TWM253207U - Direct conduction type high-efficiency heat dissipation device - Google Patents

Direct conduction type high-efficiency heat dissipation device Download PDF

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Publication number
TWM253207U
TWM253207U TW93202703U TW93202703U TWM253207U TW M253207 U TWM253207 U TW M253207U TW 93202703 U TW93202703 U TW 93202703U TW 93202703 U TW93202703 U TW 93202703U TW M253207 U TWM253207 U TW M253207U
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Taiwan
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heat
direct
socket
thermally conductive
efficiency
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TW93202703U
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Chinese (zh)
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Pei-Shi Lin
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Thermaltake Technology Co Ltd
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Priority to TW93202703U priority Critical patent/TWM253207U/en
Publication of TWM253207U publication Critical patent/TWM253207U/en

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Description

M253207 五 、創作說明(1) 一、 【新型所屬之技術領域】 本新型係有關於一種直接傳導式高效率散熱裝 指一種藉高傳導效率之導熱接座,直接貼靠於一熱源上, 使該熱源之熱能可迅速的經連接於導熱接座上之其 熱傳導至多數散熱鰭片上,以達快速散熱之目的。吕 二、 【先前技術】 '前應用於電腦電路板上之晶片,如中央處理哭 2PU)吝等/-於啟動執行—段時間後,便會因連續之高頻振 ::產生南溫現象,若無適當之散熱裝置, 埶、振 ==而造成晶片損壞或損及執行效率,心目、二1 ,一般都會於晶片等熱源上加裝散執“ 增進該晶片之散熱效率。 不舣…衣置,以 型之:ί:遍應用之散熱裝置,係以-紹金屬材^ 型之散熱構件,令其底板部 i屬材一體成 熱能時,熱便經由傳導t ^ ,當熱源產生 該底板部上之多數t::片用,” f板部傳遞至各連伸於 知銘擠型散熱構件,由、;:二散熱至外惟上述之習 底板部上所蓄積之熱At,、‘、、、傳效率較差,往往不能快速的 因此該散熱構件,^ = A’t迅速傳導至各散熱鰭片之末端, 習知鋁擠型散熱構件,5產生較佳的散熱效果,因此這種 理器散熱之需, 匕不符合現今高振盪頻率之中 ……:有改進… 央處 M253207 五、創作說明(2) 置,之目的旨在提供一種直接傳導式高效率散熱裝M253207 V. Creation instructions (1) 1. [Technical field to which the new type belongs] This new type relates to a direct-conduction high-efficiency heat-dissipating device, which refers to a heat-conducting socket with high conductive efficiency, which is directly attached to a heat source, so that The thermal energy of the heat source can be quickly conducted to most of the heat dissipation fins through the heat connected to the thermally conductive socket to achieve the purpose of rapid heat dissipation. Lu Er, [Previous Technology] 'chips previously applied to computer circuit boards, such as the central processing cry 2PU) 吝 etc. /-after the start of execution-a period of time, due to continuous high-frequency vibration :: South temperature phenomenon, if Without proper heat dissipation device, the chip damage or damage to the execution efficiency caused by 埶, vibration ==, mind 1, 2 will generally be installed on the chip and other heat sources to improve the heat dissipation efficiency of the chip. The type of heat sink: ί: The heat dissipation device used in all applications is a heat dissipation member of type-Shao metal material ^, so that when the base plate i material is integrated into thermal energy, the heat is transmitted through the conductive t ^, when the heat source generates the bottom plate portion Most of the t :: sheets are used. "The f-plate portion is transmitted to each heat-extrusion heat-dissipating member that extends to the Zhiming, from ;;: The heat is dissipated to the outside, except the heat accumulated on the bottom plate portion, At ,, ', The transmission efficiency is poor, so the heat dissipation member can not be quickly transferred. ^ = A't quickly conducts to the end of each heat dissipation fin. Knowing the aluminum extruded heat dissipation member, 5 produces a better heat dissipation effect. The need for heat dissipation of the device does not meet the current high oscillation frequency. ......: ... M253207 improved V. Creation described at the central (2) is set, the object aims to provide a high-efficiency direct heat conduction means

