is the third area, and based on the first area being 100%, the overlap area between the first area and the third area is 1% to 60%.

根據本發明之一實施例,上述第一階段熱壓步驟包含施加第一壓力,第二階段熱壓步驟包含施加第二壓力,且第一壓力與第二壓力為相同或不同。According to one embodiment of the present invention, the first stage hot pressing step includes applying a first pressure, and the second stage hot pressing step includes applying a second pressure, wherein the first pressure and the second pressure are the same or different.

根據本發明之一實施例,上述第一階段熱壓步驟包含施加第一壓力,第二階段熱壓步驟包含施加第二壓力,第三階段熱壓步驟包含施加第三壓力,且第一壓力、第二壓力及第三壓力為相同或不同。According to one embodiment of the present invention, the first stage hot pressing step includes applying a first pressure, the second stage hot pressing step includes applying a second pressure, and the third stage hot pressing step includes applying a third pressure, wherein the first pressure, the second pressure, and the third pressure may be the same or different.

根據本發明之一實施例,上述第二面積小於或等於第一面積。According to one embodiment of the present invention, the second area is less than or equal to the first area.

根據本發明之一實施例,上述第三面積小於或等於第一面積。According to one embodiment of the present invention, the third area is less than or equal to the first area.

根據本發明之一實施例,上述熱壓操作係在100°C至1000°C的溫度下進行。According to one embodiment of the present invention, the hot pressing operation is carried out at a temperature of 100°C to 1000°C.

根據本發明之一實施例,上述第一階段熱壓步驟及該第二階段熱壓步驟係進行1分鐘至8小時。According to one embodiment of the present invention, the first stage hot pressing step and the second stage hot pressing step are performed for 1 minute to 8 hours.

根據本發明之一實施例,上述第一壓塊與第二壓塊為圓盤、圓環、四邊體或多邊體。According to one embodiment of the present invention, the first pressing block and the second pressing block are discs, rings, quadrilaterals or polygons.

根據本發明之一實施例,上述待接合工件係選自於由陶瓷、金屬及複合材料所組成的群組。According to one embodiment of the present invention, the workpiece to be joined is selected from a group consisting of ceramics, metals and composite materials.

應用本發明之擴散接合工件的方法,對待接合工件進行包含多階段熱壓步驟的熱壓操作,各階段的熱壓步驟係以不同壓塊對待接合工件進行接合,且不同壓塊與待合工件的接觸面積具有特定的重疊範圍,藉以達到提升工件的接合強度及接合率的效果。The diffusion bonding method of this invention is used to perform a hot pressing operation on the workpieces to be bonded, which includes multiple hot pressing steps. Each hot pressing step uses different pressing blocks to bond the workpieces to be bonded, and the contact areas between the different pressing blocks and the workpieces to be bonded have a specific overlap range, thereby achieving the effect of improving the bonding strength and bonding rate of the workpieces.

以下揭露提供許多不同實施例或例示,以實施發明的不同特徵。以下敘述之組件和配置方式的特定例示是為了簡化本揭露。這些當然僅是做為例示,其目的不在構成限制。舉例而言,第一特徵形成在第二特徵之上或上方的描述包含第一特徵和第二特徵有直接接觸的實施例,也包含有其他特徵形成在第一特徵和第二特徵之間,以致第一特徵和第二特徵沒有直接接觸的實施例。除此之外,本揭露在各種具體例中重覆元件符號及/或字母。此重覆的目的是為了使說明簡化且清晰,並不表示各種討論的實施例及/或配置之間有關係。The following disclosure provides numerous different embodiments or illustrations to implement various features of the invention. The specific examples of components and configurations described below are for the purpose of simplifying this disclosure. These are, of course, merely illustrative and are not intended to be limiting. For example, a description in which a first feature is formed on or above a second feature includes embodiments where the first and second features are in direct contact, as well as embodiments where other features are formed between the first and second features such that the first and second features are not in direct contact. Furthermore, element symbols and/or letters are repeated in various specific instances in this disclosure. This repetition is for the purpose of simplification and clarity and does not imply a relationship between the various embodiments and/or configurations discussed.

再者,空間相對性用語,例如「下方(beneath)」、「在…之下(below)」、「低於(lower)」、「在…之上(above)」、「高於(upper)」等,是為了易於描述圖式中所繪示的零件或特徵和其他零件或特徵的關係。空間相對性用語除了圖式中所描繪的方向外,還包含元件在使用或操作時的不同方向。裝置可以其他方式定向(旋轉90度或在其他方向),而本揭露所用的空間相對性描述也可以如此解讀。Furthermore, spatial relative terms, such as "beneath," "below," "lower," "above," and "upper," are used to easily describe the relationship between parts or features depicted in the drawings and other parts or features. In addition to the directions depicted in the drawings, spatial relative terms also include different orientations of the components during use or operation. The device may be oriented in other ways (rotated 90 degrees or in other directions), and the spatial relative descriptions used in this disclosure can also be interpreted in this way.

