M285034 八、新型說明： 【新型所屬之技術領域】 本創作係有關於一種植球機助焊劑沾點機構改良，尤 其是指一種不僅能令助焊劑沾點腳柱保持向下凸設狀 態，避免晶片球墊有漏沾助焊劑之情況發生，且亦能避免 該助焊劑沾點腳柱將晶片球墊壓壞之現象產生，而在其整 體施行使用上更增其實用功效增進之植球機助焊劑沾點 機構改良創新應用者。 • 【先前技術】 按’ 一般半導體構裝製程中用以在晶片上設置鍚球之 自動植球機，其於助焊劑塗佈結構主要係如第四圖所示， 設有一模座（4)，且於模座（4)底端面開具有諸多穿孔 (41) ’於各穿孔（41)中皆予以套設有助焊劑沾點腳枉 (42) ’該助焊劑沾點腳柱（42)上端皆形成有頂撐塊 (421)，以能令助焊劑沾點腳柱（42)於穿孔（41)中上、下 移動且避免其由穿孔（41)内脫出，並為令該助焊劑沾點腳 • 柱（42)常保持向下凸設至定位，而於該模座⑷内另設有 壓塊（43)壓掣於各助焊劑沾點腳柱（42)之頂撐塊（421) 上，同時該壓塊（43)上設有彈性元件⑷）使其常保持一向 下頂撐之壓掣力量。 該結構於施行動作上，請一併參閲第五〜七圖所示， 其係令該模座（4)帶動各助焊劑沾點腳柱（42)移動至助焊 劑槽（5)巾’使各助焊㈣點腳柱（42)上皆沾附有助焊 劑，並令模座（4)帶動各助焊劑沾點腳柱（42)移動至晶片 ⑻上對應各球墊（61)下壓，使助焊劑沾點腳柱（42)上之 M285034 Μ 4附在晶片⑹之球塾(61)上，再利用另一模座⑺ 以模穴（71)藉由真空吸力吸附錫球（72)後，予以焊固在晶 片（6)之球墊（61)上。 、然而，上述結構雖可達到於晶片之球墊上沾附助焊劑 並烊©財之翻功效，但於其實際操作實施❹上卻發 現由於模座在反覆帶動助焊劑沾點腳柱沾附助焊劑過程 中，極易因助焊劑沾附於模座之穿孔中，造成該助焊劑沾 點腳柱無法順利在穿孔中上、下移動，此時，若壓塊上所 籲 $之彈性it件彈力較小時，其並無法順利帶動壓塊將各助 焊劑沾點腳柱由穿孔中推出，而若壓塊上所設之彈性元件 彈力過大時，卻極易於令各助焊劑沾點腳柱下壓使助焊劑 沾附在晶片球墊過程中將該球墊壓壞，導致該結構在整體 施行使用上存有極大不便與困擾之處尚待改進。 另，請參閱第八圖所示，其係常見另一種自動植球機 之助焊劑塗佈結構，該結構同樣係於模座（8)底端面開具 牙孔（81)供助焊劑沾點腳柱（82)穿設，且於助焊劑沾點腳 • 柱（82)上端亦形成頂撐塊（821)供其於穿孔（81)中上、下 移動卻不脫落，於模座（8)中則設有軟性墊塊（83),以利 用該軟性墊塊（83)之回復彈力令助焊劑沾點腳柱（82)常 保向下凸設之狀態，及避免於使助焊劑沾附在晶片球墊之 過程中將該球墊壓壞；但，該結構於其施行使用上卻仍發 現，該軟性墊塊於長期使用下極性造成彈性疲乏，導致^ 無法再具有足夠的回復彈力將助焊劑沾點腳柱向下推動 回復凸設定位，而於晶片球墊上會有漏沾助焊劑之情況發 生，同樣於其整體施行使用上存有不便及困擾之處尚待改 M285034 【新型内容】 本創作之植球機助焊劑沾點機構改良，其主 f内或機台上設麵力源，該動力源可於助㈣沾點腳= 沾附助^劑後及令助焊劑沾附在晶片球墊上後，利用動^ 源之壓杯推動助焊劑沾點腳柱上之壓沾 腳柱受推動保持向下凸設之狀態;藉此，以不== 助焊劑沾點腳柱皆能確實沾附助焊劑及將助焊劑確實沾 :在晶片各球墊上1亦能避免該助_沾點腳柱下壓力M285034 VIII. New Description: [New Technology Field] This creation department is about the improvement of the spotting mechanism of a planting ball machine flux, especially a kind of not only can the flux sticking to the foot column to keep the downward protruding state, avoiding The wafer ball pad has a leakage flux, and the flux ball is prevented from being crushed by the foot ball, and the ball ball machine is further improved in practical use. Flux smear mechanism to improve innovative applications. • [Prior Art] According to the 'General Semiconductor Assembly Process, the automatic ball planter for setting the ball on the wafer, the flux coating structure is mainly as shown in the fourth figure, and there is a mold base (4) And a plurality of perforations (41) are formed on the bottom end surface of the mold base (4). Each of the perforations (41) is provided with a flux-staining ankle (42) 'The flux dipping the foot post (42) A top support block (421) is formed on the upper end to enable the flux to touch the foot post (42) to move up and down in the perforation (41) and prevent it from coming out of the perforation (41), and The flux is stuck to the foot • The column (42) is always kept downwardly convex to the position, and the die block (43) is further provided with a pressing block (43) pressed against the top block of each flux-welding foot column (42). (421), at the same time, the pressing block (43) is provided with an elastic member (4) so as to maintain a compressive force of a downward struts. For the operation of the structure, please refer to the fifth to seventh figures, which is to make the mold base (4) drive the flux to touch the foot column (42) to the flux tank (5) towel' Each flux (four) foot post (42) is coated with a flux, and the mold base (4) drives the flux to touch the foot post (42) to move to the wafer (8) corresponding to each ball pad (61) Pressing, the M285034 Μ 4 on the flux sticking pin (42) is attached to the ball cymbal (61) of the wafer (6), and the other mold base (7) is used to adsorb the solder ball by the vacuum suction force. After 