Pi貴於1ί、: 一導熱接座,其底面界定形成一接熱端,以 座之頂而、、源上者;多數導熱管,其一端焊連於該導熱接 气埶銬Η ,並縱長地向上突伸者;多數散熱鰭片,令各該 内,^八上,分別穿設有嵌孔,以對應地嵌套該導熱管於 接座’发兩相鄰政熱,續片間係相隔一間距者;以及一固定 内央穿言卜容4穴,“吻合地鎖接料熱接座於 一導風置=固定接座之板面上,穿設有多數扣孔,以扣接 高严埶处如是藉由該導熱接片,直接將熱源所產生之 向外界ί敎經導熱管快速傳導至多數散熱鰭片上,以快速 1月…、’以達快速散熱之目的。 得以ί Ξ ί之可取實體’可由以下說明及所附各圖式,而 四、【實施方式】 導上ΐ!第一至四圖所示’本新型係有關於-種直接傳 '冋:率散熱裝置,尤指一種可將熱源(5〇)之高溫熱 ’導至、ϋ:導熱系數之導熱管(20) ’可直接、快速地傳 二數政熱鰭片(30)上’並對外界散熱,以達快速散熱 之目的。 莫ΐ :、—、二、四圖所示,本創作所揭示之直接傳 二同夕“散熱裝置,係包括:一導熱接座(丨〇 ),其底面 界=形成一接熱端(11),以貼靠於一熱源(5〇,如電腦中 器)上者;多數導熱管(2〇),其一端焊連於該導熱 座(10)之頂面(12),並縱長地向上突伸者;多數散熱鰭 M253207Pi is more expensive than: A thermally conductive socket, the bottom surface of which is defined to form a thermally connected end, and the top of the seat, the source; the majority of thermally conductive pipes, one end of which is welded to the thermally conductive gas shackle, and longitudinally Those who protrude upwards long; most of the heat sink fins, so that each of the inner and outer sides are respectively provided with embedded holes to correspondingly nest the heat pipe in the socket to send two adjacent political heat, continued between the fins They are separated by a distance; and a fixed inner central Chuanyan Burong 4 points, "the hot-fitting seat of the locking material is fit on the plate surface of an air guide = fixed socket, and there are many buckle holes to buckle. If the high-rigidity connection is used, the thermally conductive tab can directly conduct the heat generated by the heat source to the outside through the heat pipe to most of the heat dissipation fins, in order to quickly January ..., to achieve the purpose of rapid heat dissipation. Ξ The desirable entity can be described in the following description and the accompanying drawings, and [Embodiment] leads to the above! The first to fourth pictures show that the "new type is about-a kind of direct transmission": rate cooling device , Especially a heat transfer tube (20) that can direct the high-temperature heat of the heat source (50) to Quickly pass on the number two political heat fins (30) and dissipate heat to the outside world for the purpose of rapid heat dissipation. Mo Yan: As shown in the figure, two, four, the direct transmission of the two revealed on this creation " The heat-dissipating device includes: a heat-conducting socket (丨 〇), whose bottom surface boundary forms a heat-connecting end (11) to abut against a heat source (50, such as a computer device); most of the heat-conducting pipes ( 2〇), one end of which is welded to the top surface (12) of the heat conductive base (10), and protrudes upwards vertically; most of the heat-dissipating fins M253207