如本發明所使用的「大約(around)」、「約(about)」、「近乎 (approximately)」或「實質上(substantially)」一般係代表在所述之數值或範圍的百分之20以內、或百分之10以內、或百分之5以內。As used in this invention, “around,” “about,” “approximately,” or “substantially” generally mean within 20 percent, 10 percent, or 5 percent of the stated value or range.

以下仔細討論本發明實施例之製造和使用。然而,可以理解的是,實施例提供許多可應用的發明概念,其可實施於各式各樣的特定內容中。所討論之特定實施例僅供說明,並非用以限定本發明之範圍。The manufacture and use of embodiments of the present invention will now be discussed in detail. However, it is understood that the embodiments provide many applicable inventive concepts that can be implemented in a wide variety of specific contexts. The specific embodiments discussed are for illustrative purposes only and are not intended to limit the scope of the present invention.

承上所述,本發明提供一種擴散接合工件的方法,其係對待接合工件進行包含多階段熱壓步驟的熱壓操作,各階段的熱壓步驟係以不同壓塊對待接合工件進行接合,且不同壓塊與待合工件的接觸面積具有特定的重疊範圍。藉此,可達到提升工件的接合強度及接合率的效果。As described above, this invention provides a method for diffusion-bonding workpieces, which involves performing a multi-stage hot pressing operation on the workpieces to be joined. Each stage of the hot pressing process uses different pressing blocks to join the workpieces, and the contact areas between the different pressing blocks and the workpieces have a specific overlap range. This achieves the effect of improving the bonding strength and bonding rate of the workpieces.

請參閱圖1,其係繪示根據本發明一些實施例之實施擴散接合工件之製程裝置100的示意圖。本發明之擴散接合工件的方法包含先將待接合工件120放置於熱壓設備110中。在一些實施例中,待接合工件120包含上下疊合的待接物122及待接物125。具體而言,此方法係要將待接物122與待接物125進行擴散接合。在一些實施例中,待接合工件120可為陶瓷、金屬或複合材料。在一些實施例中,待接合工件120係放置在下壓塊130上。Please refer to Figure 1, which is a schematic diagram of a diffusion bonding process apparatus 100 according to some embodiments of the present invention. The diffusion bonding method of the present invention includes placing the workpiece 120 to be bonded 120 in a hot press 110. In some embodiments, the workpiece 120 to be bonded includes two overlapping elements 122 and 125. Specifically, this method involves diffusion bonding of elements 122 and 125. In some embodiments, the workpiece 120 to be bonded may be ceramic, metal, or a composite material. In some embodiments, the workpiece 120 to be bonded is placed on a lower pressure block 130.

接著,對待接合工件120進行熱壓操作。熱壓操作包含多階段的熱壓步驟,其階段數可根據應用需求而調整,本發明不限制所執行的熱壓步驟階段數。熱壓步驟包含放置上壓塊140在待接合工件120上。圖1所示的上壓塊140僅是做為例示,本發明不限於此。事實上,上壓塊140可具有不同的形狀及接觸面積。在一些實施例中,上壓塊140可為圓盤、圓環或多邊體,其中多邊體可例如為四邊體。請參閱圖2A至圖2D,其係繪示各種不同上壓塊140設置在待接合工件120上的示意圖。一般而言,特別是針對大尺寸(例如大於1000 cm2)的待接合工件時,須至少使用一次圓環狀壓塊,以對待接合工件的周圍進行加壓接合,以增加待接合工件之周圍區域的接合強度。Next, a hot pressing operation is performed on the workpieces 120 to be joined. The hot pressing operation includes multiple stages, the number of which can be adjusted according to application requirements. The present invention does not limit the number of hot pressing stages performed. The hot pressing step includes placing an upper pressure block 140 on the workpieces 120 to be joined. The upper pressure block 140 shown in FIG1 is merely an example, and the present invention is not limited thereto. In fact, the upper pressure block 140 can have different shapes and contact areas. In some embodiments, the upper pressure block 140 can be a disk, a ring, or a polygon, wherein the polygon can be, for example, a quadrilateral. Please refer to Figures 2A to 2D, which are schematic diagrams illustrating various upper pressure blocks 140 disposed on the workpieces 120 to be joined. Generally, especially for large workpieces (e.g., larger than 1000 cm² ), an annular pressure block must be used at least once to apply pressure to the periphery of the workpieces to be joined, thereby increasing the joint strength of the surrounding area of the workpieces to be joined.