72), it is soldered to the ball pad (61) of the wafer (6). However, although the above structure can achieve the effect of immersing the flux on the ball pad of the wafer and the effect of the smuggling, it is found that the mold base is repeatedly driven by the flux. During the fluxing process, it is easy to adhere to the perforation of the mold base due to the flux, so that the flux sticking to the foot column cannot move up and down smoothly in the perforation. At this time, if the pressure piece is called the elastic one piece When the elastic force is small, it does not smoothly drive the pressure block to push the flux-welding foot column out of the perforation. If the elastic element provided on the pressure block is too elastic, it is easy to make the flux touch the foot. The under-column pressure causes the flux pad to be crushed during the wafer ball pad process, which results in great inconvenience and troubles in the overall implementation of the structure. In addition, please refer to the eighth figure, which is another flux coating structure of another automatic ball planter. The structure is also attached to the bottom end of the mold base (8) to open the dental hole (81) for the flux to touch the foot. The column (82) is pierced, and a top support block (821) is also formed on the upper end of the flux-drilling foot column (82) for moving up and down in the perforation (81) without falling off, in the mold base (8) In the middle, a soft spacer (83) is provided to utilize the resilience of the soft spacer (83) to keep the flux sticking to the foot post (82) and to prevent the flux from sticking to it. The ball pad is crushed during the process of the wafer ball pad; however, the structure is still used in its application, and the soft pad is elastically fatigued under long-term use, resulting in no more resilience. The flux sticks to the column to push down the return convex setting position, and there is a leakage of flux on the wafer ball pad. It is also inconvenient and troublesome to be used in its overall implementation. M285034 [New content] The ball planting machine of this creation is improved by the fluxing point mechanism, and the main f or the machine is set on the machine. The source of force, the power source can help (4) touch the foot = after attaching the help agent and after the flux is attached to the wafer ball pad, use the pressure cup of the power source to push the flux to the pressure on the foot post The dipstick column is pushed and held downwardly; thereby, the flux can be surely adhered to the flux and the flux can be surely adhered to the foot without the flux: the ball pad on the wafer 1 can also avoid Help _ dip the pressure under the foot column
篁過大將晶μ球塾壓壞讀況發生，而在其整體施行實用 上更增實用功效增進者。 【實施方式】 首先，凊參閱第一圖所示，本創作主要係於模座（1) ^端面開具有諸多穿孔(⑴，且於各穿孔⑴）内皆分別穿 设有助焊劑沾點腳柱（2)，該助焊劑沾點腳柱（2)上端則形 成有頂撐塊（21)，以供助焊劑沾點腳柱（2)能於模座（1)穿 孔（11)中上、下移動不脫落，另於該模座〇)内對應各助 焊劑沾點腳柱（2)之頂撐塊（21)上端設有壓塊（12)，該壓 塊（12)則可供利用設於模座或機台〔圖中未示〕之動 力源（3)〔如：氣壓缸、電磁閥……等〕以其壓桿（31)所 向下推動。 如此一來，請再參閱第二、三圖所示，即可於該模座 (1)帶動各助焊劑沾點腳柱（2)移動下降沾附助焊劑，及令 助焊劑、沾點腳柱（2)移動下降使助焊劑沾附在晶片各球墊 上後，於模座（1)上升進行下一流程動作時，該模座（1)内 或機台上〔圖中未示〕之動力源（3)即會作動以其壓桿（31) 將壓塊（12)下壓，連帶使各助焊劑沾點腳柱（2)之頂撐塊 M285034 -流程動作者。出穿孔⑴）外之狀態，㈣實進行下 本創= 之;元:二：使用實施說明可知， 沾點腳柱下壓沾：焊:二^作係於模座帶動助焊劑 :焊=:::==帶動壓㈣，使各 塔业能P甘符向下凸执’此時，該動力源即又回復 不僅能確實於助焊__柱上沾附助焊 在晶片球墊上’不會有漏沾附助焊劑之 二::避免施加壓力過大令助焊劑沾點腳柱將 ;L=:發生’而在其整趙施行使用上更增其 本創作實施例確能達到所預期之使用功 ΓίίΓ :^具_造’不僅未曾見諸於同類產品 中’亦未日么開於”前，誠已完全符合專利法之規定盘 爱==新型專利之申請’懇請惠予審查，並賜 准專利，則實感德便。 