片(30),令各該散熱鰭片(30)上’分別穿設有嵌孔 以對應地嵌套該導熱管(20)於内,並令兩相 (30)間係相隔一間距者;以及—固定接座(4〇),^中^穿 設一容置穴(42),以吻合地鎖接該導熱接座(1〇)於内,並 於該固定接座(40)之板面上,穿設有多數扣孔(43),以扣 接一導風罩(60)或一體成型有導風罩之散熱風扇,如 圖所示者。 本創作所揭示之導熱接座(1〇)的頂面(12)上係凹設有 多數之嵌槽(121),以分別容置一導熱管(2〇)跨置於内, 另於該導熱接座(1 〇 )之兩側侧緣,分別穿設有多數螺孔 (1 3 ),以藉螺絲鎖該固定接座(4 〇 )者。 本創作所揭示之各該導熱管(2 〇 ),係可彎呈一 u型 狀’令其中段(21)跨置於該導熱接座(1〇)之頂面上,並於 該跨接處施以焊接,以固連該導熱接座(1〇)及各導熱管 (2 0 )’而各導熱管(2 〇 )之兩端,係分別投影於該導熱接座 (1 0 )之兩側,並向上縱長延伸者。 上述之各導熱管(20)之中段(21)上方,係水平地連設 一載板(2 2 )’以供跨接一扣具或壓桿(2 3 ),以藉該扣具或 壓桿(2 3 )迫壓本創作,緊貼於該熱源(4 〇 )上者。 本創作所揭示之固定接座(4 〇 ),係可由金屬板材一體 衝壓成型’含有一板體部(4丨),於該板體部(4丨)上穿設有 一容置穴(42),並於該容置穴(42)之相對兩穴緣,分別向 下突伸一突片(421),且於各突片(421)上穿設有固定孔 (422 ) ’以藉螺絲穿經突片(421)之固定孔(422)後,鎖入Piece (30), so that each of the heat dissipation fins (30) is provided with embedded holes to correspondingly nest the heat pipe (20), and the two phases (30) are separated by a distance; And—fixed socket (40), a receiving hole (42) is inserted through ^, and the heat conductive socket (10) is locked in an anastomosis, and the plate of the fixed socket (40) On the surface, a plurality of buckle holes (43) are provided to buckle an air hood (60) or a cooling fan integrally formed with the air hood, as shown in the figure. The top surface (12) of the thermally conductive socket (10) disclosed in this creation is concavely provided with a plurality of recessed grooves (121) to respectively accommodate a thermally conductive tube (20) to be placed inside, and the other A plurality of screw holes (1 3) are respectively formed on the side edges of both sides of the thermally conductive socket (10) to lock the fixed socket (40) by screws. Each of the heat-conducting pipes (20) disclosed in this creation can be bent into a U-shape, so that the middle section (21) is placed on the top surface of the heat-conducting socket (10), and connected on the bridge. Welding is applied to securely connect the heat conducting socket (10) and each heat conducting pipe (20) ', and both ends of each heat conducting pipe (20) are respectively projected on the heat conducting socket (1 0). On both sides, and extend vertically upwards. Above the middle section (21) of each of the above-mentioned heat-conducting pipes (20), a carrier plate (2 2) 'is horizontally connected for bridging a buckle or pressing rod (2 3) to borrow the buckle or pressing The pole (2 3) presses this creation, and sticks closely to the heat source (40). The fixed socket (40) disclosed in this creation is formed by integrally stamping and forming a metal plate, and includes a plate body portion (4 丨), and a receiving cavity (42) is formed on the plate body portion (4 丨). A protruding piece (421) is protruded downward from the two edge points of the receiving hole (42), and a fixing hole (422) is provided on each protruding piece (421) to pass through the screw. After fixing holes (422) of the protruding piece (421), lock in

第7頁 M253207 五、創作說明(4) 該導熱接座(1 0 ) (10)緊固於該固 如第三、四 於這板體部(41) 該兩側壁(4 4 )之 散熱鰭片(3 0 )下 流’僅能從各散 (3 0 )之散熱效率 本創作揭示 於一般電腦中央 至導熱接座(1 〇 ) 地傳導到與該導 藉由多數之散熱 的,而顯本創作 本新型所揭 與範疇下,予以 與其對應螺孔(1 3 )中,以將該導熱接座 定接座(40)内。 圖所示,本創作所揭示之固定接座(4〇), 之相對兩側,猶向上突設一側壁(44 ),令 頂緣(441 ),係分別跨置於位於最下層之 方’以導引該導風罩(6 〇 )所引入之空氣 熱籍片(30) 通過,以增進各散熱籍片 〇 ϋίϊίϊ”熱裝置,係可應用 =Γ 當熱源(50)將熱能傳遞 2,熱能便可循各導熱管(20) ⑽上 ϊ a μ ^界放熱,以達快速散熱之目 之新穎性及貫用性。 結構、形狀,可於不違本新型之精神 修飾應用’本新型並不予自限u之精神Page 7 M253207 V. Creation instructions (4) The thermally conductive socket (1 0) (10) is fastened to the solid third and fourth plate body parts (41) The two side walls (4 4) of the heat dissipation fins The film (3 0) is 'downstream' and can only be dissipated from the heat dissipation efficiency of each fan (3 0). This creation reveals that it is transmitted from the center of a general computer to the thermally conductive socket (1 0) to the one that is radiated by the majority of the heat, and the significant cost Under the scope and category of this novel, the corresponding screw holes (1 3) are created to fix the heat conductive socket in the socket (40). As shown in the figure, on the opposite sides of the fixed socket (40) disclosed in this creation, a side wall (44) is still protruding upwards, so that the top edge (441) is placed on the bottom side. It guides the air-heating sheet (30) introduced by the air baffle (60) to pass through the heat-sinking sheet. The heat device is applicable. When the heat source (50) transfers heat energy 2, Thermal energy can be dissipated through each heat pipe (20) ⑽ 上 ϊ a μ ^ world to achieve the novelty and consistency of the purpose of rapid heat dissipation. The structure and shape can be modified and applied without departing from the spirit of the new model. The spirit of not limiting itself