在一些實施例中,熱壓操作包含第一階段熱壓步驟及第二階段熱壓步驟。在此實施例中,第一階段熱壓步驟係放置第一壓塊在待接合工件120上,且第二階段熱壓步驟係放置第二壓塊在待接合工件120上。In some embodiments, the hot pressing operation includes a first hot pressing step and a second hot pressing step. In this embodiment, the first hot pressing step involves placing a first pressing block on the workpiece 120 to be joined, and the second hot pressing step involves placing a second pressing block on the workpiece 120 to be joined.

第一壓塊與待接合工件120之表面120A的接觸面積為第一面積,第二壓塊與待接合工件120之表面120A的接觸面積為第二面積。在一些實施例中,第一面積為待接合工件120之待接合面125A之面積的約20%至約100%,較佳為約50%至約100%。若第一面積小於待接合面125A之面積的約20%,即第一壓塊與待接合工件120的接觸面積太小,則可能導致壓塊施加在待接合工件120上的壓力不均,而影響擴散效果,進而使得接合界面間的原子間鍵結力不足,故可能增加接合缺陷,即導致接合效率降低。此外,第一壓塊與待接合工件120的接觸面積太小還可能造成整個待接合工件120的局部壓力不均,無法有效形成穩定的擴散接合層,則接合強度不穩定。若接合部位的強度不符合預期,可能使待接合工件120在後續受到機械應力時,容易發生分層、開裂或變形等問題。一般而言,熱壓操作使用的壓塊與待接合工件120之表面120A的接觸面積皆不大於待接合工件120之表面120A的面積。The contact area between the first pressing block and the surface 120A of the workpiece 120 to be joined is the first area, and the contact area between the second pressing block and the surface 120A of the workpiece 120 to be joined is the second area. In some embodiments, the first area is about 20% to about 100% of the area of the surface 125A of the workpiece 120 to be joined, preferably about 50% to about 100%. If the first area is less than approximately 20% of the area of the surface 125A to be joined, meaning the contact area between the first pressing block and the workpiece 120 to be joined is too small, it may lead to uneven pressure applied by the pressing block to the workpiece 120, affecting the diffusion effect and resulting in insufficient interatomic bonding force between the joint interfaces. This may increase joining defects, thus reducing the joining efficiency. Furthermore, a small contact area between the first pressing block and the workpiece 120 may also cause uneven local pressure across the entire workpiece 120, preventing the effective formation of a stable diffusion bonding layer and resulting in unstable bonding strength. If the strength of the joint does not meet expectations, the workpiece 120 may be prone to delamination, cracking, or deformation when subjected to subsequent mechanical stress. Generally speaking, the contact area between the pressure block used in hot pressing and the surface 120A of the workpiece 120 to be joined is not greater than the surface 120A of the workpiece 120 to be joined.

第二階段熱壓步驟與第一階段熱壓步驟的熱壓範圍須至少部分重疊,有助於提升工件的接合品質(即接合強度及接合率)。在一些實施例中,基於第一面積為100%,第一面積與第二面積的重疊面積為約1%至約60%,較佳為約20%至約55%,更佳為約30%至約50%。若第一面積與第二面積的重疊面積小於1%,則兩階段的熱壓範圍幾乎未重複作用於相同區域,則接合過程無法有效達到累積加壓的效果;反之,若第一面積與第二面積的重疊面積大於60%,則無法有效提升分段加壓的效果,且增加壓塊設計的製作成本。應理解的是,第一面積實質上等於第一壓塊的接觸面面積,而第二面積實質上等於第二壓塊的接觸面面積。在一些實施例中,第二面積小於或等於第一面積,故第二壓塊的接觸面面積小於或等於第一壓塊的接觸面面積。The hot pressing area of the second stage hot pressing step must at least partially overlap with that of the first stage hot pressing step to help improve the bonding quality of the workpiece (i.e., bonding strength and bonding rate). In some embodiments, based on the first area being 100%, the overlap area between the first and second areas is about 1% to about 60%, preferably about 20% to about 55%, and more preferably about 30% to about 50%. If the overlap area between the first and second areas is less than 1%, the hot pressing ranges of the two stages almost do not overlap in the same area, and the bonding process cannot effectively achieve the cumulative pressure effect. Conversely, if the overlap area between the first and second areas is greater than 60%, the segmented pressure effect cannot be effectively improved, and the manufacturing cost of the pressure block design is increased. It should be understood that the first area is essentially equal to the contact area of the first pressure block, and the second area is essentially equal to the contact area of the second pressure block. In some embodiments, the second area is less than or equal to the first area, so the contact area of the second block is less than or equal to the contact area of the first block.