M285034 【圖式簡單說明】 第一圖：本創作之結構示意圖 第二圖：本創作之動作示意圖（一） 第三圖：本創作之動作示意圖（二） 第四圖：習用之結構示意圖 第五圖：習用之動作示意圖（一） 第六圖··習用之動作示意圖（二） 第七圖：習用之動作示意圖（三） 第八圖：另一習用之結構示意圖 【主要元件符號說明】 (1) 模座 (11) 穿孔 (12) 壓塊 (2) 助焊劑沾點腳柱 (21) 頂撐塊 (3) 動力源 (31) 壓桿 (4) 模座 (41) 穿孔 (42) 助焊劑沾點腳柱 (421) 頂撐塊 (43) 壓塊 (44) 彈性元件 (5) 助焊劑槽 (6) 晶片 (61) 球墊 (7) 模座 (71) 模穴 (72) 錫球 (8) 模座 (81) 穿孔 (82) 助焊劑沾點腳柱 (821) 頂撐塊 (83) 軟性墊塊When the μ 大 晶 晶 μ μ 晶 晶 晶 晶 晶 晶 晶 晶 晶 晶 晶 晶 晶 晶 晶 晶 晶 晶 晶 晶 晶 晶 晶 晶[Embodiment] First, as shown in the first figure, the creation is mainly based on the mold base (1). The end face has a plurality of perforations ((1), and each of the perforations (1) is respectively provided with a flux-dip foot. Column (2), the upper end of the flux sticking foot column (2) is formed with a top block (21) for the flux to stick the foot column (2) to the hole (11) of the mold base (1) , the lower movement does not fall off, and the upper part of the top support block (21) corresponding to each flux-welding foot column (2) is provided with a pressure block (12), and the pressure block (12) is available. The power source (3) (such as a pneumatic cylinder, a solenoid valve, etc.) provided on a mold base or a machine table (not shown) is pushed downward by the pressure bar (31). In this way, please refer to the second and third figures, as shown in the mold base (1), the flux can be moved to the foot post (2) to move down and adhere to the flux, and to flux, touch the feet After the column (2) moves down, the flux is adhered to the ball mats of the wafer, and when the mold base (1) is raised for the next process, the mold base (1) or the machine table (not shown) The power source (3) will actuate to press the pressure block (12) with its pressure bar (31), so that each flux will be immersed in the struts of the foot column (2) M285034 - the flow actor. Out of the perforation (1)), (4) the actual implementation of the original =; yuan: two: using the implementation instructions, the dip point under the pressure of the foot: welding: two ^ system in the mold base to drive flux: welding =: ::==Bringing the pressure (4), so that each tower industry can p-conform downwards. At this time, the power source can be recovered not only on the welding __ pillars, but also on the wafer ball mat. There will be two leaking fluxes:: Avoid excessive pressure so that the flux will stick to the foot; L=: Occurs, and the use of the whole Zhao is increased. The original embodiment can achieve the expected The use of merit Γ ίίΓ : ^ _ _ ' not only have not seen in the same product in the 'also not open before the day', Cheng has fully complied with the provisions of the patent law, love = = new patent application ' 恳 please benefit review, and M285034 [Simple description of the picture] The first picture: The schematic diagram of the structure of the creation The second picture: The schematic diagram of the action of this creation (1) The third picture: The action diagram of the creation (2) Four figures: Schematic diagram of the structure of the habits. Figure 5: Schematic diagram of the actions of the habits (1) Schematic diagram of action (2) Figure 7: Schematic diagram of conventional action (3) Figure 8: Schematic diagram of another conventional structure [Description of main components] (1) Mold base (11) Perforation (12) Clamping block (2 Flux Dip Point (21) Top Support (3) Power Source (31) Pressure Bar (4) Mold Base (41) Perforation (42) Flux Dip Point (421) Top Support (43) Clamp (44) Elastomer (5) Flux (6) Wafer (61) Ball pad (7) Mold base (71) Mold hole (72) Tin ball (8) Mold base (81) Perforation (82) Solder Dip Point (821) Top Support (83) Soft Cushion