$ 8頁 M253207 圖式簡單說明 五、【圖式簡單說明】 第一圖:係本新型之立體分解圖。 第二圖:係本新型於組裝後之立體示意圖。 第三圖:係本新型與一含有導風罩之風扇組裝示意圖。 第四圖:係本新型之側視結構不意圖。 【元件符號簡單說明】 (1 0 )導熱接座 (11)接熱端 (1 2 )頂面 (1 2 1)嵌槽 (13)螺孔 (20)導熱管 (22)載板 (3 0 )散熱鰭片 (40)固定接座 (42)容置穴 (422 )固定孔 (44)側壁 (5 0 )熱源$ 8 pages M253207 Simple illustration of the drawing 5. [Simplified illustration of the drawing] The first picture: a three-dimensional exploded view of the new model. The second figure: is a three-dimensional schematic diagram of the new model after assembly. The third figure is a schematic diagram of the assembly of the new model with a fan containing an air hood. The fourth picture: the side view structure of the new model is not intended. [Simplified description of component symbols] (1 0) Thermal conductive socket (11) Hot end (1 2) Top surface (1 2 1) Embedded groove (13) Screw hole (20) Thermal pipe (22) Carrier board (3 0 ) Cooling fins (40) Fixing socket (42) Receiving cavity (422) Fixing hole (44) Side wall (50) Heat source

(2 1)中段 (2 3 )扣具或壓桿 (3 1 )篏孔 (4 1 )板體部 (421)突片 (43)扣孔 (441)頂緣 (60)導風罩(2 1) Middle section (2 3) Buckle or lever (3 1) Countersink (4 1) Plate body (421) Tab (43) Button hole (441) Top edge (60) Air hood

第9頁Page 9

Claims (1)