在一些實施例中,第一階段熱壓步驟包含施加第一壓力,第二階段熱壓步驟包含施加第二壓力,第一壓力與第二壓力可為相同或不同。一般而言,熱壓機可施加相同的力進行熱壓,則第一壓力與第二壓力分別為此施力除以第一面積與第二面積,故第一壓力與第二壓力即為接合應力。因此,若第二面積小於第一面積,則第二壓力大於第一壓力。應理解的是,上述施力的大小一般係受設備限制,因此,若欲增加熱壓操作的壓力,則可藉由減小壓塊與待接合工件120的接觸面積來達成,故本發明利用多階段熱壓步驟以增加調整壓塊大小及形狀的彈性,藉以提升待接合工件120各區域的接合強度。In some embodiments, the first hot pressing step includes applying a first pressure, and the second hot pressing step includes applying a second pressure. The first and second pressures may be the same or different. Generally, a hot press can apply the same force for hot pressing, so the first and second pressures are the applied force divided by the first and second areas, respectively. Therefore, the first and second pressures are the bonding stresses. Thus, if the second area is smaller than the first area, the second pressure is greater than the first pressure. It should be understood that the magnitude of the applied force is generally limited by the equipment. Therefore, if it is desired to increase the pressure of the hot pressing operation, it can be achieved by reducing the contact area between the pressure block and the workpiece 120 to be joined. Thus, the present invention utilizes a multi-stage hot pressing process to increase the flexibility of adjusting the size and shape of the pressure block, thereby improving the bonding strength of each area of the workpiece 120 to be joined.

在一些實施例中,熱壓操作可選擇性地進行第三階段熱壓步驟。第三階段熱壓步驟係放置第三壓塊在待接合工件120上,且第三壓塊與待接合工件120之表面120A的接觸面積為第三面積。相似地,在一些實施例中,基於第一面積為100%,第一面積與第三面積的重疊面積為約1%至約60%,較佳為約20%至約55%,更佳為約30%至約50%。在一些實施例中,第三面積小於或等於第一面積。在一些實施例中,第三階段熱壓步驟包含施加第三壓力,第二壓力與第三壓力可為相同或不同。若待接合工件120的待接合面125A(即待接物122及待接物125之間的介面)不平整時,較佳為進行至少一次第三階段熱壓步驟,以針對介面不平整的區域增加工件的接合強度,進而提高接合率。In some embodiments, the hot pressing operation may optionally include a third-stage hot pressing step. The third-stage hot pressing step involves placing a third pressure block on the workpiece 120 to be joined, and the contact area between the third pressure block and the surface 120A of the workpiece 120 is the third area. Similarly, in some embodiments, based on the first area being 100%, the overlap area between the first and third areas is approximately 1% to approximately 60%, preferably approximately 20% to approximately 55%, and more preferably approximately 30% to approximately 50%. In some embodiments, the third area is less than or equal to the first area. In some embodiments, the third-stage hot pressing step includes applying a third pressure, where the second and third pressures may be the same or different. If the joint surface 125A of the workpiece 120 to be joined (i.e. the interface between the workpiece 122 and the workpiece 125) is not flat, it is preferable to perform at least one third-stage hot pressing step to increase the joint strength of the workpiece in the area of uneven interface, thereby improving the joint rate.

在一些實施例中,上述熱壓操作的各階段熱壓步驟(例如第一階段熱壓步驟、第二階段熱壓步驟及第三階段熱壓步驟)係在約100°C至約1000°C的溫度下進行接合,其係取決於待接合工件120的材料。在一些實施例中,前述溫度須藉由逐步升溫、保溫及降溫的方式控制,以避免工件材料因溫度的急劇變化而導致損壞或性能下降。In some embodiments, the various stages of the hot pressing operation described above (e.g., the first, second, and third hot pressing stages) are performed at temperatures ranging from approximately 100°C to approximately 1000°C, depending on the material of the workpieces 120 to be joined. In some embodiments, the aforementioned temperature is controlled by gradually increasing, holding, and decreasing the temperature to avoid damage or performance degradation of the workpiece material due to rapid temperature changes.

在一些實施例中,上述熱壓操作的各階段熱壓步驟(例如第一階段熱壓步驟、第二階段熱壓步驟及第三階段熱壓步驟)係進行接合約1分鐘至約8小時,其係取決於待接合工件120的材料。In some embodiments, the various stages of the hot pressing operation described above (e.g., the first stage hot pressing, the second stage hot pressing, and the third stage hot pressing) are performed for about 1 minute to about 8 hours, depending on the material of the workpiece 120 to be joined.

以下利用數個實施例以說明本發明之應用,然其並非用以限定本發明,本發明技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾。The following examples illustrate the application of the invention, but they are not intended to limit the invention. Those with ordinary knowledge in the art can make various modifications and embellishments without departing from the spirit and scope of the invention.

實施例一Implementation Example 1

實施例一的待接合工件的待接合面之面積為1500 cm2,且待接合面的介面平整度良好。實施例一對待接合工件進行兩階段熱壓步驟,其中熱壓步驟皆在425°C的溫度下進行接合,且熱壓機施力皆設定為250噸。第一階段熱壓步驟係利用面積為800 cm2的環狀壓塊(如圖2B所示)對待接合工件的周圍區域進行加壓。第二階段熱壓步驟係利用面積為800 cm2的圓形壓塊(如圖2C所示)對待接合工件的中央區域進行加壓。第一階段熱壓步驟與第二階段熱壓步驟的壓塊對待接合工件加壓的重疊面積為100 cm2(即第一面積的12.5%)。進行完擴散接合的待接合工件利用拉伸強度的量測判定工件的接合強度,並利用超音波掃描判定工件的接合率,其結果如下表一所示。In Embodiment 1, the area of the surfaces to be joined is 1500 cm² , and the surface flatness is good. Embodiment 1 involves a two-stage hot-pressing process, with both stages performed at 425°C and the hot press force set to 250 tons. The first stage of hot-pressing uses an 800 cm² annular pressing block (as shown in Figure 2B) to pressurize the periphery of the workpieces. The second stage of hot-pressing uses an 800 cm² circular pressing block (as shown in Figure 2C) to pressurize the central area of the workpieces. The overlapping area of the pressure applied to the workpieces by the pressure blocks in the first and second hot pressing steps is 100 cm² (i.e., 12.5% of the first area). The bonding strength of the workpieces after diffusion bonding was determined by measuring tensile strength, and the bonding rate was determined by ultrasonic scanning. The results are shown in Table 1 below.

實施例二Implementation Example 2

實施例二的待接合工件的待接合面之面積為1000 cm2,且待接合面的介面有局部不平整。實施例二對待接合工件進行兩階段熱壓步驟,其中熱壓步驟皆在425°C的溫度下進行接合,且第一階段的熱壓機施力設定為250噸,第二階段熱壓機施力設定為200噸。第一階段熱壓步驟係利用面積為1000 cm2且形狀與待接合工件相同的壓塊對待接合工件進行全面積加壓。第二階段熱壓步驟係利用面積為300 cm2的圓形壓塊(如圖2C所示)對待接合工件的局部不平整處進行加壓。第一階段熱壓步驟與第二階段熱壓步驟的壓塊對待接合工件加壓的重疊面積為300 cm2(即第一面積的30%)。進行完擴散接合的待接合工件利用拉伸強度的量測判定工件的接合強度,並利用超音波掃描判定工件的接合率,其結果如下表一所示。In Embodiment 2, the area of the surfaces to be joined is 1000 cm² , and the interface of the surfaces to be joined has local unevenness. Embodiment 2 involves a two-stage hot pressing process on the workpieces to be joined, with both stages performed at a temperature of 425°C. The first stage hot press is set to a force of 250 tons, and the second stage hot press is set to a force of 200 tons. The first stage hot pressing process uses a pressure block with an area of 1000 cm² and the same shape as the workpieces to be joined to apply full-area pressure to the workpieces. The second-stage hot pressing step involves applying pressure to the uneven areas of the workpieces to be joined using a circular pressure block with an area of 300 cm² (as shown in Figure 2C). The overlapping area of the pressure applied by the pressure blocks in the first and second-stage hot pressing steps is 300 cm² (i.e., 30% of the first area). After diffusion bonding, the joint strength of the workpieces to be joined is determined by measuring tensile strength, and the joint rate is determined by ultrasonic scanning. The results are shown in Table 1 below.