M253207 六、申請專利範圍 1. ίΐίί傳導式高效率散熱裝置,係包括: ¥熱接座’其底面界定 上者; 牧…、挪以貼罪於熱源 t熱g ,其中一端焊連於該 、, 地向上突伸者; 获7丄冬頂面,亚縱長 丄:別穿設有嵌孔,以對應地嵌套該 固定接座::中目:;熱韓片間係相隔間距者… 接座於内。 以勿口地鎖接該導熱 2.Π請述之直接傳導式高效率散熱 3,以分別容置係凹設有多數之嵌槽 ^吻專利範圍第丄項所述之直接傳導 裝置,直中兮道如、门欢丰散執 /、中4導熱接座之兩側側緣,分別穿設 ^ 4累孔,以籍螺絲鎖該固定接座者。 夕數 •Π請範圍第1項所述之直接傳導式高效率^ X ’ /、中各該導熱管,係彎曲呈U型狀,人 @ 跨置於該導熱接座之頂面上’並於該跨接處:::段 以固連該導熱接座及各導熱管,而各導熱管、接 係分別投影於該導熱接座之兩側,並向上縱兩端 者。 、焚延伸 •如申請專利範圍第丄項所述之直接傳導式 中該固定接座,係可由金屬板材-體衡= β有板體部,於該板體部上穿設有容置 成 ,通於 M253207 六、申請專利範圍 該容置 突片上 6. 如申請 裝置, 向上突 最下層 7. 如申請 裝置, 扣接導 8. 如申請 裝置, 板者。 穴之相 穿設有 專利範 其中該 設側壁 之散熱 專利乾 其中該 風罩者 專利範 其中各 9 · 一種直接傳導 導熱接座,其 者; 導熱管,其中 地向上突伸者 散熱鰭片,分 於内,並令兩 1〇·如申請專利範 裝置,其中該 ’以分別容置 11 ·如申請專利範 裝置,其中導 對兩穴緣 固定孔者 圍第1項 固定接座 ,令該兩 鰭片下方 圍第1項 固疋接座 〇 圍弟4項 該導熱管 式鬲效率 底面界定 蠕焊連 ;以及 別穿設有 相鄰散熱 圍第9項 導熱接座 導熱管跨 圍第9項 熱管係彎 ,分別向下突伸突片,且於各 〇 所述之直接傳導式高效率散熱 ,於該板體部之相對兩侧,猶 側壁之頂緣,分別跨置於位於 者。 所述之直接傳導式高效率散熱 之板面上穿設有多數扣孔,以' 所述之直接傳導式高效率散熱 之中段上方,係水平地連設^ 散熱裝置,係包括: 形成接熱端,卩貼靠於熱源上 於該導熱接座之頂面,並縱長 甘入孔,以對應地嵌套該導熱管 鰭片間係相隔間距者。 所述之直接傳導式高效率散熱 的頂面上係凹設有多數之嵌槽 置於内。 所述之直接傳導式高效率散熱 曲呈LJ型狀,令其中段跨置於M253207 VI. Application for patent scope 1. ίΐίί Conductive high-efficiency heat-dissipating device, including: ¥ Thermal connection seat 'is defined on the bottom surface; animal husbandry ..., the crime of attaching to the heat source t heat g, one end of which is welded to the, Those who protrude upward from the ground; get the top surface of the 7th winter, the sub-longitudinal 别: do n’t wear the embedded holes to correspondingly nest the fixed socket :: the middle head :; the hot Korean films are separated by the space ... Seat inside. Directly conductive high-efficiency heat-sinking, which is described in Section 2.II, is used to accommodate the direct-conducting device described in item 丄 of the patent scope, which is recessed with a plurality of recesses. Xi Daoru, Men Huanfeng Sanzhi /, Zhong 4 thermal conductive sockets on both sides of the side edge, respectively through ^ 4 tired holes, with screws to lock the fixed socket. Evening number • Π Please direct the high efficiency of direct conduction type described in item 1 of the range ^ X '/, each of the heat pipe is curved in a U shape, and the person @ SPAN is placed on the top surface of the heat conduction socket' and At the bridging place ::: The segments are connected to the thermally conductive socket and each of the thermally conductive pipes, and each of the thermally conductive pipes and the connection system is respectively projected on both sides of the thermally conductive socket, and the two ends are vertically upward. Extending the burner • As described in the direct conduction type of the scope of the patent application, the fixed socket can be made of sheet metal-body weight = β has a plate body part, and an accommodation device is formed on the plate body part. Through M253207 VI. Application scope of the patent. The accommodation tab is 6. If applying for a device, project the bottom layer upwards. 7. If applying for a device, buckle guide 8. If applying for a device, the board. The phase of the hole is provided with a patent, wherein the heat dissipation patent provided with the side wall is dry, and the wind shield is patented. Each of the 9 is a direct conductive thermal connector, the other is a heat conduction tube, in which the ground fins protrude upward, Divide into two, and make two 10 · If you apply for a patent-type device, which 'respectively accommodate 11 · If you apply for a patent-type device, where the guide points to the two fixed edge sockets of the two holes, so that the The first fixed joint on the underside of the two fins, the fourth on the thermal pipe type, and the bottom surface of the heat pipe define the creep welding; The heat pipes are curved, each protruding downwardly, and the direct conductive high-efficiency heat dissipation described in each 0 is located on the opposite sides of the board body and the top edges of the side walls, respectively. The direct conductive high-efficiency heat-dissipating board is provided with a plurality of buckle holes, and the direct conductive high-efficiency heat-dissipating middle section is horizontally connected with a ^ heat-dissipating device, which includes: forming heat connection At the end, the cymbal abuts on the heat source on the top surface of the heat-conducting socket, and has an elongated Gan hole to correspondingly nest the spaced-apart spaces between the heat-conducting tube fins. The top surface of the direct-conduction high-efficiency heat sink is concavely provided with a plurality of embedded grooves. The direct-conduction high-efficiency heat dissipation curve is LJ-shaped, so that the middle section is placed on 第11頁 M253207 六、申請專利範圍 該導熱接座之頂面上’並於该跨接處施以焊接’以固 連該導熱接座及各導熱管,而各導熱管之兩端,係分 別投影於該導熱接座之兩側,並向上縱長延伸者。 1 2.如申請專利範圍第11項所述之直接傳導式高效率散熱 裝置,其中各該導熱管之中段上方,係水平地連設載 板者。Page 11 M253207 VI. Scope of patent application The top surface of the thermally conductive socket is welded on the bridge to fix the thermally conductive socket and each heat pipe, and the two ends of each heat pipe are respectively Projected on both sides of the thermally conductive socket, and extend upward and vertically. 1 2. The direct-conduction high-efficiency heat-dissipating device according to item 11 of the scope of the patent application, wherein the upper part of each of the heat-conducting pipes is horizontally connected with a carrier board. 第12頁Page 12
TW93202703U 2004-02-25 2004-02-25 Direct conduction type high-efficiency heat dissipation device TWM253207U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI411386B (en) * 2008-08-22 2013-10-01 Foxconn Tech Co Ltd Heat sink assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI411386B (en) * 2008-08-22 2013-10-01 Foxconn Tech Co Ltd Heat sink assembly

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