實施例三Implementation Example 3

實施例三的待接合工件的待接合面之面積為1500 cm2,且待接合面的介面不平整。實施例三對待接合工件進行三階段熱壓步驟,其中熱壓步驟皆在425°C的溫度下進行接合,且第一階段及第二階段的熱壓機施力皆設定為250噸,而第三階段的熱壓機施力設定為200噸。第一階段熱壓步驟係利用面積為1500 cm2且形狀與待接合工件相同的壓塊對待接合工件進行全面積加壓。第二階段熱壓步驟係利用面積為800 cm2的環狀壓塊(如圖2D所示)對待接合工件的局部進行加壓。第三階段熱壓步驟係利用面積為300 cm2的圓形壓塊(如圖2C所示)對待接合工件的局部進行補強加壓。第一階段熱壓步驟與第二階段熱壓步驟的壓塊對待接合工件加壓的重疊面積為800 cm2(即第一面積的53.3%),而第二階段熱壓步驟與第三階段熱壓步驟的壓塊對待接合工件加壓的重疊面積為300 cm2(即第一面積的20%)。進行完擴散接合的待接合工件利用拉伸強度的量測判定工件的接合強度,並利用超音波掃描判定工件的接合率,其結果如下表一所示。In Embodiment 3, the area of the surfaces to be joined is 1500 cm² , and the interface of the surfaces to be joined is uneven. Embodiment 3 involves a three-stage hot pressing process on the workpieces to be joined, with each hot pressing step performed at a temperature of 425°C. The hot press force is set to 250 tons in the first and second stages, and to 200 tons in the third stage. The first stage of the hot pressing process involves applying full-area pressure to the workpieces using a 1500 cm² pressure block with the same shape as the workpieces to be joined. The second stage of hot pressing involves applying pressure to a localized area of the workpieces to be joined using an 800 cm² ring-shaped pressure block (as shown in Figure 2D). The third stage of hot pressing involves reinforcing the localized area of the workpieces to be joined using a 300 cm² circular pressure block (as shown in Figure 2C). The overlapping area of the pressure applied by the pressing blocks in the first and second hot pressing steps to the workpieces to be joined is 800 cm² (53.3% of the first area), while the overlapping area of the pressure applied by the pressing blocks in the second and third hot pressing steps to the workpieces to be joined is 300 cm² (20% of the first area). The bonding strength of the workpieces after diffusion bonding was determined by measuring tensile strength, and the bonding rate was determined by ultrasonic scanning. The results are shown in Table 1 below.

比較例一Comparative example one

比較例一的待接合工件的待接合面之面積為1500 cm2,且待接合面的介面平整度良好。比較例一對待接合工件進行單次熱壓步驟,其中熱壓步驟皆在425°C的溫度下進行接合,且熱壓機施力皆設定為250噸。熱壓步驟利用面積為1500 cm2且形狀與待接合工件相同的壓塊對待接合工件進行全面積加壓。進行完擴散接合的待接合工件利用拉伸強度的量測判定工件的接合強度,並利用超音波掃描判定工件的接合率,其結果如下表一所示。In Comparative Example 1, the area of the surfaces to be joined is 1500 cm² , and the surface flatness is good. Comparative Example 1 involves a single hot-pressing step on the workpieces to be joined, with each hot-pressing step performed at a temperature of 425°C and the hot press force set to 250 tons. The hot-pressing step utilizes a 1500 cm² pressure block with the same shape as the workpieces to be joined to apply full-area pressure. The bonding strength of the workpieces after diffusion bonding was determined by measuring tensile strength, and the bonding rate was determined by ultrasonic scanning. The results are shown in Table 1 below.

比較例二Comparative Example 2

比較例二的待接合工件的待接合面之面積為1000 cm2,且待接合面的介面局部不平整。比較例一對待接合工件進行單次熱壓步驟,其中熱壓步驟皆在425°C的溫度下進行接合,且熱壓機施力皆設定為250噸。熱壓步驟利用面積為1000 cm2且形狀與待接合工件相同的壓塊對待接合工件進行全面積加壓。進行完擴散接合的待接合工件利用拉伸強度的量測判定工件的接合強度,並利用超音波掃描判定工件的接合率,其結果如下表一所示。In Comparative Example 2, the area of the surfaces to be joined is 1000 cm² , and the interface of the surfaces to be joined is locally uneven. In Comparative Example 1, a single hot-pressing step was performed on the workpieces to be joined, with each hot-pressing step conducted at a temperature of 425°C and the hot press force set to 250 tons. The hot-pressing step used a pressure block with an area of 1000 cm² and the same shape as the workpieces to be joined to apply full-area pressure. The bonding strength of the workpieces after diffusion bonding was determined by measuring tensile strength, and the bonding rate was determined by ultrasonic scanning. The results are shown in Table 1 below.

表一 Table 1

根據表一,使用多階段熱壓接合的實施例一至實施例三的工件皆具有60 MPa以上的接合強度及99%以上的接合率,故皆可判定為接合成功。According to Table 1, the workpieces of Examples 1 to 3, which use multi-stage hot pressing, all have a joint strength of over 60 MPa and a joint rate of over 99%, and therefore can all be judged as successfully joined.

相對地,比較例一的待接合工件尺寸較大,故僅使用單次的熱壓接合,整個接合面未能均勻受力,故壓塊邊緣接觸處的周圍部位接合應力不足10 MPa。再者,工件尺寸較大還可能出現局部溫度不均的情況,導致此區域的接合強度較低,即不同位置的接合強度差異大,導致整體接合率僅76%,未達預期的接合標準,故接合失敗。In contrast, the workpieces to be joined in Comparative Example 1 were larger, so a single hot-pressing process was used, resulting in uneven stress distribution across the entire joint surface. Consequently, the joint stress at the contact point of the pressure block edges was less than 10 MPa. Furthermore, the larger workpiece size could also lead to uneven local temperatures, resulting in lower joint strength in these areas. This meant that the joint strength varied significantly across different locations, resulting in an overall joint rate of only 76%, which failed to meet the expected joint standard, thus causing the joint to fail.

比較例二則是對接合面介面不平整的工件進行單次的熱壓接合,故局部無法完全接合,不平整處及工件外圍的接合強度僅48 MPa,局部強度不足,故接合率僅82%,即接合失敗。Comparative Example 2 involves a single hot-press bonding of a workpiece with an uneven interface. As a result, the bonding is not complete in some areas. The bonding strength at the uneven areas and around the workpiece is only 48 MPa, which is insufficient in some areas. Therefore, the bonding rate is only 82%, which means the bonding fails.

根據上述實施例,本發明提供一種擴散接合工件的方法,其係對待接合工件進行包含多階段熱壓步驟的熱壓操作,各階段的熱壓步驟係以不同壓塊對待接合工件進行接合,以對具有不同尺寸或平整度的待接合工件提供不同的熱壓條件,且不同壓塊與待合工件的接觸面積具有特定的重疊範圍。藉此,可達到提升工件的接合強度及接合率的效果。According to the above embodiments, the present invention provides a method for diffusion-bonding workpieces, which involves performing a multi-stage hot pressing operation on the workpieces to be joined. Each stage of the hot pressing process uses different pressing blocks to join the workpieces, providing different hot pressing conditions for workpieces with different dimensions or flatness. Furthermore, the contact areas between the different pressing blocks and the workpieces have a specific overlap range. This achieves the effect of improving the bonding strength and bonding rate of the workpieces.

雖然本發明已以數個實施例揭露如上,然其並非用以限定本發明,在本發明所屬技術領域中任何具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed above with several embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the art to which the present invention pertains may make various modifications and alterations without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended patent application.

100:製程裝置 110:熱壓設備 120:待接合工件 122,125:待接物 130:下壓塊 140:上壓塊 120A:表面 125A:待接合面100: Process apparatus; 110: Hot pressing equipment; 120: Workpiece to be joined; 122, 125: Item to be joined; 130: Lower pressure block; 140: Upper pressure block; 120A: Surface; 125A: Surface to be joined.

根據以下詳細說明並配合附圖閱讀,使本揭露的態樣獲致較佳的理解。需注意的是,如同業界的標準作法,許多特徵並不是按照比例繪示的。事實上,為了進行清楚討論,許多特徵的尺寸可以經過任意縮放。 圖1係繪示根據本發明一些實施例之實施擴散接合之製程裝置的示意圖。 圖2A至圖2D係繪示各種不同上壓塊設置在待接合工件上的示意圖。A better understanding of the features disclosed herein will be achieved by referring to the following detailed description and accompanying figures. It should be noted that, as is standard practice in the industry, many features are not drawn to scale. In fact, the dimensions of many features can be arbitrarily scaled for clarity of discussion. Figure 1 is a schematic diagram illustrating a diffusion bonding process apparatus according to some embodiments of the present invention. Figures 2A to 2D are schematic diagrams illustrating various upper pressure blocks disposed on the workpieces to be bonded.

國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無Domestic storage information (please record in order of storage institution, date, and number): None. International storage information (please record in order of storage country, institution, date, and number): None.

100:製程裝置 100: Process Equipment

110:熱壓設備 110: Hot pressing equipment

120:待接合工件 120: Workpieces to be joined

122,125:待接物 122, 125: Items to be received

130:下壓塊 130: Lower block

140:上壓塊 140: Top Press

120A:表面 120A: Surface

125A:待接合面 125A: Surface to be joined

Claims (10)

一種擴散接合工件的方法,包含: 放置一待接合工件於一熱壓設備中,其中該待接合工件包含上下疊合的兩待接物;以及 對該待接合工件進行一熱壓操作,其中該熱壓操作包含: 一第一階段熱壓步驟,包含放置一第一壓塊在該待接合工件上,其中該第一壓塊與該待接合工件之一表面的接觸面積為一第一面積,其中該第一面積為該待接合工件之該兩待接物的一待接合面的面積的20%至100%;以及 一第二階段熱壓步驟,包含放置一第二壓塊在該待接合工件上,其中該第二壓塊與該待接合工件之該表面的接觸面積為一第二面積,且基於該第一面積為100%,該第一面積與該第二面積的一重疊面積為1%至60%。A method for diffusion-joining workpieces includes: placing a workpiece to be joined in a hot pressing apparatus, wherein the workpiece to be joined comprises two objects to be joined stacked vertically; and performing a hot pressing operation on the workpiece to be joined, wherein the hot pressing operation includes: a first-stage hot pressing step, comprising placing a first pressing block on the workpiece to be joined, wherein the contact area between the first pressing block and one surface of the workpiece to be joined is a first area, wherein the first area is 20% to 100% of the area of one joining surface of the two objects to be joined; and A second-stage hot pressing step includes placing a second pressing block on the workpiece to be joined, wherein the contact area between the second pressing block and the surface of the workpiece to be joined is a second area, and based on the first area being 100%, the overlap area between the first area and the second area is 1% to 60%. 如請求項1所述之擴散接合工件的方法,其中該熱壓操作更包含: 至少一第三階段熱壓步驟,包含放置一第三壓塊在該待接合工件上,其中該第三壓塊與該待接合工件之該表面的接觸面積為一第三面積,且基於該第一面積為100%,該第一面積與該第三面積的一重疊面積為1%至60%。The method for diffusion bonding of workpieces as described in claim 1, wherein the hot pressing operation further comprises: at least a third-stage hot pressing step, comprising placing a third pressing block on the workpiece to be bonded, wherein the contact area between the third pressing block and the surface of the workpiece to be bonded is a third area, and based on the first area being 100%, the overlap area between the first area and the third area is 1% to 60%. 如請求項1所述之擴散接合工件的方法,其中該第一階段熱壓步驟包含施加一第一壓力,該第二階段熱壓步驟包含施加一第二壓力,且該第一壓力與該第二壓力為相同或不同。The method for diffusion bonding of workpieces as described in claim 1, wherein the first stage hot pressing step includes applying a first pressure, the second stage hot pressing step includes applying a second pressure, and the first pressure and the second pressure are the same or different. 如請求項2所述之擴散接合工件的方法,其中該第一階段熱壓步驟包含施加一第一壓力,該第二階段熱壓步驟包含施加一第二壓力,該至少一第三階段熱壓步驟包含施加一第三壓力,且該第一壓力、該第二壓力及該第三壓力為相同或不同。The method for diffusion bonding of workpieces as described in claim 2, wherein the first stage hot pressing step includes applying a first pressure, the second stage hot pressing step includes applying a second pressure, the at least one third stage hot pressing step includes applying a third pressure, and the first pressure, the second pressure, and the third pressure are the same or different. 如請求項1所述之擴散接合工件的方法,其中該第二面積小於或等於該第一面積。The method for diffusing and bonding workpieces as described in claim 1, wherein the second area is less than or equal to the first area. 如請求項2所述之擴散接合工件的方法,其中該第三面積小於或等於該第一面積。The method for diffusing and bonding workpieces as described in claim 2, wherein the third area is less than or equal to the first area. 如請求項1所述之擴散接合工件的方法,其中該熱壓操作係在100°C至1000°C的一溫度下進行。The method for diffusion bonding of workpieces as described in claim 1, wherein the hot pressing operation is performed at a temperature of 100°C to 1000°C. 如請求項1所述之擴散接合工件的方法,其中該第一階段熱壓步驟係進行1分鐘至8小時,且該第二階段熱壓步驟係進行1分鐘至8小時。The method for diffusion bonding of workpieces as described in claim 1, wherein the first stage hot pressing step is performed for 1 minute to 8 hours, and the second stage hot pressing step is performed for 1 minute to 8 hours. 如請求項1所述之擴散接合工件的方法,其中該第一壓塊與該第二壓塊為圓盤、圓環或多邊體。The method for diffusion bonding of workpieces as described in claim 1, wherein the first pressure block and the second pressure block are discs, rings or polygons. 如請求項1所述之擴散接合工件的方法,其中該待接合工件係選自於由陶瓷、金屬及複合材料所組成的一群組。The method for diffusion bonding of workpieces as described in claim 1, wherein the workpieces to be bonded are selected from a group consisting of ceramics, metals and composite materials.
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